Multilayer Ceramic Chip Capacitors FEATURES * CRACK RESISTANT TERMINATION * SOFT TERMINATION, OPEN MODE FAILURE * WIDE VOLTAGE RANGE (16V TO 5KV) * HIGH CAPACITANCE (UP TO 10mF) * RoHS COMPLIANT * SAC SOLDER COMPATIBLE** Temperature Coefficient Capacitance Range Capacitance Tolerance Operating Temperature Range Temperature Characteristics Rated Voltages Q or Dissipation Factor insulation Resistance Dielectric Withstanding Voltage NMC-P Series RoHS Compliant Includes all homogeneous materials *See Part Number System for Details NPO X7R 5pF ~ 0.22F 180pF ~ 10F For 2.2pF ~ 10pF: 0.1pF (B), 0.25pF (C), 0.5pF (D), 1pF (F) 10% (K) & 20% (M) Above 10pF: 1% (F), 2% (G), 5% (J), 10% (K) -55C ~ +125C 30ppm/C 15% Cap. 16Vdc, 25Vdc, 50Vdc, 100Vdc, 200Vdc, 250Vdc, 500Vdc, 630Vdc, 1KVdc, 2Kvdc, 3Kvdc & 5Kvdc Q = > 1000 (more then 30pF)* 2.5% max.@1KHz, Q = > 400 + 20 x C in pF (30pF and below)* 1.0V 0.2Vrms 10,000Megohm or 500Megohm/F whichever is less @ +25C 200% of rated voltage for 5 seconds, 50mA max. (16V ~ 250V) 150% of rated voltage for 5 seconds, 50mA max. (500V ~ 630V) 120% of rated voltage for 5 seconds, 50mA max. (1KV ~ 5KV) *Test Frequency & Voltage: Up to 100pF 1MHz/1.0Vrms, Above 100pF 1KHz/1.0Vrms **Reflow soldering is recommended. Contact NIC regarding the use of other soldering methods. PART NUMBER SYSTEM NMC-P 1206 X7R 105 K 50 TRP or TRPLP F Series RoHS Compliant Tape & Reel (Plastic Carrier) Tape & Reel (Punched Carrier) Voltage (Vdc) Capacitance Tolerance Code (see chart) Capacitance Code, expressed in pF, first 2 digits are significant, 3rd digit is no. of zeros Temperature Characteristic (NPO or X7R) Size Code (see chart) CONSTRUCTION Base layer (Cu 50V ~ 250V) (Ag 500V ~ up) Flexible layer (Polymer) Barrier layer (Ni) Finish layer (Sn) OPEN MODE FAILURE AS A RESULT OF BENDING STRESS Termination Separation (Open Failure Mode) (R) 1 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com Specifications are subject to change www.SMTmagnetics.com Multilayer Ceramic Chip Capacitors NPO VALUES AND SIZES (mm) EIA Case Size Length (L) Width (W) Thickness max. (T) Termination Width (P) Capacitance 0603 1.60 0.1 0.80 0.1 0.90 max. 0.15 min. 200 16 25 NMC-P Series 0805 2.00 0.2 1.25 0.25 1.45 max. 0.20 min. 1206 3.20 0.3 1.60 0.2 1.80 max. 0.30 min. Working Voltage (Vdc) 50 200 250 500 16 25 50 200 250 500 1K 1210 3.20 0.30 2.50 0.20 2.60 max. 0.30 min. 2K 3K 16 25 50 200 250 500 5.0 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 0.001F 0.0012 0.0015 0.0018 0.0022 0.0027 0.0033 0.0039 0.0047 0.0056 0.0068 0.0082 0.01F 0.012 0.015 0.018 0.022 0.027 0.033 0.039 0.047 0.056 0.068 0.1F (R) 2 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com Specifications are subject to change www.SMTmagnetics.com Multilayer Ceramic Chip Capacitors NPO VALUES AND SIZES (mm) EIA Case Size Length (L) Width (W) Thickness max. (T) Termination Width (P) Capacitance 1808 4.60 0.3 2.00 0.2 2.20 max. 0.30 min. 1K 2K 3K 5K NMC-P Series 1812 1825 4.60 0.3 4.60 0.3 3.20 0.3 6.35 0.4 3.00 max. 2.60 max. 0.30 min. 0.30 min. Working Voltage (Vdc) 16 25 50 1K 2K 3K 250 500 1K 2220 5.70 0.4 5.00 0.4 3.00 max. 0.30 min. 1K 5K 5.0 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 0.001F 0.0012 0.0015 0.0018 0.0022 0.0027 0.0033 0.0039 0.0047 0.0056 0.0068 0.0082 0.01F 0.012 0.015 0.018 0.022 0.027 0.033 0.039 0.047 0.056 0.068 0.1F 0.12 0.15 0.22 (R) 3 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com Specifications are subject to change www.SMTmagnetics.com Multilayer Ceramic Chip Capacitors X7R LOW VOLTAGE VALUES AND SIZES (mm) EIA Case Size Length (L) Width (W) Thickness max. (T) Termination Width (P) Capacitance NMC-P Series 0805 2.00 0.2 1.25 0.25 1.45 max. 0.20 min. 1206 3.20 0.3 1.60 0.2 1.80 max. 0.30 min. 1210 3.20 0.3 2.50 0.2 2.60 max. 0.30 min. 2220 5.70 0.4 5.00 0.4 3.00 max. 0.30 min. 2225 5.70 0.4 6.35 0.4 3.00 max. 0.30 min 50 50 50 50 50 100 100 1812 1825 4.60 0.3 4.60 0.3 3.20 0.3 6.35 0.4 3.00 max. 2.60 max. 0.30 min. 0.30 min. Working Voltage (Vdc) 100 50 100 50 100 100 100 0.1F 0.15 0.22 0.33 0.47 0.68 1.0F 1.5 2.2 3.3 4.7 6.8 10F X7R HIGH V0LTAGE VALUES AND SIZES (mm) EIA Case Size Length (L) Width (W) Thickness max. (T) Termination Width (P) Capacitance 0805 2.00 0.2 1.25 0.25 1.45 max. 0.20 min. 200 250 500 200 1206 3.20 0.3 1.60 0.2 1.80 max. 0.30 min. Working Voltage (Vdc) 250 500 630 1K 1210 3.20 0.3 2.50 0.2 2.60 max. 0.30 min. 200 250 500 1K 180pF 220 270 330 390 470 560 680 0.001F 0.0015F 0.0022F 0.0027F 0.0033F 0.0039F 0.0047F 0.0056F 0.0068F 0.01F 0.012F 0.015F 0.018F 0.022F 0.027F 0.033F 0.039F 0.047F 0.056F 0.068F 0.1F 0.12F 0.15F 0.18F 0.22F (R) 4 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com Specifications are subject to change www.SMTmagnetics.com Multilayer Ceramic Chip Capacitors X7R HIGH V0LTAGE VALUES AND SIZES (mm) EIA Case Size Length (L) Width (W) Thickness max. (T) Termination Width (P) Capacitance 1808 4.60 0.3 2.0 0.2 2.20 max. 0.30 min. 500 1K 2K 1812 4.60 0.3 3.2 0.3 3.00 max. 0.30 min. 3K 200 250 500 1K NMC-P Series 1825 4.60 0.3 6.35 0.4 2.60 max. 0.30 min. Working Voltage (Vdc) 2K 3K 250 500 1K 2220 5.70 0.4 5.00 0.4 3.00 max. 0.30 min. 250 500 1K 2225 5.70 0.4 6.35 0.4 3.00 max. 0.30 min. 2K 250 500 1K 150pF 180 220 270 330 390 470 560 680 0.001F 0.0015 0.0018 0.0022 0.0027 0.0033 0.0039 0.0047 0.0056 0.0068 0.01F 0.012 0.015 0.018 0.022 0.027 0.033 0.039 0.047 0.056 0.068 0.1F 0.12 0.15 0.18 0.22 0.27 0.33 0.39 0.47 0.56 0.68 1.0F 1.5 2.2 W T P P L (R) 5 100% Sn over Ni barrier NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com Specifications are subject to change www.SMTmagnetics.com Multilayer Ceramic Chip Capacitors REEL Taping Specifications REEL DIMENSIONS (mm) Reel Diameter (A) 7" (178 2.0) 10" (250 2.0) 13" (330 2.0) B D B 13 0.5 C 50 min. 100 1.0 100 1.0 D T max. 8.4 +1.0/-0 (1812 case size 12.4 +2.0/-0) 21 1.0 7 INCH REEL QUANTITIES* Size Tape Size Min. Qty Per Reel Max. Qty Per Reel C 0603 8mm 0805 8mm 1206 8mm 1210 8mm 1812 12mm 4,000 4,000 4,000 2,000 1,000 4,000 5,000 5,000 5,000 2,000 *Quantity dependent on chip thickness. Contact NIC for reel quantities on larger diameter reels. CARRIER TAPE MATERIAL T Parts with a thickness of >1mm will be taped on embossed plastic carrier. Parts with a thickness of less then 1mm will be taped on paper carrier A EMBOSSED PLASTIC CARRIER TAPE DIMENSIONS (mm) Tape Size W F 8mm 8.0 0.2 3.5 0.05 12mm 12 0.2 5.5 0.05 E P0 P2 D K max. 1.75 0.10 4.0 0.1 2.0 0.5 1.5 +0.1-0.0 3.0 Notes: 1. Specifications are in compliance with EIA RS481-1-A "Taping of surface Mount Components for Automatic Placement" 2. Dimensions Ao (max.) equals component width dimension plus 0.5mm 3. Dimension Bo (max.) equals component length dimension plus 0.5mm T max. P 2.0 4.0 0.1 4.5 8.0 0.1 EMBOSSED PLASTIC CARRIER TAPE D Po T E P2 F Bo W Ao P K See notes 2 & 3 regarding dimensions Ao and Bo PUNCHED CARRIER TAPE DIMENSIONS (mm) Type Ao Bo W F E P1 P0 D0 T1 max. T2 max. 0603 0805 1206 1.1 0.2 1.65 0.2 2.0 0.2 1.9 0.2 2.4 0.2 3.6 0.2 8.0 0.3 3.5 0.05 1.75 0.1 4.0 0.10 4.0 0.1 1.5 +0.1/-0.0 1.1 1.4 Mounting Hole Angular Punch Hole PUNCHED CARRIER TAPE D Po t1 E F Bo t2 Ao W P1 Component Pitch (R) 6 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com Specifications are subject to change www.SMTmagnetics.com