MAX1819
500mA Low-Dropout Linear Regulator in UCSP
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POK Output
The power-OK (POK) output pulls low when OUT is less
than 93% of the nominal regulation voltage. Once OUT
exceeds 93% of the nominal voltage, POK goes high
impedance. POK is an open-drain N-channel output. To
obtain a voltage signal, connect a pullup resistor from
POK to OUT. A 100kΩresistor works well for most appli-
cations. POK can be used as a power-OK signal to a
microcontroller (µC), or drive an external LED to indicate
power failure. When the MAX1819 is shut down, POK is
held low independent of the output voltage. If unused,
leave POK grounded or unconnected.
Current Limit
The MAX1819 monitors and controls the pass transis-
tor’s gate voltage, limiting the output current to 1.0A
(typ). This current limit doubles when the output voltage
is within 4% of the nominal value to improve perfor-
mance with large load transients.
Thermal Overload Protection
Thermal overload protection limits total power dissipa-
tion in the MAX1819. When the junction temperature
exceeds TJ= +170°C, a thermal sensor turns off the
pass transistor, allowing the IC to cool. The thermal
sensor turns the pass transistor on again after the junc-
tion temperature cools by 20°C, resulting in a pulsed
output during continuous thermal overload conditions.
Thermal overload protection protects the MAX1819 in
the event of fault conditions. For continuous operation,
do not exceed the absolute maximum junction-temper-
ature rating of TJ= +150°C.
Operating Region and Power Dissipation
The MAX1819’s maximum power dissipation depends
on the thermal resistance of the IC package and circuit
board, the temperature difference between the die
junction and ambient air, and the rate of air flow. The
power dissipated in the device is P = IOUT ×(VIN -
VOUT). The maximum allowed power dissipation is
840mW at TA= +70°C or:
PMAX = (TJ(MAX) - TA) / ( θJB + θBA)
where TJ- TAis the temperature difference between
the MAX1819 die junction and the surrounding air, θJB
is the thermal resistance of the junction to the base,
and θBA is the thermal resistance through the PC
board, copper traces, and other materials to the sur-
rounding air. For best heatsinking, the copper area
should be equally shared between the IN, OUT, and
GND pins.
The MAX1819 delivers up to 0.5A RMS and operates
with input voltages up to 5.5V, but not simultaneously.
High output currents can only be sustained when input-
output differential voltages are low, as shown in Figure 3.