5SDF 11F2501
ABB Semiconductors AG reserves the right to change specifications without notice.
Doc. No. 5SYA1113-04 Sep. 01 page 2 of 6
On-state (see Fig. 2, 3)
IFAVM Max. average on-state current 950 A
IFRMS Max. RMS on-state current 1500 A
Half sine wave, Tc = 85°C
IFSM Max. peak non-repetitive 21 kA tp = 10 ms Before surge:
surge current 65 kA tp = 1 ms Tc = Tj = 125°C
2.2⋅106A2stp= 10ms
After surge:
òI2dt Max. surge current integral
2.1⋅106A2stp= 1ms
VR ≈ 0 V
VFForward voltage drop ≤1.6 V IF= 1000 A
VF0 Threshold voltage 1.2 V Approximation for
rFSlope resistance 0.38 mΩIF= 400…4000 A
Tj = 125°C
Turn-on (see Fig. 4, 5)
Vfr Peak forward recovery voltage ≤16 V di/dt = 500 A/µs, Tj = 125°C
Turn-off (see Fig. 6 to 11)
Irr Reverse recovery current ≤550 A
Qrr Reverse recovery charge ≤1200 µC
Err Turn-off energy ≤0.45 J
di/dt = 300 A/µs, IF = 700 A,
Tj = 125°C, VRM = 2600 V,
CS = 2µF (GTO snubber circuit)
Thermal (see Fig. 1)
TjOperating junction temperature range -40...125°C
Tstg Storage temperature range -40...125°C
RthJC Thermal resistance junction to case ≤40 K/kW Anode side cooled
≤40 K/kW Cathode side cooled
≤20 K/kW Double side cooled
RthCH Thermal resistance case to heatsink ≤10 K/kW Single side cooled
Fm =
20… 24 kN
≤5 K/kW Double side cooled
Analytical function for transient thermal impedance.
i1234
R i(K/kW) 11.83 4.26 1.63 2.28
τi(s) 0.432 0.071 0.01 0.0054
)e-(1R = (t)Z
n
1i
/t-
ithJC å
=
i
τ
Fm = 20… 24 kN Double side cooled