Agilent HPMD-7904
FBAR Duplexer for
US PCS Band
Data Sheet
General Description
The HPMD-7904 is a miniaturized
duplexer designed for US PCS
handset, designed using Agilent
Technologies’ Film Bulk Acoustic
Resonator (FBAR) Technology.
The HPMD-7904 features a very
small size: it is less than 2 mm
thick and has a footprint of only
5.6 x 11.9 mm2.
The HPMD-7904 enhances the
sensitivity and dynamic range of
CDMA receivers, providing more
than 50 dB attenuation of
transmitted signal at the receiver
input, and more than 40 dB
rejection of the transmit-
generated noise in the receive
band. Typical insertion loss in
the Tx channel is only 1.8 dB,
minimizing current drain from
the power amplifier. Typical
insertion loss in the Rx channel
is 2.2 dB, improving receiver
sensitivity.
Agilent’s thin-Film Bulk Acoustic
Resonator (FBAR) technology
makes possible high-Q filters at a
fraction their usual size. The
excellent power handling of the
bulk-mode resonators supports
the high output powers needed in
PCS handsets, with virtually no
added distortion.
Features
•
Miniature size: less than 2 mm high;
5.6 x 11.9 footprint
• Rx Band: 1930-1990 MHz
Typical performance:
Rx noise blocking: 42dB
Insertion loss: 2.2 dB typical
3.0 dB band edge
• Tx Band: 1850-1910 MHz
Typical performance:
Tx interferer blocking: 54dB
Insertion Loss: 1.8 dB typical
2.5 dB band edge
• 30 dBm Tx power handling
Applications
• Handsets or data terminals
operating in the US PCS frequency
band
Board Diagram
Functional Block Diagram
Rx
Ant
2
3
Tx λ/4
1
port numbers are circled
2
HPMD-7904 Electrical Specifications, ZO = 50Ω, TC[1] as indicated
+25°C[1,3] +85°C[1,2,3] –30°C[1,2,3]
Symbol Parameters Units Min Typ Max Min Typ Max Min Typ Max
fRX Receive Bandwidth MHz 1930.6 — 1989.4 1930.6 — 1989.4 1930.6 — 1989.4
S23 Rx Attenuation in Transmit Band dB 50 54 — 50 52 — 50 52 —
(1850.6 –1909.4 MHz)
S23 Rx Typical Insertion Loss in Receive Band dB — 2.2 3.5 — 2.2 3.8 — 2.2 3.8
(1935–1985MHz)
S23 Rx Insertion Loss at Edges of Receive dB — 3.0 3.5 — 3.0 3.8 — 3.0 4.5
Band (1930.6-1935 MHz and
1985-1989.4 MHZ)
∆ S23 Ripple in Receive Band dB — 1.5 — — 1.5 — — 2.0 —
S22 Rx Return Loss in Receive Band dB 8.0 10 — 8.0 10 — 8.0 10 —
fTX Transmit Bandwidth MHz 1850.6 — 1909.4 1850.6 — 1909.4 1850.6 — 1909.4
S31 Tx Attenuation in Receive Band dB 40 42 — 40 42 — 37 42 —
(1930.6 –1935 MHz)
S31 Tx Attenuation in Receive Band dB 40 42 — 40 42 — 40 42 —
(1935–1989.4 MHz)
S31 Tx Insertion Loss in Transmit Band dB — 1.8 3.0 — 1.8 3.5 — 1.8 3.5
(1855–1905 MHz)
S31 Tx Insertion Loss at Edges of dB — 2.5 3.0 — 3.0 3.8 — 3.0 3.6
Transmit Band (1850.6-1855 MHz
and 1905-1909.4 MHz)
∆ S31 Ripple in Transmit Band dB — 2.0 — — 3.0 — — 2.0 —
S11 Tx Return Loss in Transmit Band dB 8.0 10 — 8.0 10 — 8.0 10 —
S33 Ant Return Loss, Tx and Rx bands dB 8.0 — — — — — — — —
S21 Tx-Rx Isolation, 1850.6– 1909.4 MHz dB 50 54 — 50 54 — 50 54 —
(Transmit Band)
S21 Tx-Rx Isolation, 1930.6– 1935 MHz dB 40 42 — 40 42 — 38 42 —
(Receive Band)
S21 Tx-Rx Isolation, 1935– 1989.4 MHz dB 40 42 — 40 42 — 40 42 —
(Receive Band)
Absolute Maximum Ratings[4]
Parameter Unit Value
Operating temperature[1] °C -30 to +85
Storage temperature[1] °C -30 to +100
Notes:
1. TC is defined as case temperature, the temperature of the underside of the duplexer where it
makes contact with the circuit board.
2. Specifications are given at operating temperature limits and room temperature. To estimate
performance at some intermediate temperature, use linear interpolation.
3. Specifications are guaranteed over the given temperature range, with the input power to the Tx
port equal to +30 dBm (or lower) over all Tx frequencies. The application of input power levels in
excess of +30 dBm will not destroy the duplexer, but its performance may exceed the specification
limits given above.
4. Operation in excess of any one of these conditions may result in permanent damage to the device.
3
0
-10
-20
-30
-40
-50
-60
-70
INSERTION LOSS AND REJECTION (dB)
1.82 1.84 1.86 1.88 1.90 1.92 1.94 1.96 2.001.98 2.02
FREQUENCY (GHz)
Fi
g
ure 1. Tx and Rx Port Insertion Loss
(
t
yp
ical
)
.
S31
S23
0
-1
-2
-3
-4
-5
INSERTION LOSS AND REJECTION (dB)
1.82 1.84 1.86 1.88 1.90 1.92 1.94 1.96 2.001.98 2.02
FREQUENCY (GHz)
Fi
g
ure 2. Insertion Loss Detail
(
t
yp
ical
)
.
S31
S23
0
-5
-10
-15
-20
RETURN LOSS (dB)
1.82 1.84 1.86 1.88 1.90 1.92 1.94 1.96 2.001.98 2.02
FREQUENCY (GHz)
S11 S22
Fi
g
ure 3. Tx and Rx Port Return Loss
(
t
yp
ical
)
.
0
-5
-10
-15
-20
RETURN LOSS (dB)
1.82 1.84 1.86 1.88 1.90 1.92 1.94 1.96 2.001.98 2.02
FREQUENCY (GHz)
S
33
Fi
g
ure 4. Ant Port Return Loss
(
t
yp
ical
)
.
freq (1.850 GHz to 1.910 GHz)
Figure 5. S11, Tx Port Impedance (typical).
The plots below provide typical
performance obtained from
samples of the HPMD-7904
duplexer.
In order to obtain the best
performance from the
HPMD-7904 duplexer, refer to
Design Note D007, which is
available from your Agilent
Technologies technical support
or sales departments.
freq (1.930 GHz to 1.990 GHz)
Figure 6. S22, Rx Port Impedance (typical).
4
A: freq (1.850 GHz to 1.910 GHz)
B: freq (1.930 GHz to 1.990 GHz)
Figure 7. S33, Ant Port Impedance.
A
B
-20
-30
-40
-50
-60
-70
-80
ISOLATION (dB)
1.82 1.84 1.86 1.88 1.90 1.92 1.94 1.96 2.001.98 2.02
FREQUENCY (GHz)
Fi
g
ure 8. S21, Isolation
(
t
yp
ical
)
.
S
21
0
-5
-10
-15
-20
-25
-30
-35
-40
-45
-50
RETURN LOSS (dB)
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
FREQUENCY (GHz)
Fi
g
ure 9. Wideband Insertion Loss
(
t
yp
ical
)
.
S
31
S
23
-10
-15
-20
-25
-30
-35
-40
-45
-50
ISOLATION (dB)
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
FREQUENCY (GHz)
Fi
g
ure 10. Wideband Isolation
(
t
yp
ical
)
.
S21
5
Note that the specifications given
on page 2 are guaranteed when
the duplexer is mounted on a
ground surface with a hole
pattern like that one shown in
Figure 11. See Design Note D007,
Figure 11. Mounting (grounding) Pattern.
0.4 mm diameter plated through holes
typical spacing is 0.77 to 0.9 mm
Rx output
Ant input/output
Duplexer outline shown in dashed line
Tx input
4.256
5.625 ± 0.05
4.389
3.881
3.119
2.611
4.763
3.494
Port 1
Tx
Port 3
Ant
via hole, 0.28 dia
3 places
Port 2
Rx
2.985
1.016
0.508
0
0
0.508
1.016
3.361
3.869
4.631
5.139
10.859
11.367
11.875 ± 0.05
Notes:
View of the duplexer underside, seen from the top.
All dimensions in millimeters.
Pin assignments are as shown above.
Maximum du
p
lexer hei
g
ht is 1.9 mm.
Figure 12. Outline Drawing.
which is available from your
Agilent Technologies technical
support or sales departments.
Note that it is important that
proper heat sinking be provided
in order to remove the heat
generated in the Tx filter by the
handset’s power amplifier.
Failure to do so may result in
excessive losses, especially at the
top end of the Tx band.
6
Figure 14. Reel Drawing.
R 5:49" +1.00"
-0.50"
+1.00"
-0.50"
R 6.26" 120.00° ± 0.50°
+0.40"
-0"
13.00"
R 6.26" +1.00"
-0.50"
Notes:
1. All dimensions in mm, unless otherwise noted.
2. Material: polystyrene
3. Surface resistivity: 1x10
9
ohm-mm
2
CONVEX = 0.5mm
φ
21.00±0.80
2.00 ± 0.50
R 0.20"
0.22"
+1.00"
-0.50"
R 2.00"
+1.00"
-0.50"
R 2.00"
+0.50"
-0.20"
φ
13.00" +2.00
-0
100.00
+1.00"
-0.50"
R 5.27"
2.20
φ1.50 ± 0.10
2.25 Note 5 6.60
Note 4 12.00 ± 0.10 φ1.50
Note 2
4.00 ± 0.10
Note 6
2.00 ± 0.10
11.50 ± 0.10
Note 6
24.00 ± 0.30
12.20 Note 4
1.75 ± 0.1
0.030±0.05
Notes:
1. All dimensions in mm.
2. 10 sprocket hole pitch accumulative tolerance ± 0.10 mm
3. Camber not exceed 1 mm in 250 mm
4. Pocket dimensions measured on a plane 0.3 mm above the bottom of the pocket.
5. Pocket depth measured from a plane on the inside bottom of the pocket to the top surface of the carrier.
6. Pocket position on relative to sprocket hole measure as true position of pocket, not the pocket hole.
Figure 13. Tape Drawing.
7
Solder Recommendations
The HPMD-7904 FBAR duplexer
(and its variants) is an assembly
consisting of two LCC ceramic
packages, containing the Tx and
Rx filters, mounted to a small
circuit board. Both packages on
the circuit board are mounted in
place using Sn96.5/Ag3.5 solder
(shaded in Table 1).
Figure 15. Device Orientation.
USER
FEED
DIRECTION
COVER TAPE
CARRIER
TAPE
User Feed Direction
Top View
Empty Pocket/Cavity
Leader: 100 pocket – 1 Meter
Trailer: 100 pocket – 1 Meter
End View
REEL
xx
xx 1x
DO
xx
xx 1x
DO
xx
xx 1x
DO
xx
xx 1x
DO
xx
xx 1x
DO
xx
xx 1x
DO
xx
xx 1x
DO
xx
xx 1x
DO
The recommended solder profile
for the FBAR duplexer is shown
in Figure 16. Guidelines and a
typical profile are both shown.
This typical profile was tested on
ten samples of the duplexer, each
of which was subjected to the
profile six times without effect
upon the mechanical or electrical
characteristics of the device.
Alloy type Melting temp. Recommended working Comments
(oC) temperature (oC)
Sn42Bi58 138 160 – 180 Lead free
Sn43Pb43Bi14 144 – 163 165 – 185 Contains lead – some customers prohibit it.
Sn63Pb37 183 200 – 240 Contains lead – some customers prohibit it.
Sn60Pb40 186 200 – 240 Contains lead – some customers prohibit it.
Sn91/Zn9 199 200 – 240 May have oxidation problems
Sn96.2Ag2.5Cu0.8Sb0.5 216 235 – 255 Popular lead free composition
Sn95.8Ag3.5Cu0.7 217 235 – 255 Other alloy ratios are available
Sn96.5Ag3.5 221 240 – 260 Used in the assembly of duplexers
Sn100 232 260 – 280 Too hot – will melt the duplexer
Sn95Sb5 235 260 – 280 Too hot – will melt the duplexer
Sn97Cu3 240 260 – 300 Too hot – will melt the duplexer
Table 1. Solder Compositions
Solder temperatures and times in
excess of those given in the
guidelines of Table 1 may result
in damage to the duplexer or
changes in its characteristics.
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(408) 654-8675
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6271 2451
India, Australia, New Zealand: (+65) 6271 2394
Japan: (+81 3) 3335-8152(Domestic/International), or
0120-61-1280(Domestic Only)
Korea: (+65) 6271 2194
Malaysia, Singapore: (+65) 6271 2054
Taiwan: (+65) 6271 2654
Data subject to change.
Copyright © 2002 Agilent Technologies, Inc.
May 30, 2002
5988-6610EN
600500400300200100
60 to 120 sec.
-6°C/sec. max
3°C/sec. max
0
0
50
100
150
200
250
TIME, seconds
TEMPERATURE, °C
235°C ± 5°C
125°C ± 25°C
217°C
10 to 20 sec.
Guidelines
Tested profile
120 sec. max.
Figure 16. Recommended Solder Profile.
