TAPE Attachment Method
Part Number: 371824B00034
(Vis Number: 028134)
This part is in stock and available for immediate delivery:
Contact your local sales rep
BGA Surface Tape Type Heat Sink Finish Part Class
Plastic T410 Black Anodize A
Features and Benefits
• Configurations are available for a wide range of BGA package
sizes
• Tape mounted versions eliminate the need for mounting holes
in the PC Board
• These Heat Sinks can be used with either plastic or
metal/ceramic BGA Packages depending on tape used
• These Heat Sinks are compatible with Ther-a-grip tapes
Width Length Height Fin Thickness
Across Width
Fin Thickness
Across Length Base Thickness # of fins
across width
# of fins
across length
35mm 35mm 7mm 0.97mm 1.14mm 2.03mm 11 11
Mechanical Outline Drawing
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Unless otherwise shown, tolerances are ±0.38(±.015)
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Thermal Performance
*θn**θf
31.9 9.67
*Natural convection thermal resistance is based on a 75 °C heat sink temperature rise.
**Forced convection thermal resistance based on an entering 1.0 m/s (200 lfm) airflow.
Due to various heat dissipation paths within a BGA device, please test the heat sink in your application.
This data sheet represents only one of a broad range of products we make to cool electronics.
Our representatives can help you configure a complete cooling solution for your individual applications.
Visit us at www.aavidthermalloy.com • info@aavid.com • ©2002 Aavid Thermalloy, LLC
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