©2002 Fairchild Semiconductor Corporation
www.fairchildsemi.com
Rev.1.0.2
Features
Fixed Frequency
Internal Burst Mode Controller for Stand-by Mode
Pulse By Pulse Over Current Limiting
Over Current Protection(Auto Restart Mode)
Over Voltage Protection (Auto Restart Mode)
Over Load Protection(Auto Restart Mode)
Internal Thermal Shutdown Function(Latch Mode)
Unde r Voltage Lo ck ou t
Internal High Voltage Sense FET
•Soft Start
Description
The Fairchild Power Switch(FPS) product family is specially
designed for an off line SMPS with minimal external
components. The Fairchild Power Switch(FPS) consist of
high voltage power SenseFET and current mode PWM IC.
Included PWM controller features integrated fixed oscillator,
under voltage lock out, leading edge blanking, optimized gate
turn-on/turn-off driver, thermal shut down protection, over
voltage protection, and temperature compensated precision
current sources for loop compensation and fault protection
circuitry. compared to discrete MOSFET and controller or
RCC switching converter solution, a Fairchild Power
Switch(FPS) can reduce total component count, design size,
and weight and at the same time increase efficiency,
productivity, and system reliability. It has a basic platform
well suited for cost effective LCD monitor power supply.
TO-220F-5L
1
1. Drain 2. GND 3. VCC
4. Feedback 5. S oftSt art
Internal Block Diagram
S
R
Q
S
R
QS
R
QTSD
(Tj=160)
Ifb
1
11
13
33
3
5
55
5
4
44
4
2
22
2
Vref
Rsenese
2.5R
R
Vref
Internal
Bias Vref
UVLO
Ron
Roff
PWM
OCL
Burst mode
controller
Filter
(130nsec)
Power-on
Reset
(Vcc=6.5V)
UVLO Reset
(Vcc=9V)
OLP
OVP
Vth=7.5V
Vcc
Vth=33V
Vth=2V
Vfb Offset
Idelay
Vcc
Vfb
Vth=1V
Vcc
Vth=11V/12V
OSC
Vref
Drain
VCC
GND
SoftStart
Feedbock
FS6M12653RTC
Fairchil d Power Switch(FPS)
FS6M12653RTC
2
Absolute Maximum Ratings
(Ta=25°C, unless otherwise specified)
Notes:
1. Repetitive rating: Pulse width limited by maximum junction temperature
2. L=81mH, starting Tj=25°C
3. L=13uH, starting Tj=25 °C
Characteristic Symbol Value Unit
Maximum Drain Voltage VD, MAX 650 V
Drain-Gate Voltage (RGS=1M)V
DGR 650 V
Gate-Source (GND) Voltage VGS ±30 V
Drain Current Pulsed (1) IDM 21.2 ADC
Continuous Drain Current (Tc = 25°C) ID5.3 ADC
Continuous Drain Current (TC=100°C) ID3.4 ADC
Single Pulsed Avalanche Current(3)(Energy (2))I
AS(EAS) 27(960) A(mJ)
Maximum Supply Voltage VCC, MAX 35 V
Input Voltage Range VFB 0.3 to VCC V
VSS 0.3 to 10 V
Total Power Dissipation PD(Watt H/S) 50 W
Darting 0.4 W/°C
Operating Junction Temperature Tj+150 °C
Operating Ambient Temperature TA25 to +85 °C
Storage Temperature Range TSTG 55 to +150 °C
FS6M12653RTC
3
Electrical Characteristics (SFET part)
(Ta=25°C unless otherwise specified)
Note:
1. Pulse test : Pulse wid th 300µS, duty 2%
2.
Parameter Symbol Condition Min. Typ. Max. Unit
Drain-Source Breakdown Voltage BVDSS VGS=0V, ID=250µA 650 - - V
Zero Gate Voltage Drain Current IDSS VDS=650V, VGS=0V - - 200 µA
VDS=520V
VGS=0V, TC=125°C- - 300 µA
Static Drain-source On Resistance (1) RDS(ON) VGS=10V, ID=1.8A - 0.73 0.9
Forward Trans Conductance (2) gfs VDS=50V, ID=1.8A - - - S
Input Capacitance Ciss VGS=0V, VDS=25V,
f = 1MHz
- 1820 - pFOutput Capacitance Coss - 185 -
Reverse Transfer Capacitance Crss - 32 -
Turn On Delay Time td(on) VDD=325V, ID=6.5A
(MOSFET switching
time are essentially
independent of
operating temperature)
-38-
nS
Rise Time tr - 120 -
Turn Off Delay Time td(off) - 200 -
Fall Time tf - 100 -
Total Gate Charge
(Gate-Source+Gate-Drain) Qg VGS=10V, ID=6.5A,
VDS=520V (MOSFET
Switching time are
Essentially independent of
Operating temperature)
-60-
nC
Gate Source Charge Qgs - 10 -
Gate Drain (Miller) Charge Qgd - 30 -
S1
R
----=
FS6M12653RTC
4
Electrical Characteristics (Continued)
(Ta=25°C unless otherwise specified)
Notes:
1. These parameters are the current flowing in the Control IC.
2. These parameters, although guaranteed at the design, are not 100% tested in production.
3. These parameters, although guaranteed, are tested in EDS(wafer test) process.
4. These parameters indicate Inductor current.
Parameter Symbol Condition Min. Typ. Max. Unit
UVLO SECTION
Start Threshold Voltage VSTART VFB = GND 141516V
Stop Threshold Voltage VSTOP VFB = GND 8 9 10 V
OSCILLATOR SECTION
Initial Frequency FOSC - 637077kHz
Voltage Stability FSTABLE 12V VCC 23V 0 1 3 %
Temperature Stability (2) FOSC -25°C Ta 85°C0±10%
Maximum Duty Cycle DMAX - 758085%
Minimum Duty Cycle DMIN ---0%
FEEDBACK SECTION
Feedback Source Current IFB VFB = GND 0.7 0.9 1.1 mA
Shutdown Feedback Voltage VSD VFB 6.9V 6.9 7.5 8.1 V
Shutdown Delay Current IDELAY VFB = 5V 3.2 4.0 4.8 µA
SOFTSTART SECTION
Softstart Voltage VSS VFB = 2 4.7 5.0 5.3 V
Softstart Current ISS VSS = V 0.8 1.0 1.2 mA
BURST MODE SECTION
Burst Mode Low Threshold Voltage VBURL VFB = 0V 10.4 11.0 11.6 V
Burst Mode High Threshold Voltage VBURH VFB = 0V 11.4 12.0 12.6 V
Burst Mode Enable Feedback Voltage VBEN VCC = 10.5V 0.7 1.0 1.3 V
Burst Mode Peak Current Limit (4) IBURPK VCC = 10.5V, VFB = 0V 0.46 0.6 0.74 A
Burst Mode Frequency FBUR VCC = 10.5V, VFB = 0V 63 70 77 KHz
CURRENT LIMIT(SELF-PROTECTION)SECTION
Peak Current Limit (4) IOVER - 2.82 3.2 3.58 A
PROTECTION SECTION
Over Voltage Protection VOVP VCC 29V 29 33 37 V
Over Current Latch Voltage (3) VOCL - 1.8 2.0 2.2 V
Thermal Shutdown Temp (2) TSD - 140 160 - °C
TOTAL DEVICE SECTION
Start Up Current ISTART VFB = GND, VCC = 14V - 0.1 0.17 mA
Operating Supply Current (1) IOP VFB = GND, VCC = 16V -1015mAIOP(MIN) VFB = GND, VCC = 12V
IOP(MAX) VFB = GND, VCC = 30V
FS6M12653RTC
5
Typica l Perfo rma nce Characteristics
-25 0 25 50 75 100 125 150
0.050
0.075
0.100
0.125
0.150 [mA] St art Up Curr ent vs. Temp
Temp
-25 0 25 50 75 100 125 150
9.0
9.5
10.0
10.5
11.0 [mA] Oper ating Curre nt vs. Temp
Temp
-25 0 25 50 75 100 125 150
14.0
14.5
15.0
15.5
16.0 [V] Star t T hreshold Voltage vs. T emp
Temp
-25 0 25 50 75 100 125 150
8.0
8.5
9.0
9.5
10.0 [V] Stop Threshold Voltage vs. Temp
Temp
-25 0 25 50 75 100 125 150
64
66
68
70
72
74
76 [KHz] Initia l F re qen c y vs . Temp
Temp
-25 0 25 50 75 100 125 150
79.0
79.5
80.0
80.5
81.0 [%] M aximum Dut y vs. Temp
Temp
Figure 1. Start Up Current vs. Temp Figure 2. Operating Current vs. Temp
Figure 3. Start Threshold Voltage vs. Temp Figure 4. Stop Threshold Voltage vs. Temp
Figure 5. Initial Freqency vs. Temp Figure 6. Maximum Duty vs. Temp
FS6M12653RTC
6
Typica l Perfo rmance Characteristics (Continued)
-25 0 25 50 75 100 125 150
0.20
0.25
0.30
0.35
0.40
0.45 [V] Feedback Of fset Voltage vs. T emp
Temp
-25 0 25 50 75 100 125 150
0.7
0.8
0.9
1.0
1.1 [mA] Feedback Source Cur r ent vs. Temp
Temp
-25 0 25 50 75 100 125 150
3.2
3.6
4.0
4.4
4.8 [uA] Sh u tDown Delay Current vs. Temp
Temp
-25 0 25 50 75 100 125 150
7.40
7.45
7.50
7.55
7.60
[V] ShutDown Feedback Voltage vs. Temp
Temp
-25 0 25 50 75 100 125 150
4.98
4.99
5.00
5.01
5.02 [V] Soft star t Voltage vs. Temp
Temp
Figure 7. Feedback O ffset Voltage vs. Temp Figure 8. Feedback Source Current vs. Temp
Figure 9. ShutDown Delay Current vs. Temp Figure 10. ShutDown Feedback Voltage vs. Temp
Figure 11. Softstart Voltage vs. Temp Figure 12. Over Voltage Protection vs. Temp
-25 0 25 50 75 100 125 150
32.0
32.5
33.0
33.5
34.0
[V]
Tem
p
FS6M12653RTC
7
Typica l Perfo rmance Characteristics (Continued)
-25 0 25 50 75 100 125 150
10.8
10.9
11.0
11.1
11.2 [V] Burst M ode Low Volt age vs. T emp
Temp
-25 0 25 50 75 100 125 150
11.8
11.9
12.0
12.1
12.2 [V] Burst M ode High Voltage vs. Temp
Temp
Figure 13. Burst Mode Low Voltage vs. Temp Figure 14. Burst Mode High Voltage vs. Temp
Figure 15. Burst Mode Peak Current vs. Temp
-25 0 25 50 75 100 125 150
0.48
0.54
0.60
0.66
0.72 [A] Burst Mode Peak Current vs. Temp
Tem
p
-25 0 25 50 75 100 125 150
0.48
0.54
0.60
0.66
0.72 [A] Burst Mode Peak Current vs. Temp
Tem
p
Figure 16. Burst Mode Peak Current vs. Temp
FS6M12653RTC
8
Package Dimensions
TO-220F-5L
FS6M12653RTC
9
Package Dimensions (Continued)
TO-220F-5L(Forming)
FS6M12653RTC
3/8/02 0.0m 001
Stock#DSxxxxxxxx
2002 Fairchild Semicond uctor Corporation
LIFE SU PP ORT POL ICY
FAIRCHILD’S PRODUCTS AR E NOT AUTHORIZED FOR USE AS C RITICAL COMPONENTS I N LIFE S UPPORT DEVICE S
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORA TION. As used he rein :
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, and (c) whose failure to
perform when properly used in accordance with
instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the
user.
2. A critical component in any component of a life support
device or syst em who se failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effec tiv ene ss.
www.fairchildsemi.com
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRO DUCTS HEREIN TO IMPROVE RELIABILITY, FUN C TION OR DESIGN . FAIRCHILD DO ES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER
DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIG HTS, NOR THE RIGHTS OF OTHERS.
Ordering Information
TU : Non Forming Type
YDT : Formi ng Type
Product Number Package Marking Code BVdss Rds(on)
FS6M12653RTC-TU TO-220F-5L 6M12653R
C650V 0.7
FS6M12653RTC-YDT TO-220F-5L(Forming)