Package Dimensions
CAUTION: INGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN – 1142 for additional details.
HLMP-HG65, HLMP-HM65, HLMP-HB65
Precision Optical Performance Red Green and Blue
New 5mm Standard Oval LEDs
Data Sheet
Notes:
All dimensions in millimeters (inches).
Description
These Precision Optical Performance Oval LEDs are spe-
ci cally designed for full color/video and passenger in-
formation signs. The oval shaped radiation pattern and
high luminous intensity ensure that these devices are
excellent for wide  eld of view outdoor applications
where a wide viewing angle and readability in sunlight
are essential. The package epoxy contains both UV-A
and UV-B inhibitors to reduce the e ects of long term
exposure to direct sunlight.
Applications
• Full color signs
Features
• Well de ned spatial radiation pattern
• High brightness material
• Available in Red, Green and Blue color
Red AlInGaP 626 nm
Green InGaN 525nm
Blue InGaN 470nm
• Superior resistance to moisture
• Stando Package
• Tinted and di used
• Typical viewing angle 40° x 100°
7.00 ± 0.20
0.276 ± 0.008
1.30 ± 0.20
0.051 ± 0.008
1.00
0.039
24.00
0.945
cathode lead
0.50 ± 0.10
0.020 ± 0.004
3.80 ± 0.20
0.150 ± 0.008
1.02
0.040
2.54 ± 0.30
0.10 ± 0.012
sq. typ.
max.
min.
min.
10.80 ± 0.50
0.425 ± 0.020
5.20 ± 0.20
0.205 ± 0.008
MEASURED AT BASE OF LENS.
2
Device Selection Guide
Part Number
Color and Dominant Wavelength
λd (nm) Typ
Luminous Intensity Iv
(mcd) at 20 mA-Min [1]
Luminous Intensity Iv
(mcd) at 20 mA-Max [1]
HLMP-HG65-VY0xx Red 626 1150 2400
HLMP-HM65-Y30xx Green 525 1990 5040
HLMP-HB65-QU0xx Blue 470 460 1150
Tolerance for each intensity limit is ± 15%.
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested in pulsing condition.
Part Numbering System
Note:
Please refer to AB 5337 for complete information about part numbering system.
HLMP-H x 65 - x x x xx
Packaging Option
ZZ: Flexi Ammopack
Color Bin Selection
0: Open distribution
Maximum Intensity Bin
0: No maximum intensity limit
Minimum Intensity Bin
Color
G: Red 626
M: Green 525
B: Blue 470
Package
H: 5mm Standard Oval 40° x 100°
Refer to Device Selection Guide.
DD: Ammopacks
5: Standoff
Standoff/Non Standoff
3
Absolute Maximum Ratings
TJ = 25°C
Parameter Red Green and Blue Unit
DC Forward Current [1] 50 30 mA
Peak Forward Current 100 [2] 100 [3] mA
Power Dissipation 120 116 mW
Reverse Voltage 5 (IR = 100 μA) 5 (IR = 10 μA) V
LED Junction Temperature 130 110 °C
Operating Temperature Range -40 to +100 -40 to +85 °C
Storage Temperature Range -40 to +100 -40 to +100 °C
Notes:
1. Derate linearly as shown in Figure 4.
2. Duty Factor 30%, frequency 1KHz.
3. Duty Factor 10%, frequency 1KHz.
Electrical / Optical Characteristics
TJ = 25°C
Parameter Symbol Min. Typ. Max. Units Test Conditions
Forward Voltage
Red
Green
Blue
VF
1.8
2.8
2.8
2.1
3.2
3.2
2.4
3.8
3.8
VI
F = 20 mA
Reverse Voltage
Red
Green & blue
VR
5
5
V
IF = 100 μA
IF = 10 μA
Dominant Wavelength [1]
Red
Green
Blue
λd618
520
460
626
525
470
630
540
480
nm IF = 20 mA
Peak Wavelength
Red
Green
Blue
λPEAK 634
516
464
nm Peak of Wavelength of Spectral
Distribution at IF = 20 mA
Thermal Resistance RθJ-PIN 240 °C/W LED Junction-to-Pin
Luminous E cacy [2]
Red
Green
Blue
ηV150
530
65
lm/W Emitted Luminous Power/Emitted
Radiant Power
Notes:
1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/ηV where IV is the luminous intensity in candelas and ηV is
the luminous e cacy in lumens/watt.
4
AlInGaP Red
Figure 1. Relative Intensity vs Wavelength Figure 2. Forward Current vs Forward Voltage
Figure 3. Relative Intensity vs Forward Current Figure 4. Maximum Forward Current vs Ambient Temperature
0
10
20
30
40
50
60
0 20 40 60 80 100
TA- AMBIENT TEMPERATURE - C
IF MAX
.
- MAXIMUM FORWARD CURRENT - mA
0
0.2
0.4
0.6
0.8
1
550 600 650 700
WAVELENGTH - nm
RELATIVE INTENSITY
0
20
40
60
80
100
0123
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0 20406080100
DC FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
5
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630
WAVELENGTH - nm
RELATIVE INTENSITY
GREENBLUE
0
5
10
15
20
25
30
35
0 20 40 60 80 100
TA - AMBIENT TEMPERATURE - °C
IFmax - MAXIMUM FORWARD CURRENT - mA
0
20
40
60
80
100
012345
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 20 40 60 80 100 120
DC FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20mA)
GREEN
BLUE
InGaN Blue and Green
Figure 5. Relative Intensity vs Wavelength Figure 6. Forward Current vs Forward Voltage
Figure 7. Relative Intensity vs Forward Current Figure 8. Maximum Forward Current vs Ambient Temperature
Figure 9. Relative dominant wavelength vs Forward Current
-10
-8
-6
-4
-2
0
2
4
6
8
10
0 20 40 60 80 100
FORWARD CURRENT-mA
RELATIVE DOMINANT WAVELENGTH SHIFT -nm
GREEN
BLUE
6
Figure 10. Radiation Pattern – Major Axis Figure 11. Radiation Pattern – Minor Axis
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSITY
RED
BLUE
GREEN
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSITY
RED
BLUE
GREEN
0.1
1
10
-40 -20 0 20 40 60 80 100 120 140
TJ - JUNCTION TEMPERATURE - °C
RELATIVE LIGHT OUTPUT
(NORMALIZED AT TJ = 25°C)
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
-40 -20 0 20 40 60 80 100 120 140
TJ -JUNCTION TEMPERATURE
FORWARD VOLTAGE SHIFT-V
RED
BLUE
GREEN
RED
GREEN
BLUE
Figure12. Relative Light Output vs Junction Temperature Figure 13. Relative Forward Voltage vs Junction Temperature
7
Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio)
Bin
Intensity (mcd) at 20 mA
Min Max
Q 460 550
R 550 660
S 660 800
T 800 960
U 960 1150
V 1150 1380
W 1380 1660
X 1660 1990
Y 1990 2400
Z 2400 2900
1 2900 3500
2 3500 4200
3 4200 5040
Tolerance for each bin limit is ± 15%
VF Bin Table (V at 20mA)
Bin ID Min Max
VD 1.8 2.0
VA 2.0 2.2
VB 2.2 2.4
Notes:
1. Tolerance for each bin limit is ±0.05V
2. VF binning only applicable to Red color.
Red Color Range
Min
Dom
Max
Dom Xmin Ymin Xmax Ymax
618 630 0.6872 0.3126 0.6890 0.2943
0.6690 0.3149 0.7080 0.2920
Tolerance for each bin limit is ± 0.5nm
Green Color Bin Table
Bin
Min
Dom
Max
Dom Xmin Ymin Xmax Ymax
1 520.0 524.0 0.0743 0.8338 0.1856 0.6556
0.1650 0.6586 0.1060 0.8292
2 524.0 528.0 0.1060 0.8292 0.2068 0.6463
0.1856 0.6556 0.1387 0.8148
3 528.0 532.0 0.1387 0.8148 0.2273 0.6344
0.2068 0.6463 0.1702 0.7965
4 532.0 536.0 0.1702 0.7965 0.2469 0.6213
0.2273 0.6344 0.2003 0.7764
5 536.0 540.0 0.2003 0.7764 0.2659 0.6070
0.2469 0.6213 0.2296 0.7543
Tolerance for each bin limit is ± 0.5nm.
Blue Color Bin Table
Bin
Min
Dom
Max
Dom Xmin Ymin Xmax Ymax
1 460.0 464.0 0.1440 0.0297 0.1766 0.0966
0.1818 0.0904 0.1374 0.0374
2 464.0 468.0 0.1374 0.0374 0.1699 0.1062
0.1766 0.0966 0.1291 0.0495
3 468.0 472.0 0.1291 0.0495 0.1616 0.1209
0.1699 0.1062 0.1187 0.0671
4 472.0 476.0 0.1187 0.0671 0.1517 0.1423
0.1616 0.1209 0.1063 0.0945
5 476.0 480.0 0.1063 0.0945 0.1397 0.1728
0.1517 0.1423 0.0913 0.1327
Tolerance for each bin limit is ± 0.5nm
Note:
1. All bin categories are established for classi cation of products.
Products may not be available in all bin categories. Please contact
your Avago representative for further information.
8
Avago Color Bin on CIE 1931 Chromaticity Diagram
4
Green 5
4
3
2
1
Red
Blue
5
3
21
0.000
0.200
0.400
0.600
0.800
1.000
0.000 0.100 0.200 0.300 0.400 0.500 0.600 0.700 0.800
X
Y
9
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
• Care must be taken during PCB assembly and
soldering process to prevent damage to the LED
component.
• LED component may be e ectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat
source (soldering iron’s tip) to the body is 1.59mm.
Soldering the LED using soldering iron tip closer than
1.59mm might damage the LED.
1.59mm
AlInGaP Device
CATHODE
InGaN Device
ANDOE
Note:
1. PCB with di erent size and design (component density) will have
di erent heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
pro le again before loading a new type of PCB.
2. Avago Technologies’ AllnGaP high brightness LED are using high
e ciency LED die with single wire bond as shown below. Customer
is advised to take extra precaution during wave soldering to ensure
that the maximum wave temperature does not exceed 260°C and
the solder contact time does not exceeding 5sec. Over-stressing the
LED during soldering process might cause premature failure to the
LED due to delamination.
Avago Technologies LED con guration
• Any alignment  xture that is being applied during
wave soldering should be loosely  tted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during
wave soldering process.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment  xture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using re ow soldering prior to insertion the TH LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause di culty inserting the TH LED.
Refer to application note AN5334 for more information about
soldering and handling of high brightness TH LED lamps.
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature 105 °C Max. -
Preheat time 60 sec Max -
Peak temperature 260 °C Max. 260 °C Max.
Dwell time 5 sec Max. 5 sec Max
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
• Wave soldering parameters must be set and
maintained according to the recommended
temperature and dwell time. Customer is advised
to perform daily check on the soldering pro le to
ensure that it is always conforming to recommended
soldering conditions.
10
Ammo Packs Drawing
6.35±1.30
0.25±0.0512
12.70±1.00
0.50±0.0394
CATHODE
20.50±1.00
0.8071±0.0394
4.00±0.20
0.1575±0.008
0.70±0.20
0.0276±0.0079
12.70±0.30
0.50±0.0118
9.125±0.625
0.3593±0.0246
18.00±0.50
0.7087±0.0197
TYP
Ø
VIEW A - A
AA
Note: All dimensions in millimeters (inches)
Example of Wave Soldering Temperature Pro le for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C ± 5°C
(maximum peak temperature = 260°C)
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
60 sec Max
TIME (sec)
260°C Max
105°C Max
TEMPERATURE (°C)
11
Packaging Box for Ammo Packs
LABEL ON THIS
SIDE OF BOX
FROM LEFT SIDE OF BOX
ADHESIVE TAPE MUST BE
FACING UPWARDS.
ANODE LEAD LEAVES
THE BOX FIRST.
Note: For InGaN device, the ammo pack packaging box contain ESD logo
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Refer to below information
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e3 max temp 260C
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR
AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAIN-
TENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS.
CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUP-
PLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
Acronyms and De nition:
BIN:
(i) Color bin only or VF bin only
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and no
color bin)
OR
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color bin
and VF bin)
(ii) Avago Baby Label (Only available on bulk packaging)
Example:
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
VB: VF bin “VB”
2: Color bin 2 only
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
Customer P/N:
Supplier Code:
QUANTITY: Packing Quantity
CAT: Intensity Bin
BIN: Refer to below information
DATECODE: Date Code
RoHS Compliant
e3 max tem
p
260C
Lam
p
s Bab
y
Label
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved.
AV02-1485EN - April 20, 2011