E Prepared (also subject responsible if other) MICJOHH Approved (also subject responsible if other) Prepared Checked Ericsson Internal PRODUCT SPECIFICATION No. Ericsson Internal 1/1-BMR 603 124Technical Uen TABLE OF CONTENTS Specification Date No. Rev BMR 603 1204 series Direct Converters EAB/FJB/GMF (Natalie Johansson) EANKALL EAB/FAC/P Susanne Eriksson 2009-07-31 C Uen BPOW 00201-00152 Approved Date Input 32-60 V, Triple Output / 33 W Checked Reference 1 (4) 2 (2) EN/LZT 146 406 R1B August 2009 (c) Ericsson ABReference Rev Key Features * Low profile SMD 50.2 x 46.0 x 8.5 mm (1.98 x 1.81 x 0.34 in.) * Designed for radio link applications * Three separately regulated outputs that can be adjusted independently * High efficiency, typ. 87.8 % at full load * 1500 Vdc input to output isolation * insulation according to IEC/EN/UL 60950 * More than 1.6 million hours predicted MTBF at +40C ambient temperature General Characteristics * * * * * * Input under voltage protection Wide range multiple output voltage adjust Output short-circuit protection Remote control Highly automated manufacturing ensures quality ISO 9001/14001 certified supplier Design for Environment Meets requirements in hightemperature lead-free soldering processes. Contents Ordering Information General Information Safety Specification Absolute Maximum Ratings ............................................................. 2 ............................................................. 2 ............................................................. 3 ............................................................. 4 Electrical Specification 5V-4A, 3.3V-4A, 9V-1.5A / 33W BMR 603 1204/1................................... 5 EMC Specification Operating Information Thermal Consideration Connections Mechanical Information Soldering Information Delivery Information Product Qualification Specification ........................................................... 10 ........................................................... 11 ........................................................... 12 ........................................................... 13 ........................................................... 14 ........................................................... 16 ........................................................... 17 ........................................................... 18 Ericsson Internal PRODUCT SPECIFICATION E Prepared (also subject responsible if other) No. MICJOHH 1/1301-BMR 603Technical 1204 Uen Specification Approved Checked BMR 603 1204 series Direct Converters EAB/FJB/GMF (Natalie Johansson) EANKALL Input 32-60 V, Triple Output / 33 W Rev 2009-07-31 2 Reference EN/LZT 146 406 R1B August 2009 C (c) Ericsson AB Quality Statement Ordering Information Product program BMR 603 1204/1 Date 2 (4) Output 5V, 3.3V, 9V / 33W General Information The products are designed and manufactured in an industrial environment where quality systems and methods like ISO 9000, 6 (sigma), and SPC are intensively in use to boost the continuous improvements strategy. Infant mortality or early failures in the products are screened out and they are subjected to an ATE-based final test. Conservative design rules, design reviews and product qualifications, plus the high competence of an engaged work force, contribute to the high quality of our products. Reliability The Mean Time Between Failure (MTBF) is calculated at full output power and an operating ambient temperature (TA) of +40C, which is a typical condition in Information and Communication Technology (ICT) equipment. Different methods could be used to calculate the predicted MTBF and failure rate which may give different results. Ericsson Power Modules currently uses Telcordia SR332. Predicted MTBF for the series is: 1.6 million hours according to Telcordia SR332, issue 1, Black box technique. Telcordia SR332 is a commonly used standard method intended for reliability calculations in ICT equipment. The parts count procedure used in this method was originally modelled on the methods from MIL-HDBK-217F, Reliability Predictions of Electronic Equipment. It assumes that no reliability data is available on the actual units and devices for which the predictions are to be made, i.e. all predictions are based on generic reliability parameters. Compatibility with RoHS requirements The products are compatible with the relevant clauses and requirements of the RoHS directive 2002/95/EC and have a maximum concentration value of 0.1% by weight in homogeneous materials for lead, mercury, hexavalent chromium, PBB and PBDE and of 0.01% by weight in homogeneous materials for cadmium. Exemptions in the RoHS directive utilized in Ericsson Power Modules products include: Lead in high melting temperature type solder (used to solder the die in semiconductor packages) Lead in glass of electronics components and in electronic ceramic parts (e.g. fill material in chip resistors) Lead as an alloying element in copper alloy containing up to 4% lead by weight (used in connection pins made of Brass) Warranty Warranty period and conditions are defined in Ericsson Power Modules General Terms and Conditions of Sale. Limitation of Liability Ericsson Power Modules does not make any other warranties, expressed or implied including any warranty of merchantability or fitness for a particular purpose (including, but not limited to, use in life support applications, where malfunctions of product can cause injury to a person's health or life). (c) Ericsson AB 2009 The information and specifications in this technical specification is believed to be correct at the time of publication. However, no liability is accepted for inaccuracies, printing errors or for any consequences thereof. Ericsson AB reserves the right to change the contents of this technical specification at any time without prior notice. Safety Specification General information Ericsson Power Modules DC/DC converters and DC/DC regulators are designed in accordance with safety standards IEC/EN/UL60950, Safety of Information Technology Equipment. IEC/EN/UL60950 contains requirements to prevent injury or damage due to the following hazards: * * * * * * Electrical shock Energy hazards Fire Mechanical and heat hazards Radiation hazards Chemical hazards On-board DC-DC converters and DC/DC regulators are defined as component power supplies. As components they cannot fully comply with the provisions of any Safety requirements without "Conditions of Acceptability". Clearance between conductors and between conductive parts of the component power supply and conductors on the board in the final product must meet the applicable Safety requirements. Certain conditions of acceptability Ericsson Internal PRODUCT SPECIFICATION E Prepared (also subject responsible if other) No. MICJOHH 1/1301-BMR 603Technical 1204 Uen Specification Approved Checked BMR 603 1204 series Direct Converters EAB/FJB/GMF (Natalie Johansson) EANKALL Input 32-60 V, Triple Output / 33 W apply for component power supplies with limited stand-off (see Mechanical Information for further information). It is the responsibility of the installer to ensure that the final product housing these components complies with the requirements of all applicable Safety standards and Directives for the final product. Component power supplies for general use should comply with the requirements in IEC60950, EN60950 and UL60950 "Safety of information technology equipment". There are other more product related standards, e.g. IEEE802.3af "Ethernet LAN/MAN Data terminal equipment power", and ETS300132-2 "Power supply interface at the input to telecommunications equipment; part 2: DC", but all of these standards are based on IEC/EN/UL60950 with regards to safety. Ericsson Power Modules DC/DC converters and DC/DC regulators are normally UL60950 recognized and certified in accordance with EN60950. This converter is CB certified in accordance with EN60950 The flammability rating for all construction parts of the products meets requirements for V-0 class material according to IEC 60695-11-10. The products should be installed in the end-use equipment, in accordance with the requirements of the ultimate application. Normally the output of the DC/DC converter is considered as SELV (Safety Extra Low Voltage) and the input source must be isolated by minimum Double or Reinforced Insulation from the primary circuit (AC mains) in accordance with IEC/EN/UL60950. Isolated DC/DC converters It is recommended that a slow blow fuse with a rating twice the maximum input current per selected product be used at the input of each DC/DC converter. If an input filter is used in the circuit the fuse should be placed in front of the input filter. In the rare event of a component problem in the input filter or in the DC/DC converter that imposes a short circuit on the input source, this fuse will provide the following functions: * * Isolate the faulty DC/DC converter from the input power source so as not to affect the operation of other parts of the system. Protect the distribution wiring from excessive current and power loss thus preventing hazardous overheating. The galvanic isolation is verified in an electric strength test. The test voltage (Viso) between input and output is 1500 Vdc or 2250 Vdc for 60 seconds (refer to product specification). Leakage current is less than 1 A at nominal input voltage. Date 2009-07-31 Rev 3 (4) 3 Reference EN/LZT 146 406 R1B August 2009 C (c) Ericsson AB 24 V DC systems The input voltage to the DC/DC converter is SELV (Safety Extra Low Voltage) and the output remains SELV under normal and abnormal operating conditions. 48 and 60 V DC systems If the input voltage to the DC/DC converter is 75 Vdc or less, then the output remains SELV (Safety Extra Low Voltage) under normal and abnormal operating conditions. Single fault testing in the input power supply circuit should be performed with the DC/DC converter connected to demonstrate that the input voltage does not exceed 75 Vdc. If the input power source circuit is a DC power system, the source may be treated as a TNV2 circuit and testing has demonstrated compliance with SELV limits and isolation requirements equivalent to Basic Insulation in accordance with IEC/EN/UL60950. Non-isolated DC/DC regulators The input voltage to the DC/DC regulator is SELV (Safety Extra Low Voltage) and the output remains SELV under normal and abnormal operating conditions. Ericsson Internal PRODUCT SPECIFICATION E 1 (7) Prepared (also subject responsible if other) No. EAB/FJB/GMG Tord Johansson 2/1301-BMR 603Technical 1204/1 UenSpecification Approved Checked BMR 603 1204 series Direct Converters EAB/FJB/GM (Natalie Johansson) (MICHORG) Input 32-60 V, Triple Output / 33 W Date Rev 2009-08-11 4 Reference EN/LZT 146 406 R1B August 2009 B (c) Ericsson AB Absolute Maximum Ratings Characteristics min max Unit TP1 -40 +130 C C Operating Temperature (see Thermal Consideration section) typ TS Storage temperature -40 +125 VI Input voltage -0.5 +72 V input to output 1500 V PCB bottom side 500 V 100 V -0.5 10 V -0.5 -0.5 -0.5 6 6.6 18 V V V Viso Isolation voltage Vtr Input voltage transient (tp 100 ms) VRC Remote Control pin voltage (see Operating Information section) Vadj Adjust pin voltage (see Operating Information section) Vadj 1 Vadj 2 Vadj 3 Stress in excess of Absolute Maximum Ratings may cause permanent damage. Absolute Maximum Ratings, sometimes referred to as no destruction limits, are normally tested with one parameter at a time exceeding the limits of Output data or Electrical Characteristics. If exposed to stress above these limits, function and performance may degrade in an unspecified manner. Fundamental Circuit Diagram +Out2 Control Vadj 2 +Out1 +In Rtn Control -In +Out3 RC Vcc-prim Control Vadj 1 Vadj 3 Ericsson Internal PRODUCT SPECIFICATION E 2 (7) Prepared (also subject responsible if other) No. EAB/FJB/GMG Tord Johansson 2/1301-BMR 603Technical 1204/1 UenSpecification Approved Checked BMR 603 1204 series Direct Converters EAB/FJB/GM (Natalie Johansson) (MICHORG) Input 32-60 V, Triple Output / 33 W Date Rev 5 Reference EN/LZT 146 406 R1B August 2009 2009-08-11 B (c) Ericsson AB 5V max 4A, 3.3V max 4A, 9V max 1.5A / max 33W Electrical Specification BMR 603 1204/1 TP1 = -30 to +110C, VI = 32 to 60 V, unless otherwise specified under Conditions. Typical values given at: TP1 = +25C, VI= 48 VI and nom IO (nom IO1 = nom IO2 = 2.83 A, nom IO3 = 1.06 A), unless otherwise specified under Conditions. Characteristics Conditions min typ max Unit VI Input voltage range 60 V VIoff Turn-off input voltage Decreasing input voltage 24.5 32 26 27.5 V VIon Turn-on input voltage Increasing input voltage 26.5 28 29.5 V CI Internal input capacitance PO Output power 6.6 F 33 nom IO 85 W 88 Efficiency IO1 = 1.4 A, IO2 = 0.91 A, IO3 = 0.89 A VI = 48 V Pd Power Dissipation max PO Pli Input idling power IO = 0 A, VI = 48 V 2.3 W PRC Input standby power VI = 48 V (turned off with RC) 0.1 W fs Switching frequency 300 kHz Characteristics 5 Conditions OUT1 min VOi Output voltage initial setting and accuracy Output adjust range VO TP1 = +25C, VI = 48 V, IO1 = 1.4 A, IO2 = 0.91 A, IO3 = 0.89 A See Note 1 and operating information Output voltage tolerance band Idling voltage IO = 0 A Vtr ttr tr ts tf tRC typ min VI = 48 V, 10-71% of max IO VI = 48 V, Load step 25-75-25% of nom IO on tested output, 10% of max IO on other outputs, di/dt = 1 A/s, see Note 2 (from 10-90% of VOi) Start-up time (from VI connection to 90% of VOi) typ W OUT3 max min 3.3 typ Unit max 9.0 V 3.6 5.8 2.7 3.6 4 12 V 4.85 5.15 3.20 3.40 8.73 9.27 V 5.15 3.20 3.40 8.73 4.85 50 Load regulation 10 OUT2 max 5.0 Line regulation Load transient voltage deviation Load transient recovery time Ramp-up time % 83 15 1 60 10 9.27 2 20 2 V mV 5 mV 250 70 900 mV 80 - 260 s 0.05 0.1 0.2 0.5 1 1.5 1.5 2.5 3.5 ms 3 4 5 5 6.5 8 8 10 12.5 ms nom IO 0.2 0.3 0.8 ms (from VI off to 10% of VO) IO = 10% of max IO 2.8 2.1 4.9 ms RC start-up time nom IO 4 7 10 ms VI shut-down fall time RC shut-down fall time nom IO 0.1 0.2 0.7 ms (from RC off to 10% of VO) IO = 10% of max IO 2.2 1.5 4.2 ms IO Output current 0.4 Ilim Current limit threshold TP1 < max TP1 Isc Short circuit current TP1 = 25C, see Note 3 Cout Recommended Capacitive Load TP1 = 25C 100 VOac Output ripple & noise See ripple & noise section, nom IO, VOi 20 7 4 0.4 9 11 5 12 14 55 Note 3: Hiccup mode on output 2 and 3 during current limit. 0.15 10 1.6 1.5 2.3 3 A A A 1000 100 100 10 Note 1: Output 2 cannot be adjusted higher than 0,3 V below output 1. Output 3 do not operate if output 1 is adjusted below 4.5 V. Note 2: Cout = 10 uF tantalum used on all outputs at load transient test. 7.5 4 25 1000 0 50 20 25 400 F 100 mV Ericsson Internal PRODUCT SPECIFICATION E 3 (7) Prepared (also subject responsible if other) No. EAB/FJB/GMG Tord Johansson 2/1301-BMR 603Technical 1204/1 UenSpecification Approved Checked BMR 603 1204 series Direct Converters EAB/FJB/GM (Natalie Johansson) (MICHORG) Input 32-60 V, Triple Output / 33 W Date Rev 6 Reference EN/LZT 146 406 R1B August 2009 2009-08-11 B (c) Ericsson AB 5 V, 4 A / 3.3 V, 4 A / 9 V, 1.5 A / 33 W Typical Characteristics BMR 603 1204/1 Efficiency Power Dissipation [%] [W] 10 95 8 90 32 V 85 6 32 V 48 V 80 53 V 60 V 75 48 V 4 53 V 60 V 2 0 70 0.0 0.2 0.4 0.6 0.0 [max Io ] 0.2 0.4 0.6 [max Io] Dissipated power vs. load current (Io1) and input voltage at TP1 = +25C, all outputs loaded simultaneously from 0 to 0.71 x max Io (33 W) Efficiency vs. load current and input voltage at TP1 = +25C, all outputs loaded simultaneously from 0 to 0.71 x max Io (33 W) Output 1 Characteristics Output 2 Characteristics [V] [V] 5.15 3.4 32 V 32 V 48 V 5 48 V 3.3 53 V 53 V 60 V 60 V 3.2 4.85 0.0 0.2 0.4 0.6 0.0 [max Io] Output 1 voltage vs. load current at TP1 = +25C, all outputs loaded simultaneously from 0 to 0.71 x max Io (33 W) 0.2 0.4 0.6 [max Io] Output 2 voltage vs. load current at TP1 = +25C, all outputs loaded simultaneously from 0 to 0.71 x max Io (33 W) Output 3 Characteristics Output 1 Current Limit Characteristics [V] [V] 9.27 6 5 9 32 V 4 32 V 48 V 53 V 3 48 V 60 V 2 53 V 60 V 1 0 8.73 0.0 0.2 0.4 0.6 [max Io] Output 3 voltage vs. load current at TP1 = +25 C, all outputs loaded simultaneously from 0 to 0.71 x max Io (33 W) 3 5 7 9 11 13 Output 1 voltage vs. load current at IO1 > max IO1, TP1 = +25C, Io2 = 0.4 A, Io3 = 0.15 A. 15 [A] Ericsson Internal PRODUCT SPECIFICATION E 4 (7) Prepared (also subject responsible if other) No. EAB/FJB/GMG Tord Johansson 2/1301-BMR 603Technical 1204/1 UenSpecification Approved Checked BMR 603 1204 series Direct Converters EAB/FJB/GM (Natalie Johansson) (MICHORG) Input 32-60 V, Triple Output / 33 W Date 2009-08-11 Rev Reference EN/LZT 146 406 R1B August 2009 B (c) Ericsson AB 5 V, 4 A / 3.3 V, 4 A / 9 V, 1.5 A / 33 W Typical Characteristics Start-up Start-up enabled by connecting VI at: TP1 = +25C, VI = 48 V, IO1 = IO2 = 2.83 A, IO3 = 1.06 A resistive load. 7 BMR 603 1204/1 Shut-down Top trace: output 3 voltage (5 V/div.). Second trace: output 2 voltage (2 V/div.). Third trace: output 1 voltage (5 V/div.). Bottom trace: input voltage (50 V/div.). Time scale: (5 ms/div.). Shut-down enabled by disconnecting VI at: TP1 = +25C, VI = 48 V, IO1 = IO2 = 2.83 A, IO3 = 1.06 A resistive load. Top trace: output 3 voltage (5 V/div.). Second trace: output 2 voltage (2 V/div.). Third trace: output 1 voltage (5 V/div.). Bottom trace: input voltage (50 V/div.). Time scale: (2 ms/div.). Output 1 Ripple & Noise Output 2 Ripple & Noise Trace: output 1 voltage ({20 mV/div.}). Output 1 voltage ripple at: Time scale: ({2 s/div.}). TP1 = +25C, VI = 48 V IO1 = IO2 = 2.83 A, IO3 = 1.06 A resistive load. Output 2 voltage ripple at: TP1 = +25C, VI = 48 V IO1 = IO2 = 2.83 A, IO3 = 1.06 A resistive load. Output 3 Ripple & Noise Output 1 Load Transient Response Output 3 voltage ripple at: Trace: output 3 voltage (20 mV/div.). TP1 = +25C, VI = 48 V, Time scale: (2 s/div.). IO1 = IO2 = 2.83 A, IO3 = 1.06 A resistive load. Output 1 voltage response to load current step- Top trace: output 1 voltage (0.2 V/div.). change (1-3-1 A) at: Second trace: output 2 voltage (0.2 V/div.). TP1 =+25C, VI = 53 V, IO2 = 0.4 A, IO3 = 0.15 A Third trace: output 3 voltage (1 V/div.). Bottom trace: load current (2 A/div.). Time scale: (0.2 ms/div.). Trace: output 2 voltage ({20 mV/div.}). Time scale: ({2 s/div.}). Ericsson Internal PRODUCT SPECIFICATION E 5 (7) Prepared (also subject responsible if other) No. EAB/FJB/GMG Tord Johansson 2/1301-BMR 603Technical 1204/1 UenSpecification Approved Checked BMR 603 1204 series Direct Converters EAB/FJB/GM (Natalie Johansson) (MICHORG) Input 32-60 V, Triple Output / 33 W Date Rev 2009-08-11 Reference EN/LZT 146 406 R1B August 2009 B (c) Ericsson AB 5 V, 4 A / 3.3 V, 4 A / 9 V, 1.5 A / 33 W Typical Characteristics BMR 603 1204/1 Output 2 Load Transient Response Output 2 voltage response to load current stepchange (1-3-1 A) at: TP1 =+25C, VI = 53 V, IO1 = 0.4 A, IO3 = 0.15 A 8 Output 3 Load Transient Response Top trace: output 1 voltage (0.2 V/div.). Second trace: output 2 voltage (0.2 V/div.). Third trace: output 3 voltage (1 V/div.). Bottom trace: load current (2 A/div.). Time scale: (0.2 ms/div.). Output Power Derating Output 3 voltage response to load current stepchange (0.375-1.125-0.375 A) at: TP1 =+25C, VI = 53 V, IO1 = IO2 = 0.4 A Top trace: output 1 voltage (0.2 V/div.). Second trace: output 2 voltage (0.2 V/div.). Third trace: output 3 voltage (1 V/div.). Bottom trace: load current (2 A/div.). Time scale: (0.2 ms/div.). Output 3 Derating [W] [v] 12 30 3.0 m/s 25 2.0 m/s 20 1.5 m/s 15 1.0 m/s 10 0.5 m/s 5 9 6 Nat. Conv. 3 0 0 20 40 60 80 100 [C] Available output power vs. ambient air temperature and airflow at VI = 48 V, all outputs loaded simultaneously. See Thermal Consideration section. 0.0 0.5 1.0 1.5 [A] Available output 3 voltage vs. load current with output 1 adjusted to 4.5 V at maximum reference temperature. (Higher output 3 current is available if output 1 is adjusted higher and at lower reference temperature.) Ericsson Internal PRODUCT SPECIFICATION E 6 (7) Prepared (also subject responsible if other) No. EAB/FJB/GMG Tord Johansson 2/1301-BMR 603Technical 1204/1 UenSpecification Approved Checked BMR 603 1204 series Direct Converters EAB/FJB/GM (Natalie Johansson) (MICHORG) Input 32-60 V, Triple Output / 33 W Date Rev 9 Reference EN/LZT 146 406 R1B August 2009 2009-08-11 B (c) Ericsson AB 5 V, 4 A / 3.3 V, 4 A / 9 V, 1.5 A / 33 W Typical Characteristics BMR 603 1204/1 Output 1 voltage adjusted with resistance Output 1 voltage adjusted with voltage [V] OUT1[V] 6.0 6.0 5.5 5.5 5.0 5.0 4.5 4.5 4.0 4.0 3.5 3.5 10 100 1000 4.7 10000 [kohm] Voltage increases with a resistor between Vadj 1 and -IN (red trace). Voltage decreases with a resistor between Vadj 1 and Vcc-prim (blue trace). Output 2 voltage adjusted with resistance 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5 5.6 Vadj 1[V] Vadj 1 voltage is referred to -IN. Output 2 voltage adjusted with voltage [V] OUT2 [V] 4.0 4.0 3.5 3.5 3.0 3.0 2.5 2.5 1 10 100 1000 0.0 10000 [kohm] Voltage increases with a resistor between Vadj 2 and Rtn (red trace). Voltage decreases with a resistor between Vadj 2 and OUT2 (blue trace). 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 Vadj 2 [V] 1.4 1.6 1.8 Vadj 3 [V] Vadj 2 voltage is referred to Rtn. Output 3 voltage adjusted with resistance Output 3 voltage adjusted with voltage [V] OUT3 [V] 12 12 9 9 6 6 3 3 0.1 1 10 100 Voltage increases with a resistor between Vadj 3 and Rtn (red trace). Voltage decreases with a resistor between Vadj 3 and OUT3 (blue trace). 1000 [kohm] 0.0 0.2 0.4 0.6 0.8 Vadj 3 voltage is referred to Rtn. 1.0 1.2 Ericsson Internal PRODUCT SPECIFICATION E 1 (5) Prepared (also subject responsible if other) No. MICHORG 3/1301-BMR 603Technical 1204/1 UenSpecification Approved Checked BMR 603 1204 series Direct Converters EAB/FJB/GM (Natalie Johansson) (MICTOJO) Input 32-60 V, Triple Output / 33 W Date Rev 2009-08-13 10 Reference EN/LZT 146 406 R1B August 2009 B (c) Ericsson AB EMC Specification Conducted EMI measured according to EN 55022, CISPR 22 and FCC part 15J (see test set-up). See Design Note 009 for further information. The fundamental switching frequency is 300 kHz for BMR 603 1204/1. Conducted EMI Input terminal value (typ) Test set-up Layout recommendations The radiated EMI performance of the product will depend on the PCB layout and ground layer design. It is also important to consider the stand-off of the product. If a ground layer is used, it should be connected to the output of the product and the equipment ground or chassis. EMI without filter External filter (class B) Required external input filter in order to meet class B in EN 55022, CISPR 22 and FCC part 15J. C3 L1 L2 C1 C2 C6 D C/D C C5 C4 Load Filter components: C1, C2, C6 = 1 F C3, C4 = 2.2 nF C5 = 100 F L1, L2 = 1.47 mH A ground layer will increase the stray capacitance in the PCB and improve the high frequency EMC performance. Output ripple and noise Output ripple and noise measured according to figure below. See Design Note 022 for detailed information. Ceramic Capacitor Tantalum Capacitor +Vout (all three outputs are loaded) 0.1uF + 10uF -Vout *Conductor from Vout to capacitors = 50mm [1.97in.] BNC Connector to Scope Output ripple and noise test setup (measured on all three outputs) EMI with filter Ericsson Internal PRODUCT SPECIFICATION E Prepared (also subject responsible if other) No. MICHORG 3/1301-BMR 603Technical 1204/1 UenSpecification Approved Checked BMR 603 1204 series Direct Converters EAB/FJB/GM (Natalie Johansson) (MICTOJO) Input 32-60 V, Triple Output / 33 W Operating information Input Voltage The input voltage range is 32 to 60Vdc. At input voltages exceeding 60 V, the power loss will be higher than at normal input voltage and TP1 must be limited to absolute max +130C. The absolute maximum continuous input voltage is 72 Vdc. Turn-off Input Voltage The product monitors the input voltage and will turn on and turn off at predetermined levels. The minimum hysteresis between turn on and turn off input voltage is 1 V. Remote Control (RC) The product is fitted with a remote control function referenced to the primary negative input connection (-IN), with positive logic. The RC function allows the product to be turned on/off by an external device like a semiconductor or mechanical switch. The maximum required sink current is 1 mA. When the RC pin is left open, the voltage generated on the RC pin is 8.8 - 10 V. The product is provided with "positive logic" remote control and will be on until the RC pin is connected to the -IN. To turn off the product the voltage between RC pin and -IN should be less than 1V. To turn on the converter the RC pin should be left open, or connected to a voltage higher than 9 V referenced to -IN. In situations where it is desired to have the product to power up automatically without the need for control signals or a switch, the RC pin can be left open. See Design Note 021 for detailed information. Input and Output Impedance The impedance of both the input source and the load will interact with the impedance of the product. It is important that the input source has low characteristic impedance. The product is designed for stable operation without external capacitors connected to the input or output. The performance in some applications can be enhanced by addition of external capacitance as described under External Decoupling Capacitors. If the input voltage source contains significant inductance, the addition of a 22 - 100 F capacitor across the input of the product will ensure stable operation. The capacitor is not required when powering the product from an input source with an inductance below 10 H. The minimum required capacitance value depends on the output power and the input voltage. The higher output power the higher input capacitance is needed. Approximately doubled capacitance value is required for a 24 V input voltage source compared to a 48V Date 2009-08-13 Rev 2 (5) 11 Reference EN/LZT 146 406 R1B August 2009 B (c) Ericsson AB input voltage source. External Decoupling Capacitors When powering loads with significant dynamic current requirements, the voltage regulation at the point of load can be improved by addition of decoupling capacitors at the load. The most effective technique is to locate low ESR ceramic and electrolytic capacitors as close to the load as possible, using several parallel capacitors to lower the effective ESR. The ceramic capacitors will handle high-frequency dynamic load changes while the electrolytic capacitors are used to handle low frequency dynamic load changes. It is equally important to use low resistance and low inductance PCB layouts and cabling. External decoupling capacitors will become part of the product's control loop. The control loop is optimized for a wide range of external capacitance and the maximum recommended value that could be used without any additional analysis is found in the Electrical specification. The ESR of the capacitors is a very important parameter. Stable operation is guaranteed with a capacitor of minimum 100 F with a verified ESR value of >45 m across the Output 2 connections. For further information please contact your local Ericsson Power Modules representative. To avoid undershoot below -0.3 V on Output 1 during shutdown. Use a capacitor of minimum 100 F across the Output 1 connections. Output Voltage Adjust The product has output voltage adjust pins for all outputs. These pins can be used to adjust the output voltages above or below the initial settings. At increased output voltages the maximum power rating of the product remains the same, and the max output current must be decreased correspondingly. The output voltages are adjusted with voltage on the adjust pins or by connecting resistors according to the table below: output output voltage output voltage increases with a decreases with a resistor between resistor between OUT1 Vadj 1 and -IN Vadj 1 and Vcc-prim OUT2 Vadj 2 and Rtn Vadj 2 and OUT2 OUT3 Vadj 3 and Rtn Vadj 3 and OUT3 Over Temperature Protection (OTP) The product is protected from thermal overload by an internal over temperature shutdown circuit. When TP1 as defined in thermal consideration section exceeds 130C the product will shut down. The product will make continuous attempts to start up (non-latching mode) and resume normal operation automatically when the temperature has dropped below the temperature threshold. Ericsson Internal PRODUCT SPECIFICATION E 3 (5) Prepared (also subject responsible if other) No. MICHORG 3/1301-BMR 603Technical 1204/1 UenSpecification Approved Checked BMR 603 1204 series Direct Converters EAB/FJB/GM (Natalie Johansson) (MICTOJO) Input 32-60 V, Triple Output / 33 W Over Current Protection (OCP) The product include current limiting circuitry for protection at continuous overload. The output voltage will decrease towards zero for output currents in excess of max output current (max IO). The product will resume normal operation after removal of the overload. The load distribution should be designed for the maximum output short circuit current specified. Thermal Consideration General The product is designed to operate in different thermal environments and sufficient cooling must be provided to ensure reliable operation. For products mounted on a PCB without a heat sink attached, cooling is achieved mainly by conduction, from the pins to the host board, and convection, which is dependant on the airflow across the product. Increased airflow enhances the cooling of the product. The Output Current Derating graph found in the Output section provides the available output current vs. ambient air temperature and air velocity at VI = 48 V. The product is tested on a 254 x 254 mm, 35 m (1 oz), 8-layer test board mounted vertically in a wind tunnel with a cross-section of 608 x 203 mm. Date 2009-08-13 Rev 12 Reference EN/LZT 146 406 R1B August 2009 B (c) Ericsson AB Definition of product operating temperature The product operating temperatures is used to monitor the temperature of the product, and proper thermal conditions can be verified by measuring the temperature at positions P1 and P2. The temperature at these positions (TP1 and TP2) should not exceed the maximum temperatures in the table below. The number of measurement points may vary with different thermal design and topology. Temperatures above maximum TP1 and TP2 measured at the reference points P1 and P2 are not allowed and may cause permanent damage. Position Description Max Temp. P1 Reference point TP1=110 C P2 MOSFET case TP2=125 C Ericsson Internal PRODUCT SPECIFICATION E Prepared (also subject responsible if other) No. MICHORG 3/1301-BMR 603Technical 1204/1 UenSpecification Approved Checked BMR 603 1204 series Direct Converters EAB/FJB/GM (Natalie Johansson) (MICTOJO) Input 32-60 V, Triple Output / 33 W Connections top view Pin 1-3 Designation NC Function Not Connected 4-5 +IN Positive input 6-7 -IN Negative input 8 RC Remote Control 9 Vcc-prim Decrease OUT1 10 Vadj 1 Output 1 voltage adjust 11-14 NC Not Connected 15 Vadj 3 Output 3 voltage adjust 16 OUT3 Output 3 17-19 Rtn Return 20-21 OUT1 Output 1 22 Vadj 2 Output 2 voltage adjust 23-24 NC Not Connected Date 2009-08-13 Rev Reference EN/LZT 146 406 R1B August 2009 B (c) Ericsson AB 4 (5) 13 E Ericsson Internal PRODUCT SPEC. MECHANICAL Prepared (also subject responsible if other) No. EPETSCH 4/1301-BMR 603Technical 1204 Uen Specification Approved Checked BMR 603 1204 series EAB/FJB/GM (Natalie J) Direct Converters See 1 Input 32-60 V, Triple Output / 33 W Date 2009-05-29 Rev 1 (3) 14 Reference EN/LZT 146 406 R1B August 2009 A (c) Ericsson AB Mechanical Information All component placements - whether shown as physical components or symbolical outline - are for reference only and are subject to change throughout the product's life cycle, unless explicitly described and dimensioned in this drawing. E Ericsson Internal PRODUCT SPEC. MECHANICAL Prepared (also subject responsible if other) No. EPETSCH 4/1301-BMR 603Technical 1204 Uen Specification Approved Checked BMR 603 1204 series EAB/FJB/GM (Natalie J) Direct Converters See 1 Input 32-60 V, Triple Output / 33 W Date 2009-05-29 Rev 2 (3) 15 Reference EN/LZT 146 406 R1B August 2009 A (c) Ericsson AB Assembly Information All component placements - whether shown as physical components or symbolical outline - are for reference only and are subject to change throughout the product's life cycle, unless explicitly described and dimensioned in this drawing. E Ericsson Internal PROD. SPECIFICATION MECHANICAL 1 (4) Prepared (also subject responsible if other) No. MICKAOV 5/1301-BMR 603Technical 1204 Uen Specification Approved Checked BMR 603 1204 series Direct Converters EAB/FJB/GM [Natalie Johansson] See 1 Input 32-60 V, Triple Output / 33 W Date Rev 16 Reference EN/LZT 146 406 R1B August 2009 2009-05-29 A (c) Ericsson AB Soldering Information The product is intended for convection reflow or vapor phase reflow in Pb-free reflow processes. The reflow profile should be optimised to avoid excessive heating of the product. It is recommended to have a sufficiently extended preheat time to ensure an even temperature across the host PCB and to minimize the time in reflow. Temperature Pin profile 60-90 s 170C to 180C 30-60 s 221C to 225C Time A no-clean flux is recommended to avoid entrapment of cleaning fluids in cavities inside the product or between the product and the host board, since cleaning residues may affect long time reliability and isolation voltage. Reflow process specifications1 SnPb eutectic Average ramp-up rate N/A 3C/s max TL N/A +221C N/A 30 s Minimum pin temperature TPIN N/A +235C Peak product temperature TPRODUCT N/A +260C N/A 6C/s max Typical solder melting (liquidus) temperature Minimum reflow time above TL Average ramp-down rate 1 Pb-free Maximum time 25C to peak N/A 8 minutes Note: for mixed SnPb / Pb-free soldering, special recommendations apply Reflow profile for mixed soldering (pin temperature = solder joint temperature) Thermocoupler Attachment Top of PCB at pin 1 for measurement of maximum product temperature, TPRODUCT Pin 18/19 for measurement of minimum pin (solder joint) temperature, TPIN (attach sensors as close as possible to actual solder joint) Temperatur e TPRODU CT m axi mum TPIN minimum P in profi le TL Prod uct profile Time in reflow Time in preheat / soak zone Ti me 25C to p eak T ime General reflow profile (min pin and max product temperature) Mixed Solder Process Recommendations When using products with Pb-free solder bumps with SnPb paste on the host board, and thereby mixing SnPb with Pbfree solder, and reflowing at SnPb process temperatures (backwards compatibility), special recommendations apply: An extended preheat time between +170C and +180C for 60 to 90s and a pin reflow temperature (TPIN) between +220C and +225C for 30 to 60 s is recommended. Ramp-up, rampdown and time limitations should be according to Pb-free reflow process specifications. The extended preheat time and soak at reflow temperature will minimize temperature gradients and maximize the wetting and solder mixing in the final solder joints. The use of nitrogen reflow atmosphere will further improve the solder joint quality. Pin Temperature Recommendations Pin number 18/19 - or possibly pin 6/7, depending on host board layout - are chosen as reference locations for the minimum pin temperature recommendations since either of these will likely be the coolest solder joints during reflow Pb-free Solder Processes For Pb-free solder processes, a pin temperature (TPIN) in excess of the solder melting temperature (TL, +217 to +221 C for SnAgCu solder alloys) for more than 30 seconds, and a peak temperature of +235C on all solder joints is recommended to ensure a reliable solder joint. Maximum Product Temperature Requirements Top of the product PCB near pin 1 is chosen as reference location for the maximum (peak) allowed product temperature (TPRODUCT), since this will likely be the warmest part of the product during the reflow process. Pb-free Solder Processes For Pb-free solder processes, the product is qualified for MSL 3 according to IPC/JEDEC standard J-STD-020C. During reflow, TPRODUCT must not exceed +260 C at any time. E Ericsson Internal PROD. SPECIFICATION MECHANICAL Prepared (also subject responsible if other) No. MICKAOV 5/1301-BMR 603Technical 1204 Uen Specification Approved Checked BMR 603 1204 series Direct Converters EAB/FJB/GM [Natalie Johansson] See 1 Input 32-60 V, Triple Output / 33 W Date 2009-05-29 Rev 2 (4) 17 Reference EN/LZT 146 406 R1B August 2009 A (c) Ericsson AB Surface Mount Assembly and Repair Delivery Package Information The solder bumps of the product require particular care during assembly since the solder bumps are hidden between the host board and the product's PCB. Special procedures are required for successful rework of these products. The surface mount version of the product is delivered in antistatic injection molded trays (Jedec design guide 4.10D standard). Tray Specifications Assembly Automatic pick and place equipment should be used to mount the product on the host board. The use of a vision system, using the fiducials on the bottom side of the product for position control, will ensure adequate accuracy. Manual mounting of solder bump products is not recommended. Note that the actual position of the pick up surface is not necessarily in the center of the product outline. Refer to mechanical drawing for actual location. If necessary, it is recommended to fine tune the solder print aperture size to optimize the amount of deposited solder with consideration to screen thickness and solder print capability. Repair For a successful repair (removal and replacement) of a solder bump product, a dedicated rework system should be used. The rework system should preferably utilize a bottom side heater and a dedicated hot air nozzle to heat the solder bumps to reflow temperature. The product is an open frame design with a pick up surface on a large central component. This pick up surface can not be used for removal with a vacuum nozzle since the component solder joints may have melted during the removal reflow. In order not to damage the product and nearby components during removal and replacement with a new product, it is recommended to use a double wall design of the hot air nozzle to direct the air flow only to the edges of the product, see `Assembly Information' in the mechanical drawing. Dry Pack Information Products intended for Pb-free reflow processes are delivered in standard moisture barrier bags according to IPC/JEDEC standard J-STD-033 (Handling, packing, shipping and use of moisture/reflow sensitivity surface mount devices). The SnPb option of this product is also delivered in dry packing. Using products in high temperature Pb-free soldering processes requires dry pack storage and handling. In case the products have been stored in an uncontrolled environment and no longer can be considered dry, the modules must be baked according to J-STD-033. Material Antistatic PPE Surface resistance Tray capacity 105 < Ohm/square < 1012 The trays can be baked at maximum 125C for maximum 48 hours 10 products / tray Tray thickness 12.19 mm [0.480 inch] Tray weight 115 g empty, max 365 g full Baking E Ericsson Internal PROD. SPECIFICATION MECHANICAL Prepared (also subject responsible if other) No. MICKAOV 5/1301-BMR 603Technical 1204 Uen Specification Approved Checked BMR 603 1204 series Direct Converters EAB/FJB/GM [Natalie Johansson] See 1 Input 32-60 V, Triple Output / 33 W Date 2009-05-29 Rev 3 (4) 18 Reference EN/LZT 146 406 R1B August 2009 A (c) Ericsson AB Product Qualification Specification Characteristics External visual inspection IPC-A-610 Change of temperature (Temperature cycling) IEC 60068-2-14 Na Temperature range Number of cycles Dwell/transfer time -40 to +100C 1000 15 min/0-1 min Cold (in operation) IEC 60068-2-1 Ad Temperature TA Duration -45C 72 h Damp heat IEC 60068-2-67 Cy Temperature Humidity Duration +85C 85 % RH 1000 hours Dry heat IEC 60068-2-2 Bd Temperature Duration +125C 1000 h Electrostatic discharge susceptibility IEC 61340-3-1, JESD 22-A114 IEC 61340-3-2, JESD 22-A115 Human body model (HBM) Machine Model (MM) Class 2, 2000 V Class 3, 200 V Immersion in cleaning solvents IEC 60068-2-45 XA Method 2 Water Glycol ether Isopropanol +55C +35C +35C Mechanical shock IEC 60068-2-27 Ea Peak acceleration Duration 100 g 6 ms Moisture reflow sensitivity 1 J-STD-020C level 1 (SnPb-eutectic) level 3 (Pb Free) 225C 260C Operational life test MIL-STD-202G method 108A Duration 1000 h Resistance to soldering heat 2 IEC 60068-2-20 Tb Method 1A Solder temperature Duration 270C 10-13 s Robustness of terminations IEC 60068-2-21 Test Ua1 IEC 60068-2-21 Test Ue1 Through hole mount products Surface mount products All leads All leads Solderability IEC 60068-2-58 test Td 1 Preconditioning Temperature, SnPb Eutectic Temperature, Pb-free 150C dry bake 16 h 215C 235C IEC 60068-2-20 test Ta 2 Preconditioning Temperature, SnPb Eutectic Temperature, Pb-free Steam ageing 235C 245C IEC 60068-2-64 Fh, method 1 Frequency Spectral density Duration 10 to 500 Hz 0.07 g2/Hz 10 min in each perpendicular direction Vibration, broad band random Note 1: Only for products intended for reflow soldering (surface mount products) Note 2: Only for products intended for wave soldering (hole mounted products)