Ericsson Internal
PRODUCT SPECIFICATION 1 (4)
Prepared (also subject responsible if other) No.
MICJOHH 1/1-BMR 603 124 Uen
Approved Checked Date Rev Reference
EAB/FJB/GMF (Natalie Johansson) EANKALL 2009-07-31 C
Key Features
• Low profile SMD
50.2 x 46.0 x 8.5 mm (1.98 x 1.81 x 0.34 in.)
• Designed for radio link applications
• Three separately regulated outputs that can be adjusted
independently
• High efficiency, typ. 87.8 % at full load
• 1500 Vdc input to output isolation
• insulation according to IEC/EN/UL 60950
• More than 1.6 million hours predicted MTBF at +40ºC
ambient temperature
General Characteristics
• Input under voltage protection
• Wide range multiple output voltage adjust
• Output short-circuit protection
• Remote control
• Highly automated manufacturing ensures quality
• ISO 9001/14001 certified supplier
Design for Environment
Meets requirements in high-
temperature lead-free soldering
processes.
Ericsson Internal
TABLE OF CONTENTS 2 (2)
Prepared (also subject responsible if other) No.
EAB/FAC/P Susanne Eriksson BPOW 00201-00152 Uen
Approved Checked Date Rev Reference
Contents
Ordering Information .............................................................2
General Information .............................................................2
Safety Specification .............................................................3
Absolute Maximum Ratings .............................................................4
Electrical Specification
5V-4A, 3.3V-4A, 9V-1.5A / 33W BMR 603 1204/1...................................5
EMC Specification ........................................................... 10
Operating Information ...........................................................11
Thermal Consideration ........................................................... 12
Connections ...........................................................13
Mechanical Information ...........................................................14
Soldering Information ...........................................................16
Delivery Information ...........................................................17
Product Qualification Specification ........................................................... 18
E
BMR 603 1204 series Direct Converters
Input 32-60 V, Triple Output / 33 W
EN/LZT 146 406 R1B August 2009
© Ericsson AB
Technical Specification
Ericsson Internal
PRODUCT SPECIFICATION 2 (4)
Prepared (also subject responsible if other) No.
MICJOHH 1/1301-BMR 603 1204 Uen
Approved Checked Date Rev Reference
EAB/FJB/GMF (Natalie Johansson) EANKALL 2009-07-31 C
Ordering Information
Product program Output
BMR 603 1204/1 5V, 3.3V, 9V / 33W
General Information
Reliability
The Mean Time Between Failure (MTBF) is calculated at
full output power and an operating ambient temperature
(TA) of +40°C, which is a typical condition in Information
and Communication Technology (ICT) equipment. Different
methods could be used to calculate the predicted MTBF
and failure rate which may give different results. Ericsson
Power Modules currently uses Telcordia SR332.
Predicted MTBF for the series is:
- 1.6 million hours according to Telcordia SR332, issue
1, Black box technique.
Telcordia SR332 is a commonly used standard method
intended for reliability calculations in ICT equipment. The
parts count procedure used in this method was originally
modelled on the methods from MIL-HDBK-217F, Reliability
Predictions of Electronic Equipment. It assumes that no
reliability data is available on the actual units and devices
for which the predictions are to be made, i.e. all predictions
are based on generic reliability parameters.
Compatibility with RoHS requirements
The products are compatible with the relevant clauses and
requirements of the RoHS directive 2002/95/EC and have a
maximum concentration value of 0.1% by weight in
homogeneous materials for lead, mercury, hexavalent
chromium, PBB and PBDE and of 0.01% by weight in
homogeneous materials for cadmium.
Exemptions in the RoHS directive utilized in Ericsson
Power Modules products include:
- Lead in high melting temperature type solder (used to
solder the die in semiconductor packages)
- Lead in glass of electronics components and in
electronic ceramic parts (e.g. fill material in chip
resistors)
- Lead as an alloying element in copper alloy containing
up to 4% lead by weight (used in connection pins
made of Brass)
Quality Statement
The products are designed and manufactured in an
industrial environment where quality systems and methods
like ISO 9000, 6σ (sigma), and SPC are intensively in use
to boost the continuous improvements strategy. Infant
mortality or early failures in the products are screened out
and they are subjected to an ATE-based final test.
Conservative design rules, design reviews and product
qualifications, plus the high competence of an engaged
work force, contribute to the high quality of our products.
Warranty
Warranty period and conditions are defined in Ericsson
Power Modules General Terms and Conditions of Sale.
Limitation of Liability
Ericsson Power Modules does not make any other
warranties, expressed or implied including any warranty of
merchantability or fitness for a particular purpose
(including, but not limited to, use in life support
applications, where malfunctions of product can cause
injury to a person’s health or life).
© Ericsson AB 2009
The information and specifications in this technical
specification is believed to be correct at the time of
publication. However, no liability is accepted for
inaccuracies, printing errors or for any consequences
thereof. Ericsson AB reserves the right to change the
contents of this technical specification at any time without
prior notice.
Safety Specification
General information
Ericsson Power Modules DC/DC converters and DC/DC
regulators are designed in accordance with safety
standards IEC/EN/UL60950, Safety of Information
Technology Equip m ent.
IEC/EN/UL60950 contains requirements to prevent injury or
damage due to the following hazards:
• Electrical shock
• Energy hazards
• Fire
• Mechanical and heat hazards
• Radiation hazards
• Chemical hazards
On-board DC-DC converters and DC/DC regulators are
defined as component power supplies. As components
they cannot fully comply with the provisions of any Safety
requirements without “Conditions of Acceptability”.
Clearance between conductors and between conductive
parts of the component power supply and conductors on
the board in the final product must meet the applicable
Safety requirements. Certain conditions of acceptability
E
BMR 603 1204 series Direct Converters
Input 32-60 V, Triple Output / 33 W
EN/LZT 146 406 R1B August 2009
© Ericsson AB
Technical Specification
2
Ericsson Internal
PRODUCT SPECIFICATION 3 (4)
Prepared (also subject responsible if other) No.
MICJOHH 1/1301-BMR 603 1204 Uen
Approved Checked Date Rev Reference
EAB/FJB/GMF (Natalie Johansson) EANKALL 2009-07-31 C
apply for component power supplies with limited stand-off
(see Mechanical Information for further information). It is
the responsibility of the installer to ensure that the final
product housing these components complies with the
requirements of all applicable Safety standards and
Directives for the final product.
Component power supplies for general use should comply
with the requirements in IEC60950, EN60950 and UL60950
“Safety of information technology equipment”.
There are other more product related standards, e.g.
IEEE802.3af “Ethernet LAN/MAN Data terminal equipment
power”, and ETS300132-2 “Power supply interface at the
input to telecommunications equipment; part 2: DC”, but all
of these standards are based on IEC/EN/UL60950 with
regards to safety.
Ericsson Power Modules DC/DC converters and DC/DC
regulators are normally UL60950 recognized and certified
in accordance with EN60950. This converter is CB certified
in accordance with EN60950
The flammability rating for all construction parts of the
products meets requirements for V-0 class material
according to IEC 60695-11-10.
The products should be installed in the end-use equipment,
in accordance with the requirements of the ultimate
application. Normally the output of the DC/DC converter is
considered as SELV (Safety Extra Low Voltage) and the
input source must be isolated by minimum Double or
Reinforced Insulation from the primary circuit (AC mains) in
accordance with IEC/EN/UL60950.
Isolated DC/DC converters
It is recommended that a slow blow fuse with a rating twice
the maximum input current per selected product be used at
the input of each DC/DC converter. If an input filter is used
in the circuit the fuse should be placed in front of the input
filter.
In the rare event of a component problem in the input filter
or in the DC/DC converter that imposes a short circuit on
the input source, this fuse will provide the following
functions:
• Isolate the faulty DC/DC converter from the input
power source so as not to affect the operation of
other parts of the system.
• Protect the distribution wiring from excessive
current and power loss thus preventing hazardous
overheating.
The galvanic isolation is verified in an electric strength test.
The test voltage (Viso) between input and output is
1500 Vdc or 2250 Vdc for 60 seconds (refer to product
specification).
Leakage current is less than 1 µA at nominal input voltage.
24 V DC systems
The input voltage to the DC/DC converter is SELV (Safety
Extra Low Voltage) and the output remains SELV under
normal and abnormal operating conditions.
48 and 60 V DC systems
If the input voltage to the DC/DC converter is 75 Vdc or
less, then the output remains SELV (Safety Extra Low
Voltage) under normal and abnormal operating conditions.
Single fault testing in the input power supply circuit should
be performed with the DC/DC converter connected to
demonstrate that the input voltage does not exceed
75 Vdc.
If the input power source circuit is a DC power system, the
source may be treated as a TNV2 circuit and testing has
demonstrated compliance with SELV limits and isolation
requirements equivalent to Basic Insulation in accordance
with IEC/EN/UL60950.
Non-isolated DC/DC regulators
The input voltage to the DC/DC regulator is SELV (Safety
Extra Low Voltage) and the output remains SELV under
normal and abnormal operating conditions.
E
BMR 603 1204 series Direct Converters
Input 32-60 V, Triple Output / 33 W
EN/LZT 146 406 R1B August 2009
© Ericsson AB
Technical Specification
3
Ericsson Internal
PRODUCT SPECIFICATION 1 (7)
Prepared (also subject responsible if other) No.
EAB/FJB/GMG Tord Johansson 2/1301-BMR 603 1204/1 Uen
Approved Checked Date Rev Reference
EAB/FJB/GM (Natalie Johansson) (MICHORG) 2009-08-11 B
Absolute Maximum Ratings
Characteristics min typ max Unit
TP1 Operating Temperature (see Thermal Consideration section) -40 +130 °C
TS Storage temperature -40 +125 °C
VI Input voltage -0.5 +72 V
input to output 1500 V
Viso Isolation voltage PCB bottom side 500 V
Vtr Input voltage transient (tp 100 ms) 100 V
VRC Remote Control pin voltage
(see Operating Information section) -0.5 10 V
Vadj 1 -0.5 6 V
Vadj 2 -0.5 6.6 V
Vadj Adjust pin voltage (see Operating Information section)
Vadj 3 -0.5 18 V
Stress in excess of Absolute Maximum Ratings may cause permanent damage. Absolute Maximum Ratings, sometimes referred to as no destruction limits, are
normally tested with one parameter at a time exceeding the limits of Output data or Electrical Characteristics. If exposed to stress above these limits, function and
performance may degrade in an unspecified manner.
Fundamental Circuit Diagram
Control
+Out2
Vcc-prim
+Out1
+Out3
Control
Rtn
Vadj 2
Vadj 3
Vadj 1
Control
+In
-In
RC
E
BMR 603 1204 series Direct Converters
Input 32-60 V, Triple Output / 33 W
EN/LZT 146 406 R1B August 2009
© Ericsson AB
Technical Specification
4
Ericsson Internal
PRODUCT SPECIFICATION 2 (7)
Prepared (also subject responsible if other) No.
EAB/FJB/GMG Tord Johansson 2/1301-BMR 603 1204/1 Uen
Approved Checked Date Rev Reference
EAB/FJB/GM (Natalie Johansson) (MICHORG) 2009-08-11 B
5V max 4A, 3.3V max 4A, 9V max 1.5A / max 33W
Electrical Specification BMR 603 1204/1
TP1 = -30 to +110ºC, VI = 32 to 60 V, unless otherwise specified under Conditions.
Typical values given at: TP1 = +25°C, VI= 48 VI and nom IO (nom IO1 = nom IO2 = 2.83 A, nom IO3 = 1.06 A), unless otherwise specified under
Conditions.
Characteristics Conditions min typ max Unit
VI Input voltage range 32 60 V
VIoff Turn-off input voltage Decreasing input voltage 24.5 26 27.5 V
VIon Turn-on input voltage Increasing input voltage 26.5 28 29.5 V
CI Internal input capacitance 6.6 µF
PO Output power 33 W
nom IO 85 88
η Efficiency IO1 = 1.4 A, IO2 = 0.91 A, IO3 = 0.89 A
VI = 48 V 83
%
Pd Power Dissipation max PO 5 10 W
Pli Input idling power IO = 0 A, VI = 48 V 2.3 W
PRC Input standby power VI = 48 V (turned off with RC) 0.1 W
fs Switching frequency 300 kHz
Characteristics Conditions OUT1 OUT2 OUT3 Unit
min typ max min typ max min typ max
VOi Output voltage initial
setting and accuracy
TP1 = +25°C, VI = 48 V,
IO1 = 1.4 A, IO2 = 0.91 A,
IO3 = 0.89 A
5.0 3.3 9.0 V
Output adjust range See Note 1 and operating
information 3.6 5.8 2.7 3.6 4 12 V
Output voltage
tolerance band 4.85 5.15 3.20 3.40 8.73 9.27 V
Idling voltage IO = 0 A 4.85 5.15 3.20 3.40 8.73 9.27 V
Line regulation 50 1 2 mV
VO
Load regulation VI = 48 V, 10-71% of max IO 15 60 10 20 2 5 mV
Vtr Load transient
voltage deviation ±250 ±70 ±900 mV
ttr Load transient recovery
time
VI = 48 V, Load step 25-75-25%
of nom IO on tested output,
10% of max IO on other outputs,
di/dt = 1 A/µs, see Note 2 80 - 260 µs
tr Ramp-up time
(from 10−90% of VOi) 0.05 0.1 0.2 0.5 1 1.5 1.5 2.5 3.5 ms
ts
Start-up time
(from VI connection to 90%
of VOi)
3 4 5 5 6.5 8 8 10 12.5 ms
nom IO 0.2 0.3 0.8 ms
tf VI shut-down fall time
(from VI off to 10% of VO) IO = 10% of max IO 2.8 2.1 4.9 ms
RC start-up time nom IO 4 7 10 ms
nom IO 0.1 0.2 0.7 ms
tRC RC shut-down fall time
(from RC off to 10% of VO) IO = 10% of max IO 2.2 1.5 4.2 ms
IO Output current 0.4 4 0.4 4 0.15 1.5 A
Ilim Current limit threshold TP1 < max TP1 7 9 11 5 7.5 10 1.6 2.3 3 A
Isc Short circuit current TP1 = 25ºC, see Note 3 12 14 A
Cout Recommended
Capacitive Load TP1 = 25ºC 100 1000 100 1000 0 400 µF
VOac Output ripple & noise See ripple & noise section,
nom IO, VOi 20 55 100 10 25 50 20 25 100 mV
Note 1: Output 2 cannot be adjusted higher than 0,3 V below output 1. Output 3 do not operate if output 1 is adjusted below 4.5 V.
Note 2: Cout = 10 uF tantalum used on all outputs at load transient test.
Note 3: Hiccup mode on output 2 and 3 during current limit.
E
BMR 603 1204 series Direct Converters
Input 32-60 V, Triple Output / 33 W
EN/LZT 146 406 R1B August 2009
© Ericsson AB
Technical Specification
5
Ericsson Internal
PRODUCT SPECIFICATION 3 (7)
Prepared (also subject responsible if other) No.
EAB/FJB/GMG Tord Johansson 2/1301-BMR 603 1204/1 Uen
Approved Checked Date Rev Reference
EAB/FJB/GM (Natalie Johansson) (MICHORG) 2009-08-11 B
5 V, 4 A / 3.3 V, 4 A / 9 V, 1.5 A / 33 W Typical
Characteristics BMR 603 1204/1
Efficiency Power Dissipation
70
75
80
85
90
95
0.0 0.2 0.4 0.6 [m ax Io ]
[%]
32 V
48 V
53 V
60 V
0
2
4
6
8
10
0.0 0.2 0.4 0.6 [max Io]
[W]
32 V
48 V
53 V
60 V
Efficiency vs. load current and input voltage at TP1 = +25°C,
all outputs loaded simultaneously from 0 to 0.71 x max Io (33 W) Dissipated power vs. load current (Io1) and input voltage at TP1 = +25°C,
all outputs loaded simultaneously from 0 to 0.71 x max Io (33 W)
Output 1 Characteristics Output 2 Characteristics
4.85
5
5.15
0.0 0.2 0.4 0.6 [max Io]
[V]
32 V
48 V
53 V
60 V
3.2
3.3
3.4
0.0 0.2 0.4 0.6 [max Io]
[V]
32 V
48 V
53 V
60 V
Output 1 voltage vs. load current at TP1 = +25°C, all outputs loaded
simultaneously from 0 to 0.71 x max Io (33 W)
Output 2 voltage vs. load current at TP1 = +25°C, all outputs loaded
simultaneously from 0 to 0.71 x max Io (33 W)
Output 3 Characteristics Output 1 Current Limit Ch aracteristics
8.73
9
9.27
0.0 0.2 0.4 0.6 [max Io]
[V]
32 V
48 V
53 V
60 V
0
1
2
3
4
5
6
3 5 7 9 11 13 15 [A]
[V]
32 V
48 V
53 V
60 V
Output 3 voltage vs. load current at TP1 = +25° C, all outputs loaded
simultaneously from 0 to 0.71 x max Io (33 W)
Output 1 voltage vs. load current at IO1 > max IO1,
TP1 = +25°C, Io2 = 0.4 A, Io3 = 0.15 A.
E
BMR 603 1204 series Direct Converters
Input 32-60 V, Triple Output / 33 W
EN/LZT 146 406 R1B August 2009
© Ericsson AB
Technical Specification
6
Ericsson Internal
PRODUCT SPECIFICATION 4 (7)
Prepared (also subject responsible if other) No.
EAB/FJB/GMG Tord Johansson 2/1301-BMR 603 1204/1 Uen
Approved Checked Date Rev Reference
EAB/FJB/GM (Natalie Johansson) (MICHORG) 2009-08-11 B
5 V, 4 A / 3.3 V, 4 A / 9 V, 1.5 A / 33 W Typical
Characteristics BMR 603 1204/1
Start-up Shut-down
Start-up enabled by connecting VI at:
TP1 = +25°C, VI = 48 V,
IO1 = IO2 = 2.83 A, IO3 = 1.06 A resistive load.
Top trace: output 3 voltage (5 V/div.).
Second trace: output 2 voltage (2 V/div.).
Third trace: output 1 voltage (5 V/div.).
Bottom trace: input voltage (50 V/div.).
Time scale: (5 ms/div.).
Shut-down enabled by disconnecting VI at:
TP1 = +25°C, VI = 48 V,
IO1 = IO2 = 2.83 A, IO3 = 1.06 A resistive load.
Top trace: output 3 voltage (5 V/div.).
Second trace: output 2 voltage (2 V/div.).
Third trace: output 1 voltage (5 V/div.).
Bottom trace: input voltage (50 V/div.).
Time scale: (2 ms/div.).
Output 1 Ripple & Noise Output 2 Ripple & Noise
Output 1 voltage ripple at:
TP1 = +25°C, VI = 48 V
IO1 = IO2 = 2.83 A, IO3 = 1.06 A resistive load.
Trace: output 1 voltage ({20 mV/div.}).
Time scale: ({2 µs/div.}).
Output 2 voltage ripple at:
TP1 = +25°C, VI = 48 V
IO1 = IO2 = 2.83 A, IO3 = 1.06 A resistive load.
Trace: output 2 voltage ({20 mV/div.}).
Time scale: ({2 µs/div.}).
Output 3 Ripple & Noise Output 1 Load Transient Resp onse
Output 3 voltage ripple at:
TP1 = +25°C, VI = 48 V,
IO1 = IO2 = 2.83 A, IO3 = 1.06 A resistive load.
Trace: output 3 voltage (20 mV/div.).
Time scale: (2 µs/div.).
Output 1 voltage response to load current step-
change (1-3-1 A) at:
TP1 =+25°C, VI = 53 V, IO2 = 0.4 A, IO3 = 0.15 A
Top trace: output 1 voltage (0.2 V/div.).
Second trace: output 2 voltage (0.2 V/div.).
Third trace: output 3 voltage (1 V/div.).
Bottom trace: load current (2 A/div.).
Time scale:
(
0.2 ms/div.
)
.
E
BMR 603 1204 series Direct Converters
Input 32-60 V, Triple Output / 33 W
EN/LZT 146 406 R1B August 2009
© Ericsson AB
Technical Specification
7
Ericsson Internal
PRODUCT SPECIFICATION 5 (7)
Prepared (also subject responsible if other) No.
EAB/FJB/GMG Tord Johansson 2/1301-BMR 603 1204/1 Uen
Approved Checked Date Rev Reference
EAB/FJB/GM (Natalie Johansson) (MICHORG) 2009-08-11 B
5 V, 4 A / 3.3 V, 4 A / 9 V, 1.5 A / 33 W Typical
Characteristics BMR 603 1204/1
Output 2 Load Transient Resp onse Output 3 Load Transient Resp onse
Output 2 voltage response to load current step-
change (1-3-1 A) at:
TP1 =+25°C, VI = 53 V, IO1 = 0.4 A, IO3 = 0.15 A
Top trace: output 1 voltage (0.2 V/div.).
Second trace: output 2 voltage (0.2 V/div.).
Third trace: output 3 voltage (1 V/div.).
Bottom trace: load current (2 A/div.).
Time scale:
(
0.2 ms/div.
)
.
Output 3 voltage response to load current step-
change (0.375-1.125-0.375 A) at:
TP1 =+25°C, VI = 53 V, IO1 = IO2 = 0.4 A
Top trace: output 1 voltage (0.2 V/div.).
Second trace: output 2 voltage (0.2 V/div.).
Third trace: output 3 voltage (1 V/div.).
Bottom trace: load current (2 A/div.).
Time scale:
(
0.2 ms/div.
)
.
Output Power Derating Output 3 Derating
0
5
10
15
20
25
30
0 20406080100[°C]
[W]
3.0 m/s
2.0 m/s
1.5 m/s
1.0 m/s
0.5 m/s
Nat. Conv.
3
6
9
12
0.0 0.5 1.0 1.5 [A]
[v]
Available output power vs. ambient air temperature and airflow at VI = 48 V, all outputs
loaded simultaneously. See Thermal Consideration section.
Available output 3 voltage vs. load current with output 1 adjusted to 4.5 V at maximum
reference temperature. (Higher output 3 current is available if output 1 is adjusted
higher and at lower reference temperature.)
E
BMR 603 1204 series Direct Converters
Input 32-60 V, Triple Output / 33 W
EN/LZT 146 406 R1B August 2009
© Ericsson AB
Technical Specification
8
Ericsson Internal
PRODUCT SPECIFICATION 6 (7)
Prepared (also subject responsible if other) No.
EAB/FJB/GMG Tord Johansson 2/1301-BMR 603 1204/1 Uen
Approved Checked Date Rev Reference
EAB/FJB/GM (Natalie Johansson) (MICHORG) 2009-08-11 B
5 V, 4 A / 3.3 V, 4 A / 9 V, 1.5 A / 33 W Typical
Characteristics BMR 603 1204/1
Output 1 voltage adjusted with resistance Output 1 voltage adjusted with voltage
3.5
4.0
4.5
5.0
5.5
6.0
10 100 1000 10000
[kohm]
[V]
3.5
4.0
4.5
5.0
5.5
6.0
4.74.84.95.05.15.25.35.45.55.6
Vadj 1 [V]
OUT1 [V]
Voltage increases with a resistor between Vadj 1 and –IN (red trace).
Voltage decreases with a resistor between Vadj 1 and Vcc-prim (blue trace). Vadj 1 voltage is referred to –IN.
Output 2 voltage adjusted with resistance Output 2 voltage adjusted with voltage
2.5
3.0
3.5
4.0
1 10 100 1000 10000
[kohm]
[V]
2.5
3.0
3.5
4.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Vadj 2 [V]
OUT2 [V]
Voltage increases with a resistor between Vadj 2 and Rtn (red trace).
Voltage decreases with a resistor between Vadj 2 and OUT2 (blue trace). Vadj 2 voltage is referred to Rtn.
Output 3 voltage adjusted with resistance Output 3 voltage adjusted with voltage
3
6
9
12
0.1 1 10 100 1000
[kohm]
[V]
3
6
9
12
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Vadj 3 [V]
OUT3 [V]
Voltage increases with a resistor between Vadj 3 and Rtn (red trace).
Voltage decreases with a resistor between Vadj 3 and OUT3 (blue trace). Vadj 3 voltage is referred to Rtn.
E
BMR 603 1204 series Direct Converters
Input 32-60 V, Triple Output / 33 W
EN/LZT 146 406 R1B August 2009
© Ericsson AB
Technical Specification
9
Ericsson Internal
PRODUCT SPECIFICATION 1 (5)
Prepared (also subject responsible if other) No.
MICHORG 3/1301-BMR 603 1204/1 Uen
Approved Checked Date Rev Reference
EAB/FJB/GM (Natalie Johansson) (MICTOJO) 2009-08-13 B
EMC Specification
Conducted EMI measured according to EN 55022, CISPR 22
and FCC part 15J (see test set-up). See Design Note 009 for
further information. The fundamental switching frequency is
300 kHz for BMR 603 1204/1.
Conducted EMI Input terminal value (typ)
EMI without filter
External filter (class B)
Required external input filter in order to meet class B in
EN 55022, CISPR 22 and FCC part 15J.
(all three outputs are loaded)
Filter components:
C1, C2, C6 = 1 µF
C3, C4 = 2.2 nF
C5 = 100 µF
L1, L2 = 1.47 mH
EMI with filter
Test set-up
Layout recommendations
The radiated EMI performance of the product will depend on
the PCB layout and ground layer design. It is also important to
consider the stand-off of the product. If a ground layer is used,
it should be connected to the output of the product and the
equipment ground or chassis.
A ground layer will increase the stray capacitance in the PCB
and improve the high frequency EMC performance.
Output ripple and noise
Output ripple and noise measured according to figure below.
See Design Note 022 for detailed information.
10uF
0.1uF
-Vout
+Vout
*Conductor from Vout to capacitors = 50mm [1.97in.]
BNC
Connector
to Scope
Tantalum
Capacitor
Ceramic
Capacitor
+
Output ripple and noise test setup (measured on all three outputs)
L1 L2
C1
C3
C4
C2
C5 Load
DC/DCC6
E
BMR 603 1204 series Direct Converters
Input 32-60 V, Triple Output / 33 W
EN/LZT 146 406 R1B August 2009
© Ericsson AB
Technical Specification
10
Ericsson Internal
PRODUCT SPECIFICATION 2 (5)
Prepared (also subject responsible if other) No.
MICHORG 3/1301-BMR 603 1204/1 Uen
Approved Checked Date Rev Reference
EAB/FJB/GM (Natalie Johansson) (MICTOJO) 2009-08-13 B
Operating information
Input Voltage
The input voltage range is 32 to 60Vdc.
At input voltages exceeding 60 V, the power loss will be higher
than at normal input voltage and TP1 must be limited to
absolute max +130°C. The absolute maximum continuous
input voltage is 72 Vdc.
Turn-off Input Voltage
The product monitors the input voltage and will turn on and
turn off at predetermined levels.
The minimum hysteresis between turn on and turn off input
voltage is 1 V.
Remote Control (RC)
The product is fitted with a remote
control function referenced to the
primary negative input connection
(-IN), with positive logic. The RC
function allows the product to be
turned on/off by an external device
like a semiconductor or mechanical
switch.
The maximum required sink current is 1 mA. When the RC pin
is left open, the voltage generated on the RC pin is
8.8 - 10 V. The product is provided with “positive logic” remote
control and will be on until the RC pin is connected to the -IN.
To turn off the product the voltage between RC pin and -IN
should be less than 1V. To turn on the converter the RC pin
should be left open, or connected to a voltage higher than 9 V
referenced to -IN. In situations where it is desired to have the
product to power up automatically without the need for control
signals or a switch, the RC pin can be left open.
See Design Note 021 for detailed information.
Input and Output Impedance
The impedance of both the input source and the load will
interact with the impedance of the product. It is important that
the input source has low characteristic impedance. The
product is designed for stable operation without external
capacitors connected to the input or output. The performance
in some applications can be enhanced by addition of external
capacitance as described under External Decoupling
Capacitors.
If the input voltage source contains significant inductance, the
addition of a 22 - 100 µF capacitor across the input of the
product will ensure stable operation. The capacitor is not
required when powering the product from an input source with
an inductance below 10 µH. The minimum required
capacitance value depends on the output power and the input
voltage. The higher output power the higher input capacitance
is needed. Approximately doubled capacitance value is
required for a 24 V input voltage source compared to a 48V
input voltage source.
External Decoupling Capacitors
When powering loads with significant dynamic current
requirements, the voltage regulation at the point of load can
be improved by addition of decoupling capacitors at the load.
The most effective technique is to locate low ESR ceramic and
electrolytic capacitors as close to the load as possible, using
several parallel capacitors to lower the effective ESR. The
ceramic capacitors will handle high-frequency dynamic load
changes while the electrolytic capacitors are used to handle
low frequency dynamic load changes. It is equally important to
use low resistance and low inductance PCB layouts and
cabling.
External decoupling capacitors will become part of the
product’s control loop. The control loop is optimized for a wide
range of external capacitance and the maximum
recommended value that could be used without any additional
analysis is found in the Electrical specification.
The ESR of the capacitors is a very important parameter.
Stable operation is guaranteed with a capacitor of minimum
100 µF with a verified ESR value of >45 mΩ across the
Output 2 connections.
For further information please contact your local Ericsson
Power Modules representative.
To avoid undershoot below -0.3 V on Output 1 during shut-
down. Use a capacitor of minimum 100 µF across the
Output 1 connections.
Output Voltage Adjust
The product has output voltage adjust pins for all outputs.
These pins can be used to adjust the output voltages above or
below the initial settings.
At increased output voltages the maximum power rating of the
product remains the same, and the max output current must
be decreased correspondingly.
The output voltages are adjusted with voltage on the adjust
pins or by connecting resistors according to the table below:
output output voltage
increases with a
resistor between
output voltage
decreases with a
resistor between
OUT1 Vadj 1 and –IN Vadj 1 and Vcc-prim
OUT2 Vadj 2 and Rtn Vadj 2 and OUT2
OUT3 Vadj 3 and Rtn Vadj 3 and OUT3
Over Temperature Protection (OTP)
The product is protected from thermal overload by an internal
over temperature shutdown circuit.
When TP1 as defined in thermal consideration section exceeds
130°C the product will shut down. The product will make
continuous attempts to start up (non-latching mode) and
resume normal operation automatically when the temperature
has dropped below the temperature threshold.
E
BMR 603 1204 series Direct Converters
Input 32-60 V, Triple Output / 33 W
EN/LZT 146 406 R1B August 2009
© Ericsson AB
Technical Specification
11
Ericsson Internal
PRODUCT SPECIFICATION 3 (5)
Prepared (also subject responsible if other) No.
MICHORG 3/1301-BMR 603 1204/1 Uen
Approved Checked Date Rev Reference
EAB/FJB/GM (Natalie Johansson) (MICTOJO) 2009-08-13 B
Over Current Protection (OCP)
The product include current limiting circuitry for protection at
continuous overload. The output voltage will decrease towards
zero for output currents in excess of max output current (max
IO). The product will resume normal operation after removal of
the overload. The load distribution should be designed for the
maximum output short circuit current specified.
Thermal Consideration
General
The product is designed to operate in different thermal
environments and sufficient cooling must be provided to
ensure reliable operation.
For products mounted on a PCB without a heat sink attached,
cooling is achieved mainly by conduction, from the pins to the
host board, and convection, which is dependant on the airflow
across the product. Increased airflow enhances the cooling of
the product. The Output Current Derating graph found in the
Output section provides the available output current vs.
ambient air temperature and air velocity at VI = 48 V.
The product is tested on a 254 x 254 mm, 35 µm (1 oz),
8-layer test board mounted vertically in a wind tunnel with a
cross-section of 608 x 203 mm.
Definition of product operating temperature
The product operating temperatures is used to monitor the
temperature of the product, and proper thermal conditions can
be verified by measuring the temperature at positions P1 and
P2. The temperature at these positions (TP1 and TP2) should
not exceed the maximum temperatures in the table below. The
number of measurement points may vary with different thermal
design and topology. Temperatures above maximum TP1 and
TP2 measured at the reference points P1 and P2 are not
allowed and may cause permanent damage.
Position Description Max Temp.
P1 Reference point TP1=110º C
P2 MOSFET case TP2=125º C
E
BMR 603 1204 series Direct Converters
Input 32-60 V, Triple Output / 33 W
EN/LZT 146 406 R1B August 2009
© Ericsson AB
Technical Specification
12
Ericsson Internal
PRODUCT SPECIFICATION 4 (5)
Prepared (also subject responsible if other) No.
MICHORG 3/1301-BMR 603 1204/1 Uen
Approved Checked Date Rev Reference
EAB/FJB/GM (Natalie Johansson) (MICTOJO) 2009-08-13 B
Connections
top view
Pin Designation Function
1-3 NC Not Connected
4-5 +IN Positive input
6-7 -IN Negative input
8 RC Remote Control
9 Vcc-prim Decrease OUT1
10 Vadj 1 Output 1 voltage adjust
11-14 NC Not Connected
15 Vadj 3 Output 3 voltage adjust
16 OUT3 Output 3
17-19 Rtn Return
20-21 OUT1 Output 1
22 Vadj 2 Output 2 voltage adjust
23-24 NC Not Connected
E
BMR 603 1204 series Direct Converters
Input 32-60 V, Triple Output / 33 W
EN/LZT 146 406 R1B August 2009
© Ericsson AB
Technical Specification
13
Ericsson Internal
PRODUCT SPEC. MECHANICAL 1 (3)
Prepared (also subject responsible if other) No.
EPETSCH 4/1301-BMR 603 1204 Uen
Approved Checked Date Rev Reference
EAB/FJB/GM (Natalie J) See §1 2009-05-29 A
Mechanical Information
All component placements – whether shown as physical components or symbolical outline – are for reference only and are subject to change throughout the product’s life cycle,
unless explicitly described and dimensioned in this drawing.
E
BMR 603 1204 series Direct Converters
Input 32-60 V, Triple Output / 33 W
EN/LZT 146 406 R1B August 2009
© Ericsson AB
Technical Specification
14
Ericsson Internal
PRODUCT SPEC. MECHANICAL 2 (3)
Prepared (also subject responsible if other) No.
EPETSCH 4/1301-BMR 603 1204 Uen
Approved Checked Date Rev Reference
EAB/FJB/GM (Natalie J) See §1 2009-05-29 A
Assembly Information
All component placements – whether shown as physical components or symbolical outline – are for reference only and are subject to change throughout the product’s life cycle,
unless explicitly described and dimensioned in this drawing.
E
BMR 603 1204 series Direct Converters
Input 32-60 V, Triple Output / 33 W
EN/LZT 146 406 R1B August 2009
© Ericsson AB
Technical Specification
15
Ericsson Internal
PROD. SPECIFICATION MECHANICAL 1 (4)
Prepared (also subject responsible if other) No.
MICKAOV 5/1301-BMR 603 1204 Uen
Approved Checked Date Rev Reference
EAB/FJB/GM [Natalie Johansson] See §1 2009-05-29 A
Soldering Information
The product is intended for convection reflow or vapor phase
reflow in Pb-free reflow processes.
The reflow profile should be optimised to avoid excessive
heating of the product. It is recommended to have a
sufficiently extended preheat time to ensure an even
temperature across the host PCB and to minimize the time in
reflow.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board, since cleaning residues may
affect long time reliability and isolation voltage.
Reflow process specifications1 SnPb eutectic Pb-free
Average ramp-up rate N/A 3°C/s max
Typical solder melting (liquidus)
temperature
TL N/A +221°C
Minimum reflow time above TL N/A 30 s
Minimum pin temperature TPIN N/A +235°C
Peak product temperature TPRODUCT N/A +260°C
Average ramp-down rate N/A 6°C/s max
Maximum time 25°C to peak N/A 8 minutes
1 Note: for mixed SnPb / Pb-free soldering, special recommendations apply
TPRODU CT maximum
TPIN minimu
m
Time
Pin
profi le
Pr od uct
prof ile
TL
Time in
reflow
Time in preheat
/ s o a k z o n e
Ti me 25°C to p eak
Temperatur e
General reflow profile (min pin and max product temperature)
Mixed Solder Process Recommendations
When using products with Pb-free solder bumps with SnPb
paste on the host board, and thereby mixing SnPb with Pb-
free solder, and reflowing at SnPb process temperatures
(backwards compatibility), special recommendations apply:
An extended preheat time between +170°C and +180°C for
60 to 90s and a pin reflow temperature (TPIN) between +220°C
and +225°C for 30 to 60 s is recommended. Ramp-up, ramp-
down and time limitations should be according to Pb-free
reflow process specifications.
The extended preheat time and soak at reflow temperature
will minimize temperature
g
radients and maximize the wettin
g
and solder mixing in the final solder joints. The use of nitro
g
en
reflow atmosphere will further improve the solder joint quality.
30-60 s
221°C to 225°C
60-90 s
170°C to 180°C
Pin profile
Temperature
Time
Reflow profile for mixed soldering (pin temperature = solder joint temperature)
Thermocoupler Attachment
Pin Temperature Recommendations
Pin number 18/19 - or possibly pin 6/7, depending on host
board layout - are chosen as reference locations for the
minimum pin temperature recommendations since either of
these will likely be the coolest solder joints during reflow
Pb-free Solder Processes
For Pb-free solder processes, a pin temperature (TPIN) in
excess of the solder melting temperature (TL, +217 to +221 °C
for SnAgCu solder alloys) for more than 30 seconds, and a
peak temperature of +235°C on all solder joints is
recommended to ensure a reliable solder joint.
Maximum Product Temperature Requirements
Top of the product PCB near pin 1 is chosen as reference
location for the maximum (peak) allowed product temperature
(TPRODUCT), since this will likely be the warmest part of the
product during the reflow process.
Pb-free Solder Processes
For Pb-free solder processes, the product is qualified for
MSL 3 according to IPC/JEDEC standard J-STD-020C.
During reflow, TPRODUCT must not exceed +260 °C at any time.
Top of PCB at pin 1
for measurement of
maximum product
temperature, TPRODUCT
Pin 18/19 for
measurement of
minimum pin (solder
oint) temperature,
PIN
(attach sensors as
close as possible to
actual solder joint)
E
BMR 603 1204 series Direct Converters
Input 32-60 V, Triple Output / 33 W
EN/LZT 146 406 R1B August 2009
© Ericsson AB
Technical Specification
16
Ericsson Internal
PROD. SPECIFICATION MECHANICAL 2 (4)
Prepared (also subject responsible if other) No.
MICKAOV 5/1301-BMR 603 1204 Uen
Approved Checked Date Rev Reference
EAB/FJB/GM [Natalie Johansson] See §1 2009-05-29 A
Surface Mount Assembly and Repair
The solder bumps of the product require particular care
during assembly since the solder bumps are hidden between
the host board and the product’s PCB. Special procedures
are required for successful rework of these products.
Assembly
Automatic pick and place equipment should be used to
mount the product on the host board. The use of a vision
system, using the fiducials on the bottom side of the product
for position control, will ensure adequate accuracy. Manual
mounting of solder bump products is not recommended.
Note that the actual position of the pick up surface is not
necessarily in the center of the product outline. Refer to
mechanical drawing for actual location.
If necessary, it is recommended to fine tune the solder print
aperture size to optimize the amount of deposited solder with
consideration to screen thickness and solder print capability.
Repair
For a successful repair (removal and replacement) of a solder
bump product, a dedicated rework system should be used.
The rework system should preferably utilize a bottom side
heater and a dedicated hot air nozzle to heat the solder
bumps to reflow temperature.
The product is an open frame design with a pick up surface
on a large central component. This pick up surface can not be
used for removal with a vacuum nozzle since the component
solder joints may have melted during the removal reflow.
In order not to damage the product and nearby components
during removal and replacement with a new product, it is
recommended to use a double wall design of the hot air
nozzle to direct the air flow only to the edges of the product,
see ‘Assembly Information’ in the mechanical drawing.
Dry Pack Information
Products intended for Pb-free reflow processes are delivered
in standard moisture barrier bags according to IPC/JEDEC
standard J-STD-033 (Handling, packing, shipping and use of
moisture/reflow sensitivity surface mount devices). The SnPb
option of this product is also delivered in dry packing.
Using products in high temperature Pb-free soldering
processes requires dry pack storage and handling. In case
the products have been stored in an uncontrolled
environment and no longer can be considered dry, the
modules must be baked according to J-STD-033.
Delivery Package Information
The surface mount version of the product is delivered in
antistatic injection molded trays (Jedec design guide 4.10D
standard).
Tray Specifications
Material Antistatic PPE
Surface resistance 105 < Ohm/square < 1012
Baking The trays can be baked at maximum 125°C
for maximum 48 hours
Tray capacity 10 products / tray
Tray thickness 12.19 mm [0.480 inch]
Tray weight 115 g empty, max 365 g full
E
BMR 603 1204 series Direct Converters
Input 32-60 V, Triple Output / 33 W
EN/LZT 146 406 R1B August 2009
© Ericsson AB
Technical Specification
17
Ericsson Internal
PROD. SPECIFICATION MECHANICAL 3 (4)
Prepared (also subject responsible if other) No.
MICKAOV 5/1301-BMR 603 1204 Uen
Approved Checked Date Rev Reference
EAB/FJB/GM [Natalie Johansson] See §1 2009-05-29 A
Product Qualification Specification
Characteristics
External visual inspection IPC-A-610
Change of temperature
(Temperature cycling)
IEC 60068-2-14 Na Temperature range
Number of cycles
Dwell/transfer time
-40 to +100°C
1000
15 min/0-1 min
Cold (in operation) IEC 60068-2-1 Ad Temperature TA
Duration
-45°C
72 h
Damp heat IEC 60068-2-67 Cy Temperature
Humidity
Duration
+85°C
85 % RH
1000 hours
Dry heat IEC 60068-2-2 Bd Temperature
Duration
+125°C
1000 h
Electrostatic discharge
susceptibility
IEC 61340-3-1, JESD 22-A114
IEC 61340-3-2, JESD 22-A115
Human body model (HBM)
Machine Model (MM)
Class 2, 2000 V
Class 3, 200 V
Immersion in cleaning solvents IEC 60068-2-45 XA
Method 2
Water
Glycol ether
Isopropanol
+55°C
+35°C
+35°C
Mechanical shock IEC 60068-2-27 Ea Peak acceleration
Duration
100 g
6 ms
Moisture reflow sensitivity 1 J-STD-020C level 1 (SnPb-eutectic)
level 3 (Pb Free)
225°C
260°C
Operational life test MIL-STD-202G method 108A Duration 1000 h
Resistance to soldering heat 2 IEC 60068-2-20 Tb
Method 1A
Solder temperature
Duration
270°C
10-13 s
Robustness of terminations
IEC 60068-2-21 Test Ua1
IEC 60068-2-21 Test Ue1
Through hole mount products
Surface mount products
All leads
All leads
Solderability
IEC 60068-2-58 test Td 1
IEC 60068-2-20 test Ta 2
Preconditioning
Temperature, SnPb Eutectic
Temperature, Pb-free
Preconditioning
Temperature, SnPb Eutectic
Temperature, Pb-free
150°C dry bake 16 h
215°C
235°C
Steam ageing
235°C
245°C
Vibration, broad band random IEC 60068-2-64 Fh, method 1 Frequency
Spectral density
Duration
10 to 500 Hz
0.07 g2/Hz
10 min in each perpendicular
direction
Note 1: Only for products intended for reflow soldering (surface mount products)
Note 2: Only for products intended for wave soldering (hole mounted products)
E
BMR 603 1204 series Direct Converters
Input 32-60 V, Triple Output / 33 W
EN/LZT 146 406 R1B August 2009
© Ericsson AB
Technical Specification
18