© 2003 California Micro Devices Corp. All rights reserved.
10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 1
CSPEMI204
2 Channel Headset EMI Filter with ESD Protection
Features
• Two channels of EMI filtering, one for a micro-
phone and one for an earpiece speaker
• Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
• Chip Scale Package features extremely low para-
sitic inductance for optimum filter performance
• Greater than 30dB relative attenuation in the 800-
2700MHz range
•+8kV ESD protection on each channel (IEC 61000-
4-2 Level 4, contact discharge)
•+15kV ESD protection on each channel (HBM)
• 5-bump, 0.950mm X 1.41mm footprint
Chip Scale Package (CSP)
• Lead-free version available
Applications
• EMI filtering and ESD protection for headset micro-
phone and earpiece speaker ports
• Cellular / Mobile Phones
• Notebooks and Personal Computers
• Handheld PCs / PDAs / Tablets
• Wireless Handsets
• Digital Camcorders
Product Description
The CSPEMI204 is a low-pass filter array designed
specifically to reduce EMI/RFI emissions and provide
ESD protection for a headset port on a cellular and
mobile devices. The CSPEMI204 integrates two high
quality, pi-style filters (C-R-C) filters, one for a micro-
phone and one for an earpiece or speaker, each pro-
viding more than 30dB attenuation relative to the pass
band attenuation in the 800-2700 MHz range. These
filters support bidirectional filtering, reducing EMI both
to and from the headset port and support bipolar audio
signals without distortion.
In addition, the CSPEMI204 provides a very high level
of protection for sensitive electronic components that
may be subject to electrostatic discharge (ESD). The
input pins are designed and characterized to safely dis-
sipate ESD strikes of +8kV, the maximum requirement
of the IEC 61000-4-2 international standard. Using the
MIL-STD-883 (Method 3015) specification for Human
Body Model (HBM) ESD, the device provides protec-
tion for contact discharges to greater than +15kV. The
CSPEMI204 protects sensitive components such as
CPU and DSPs that have much weaker internal ESD
protection circuitry usually only intended for mechani-
cal handling protection.
The CSPEMI204 is particularly well suited for portable
electronics because of its small package format and
low weight. The CSPEMI204 is available in a space-
saving, low-profile Chip Scale Package with optional
lead-free finishing.
Electrical Schematic
10
Ω
100pF
100pF
Earpiece C1
B2
GND
A1
Input
Earpiece
Output
68
Ω
47pF
47pF
Microphone C3A3
Input
Microphone
Output
© 2003 California Micro Devices Corp. All rights reserved.
2430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 10/09/03
CSPEMI204
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN NAME DESCRIPTION
A1 EAR_IN Earpiece Input (from audio circuitry)
A3 MIC_IN Microphone Input (from microphone)
B2 GND Device Ground
C1 EAR_OUT Earpiece Output (to earpiece)
C3 MIC_OUT Microphone Output (to audio circuitry)
MIC_OUT EAR_OUT
GND
MIC_IN EAR_IN
C3
Orientation
Marking
C1
B2
A1A3
A1
AE
312
C
B
A
Orientation
Marking
(see note 2)
PACKAGE / PINOUT DIAGRAMS
Notes:
TOP VIEW
CSPEMI204
CSP Package
BOTTOM VIEW
(Bumps Down View) (Bumps Up View)
1) These drawings are not to scale.
2)
Lead-free devices are specified by using a "+" character for the top side orientation mark.
PART NUMBERING INFORMATION
Bumps Package
Standard Finish Lead-free Finish2
Ordering Part
Number1Part Marking
Ordering Part
Number1Part Marking
5 CSP CSPEMI204 AE CSPEMI204G AE
© 2003 California Micro Devices Corp. All rights reserved.
10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 3
CSPEMI204
Specifications
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open
Note 5: The parameters are guaranteed by design.
Note 6: ZSOURCE=50Ω, ZLOAD=50Ω
ABSOLUTE MAXIMUM RATINGS
PARAMETER RATING UNITS
Storage Temperature Range -65 to +150 °C
DC Power per Resistor 100 mW
DC Package Power Rating 300 mW
STANDARD OPERATING CONDITIONS
PARAMETER RATING UNITS
Operating Temperature Range -40 to +85 °C
ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
R1Resistance 9 10 11 Ω
R2Resistance 54 68 75 Ω
C1 Capacitance 80 100 120 pF
C2 Capacitance 38 47 57 pF
ILEAK Diode Leakage Current VIN=5.0V 1.0 µA
VSIG Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
5
-5
7
-10
15
-15
V
V
VESD In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Notes 2,4 and 5
±15
±8
kV
kV
VCL Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2,3,4 and 5
+15
-19
V
V
fC1 Cut-off frequency 1; Note 6 R = 10Ω, C = 100pF 33 MHz
fC2 Cut-off frequency 2; Note 6 R = 68Ω, C = 47pF 61 MHz
© 2003 California Micro Devices Corp. All rights reserved.
4430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 10/09/03
CSPEMI204
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. Earpiece Circuit (A1-C1) EMI Filter Performance
Figure 2. Microphone Circuit (A3-C3) EMI Filter Performance
© 2003 California Micro Devices Corp. All rights reserved.
10/09/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 5
CSPEMI204
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
Figure 4. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 5. Lead-free (SnAgCu) Solder
Ball Reflow Profile
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER VALUE
Pad Size on PCB 0.275mm Round
Pad Definition Non-Solder Mask defined pads
Solder Mask Opening 0.325mm Round
Solder Stencil Thickness 0.125 - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330mm Round
Solder Flux Ratio 50/50 by volume
Solder Paste Type No Clean
Pad Protective Finish OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball +50µm
Solder Ball Side Coplanarity +20µm
Maximum Dwell Time Above Liquidous 60 seconds
Soldering Maximum Temperature 260°C
Solder Mask Opening
0.325mm DIA.
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
200
250
150
100
50
0 1:00.0 2:00.0 3:00.0 4:00.0
Time (minutes)
Temperature (°C)
© 2003 California Micro Devices Corp. All rights reserved.
6430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 10/09/03
CSPEMI204
Mechanical Details
CSP Mechanical Specifications
CSPEMI204 devices are packaged in a custom Chip
Scale Package (CSP). Dimensions are presented
below. For complete information on CSP packaging,
see the California Micro Devices CSP Package Infor-
mation document.
Package Dimensions for CSPEMI204
Chip Scale Package
CSP Tape and Reel Specifications
Figure 6. Tape and Reel Mechanical Data
PACKAGE DIMENSIONS
Package Custom CSP
Bumps 5
Dim Millimeters Inches
Min Nom Max Min Nom Max
A1 0.905 0.950 0.995 0.0356 0.0374 0.0392
A2 1.365 1.410 1.455 0.0537 0.0555 0.0573
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.245 0.250 0.255 0.0096 0.0098 0.0100
B3 0.430 0.435 0.440 0.0169 0.0171 0.0173
B4 0.430 0.435 0.440 0.0169 0.0171 0.0173
C1 0.175 0.225 0.275 0.0069 0.0089 0.0108
C2 0.220 0.270 0.320 0.0087 0.0106 0.0126
D1 0.561 0.605 0.649 0.0221 0.0238 0.0255
D2 0.355 0.380 0.405 0.0140 0.0150 0.0159
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
A
B
C
12
C1
B1
A1
B3
C2
DIMENSIONS IN MILLIMETERS
D1
D2
A2
BOTTOM VIEW
SIDE
VIEW
3
B2
B4
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
SOLDER BUMPS
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
PART NUMBER CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL P0P1
CSPEMI204 1.41 X 0.95 X 0.6 1.52 X 1.07 X 0.72 8mm 178mm (7") 3500 4mm 4mm
To p
For tape feeder reference
Cover
Ta pe
P
1
only including draft.
Concentric around B.
K
o
Embossment
User direction of feed
±
0.2 mm
P
o
Center lines
of cavity
W
10 Pitches cumulative
tolerance on tape
A
o
B
o
