MAX8682 RELIABILITY REPORT FOR MAX8682ETM+ PLASTIC ENCAPSULATED DEVICES October 26, 2012 MAXIM INTEGRATED 160 RIO ROBLES SAN JOSE, CA 95134 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated. All rights reserved. Page 1/5 MAX8682 Conclusion The MAX8682ETM+T successfully meets the quality and reliability standards required of all Maxim Integrated products. In addition, Maxim Integrated's continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim Integrated's quality and reliability standards. Table of Contents I. ........Device Description IV. .......Die Information II. ........Manufacturing Information V. ........Quality Assurance Information III. .......Packaging Information VI. .......Reliability Evaluation .....Attachments I. Device Description A. General The MAX8682 power-management IC (PMIC) provides a compact and complete power-supply solution for Digital Single-Lens Reflex (DSLR) cameras. Six DC-DC converters with internal switches provide up to 94% efficiency to generate the critical power-supply voltages required in DSLR camera systems. The two H-bridge and three step-down DC-DC converters are internally compensated and switch only as necessary at light loads to optimize efficiency. The H-bridge channels utilize MaximaTMs proprietary H-bridge topology, providing a seamless transition through all operating modes without the glitches commonly seen in competing H-bridge converters. All six converters offer True Shutdown(tm) short-circuit protection, and overload protection. To prevent current runaway in the event of a hard short, channels 1 and 2 latch off immediately if the output voltage drops below 1.25V anytime after startup. The white LED step-up converter provides regulated current and dimming control. If a short-circuit condition is detected on the output capacitor of the white LED converter, only this converter turns off. If a short or overload condition is detected on any other output for at least 66ms, the PMIC turns off all converters. Maxim Integrated. All rights reserved. Page 2/5 MAX8682 II. Manufacturing Information A. Description/Function: Smallest 6-Channel, 2-Cell Li+ PMIC for Digital SLR Cameras B. Process: S45 C. Number of Device Transistors: 36633 D. Fabrication Location: California, Texas or Japan E. Assembly Location: China, Thailand F. Date of Initial Production: October 13, 2010 III. Packaging Information A. Package Type: 48-pin TQFN 6x6 B. Lead Frame: Copper C. Lead Finish: 100% matte Tin D. Die Attach: Conductive E. Bondwire: Au (1.3 mil dia.) F. Mold Material: Epoxy with silica filler G. Assembly Diagram: #05-9000-3132 H. Flammability Rating: Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard J-STD-020-C Level 1 J. Single Layer Theta Ja: 38C/W K. Single Layer Theta Jc: 1.4C/W L. Multi Layer Theta Ja: 27C/W M. Multi Layer Theta Jc: 1.4C/W IV. Die Information A. Dimensions: 123 X 157 mils B. Passivation: Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) C. Interconnect: Al/0.5%Cu with Ti/TiN Barrier D. Backside Metallization: None E. Minimum Metal Width: Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn) F. Minimum Metal Spacing: Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn) G. Bondpad Dimensions: H. Isolation Dielectric: SiO2 I. Die Separation Method: Wafer Saw Maxim Integrated. All rights reserved. Page 3/5 MAX8682 V. Quality Assurance Information A. Quality Assurance Contacts: Richard Aburano (Manager, Reliability Engineering) Don Lipps (Manager, Reliability Engineering) Bryan Preeshl (Vice President of QA) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows: = 1 MTTF = 1.83 (Chi square value for MTTF upper limit) 192 x 4340 x 68 x 2 (where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV) = 16.1 x 10-9 = 16.1 F.I.T. (60% confidence level @ 25C) The following failure rate represents data collected from Maxim Integrated's reliability monitor program. Maxim Integrated performs quarterly life test monitors on its processes. This data is published in the Reliability Report found at http://www.maximintegrated.com/qa/reliability/monitor. Cumulative monitor data for the S45 Process results in a FIT Rate of 0.49 @ 25C and 8.49 @ 55C (0.8 eV, 60% UCL) B. E.S.D. and Latch-Up Testing (ESD lot EGTZDQ002A D/C 0821, Latch-Up lot EGTZDQ003A D/C 0849) The PQ16 die type has been found to have all pins able to withstand a HBM transient pulse of +/-2500V per JEDEC JESD22-A114. Latch-Up testing has shown that this device withstands a current of +/-250mA. Maxim Integrated. All rights reserved. Page 4/5 MAX8682 Table 1 Reliability Evaluation Test Results MAX8682ETM+T TEST ITEM TEST CONDITION Static Life Test (Note 1) Ta = 135C Biased Time = 192 hrs. FAILURE IDENTIFICATION SAMPLE SIZE NUMBER OF FAILURES COMMENTS DC Parameters & functionality 43 25 0 0 EGTZDQ003A, D/C 0849 EGTZDQ002B, D/C 0821 Note 1: Life Test Data may represent plastic DIP qualification lots. Maxim Integrated. All rights reserved. Page 5/5