2SD300C17A1 - Powerint - Datasheet.Live

SCALE™-2 2SD300C17A1, 2SD300C17A1C

www.power.com/igbt-driver Page 1

2SD300C17A1 and 2SD300C17A1C

Preliminary Datasheet

Dual-Channel High-quality and SCALE™-2 Driver Core

Abstract

The SCALE™-2 dual-driver core 2SD300C17A1 / 2SD300C17A1C (Coated version using ELPEGUARD SL 1307

FLZ/2 from Lackwerke Peters) is designed for applications in which high reliability is expected.

The use of Power Integrations' highly integrated SCALE-2 chipset allows 63% of the components to be

dispensed with compared to conventional drivers. This advantage is impressively reflected in increased

reliability (function and MTBF).

The 2SD300C17A1(C) combines a complete two-channel driver core with all components required for driving,

such as an isolated DC/DC converter, short-circuit protection, failure soft shut down, short pulse suppression

as well as supply voltage monitoring. Each of the two output channels is electrically isolated from the primary

side and the other secondary channel.

The driver provides a gate voltage swing of ±15V. An output current of 30A and 4W drive power is available

per channel.

Its outstanding EMC with a dv/dt strength of more than 50V/ns allows safe and reliable operation in even the

demanding industrial applications

Product Highlights Applications

 Dual channel driver  IGBTs up to 1700V

 Highly integrated SCALE-2 chipset

 Switching frequency up to 60kHz

 Gate current ±30A

 4W output power per channel

 Direct and half-bridge mode

 IGBT short-circuit protection

 Failure soft shut down

 Isolated DC/DC converter

 Safe isolation to EN 50178

 UL compliant

 Reliable, long service life

SCALE™-2 2SD300C17A1, 2SD300C17A1C

Preliminary Data Sheet

www.power.com/igbt-driver Page 2

Safety Notice!

The data contained in this data sheet is intended exclusively for technically trained staff. Handling all high-

voltage equipment involves risk to life. Strict compliance with the respective safety regulations is mandatory!

Any handling of electronic devices is subject to the general specifications for protecting electrostatic-sensitive

devices according to international standard IEC 60747-1, Chapter IX or European standard EN 100015 (i.e. the

workplace, tools, etc. must comply with these standards). Otherwise, this product may be damaged.

Important Product Documentation

This data sheet contains only product-specific data. For a detailed description, must-read application notes and

important information that apply to this product, please refer to “2SD300C17 Description & Application

Manual” on www.power.com/igbt-driver/go/2SD300C17.

Absolute Maximum Ratings

Parameter Remarks Min Max Unit

Supply voltage VDC

VDC to GND 0 16 V

Supply voltage VDD

VDD to GND 0 16 V

Logic input voltages INA, INB and Mod to GND -0.5 20 V

Logic output voltages SOA and SOB to GND -0.5 VDD+0.5 V

SOx current Failure condition, total current 20 mA

Gate peak current Iout Note 1 -30 +30 A

Gate resistance Turn-on and turn-off 1 Ω

IGBT gate charge 50 µC

Average supply current IDC Notes 2, 3 540 mA

Output power Ambient temperature ≤ 70°C (Notes 4, 5) 4 W

Ambient temperature ≤ 85°C (Note 4) 3 W

Switching frequency f 60 kHz

Test voltage (50Hz/1min.) Primary to secondary (Note 11) 5000 VAC(eff)

Secondary to secondary (Note 11) 4000 VAC(eff)

|dV/dt| Rate of change of input to output voltage 50 kV/μs

Operating voltage Primary and secondary to secondary side 1700 Vpeak

Operating temperature Note 5 -40 85 °C

Storage temperature Note 14 -40 50 °C

Surface temperature Only for 2SD300C17A1C (Note 15) 125 °C

SCALE™-2 2SD300C17A1, 2SD300C17A1C

Preliminary Data Sheet

www.power.com/igbt-driver Page 3

Recommended Operating Conditions

Power Supply Remarks Min Typ Max Unit

Supply voltage

VDC

VDC to GND 14 15 16 V

Supply voltage

VDD

VDD to GND 14 15 16 V

Input logic level INx and Mod to GND, high level VDD V

Input logic level INx and Mod to GND, low level 0 V

Electrical Characteristics

All data refer to +25°C and VDC = VDD

= 15V unless otherwise specified.

Power supply Remarks Min Typ Max Unit

Supply current IDC Without load 65 mA

Supply current IDD Direct mode, f = 0Hz 14 mA

Supply current IDD Direct mode, f = 60kHz 21 mA

Coupling capacitance Cio Primary to secondary, per channel 22 pF

Secondary to secondary 15 pF

Power Supply Monitoring Remarks Min Typ Max Unit

Supply threshold VDD Primary side, clear fault 11.9 12.6 13.3 V

Primary side, set fault (Note 6) 11.3 12.0 12.7 V

Monitoring hysteresis Primary side, set/clear fault 0.35 V

Supply threshold Vx+-VCOMx Secondary side, clear fault 12.1 12.6 13.1 V

Secondary side, set fault (Note 7) 11.5 12.0 12.5 V

Monitoring hysteresis Secondary side, set/clear fault 0.35 V

Supply threshold VCOMx-Vx- Secondary side, clear fault 5 5.15 5.3 V

Secondary side, set fault (Note 7) 4.7 4.85 5 V

Monitoring hysteresis Secondary side, set/clear fault 0.15 V

Logic Inputs and Outputs Remarks Min Typ Max Unit

Input impedance INx and Mod 3.9 kΩ

Turn-on threshold V(INx) 8.1 V

Turn-off threshold V(INx) 4.8 V

SOx output voltage Failure condition, I(SOx) < 20mA 0.7 V

Short-Circuit Protection Remarks Min Typ Max Unit

Rth value Between RCx and COM x 2 70 kΩ

Blocking time Note 10 27 ms

SCALE™-2 2SD300C17A1, 2SD300C17A1C

Preliminary Data Sheet

www.power.com/igbt-driver Page 4

External Fault input Remarks Min Typ Max Unit

Threshold level Between E.x and COM x 5 V

Timing Characteristics Remarks Min Typ Max Unit

Turn-on delay td(on) Direct mode (Note 8) 630 ns

Turn-off delay td(off) Direct mode (Note 8) 490 ns

Short pulse suppression Turn-on command pulse width 470 ns

Turn-off command pulse width 300 ns

Dead time between channels Half-bridge mode, with CA = CB = 0pF (Note 13) 1.3 µs

Transmission delay of fault state Note 9 450 ns

Output Voltage Remarks Min Typ Max Unit

Turn-on voltage Gate x to COM x 15 V

Turn-off voltage Gate x to COM x -15 V

Electrical Isolation Remarks Min Typ Max Unit

Test voltage (50Hz/1s) Primary to secondary side (Note 11) 5000 5050 5100 Veff

Secondary to secondary side (Note 11) 4000 4050 4100 Veff

Partial discharge extinction volt. Primary to secondary side (Note 12) 1768 Vpeak

Secondary to secondary side (Note 12) 1700 Vpeak

Creepage distance Primary to secondary side 16.2 mm

Secondary to secondary side 14.2 mm

Clearance distance Primary to secondary side 16.2 mm

Secondary to secondary side 6.5 mm

Output Remarks Min Typ Max Unit

Blocking capacitance Vx+ to COM x 9.4 µF

COM x to Vx- 9.4 µF

Footnotes to the Key Data

1) The maximum peak gate current refers to the highest current level occurring during the product

lifetime. It is an absolute value and does also apply for short pulses.

2) The average supply input current is limited for thermal reasons. Higher values than specified by the

absolute maximum rating are permissible (e.g. during power supply start up) if the average remains

below the given value, provided the average is taken over a time period which is shorter than the

thermal time constants of the driver in the application.

3) There is no means of actively controlling or limiting the input current in the driver. In the case of

start-up with very high blocking capacitor values, or in case of short circuit at the output, the supply

input current has to be limited externally.

4) The maximum output power must not be exceeded at any time during operation. The absolute

maximum rating must also be observed for time periods shorter than the thermal time constants of

the driver in the application.

5) An extended output power range is specified for maximum ambient temperatures of 70°C.

SCALE™-2 2SD300C17A1, 2SD300C17A1C

Preliminary Data Sheet

www.power.com/igbt-driver Page 5

6) Undervoltage monitoring of the primary-side supply voltage (VDD to GND). If the voltage drops below

this limit, a fault is transmitted to both outputs SOA and SOB and the IGBTs are switched off.

7) Undervoltage monitoring of the secondary-side supply voltage (Vx+ to COM x and COM x to Vx- which

correspond with the approximate turn-on and turn-off gate-emitter voltages). If the corresponding

voltage drops below this limit, the IGBT is switched off and a fault is transmitted to the corresponding

SOx output on the primary side.

8) The delay time is measured between 50% of the input signal and 10% (turn-on) or 90% (turn-off) of

the corresponding output.

9) Transmission delay of fault state from the secondary side to the primary status output.

10) The blocking time sets a minimum time span between the end of any fault state and the start of

normal operation (remove fault from pin SOx). The value of the blocking time is programmed on the

driver and cannot be modified externally.

11) HiPot testing (= dielectric testing) must generally be restricted to suitable components. This gate

driver is suited for HiPot testing. Nevertheless, it is strongly recommended to limit the testing time to

1s slots as stipulated by EN 50178. Excessive HiPot testing at voltages much higher than 1200VAC(eff)

may lead to insulation degradation. No degradation has been observed over 1min. testing at

5000VAC(eff). The transformer of every production sample shipped to customers has undergone 100%

testing at the given value for 1s.

12) Partial discharge measurement is performed in accordance with IEC 60270 and isolation coordination

specified in EN 50178. The partial discharge extinction voltage between primary and either secondary

side is coordinated for safe isolation to EN 50178.

13) The dead time is measured between 50% voltage swing of the gate-emitter voltage which is turned

off and 50% voltage swing of the gate-emitter voltage which is turned-on.

14) The storage temperature inside the original package (1) or in case the coating material of coated

products may touch external parts (2) must be limited to the given value.

Otherwise, it is limited to 90°C.

15) The component surface temperature, which may strongly vary depending on the operating condition,

must be limited to the given value for coated driver versions to ensure long-term reliability of the

coating material.

Legal Disclaimer

The statements, technical information and recommendations contained herein are believed to be accurate as

of the date hereof. All parameters, numbers, values and other technical data included in the technical

information were calculated and determined to our best knowledge in accordance with the relevant technical

norms (if any). They may base on assumptions or operational conditions that do not necessarily apply in

general. We exclude any representation or warranty, express or implied, in relation to the accuracy or

completeness of the statements, technical information and recommendations contained herein. No

responsibility is accepted for the accuracy or sufficiency of any of the statements, technical information,

recommendations or opinions communicated and any liability for any direct, indirect or consequential loss or

damage suffered by any person arising therefrom is expressly disclaimed.

SCALE™-2 2SD300C17A1, 2SD300C17A1C

Preliminary Data Sheet

www.power.com/igbt-driver Page 6

Ordering Information

Our international terms and conditions of sale apply.

Type Designation Description

2SD300C17A1 Dual-channel SCALE-2 driver core (PCB thickness: 1.55mm)

2SD300C17A1C Dual-channel SCALE-2 driver core (PCB thickness: 1.55mm, conformal coating)

Product home page: www.power.com/igbt-driver/go/2SD300C17

Refer to www.power.com/igbt-driver/go/nomenclature for information on driver nomenclature

Information about Other Products

For other drivers, product documentation, and application support

Please click: www.power.com

We reserve the right to make any technical modifications without prior notice. Version 3.0 from 2018-02-09

SCALE™-2 2SD300C17A1, 2SD300C17A1C

Preliminary Data Sheet

www.power.com/igbt-driver Page 7

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