Preliminary Specification Number : SP-HNZY-F Bluetooth Low Energy Module Data Sheet Dialog Semiconductor Chipset for Bluetooth 4.1 Tentative P/N : LBCA2HNZYZ-711 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-HNZY-F P1/19 Revision History Revision Code Date Oct.24.2013 A Feb.13.2014 B Mar.20.2014 Description First issue 4. Dimensions and Terminal Configurations Added Dimensions of m6 and m7 5. Revised Absolute Maximum Ratings 6. Revised Operating Condition 10. Revised RF Characteristics 12. Recommended Land Pattern Corrected to Top view 11. packing Information Added the figure of Tape and Reel 1. Revised Scope Added the weight C Apr.23.2014 D Apr.29.2014 E Jun.04.2014 F Jul.02.2014 5.Revised Absolute Maximum Ratings 8.Revised Sleep Clock for 32kHz Crystal 10.Revised RF Characteristics 13.Revised Application Circuit 11.Revised Packing Information 5.Revised Absolute Maximum Ratings 6. Operating Conditions 10.Revised RF Characteristics 4.Revised Dimensions and Terminal Configurations 10.Revised RF Characteristics 13.Revised Application Circuit Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-HNZY-F P2/19 TABLE OF CONTENTS TABLE OF CONTENTS ............................................................................................................................. 2 1. Scope.................................................................................................................................................. 3 2. Part Number....................................................................................................................................... 3 3. Block Diagram ................................................................................................................................... 3 4. Dimensions and Terminal Configurations...................................................................................... 4 5. Absolute Maximum Ratings ............................................................................................................. 7 6. Operating Condition ......................................................................................................................... 7 7. DC Characteristics ............................................................................................................................ 8 8. Sleep Clock ........................................................................................................................................ 8 9. Power Sequence ............................................................................................................................... 9 10. RF Characteristics ....................................................................................................................... 10 11. Packing Information .................................................................................................................... 11 12. Recommended Land Pattern ..................................................................................................... 14 13. Application Circuit ...................................................................................................................... 15 NOTICE .................................................................................................................................................... 16 PRECONDITION TO USE OUR PRODUCTS ......................................................................................... 19 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Murata products and disclaimers thereto appears at the end of this specification sheet. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-HNZY-F P3/19 1. Scope This specification is applied to the Bluetooth low energy module. - Interface - IC - Reference Clock - Weight - MSL - RoHS : UART/SPI : DA14580 (Dialog Semiconductor) : Internal Crystal. : 0.107g :3 : This module is compliant with the RoHS directive. 2. Part Number Part Number LBCA2HNZYZ-711 3. Block Diagram External X'tal / TCXO (32.768kHz) X'tal (16MHz) Antenna BLE IC LC Network for DCDC UART /SPI/I2C GPIO/ADC Quadrature Decoder Power Source Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-HNZY-F P4/19 4. Dimensions and Terminal Configurations <Top View> <Side View> <Bottom View> Pin 1 Marking (unit: mm) Dimension Mark Dimensions Mark Dimensions Mark Dimensions Mark Dimensions L 7.40.25 W 7.00.25 T 1.0 Max a1 0.30.1 a2 0.30.1 b1 0.30.2 b2 0.4250.2 b3 0.4250.2 c1 0.60.1 c2 0.60.1 e1 0.350.1 e2 0.350.1 e3 0.350.1 e4 0.50.1 e5 0.50.1 e6 0.40.1 e7 0.50.1 e8 0.50.1 m1 0.30.1 m2 0.60.1 m3 0.30.1 m4 0.30.1 m5 0.60.1 m6 3.30.2 m7 0.30.2 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-HNZY-F P5/19 Terminal Configurations <Bottom View> 36 13 37 14 15 16 17 18 19 20 22 12 11 31 32 33 34 10 30 29 28 27 35 23 24 9 8 21 25 7 6 5 4 3 2 1 26 1 2 Terminal Name P0_5 P0_7 Connection to IC Terminal P0_5 P0_7 3 P0_6 P0_6 4 SWCLK SWCLK 5 SWDIO SWDIO 6 GND GND INPUT/OUTPUT with selectable pull up/down resistor. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contain state retention mechanism during power down. INPUT JTAG clock signal INPUT/OUTPUT. JTAG Data input/output. Bidirectional data and control communication GND 7 8 VBAT GND VBAT GND INPUT Battery connection. GND 9 10 XTAL32KP XTAL32KM P0_3 XTAL32KP XTAL32KM P0_3 P0_2 P0_2 13 ANTout - 14 ANTin - 15 16 GND GND GND GND No. 11 12 Description INPUT. Crystal input for the 32.768 kHz XTAL OUTPUT. Crystal output for the 32.768 kHz XTAL INPUT/OUTPUT with selectable pull up/down resistor. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contain state retention mechanism during power down. refer to reference schematic refer to reference schematic GND GND Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-HNZY-F P6/19 17 Terminal Name GND Connection to IC Terminal GND 18 GND GND GND 19 20 NC GND GND NC GND 21 22 GND P0_1 GND P0_1 23 P0_0 P0_0 24 P0_4 P0_4 25 RST RST 26 GND GND GND INPUT/OUTPUT with selectable pull up/down resistor. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contain state retention mechanism during power down. INPUT. Reset signal (Active High). It can be connected to GND if not used. GND 27 28 GND GND GND GND GND GND 29 GND GND 30 P1_1 P1_1 31 VPP VPP 32 33 GND GND GND GND GND INPUT/OUTPUT with selectable pull up/down resistor. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contain state retention mechanism during power down. INPUT. This pin is used while OTP programming and testing. OTP programming: VPP = 6.8V 0.25V OTP Normal operation: VPP float GND GND 34 GND GND 35 P1_0 P1_0 36 NC GND INPUT/OUTPUT with selectable pull up/down resistor. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contain state retention mechanism during power down. NC 37 NC NC No. Description GND Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-HNZY-F P7/19 5. Absolute Maximum Ratings Item Storage Temperature VBAT Min -40 Max 85 3.6 Unit degC V Remarks Stresses in excess of the absolute ratings may cause permanent damage. Functional operation is not implied under these conditions. Exposure to absolute ratings for extended periods of time may adversely affect reliability. No damage assuming only one parameter is set at limit at a time with all other parameters are set within operating condition. 6. Operating Condition Item Operating Temperature*1 VBAT RF Load Impedance *1 Min -40 2.35 Typ 50 Max 85 3.3 Unit degC V Remarks Functionality is guaranteed but specifications require derating at extreme temperatures. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-HNZY-F P8/19 7. DC Characteristics Parameters VIH VIL VOH VOL IIH(PD) IIL(PU) Description HIGH level input voltage LOW level input voltage HIGH level output voltage LOW level output voltage HIGH level input current with internal pull down enabled LOW level input current with internal pull up enabled Conditions Active mode Active mode Active mode Active mode Vin = VBAT = 2.5V Vin = GND = 0V Min 0.84 Typ Max 0.47 Unit V V V V 50 150 uA -150 -50 uA Max Unit kHz 100 kohm 7 1 9 2 250 pF pF ppm uW Typ 32.768 Max Unit kHz mVpp ppm 0.36 1.88 8. Sleep Clock For 32kHz Crystal Parameters fXTAL ESR CL C0 dfXTAL DLmax Description Crystal frequency Equivalent Series Resistance Load Capacitance Shunt Capacitance Crystal frequency tolerance Maximum drive level Conditions Min Typ 32.768 6 -250 0.1 For 32kHz Crystal Oscillator Parameters fXO AXO dfXO Description Oscillator frequency Amplitude Frequency tolerance Conditions Min 100 -250 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. 1500 250 Preliminary Specification Number : SP-HNZY-F P9/19 9. Power Sequence Power Up / Down Sequence Power Up Power Down Td VBAT H V1 L Ta Tb H GPIO L Reset and Power Cycle Sequence Symbol Description Typ Unit Ta > 500 us Ta Time between VCC valid and GPIO enabled Tb Time between GPIO invalid and VCC invalid Tb > 0 us Tc Length of RST pulse Tc > 10 us Td Required VBAT ramp-up time Td < 50 ms V1 Threshold voltage of VBAT rise up V1 > 2.35 V Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-HNZY-F P10/19 10. RF Characteristics Normal Condition: VBAT=3.0V, +25deg.C, (otherwise notified) Item / Conditions Center frequency Channel Spacing Number of RF Channels Output power (Measured at ANT pin) Modulation characteristics 1) f1avg 2) f2max (at 99.9%) 3) f2avg / f1avg Carrier frequency offset and drift 1) Frequency offset: | fn - fTX | 2) Frequency drift: | f0 - fn | 3) Drift rate #0: | f1 - f0 | 4) Drift rate #n: | fn - fn-5 | Receiver sensitivity (PER < 30.8%) Maximum input signal level (PER < 30.8%) PER Report Integrity (-30dBm input) TX Current consumption RX Current consumption MIN 2402 - Spec. TYP 2 40 -1 MAX 2480 - MHz MHz dBm 225 185 0.8 - 275 - kHz kHz - -10 50 - -93 4.8 5.1 150 50 20 20 -70 65.4 - kHz kHz kHz kHz dBm dBm % mA mA Unit *Since Murata cannot always guarantee 100% connection success in all actual condition, please implement retry of connection until success if you will program the application software for central device. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-HNZY-F P11/19 11. Packing Information (1) Dimensions of Tape (Plastic tape) .1 0 5 7 .1 1 .0 .5 7 1.5 0.300.05 +0.1 0 1.50.1 .10 8. 7 12.00.1 7.50.1 1.4 max. (2) Dimensions of Reel 17.41.0 (100) 2.00.5 13.00.2 ( 330) 2 . 0 0 . 6 1 2.00.1 4.00.1 22.4 max (in mm) Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-HNZY-F P12/19 (3) Taping Diagrams [1] Feeding Hole : As specified in (1) [2] Hole for chip : As specified in (1) [3] Cover tape : 62 um in thickness [4] Base tape : As specified in (1) [3] [1] [2] [3] [4] Feeding Hole Feeding Direction Pin 1 Marking Chip (4) Leader and Tail tape Feeding direction Tail tape (No components) 40 to 200mm Components No components Leader tape (Cover tape alone) 150mm min. 250mm min. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-HNZY-F P13/19 (5) The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. (6) The cover tape and base tape are not adhered at no components area for 250 mm min. (7) Tear off strength against pulling of cover tape : 5 N min. (8) Packaging unit : 1000 pcs./ reel (9) material : Base tape : Plastic Reel : Plastic Cover tape , cavity tape and reel are made the anti-static processing. (10) Peeling of force : 1.3 N max. in the direction of peeling as shown below. 1.3 N max. 165 to 180 Cover tape Base tape (11) PACKAGE (Humidity proof Packing) Desiccant Label Humidity Indicator Label Anti-humidity Plastic Bag Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity indicator. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-HNZY-F P14/19 12. Recommended Land Pattern <Top View> (Unit : mm) Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-HNZY-F P15/19 13. Application Circuit 2 .2 uF ( *1 ) Mu ra ta re co m m e nd to i n s e rt ma tc h in g cir cu i t be tw ee n p i ns # 13 a n d # 1 4. 0 Oh m No Lo a d No L oa d Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-HNZY-F P16/19 NOTICE 1.Storage Conditions: Please use this product within 6month after receipt. - The product shall be stored without opening the packing under the ambient temperature from 5 to 35deg.C and humidity from 20 to 70%RH. (Packing materials, in particular, may be deformed at the temperature over 40deg.C.) - The product left more than 6months after reception, it needs to be confirmed the solderbility before used. - The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.). - Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping the product, shall not be applied in order not to damage the packing materials. This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020) - After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product shall be used within 168hours. - When the color of the indicator in the packing changed, the product shall be baked before soldering. Baking condition: 125+5/-0deg.C, 24hours, 1time The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and Cover Tape) are not heat-resistant. 2.Handling Conditions: Be careful in handling or transporting products because excessive stress or mechanical shock may break products. Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change. Do not touch products with bear hands that may result in poor solder ability and destroy by static electrical charge. 3.Standard PCB Design (Land Pattern and Dimensions): All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions. The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand. 4.Notice for Chip Placer: When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-HNZY-F P17/19 5.Soldering Conditions: The recommendation conditions of soldering are as in the following figure. When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100 C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Set up the highest temperature of reflow within 260 C. Contact Murata before use if concerning other soldering conditions. Reflow soldering standard conditions Reflow soldering standard conditions(Example) Within 3s 240to 250 deg.C 220 deg.C Cooling down Slowly 180 deg.C 150 deg.C Pre-heating Within 120s Within 60s time(s) Please use the reflow within 2 times. Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less. 6.Cleaning: Since this Product is Moisture Sensitive, any cleaning is not permitted. 7.Operational Environment Conditions: Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur. - In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.). - In an atmosphere containing combustible and volatile gases. - Dusty place. - Direct sunlight place. - Water splashing place. - Humid place where water condenses. - Freezing place. If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-HNZY-F P18/19 As it might be a cause of degradation or destruction to apply static electricity to products, do not apply static electricity or excessive voltage while assembling and measuring. 8.Input Power Capacity: Products shall be used in the input power capacity as specified in this specifications. Inform Murata beforehand, in case that the components are used beyond such input power capacity range. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number : SP-HNZY-F P19/19 PRECONDITION TO USE OUR PRODUCTS PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS. Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is mounted to your product. All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our product is used for the purpose, under the condition and in the environment specified in this specification. You are requested not to use our product deviating from the condition and the environment specified in this specification. Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this specification. WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. 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In particular we disclaim liability for damages caused by - the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the product to be sold by you, -deviation or lapse in function of engineering sample, -improper use of engineering samples. We disclaim any liability for consequential and incidental damages. If you can't agree the above contents, you should inquire our sales. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd.