LBCA2HNZYZ-711 - MURATA MANUFACTURING

Preliminary Specification Number : SP-HNZY-F

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

Bluetooth Low Energy Module Data Sheet

Dialog Semiconductor Chipset

for Bluetooth 4.1

Tentative P/N : LBCA2HNZYZ-711

Preliminary Specification Number : SP-HNZY-F

P1/19

Preliminary

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Murata Manufacturing Co., Ltd.

Revision History

Revision

Code Date Description

Oct.24.2013 First issue

A Feb.13.2014

4. Dimensions and Terminal Configurations

Added Dimensions of m6 and m7

5. Revised Absolute Maximum Ratings

6. Revised Operating Condition

10. Revised RF Characteristics

12. Recommended Land Pattern

Corrected to Top view

B Mar.20.2014 11. packing Information

Added the figure of Tape and Reel

C Apr.23.2014

1. Revised Scope

Added the weight

5.Revised Absolute Maximum Ratings

8.Revised Sleep Clock for 32kHz Crystal

10.Revised RF Characteristics

13.Revised Application Circuit

D Apr.29.2014 11.Revised Packing Information

E Jun.04.2014

5.Revised Absolute Maximum Ratings

6.

Operating Conditions

10.Revised RF Characteristics

F Jul.02.2014

4.Revised Dimensions and Terminal Configurations

10.Revised RF Characteristics

13.Revised Application Circuit

Preliminary Specification Number : SP-HNZY-F

P2/19

Preliminary

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Murata Manufacturing Co., Ltd.

TABLE OF CONTENTS

TABLE OF CONTENTS ............................................................................................................................. 2

1. Scope .................................................................................................................................................. 3

2. Part Number ....................................................................................................................................... 3

3. Block Diagram ................................................................................................................................... 3

4. Dimensions and Terminal Configurations ...................................................................................... 4

5. Absolute Maximum Ratings ............................................................................................................. 7

6. Operating Condition ......................................................................................................................... 7

7. DC Characteristics ............................................................................................................................ 8

8. Sleep Clock ........................................................................................................................................ 8

9. Power Sequence ............................................................................................................................... 9

10. RF Characteristics ....................................................................................................................... 10

11. Packing Information .................................................................................................................... 11

12. Recommended Land Pattern ..................................................................................................... 14

13. Application Circuit ...................................................................................................................... 15

NOTICE .................................................................................................................................................... 16

PRECONDITION TO USE OUR PRODUCTS ......................................................................................... 19

Please be aware that an important notice concerning availability, standard warranty, and use in critical

applications of Murata products and disclaimers thereto appears at the end of this specification sheet.

Preliminary Specification Number : SP-HNZY-F

P3/19

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

1.

Scope

This specification is applied to the Bluetooth low energy module.

- Interface : UART/SPI

- IC : DA14580 (Dialog Semiconductor)

- Reference Clock : Internal Crystal.

- Weight : 0.107g

- MSL : 3

- RoHS : This module is compliant with the RoHS directive.

2.

Part Number

3.

Block Diagram

Part Number

LBCA2HNZYZ-711

Power

Source

Antenna

X’tal (16MHz)

External X’tal / TCXO

(32.768kHz)

LC Network

for DCDC

UART /SPI/I2C

GPIO/ADC

Quadrature

Decoder

BLE IC

Preliminary Specification Number : SP-HNZY-F

P4/19

Preliminary

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Murata Manufacturing Co., Ltd.

4.

Dimensions and Terminal Configurations

(unit: mm)

Dimension

Mark Dimensions Mark Dimensions Mark Dimensions Mark Dimensions

L 7.4±0.25 W 7.0±0.25 T 1.0 Max

a1 0.3±0.1 a2 0.3±0.1

b1 0.3±0.2 b2 0.425±0.2 b3 0.425±0.2

c1 0.6±0.1 c2 0.6±0.1

e1 0.35±0.1 e2 0.35±0.1 e3 0.35±0.1 e4 0.5±0.1

e5 0.5±0.1 e6 0.4±0.1 e7 0.5±0.1 e8 0.5±0.1

m1 0.3±0.1 m2 0.6±0.1 m3 0.3±0.1 m4 0.3±0.1

m5 0.6±0.1 m6 3.3±0.2 m7 0.3±0.2

Pin 1 Marking

Preliminary Specification Number : SP-HNZY-F

P5/19

Preliminary

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Murata Manufacturing Co., Ltd.

Terminal Configurations

1

2

3

4

5

6

7

26

25

24

23

22

21

20

31

30 29

32 33

28

34

27

1918

35

17161514

36

13

12

11

10

9

8

37

No. Terminal

Name

Connection to

IC Terminal Description

1 P0_5 P0_5 INPUT/OUTPUT with selectable pull up/down

resistor. Pull-down enabled during and after reset.

General purpose I/O port bit or alternate function

nodes. Contain state retention mechanism during

power down.

2 P0_7 P0_7

3 P0_6 P0_6

4 SWCLK SWCLK INPUT JTAG clock signal

5 SWDIO SWDIO INPUT/OUTPUT. JTAG Data input/output.

Bidirectional data and control communication

6 GND GND GND

7 VBAT VBAT INPUT Battery connection.

8 GND GND GND

9 XTAL32KP XTAL32KP INPUT. Crystal input for the 32.768 kHz XTAL

10 XTAL32KM XTAL32KM OUTPUT. Crystal output for the 32.768 kHz XTAL

11 P0_3

P0_3

INPUT/OUTPUT with selectable pull up/down

resistor. Pull-down enabled during and after reset.

General purpose I/O port bit or alternate function

nodes. Contain state retention mechanism during

power down.

12 P0_2

P0_2

13 ANTout -

※

refer to reference schematic

14 ANTin -

※

refer to reference schematic

15 GND GND GND

16 GND GND GND

Preliminary Specification Number : SP-HNZY-F

P6/19

Preliminary

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Murata Manufacturing Co., Ltd.

No. Terminal

Name

Connection to

IC Terminal Description

17 GND GND GND

18 GND GND GND

19 NC - NC

20 GND GND GND

21 GND GND GND

22 P0_1 P0_1 INPUT/OUTPUT with selectable pull up/down

resistor. Pull-down enabled during and after reset.

General purpose I/O port bit or alternate function

nodes. Contain state retention mechanism during

power down.

23 P0_0 P0_0

24 P0_4 P0_4

25 RST RST INPUT. Reset signal (Active High). It can be

connected to GND if not used.

26 GND GND GND

27 GND GND GND

28 GND GND GND

29 GND GND GND

30 P1_1 P1_1

INPUT/OUTPUT with selectable pull up/down

resistor. Pull-down enabled during and after reset.

General purpose I/O port bit or alternate function

nodes. Contain state retention mechanism during

power down.

31 VPP VPP

INPUT. This pin is used while OTP programming

and testing.

OTP programming: VPP = 6.8V ± 0.25V

OTP Normal operation: VPP float

32 GND GND GND

33 GND GND GND

34 GND GND GND

35 P1_0 P1_0

INPUT/OUTPUT with selectable pull up/down

resistor. Pull-down enabled during and after reset.

General purpose I/O port bit or alternate function

nodes. Contain state retention mechanism during

power down.

36 NC NC

37 NC NC

Preliminary Specification Number : SP-HNZY-F

P7/19

Preliminary

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Murata Manufacturing Co., Ltd.

5.

Absolute Maximum Ratings

Item Min Max Unit Remarks

Storage Temperature -40 85 degC

VBAT 3.6 V

Stresses in excess of the absolute ratings may cause permanent damage. Functional operation is

not implied under these conditions. Exposure to absolute ratings for extended periods of time may

adversely affect reliability. No damage assuming only one parameter is set at limit at a time with all

other parameters are set within operating condition.

6.

Operating Condition

Item Min Typ Max Unit Remarks

Operating Temperature

*1

-40 85 degC

VBAT 2.35 3.3 V

RF Load Impedance 50

Ω

*1

Functionality is guaranteed but specifications require derating at extreme temperatures.

Preliminary Specification Number : SP-HNZY-F

P8/19

Preliminary

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Murata Manufacturing Co., Ltd.

7.

DC Characteristics

Parameters Description Conditions Min Typ Max Unit

V

IH

HIGH level input voltage Active mode 0.84 V

V

IL

LOW level input voltage Active mode 0.36 V

V

OH

HIGH level output voltage Active mode 1.88 V

V

OL

LOW level output voltage Active mode 0.47 V

I

IH

(PD) HIGH level input current with

internal pull down enabled

Vin = VBAT

= 2.5V 50 150 uA

I

IL

(PU) LOW level input current with

internal pull up enabled

Vin = GND

= 0V -150 -50 uA

8.

Sleep Clock

For 32kHz Crystal

Parameters Description Conditions Min Typ Max Unit

f

XTAL

Crystal frequency 32.768 kHz

ESR Equivalent Series

Resistance 100 kohm

C

L

Load Capacitance 6 7 9 pF

C

0

Shunt Capacitance 1 2 pF

df

XTAL

Crystal frequency tolerance -250 250 ppm

D

Lmax

Maximum drive level 0.1 uW

For 32kHz Crystal Oscillator

Parameters Description Conditions Min Typ Max Unit

f

X

O

Oscillator frequency 32.768 kHz

A

X

O

Amplitude 100 1500 mVpp

df

XO

Frequency tolerance -250 250 ppm

Preliminary Specification Number : SP-HNZY-F

P9/19

Preliminary

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Murata Manufacturing Co., Ltd.

9.

Power Sequence

Power Up / Down Sequence

VBAT

GPIO

Ta Tb

H

L

H

L

Power Up Power Down

V1

Td

Reset and Power Cycle Sequence

Symbol Description Typ Unit

Ta Time between VCC valid

and GPIO enabled Ta > 500 us

Tb Time between GPIO invalid

and VCC invalid Tb > 0 us

Tc Length of RST pulse Tc > 10 us

Td Required VBAT ramp-up time Td < 50 ms

V1 Threshold voltage of VBAT rise up V1 > 2.35 V

Preliminary Specification Number : SP-HNZY-F

P10/19

Preliminary

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Murata Manufacturing Co., Ltd.

10.

RF Characteristics

Normal Condition: VBAT=3.0V, +25deg.C, (otherwise notified)

Item / Conditions Spec. Unit

MIN TYP MAX

Center frequency 2402 - 2480 MHz

Channel Spacing - 2 - MHz

Number of RF Channels - 40 - -

Output power (Measured at ANT pin) - -1 - dBm

Modulation characteristics

1)

∆

f1

avg

225 - 275 kHz

2)

∆

f2

max

(at 99.9%) 185 - - kHz

3)

∆

f2

avg

/

∆

f1

avg

0.8 - - -

Carrier frequency offset and drift

1) Frequency offset: | f

n

– f

TX

| - - 150 kHz

2) Frequency drift: | f

0

– f

n

| - - 50 kHz

3) Drift rate #0: | f

1

– f

0

| - - 20 kHz

4) Drift rate #n: | f

n

– f

n

-

5

| - - 20 kHz

Receiver sensitivity (PER < 30.8%) - -93 -70 dBm

Maximum input signal level (PER < 30.8%) -10 - - dBm

PER Report Integrity (-30dBm input) 50 - 65.4 %

TX Current consumption - 4.8 - mA

RX Current consumption - 5.1 - mA

*Since Murata cannot always guarantee 100% connection success in all actual condition, please implement retry of connection until

success if you will program the application software for central device.

Preliminary Specification Number : SP-HNZY-F

P11/19

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

11.

Packing Information

(1) Dimensions of Tape (Plastic tape)

Φ1.5±0.1

Φ1.5

4.0±0.1

2.0±0.1

12.0±0.1

7

.

8

±

0

.

1

7

.

5

±

0

.

1

.

7

5

±

0

.

1

6

.

0

±

0

.

2

7.5±0.1

1.4 max.

+0.1

0

0.30±0.05

(2) Dimensions of Reel

22.4 max

(φ

100)

(in mm)

φ

13.0±0.2

2.0±0.5

17.4

±

1.0

330)

(φ

Preliminary Specification Number : SP-HNZY-F

P12/19

Preliminary

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Murata Manufacturing Co., Ltd.

(3) Taping Diagrams

[1] Feeding Hole : As specified in (1)

[2] Hole for chip : As specified in (1)

[3] Cover tape : 62 um in thickness

[4] Base tape : As specified in (1)

(4) Leader and Tail tape

Feeding Hole

Chip

Feeding Direction

[2]

[3]

[4]

[3]

[1]

Pin 1 Marking

Tail tape

(No components)

40 to 200mm

Components No components

150mm min.

Leader tape

(Cover tape alone)

250mm min.

Feeding direction

Preliminary Specification Number : SP-HNZY-F

P13/19

Preliminary

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Murata Manufacturing Co., Ltd.

(5) The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled

toward the user.

(6) The cover tape and base tape are not adhered at no components area for 250 mm min.

(7) Tear off strength against pulling of cover tape : 5 N min.

(8) Packaging unit : 1000 pcs./ reel

(9) material : Base tape : Plastic

Reel : Plastic

Cover tape , cavity tape and reel are made the anti-static processing.

(10) Peeling of force : 1.3 N max. in the direction of peeling as shown below.

(11) PACKAGE (Humidity proof Packing)

Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and

the humidity indicator.

165 to 180 °

1.3 N max.

Base tape

Cover tape

　湿度

インジケ－タ

乾燥剤

表示ラべル

防湿梱包袋

表示ラベル

Label

Desiccant

Humidity

Indicator

Anti-humidity

Plastic Bag

Preliminary Specification Number : SP-HNZY-F

P14/19

Preliminary

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Murata Manufacturing Co., Ltd.

12.

Recommended Land Pattern

(Unit : mm)

Preliminary Specification Number : SP-HNZY-F

P15/19

Preliminary

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Murata Manufacturing Co., Ltd.

13.

Application Circuit

2.2uF

( *1) Murata reco m me nd to i ns ert ma tc hing cir cu it betw ee n p ins # 13 a nd # 1 4.

0Oh m No L oad

No Lo ad

Preliminary Specification Number : SP-HNZY-F

P16/19

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

NOTICE

1.Storage Conditions:

Please use this product within 6month after receipt.

- The product shall be stored without opening the packing under the ambient temperature from 5 to

35deg.C and humidity from 20 to 70%RH.

(Packing materials, in particular, may be deformed at the temperature over 40deg.C.)

- The product left more than 6months after reception, it needs to be confirmed the solderbility before

used.

- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.).

- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp

object and dropping the product, shall not be applied in order not to damage the packing materials.

This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020)

- After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product shall be

used within 168hours.

- When the color of the indicator in the packing changed, the product shall be baked before soldering.

Baking condition: 125+5/-0deg.C, 24hours, 1time

The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and

Cover Tape) are not heat-resistant.

2.Handling Conditions:

Be careful in handling or transporting products because excessive stress or mechanical shock may

break products.

Handle with care if products may have cracks or damages on their terminals, the characteristics of

products may change. Do not touch products with bear hands that may result in poor solder ability and

destroy by static electrical charge.

3.Standard PCB Design (Land Pattern and Dimensions):

All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern

should be provided between IN and OUT terminals. Please refer to the specifications for the standard

land dimensions.

The recommended land pattern and dimensions is as Murata's standard. The characteristics of

products may vary depending on the pattern drawing method, grounding method, land dimensions,

land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to

verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand.

4.Notice for Chip Placer:

When placing products on the PCB, products may be stressed and broken by uneven forces from a

worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to

follow the specifications for the maintenance of the chip placer being used. For the positioning of

products on the PCB, be aware that mechanical chucking may damage products.

Preliminary Specification Number : SP-HNZY-F

P17/19

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

5.Soldering Conditions:

The recommendation conditions of soldering are as in the following figure.

When products are immersed in solvent after mounting, pay special attention to maintain the

temperature difference within 100 °C. Soldering must be carried out by the above mentioned

conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C.

Contact Murata before use if concerning other soldering conditions.

Reflow soldering standard conditions

Reflow soldering standard conditions(Example)

Please use the reflow within 2 times.

Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.

6.Cleaning:

Since this Product is Moisture Sensitive, any cleaning is not permitted.

7.Operational Environment Conditions:

Products are designed to work for electronic products under normal environmental conditions (ambient

temperature, humidity and pressure). Therefore, products have no problems to be used under the

similar conditions to the above-mentioned. However, if products are used under the following

circumstances, it may damage products and leakage of electricity and abnormal temperature may

occur.

- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).

- In an atmosphere containing combustible and volatile gases.

- Dusty place.

- Direct sunlight place.

- Water splashing place.

- Humid place where water condenses.

- Freezing place.

If there are possibilities for products to be used under the preceding clause, consult with Murata before

actual use.

Within 120s

Pre-heating

time(s)

220

deg.C

Within 60s

Cooling down

Slowly

180

deg.C

150

deg.C

240to 250

deg.C

Within 3s

Preliminary Specification Number : SP-HNZY-F

P18/19

Preliminary

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Murata Manufacturing Co., Ltd.

As it might be a cause of degradation or destruction to apply static electricity to products, do not apply

static electricity or excessive voltage while assembling and measuring.

8.Input Power Capacity:

Products shall be used in the input power capacity as specified in this specifications.

Inform Murata beforehand, in case that the components are used beyond such input power capacity

range.

Preliminary Specification Number : SP-HNZY-F

P19/19

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

PRECONDITION TO USE OUR PRODUCTS

PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS.

Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the

specifications of our product when our product is mounted to your product.

All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that

our product is used for the purpose, under the condition and in the environment specified in this specification. You are

requested not to use our product deviating from the condition and the environment specified in this specification.

Please note that the only warranty that we provide regarding the products is its conformance to the specifications

provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such

products, which are caused under the conditions other than those specified in this specification.

WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED,

INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY

ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS.

The product shall not be used in any application listed below which requires especially high reliability for the prevention

of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that,

if you use our products in such applications, we will not be responsible for any failure to meet such requirements.

Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS,

DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY

FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS.

- Aircraft equipment.

- Aerospace equipment

- Undersea equipment.

- Power plant control equipment

- Medical equipment.

- Transportation equipment (vehicles, trains, ships, elevator, etc.).

- Traffic signal equipment.

- Disaster prevention / crime prevention equipment.

-Burning / explosion control equipment

- Application of similar complexity and/ or reliability requirements to the applications listed in the above.

We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and reproducing our

product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by

the regulations and laws in the world.

We do not warrant or represent that any license, either express or implied, is granted under any our patent right,

copyright, mask work right, or our other intellectual property right relating to any combination, machine, or process in

which our products or services are used. Information provided by us regarding third-party products or services does not

constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such

information may require a license from a third party under the patents or other intellectual property of the third party, or a

license from us under our patents or other intellectual property.

Please do not use our products, our technical information and other data provided by us for the purpose of developing of

mass-destruction weapons and the purpose of military use.

Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations",

etc.

Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials

and/or components from our suppliers.

By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your

company and that you understand and accept the validity of the contents herein. When you are not able to return the

signed version of specification sheet or approval sheet within 30 days from receiving date of specification sheet or

approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. Customer

acknowledges that engineering samples may deviate from specifications and may contain defects due to their

development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability

for damages caused by

- the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the

product to be sold by you,

-deviation or lapse in function of engineering sample,

-improper use of engineering samples.

We disclaim any liability for consequential and incidental damages.

If you can’t agree the above contents, you should inquire our sales.