TC1263 500 mA, Fixed-Output, CMOS LDO with Shutdown Features Description * * * * * * * The TC1263 is a fixed-output, high-accuracy (typically 0.5%) CMOS low dropout regulator. Designed specifically for battery-operated systems, the TC1263's CMOS construction eliminates wasted ground current, significantly extending battery life. Total supply current is typically 80 A at full load (20 to 60 times lower than in bipolar regulators). Very Low Dropout Voltage 500 mA Output Current High-Output Voltage Accuracy Standard or Custom Output Voltages Overcurrent and Overtemperature Protection SHDN Input for Active Power Management ERROR Output Can Be Used as a Low Battery Detector (SOIC only) Applications * * * * * * * TC1263 key features include ultra low noise operation, very low dropout voltage (typically 350 mV at full load) and fast response to step changes in load. The TC1263 incorporates both overtemperature and overcurrent protection. The TC1263 is stable with an output capacitor of only 1 F and has a maximum output current of 500 mA. It is available in 8-Pin SOIC, 5-Pin TO-220 and 5-Pin DDPAK packages. Battery-Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators for SMPS Pagers Package Type 5-Pin TO-220 5-Pin DDPAK Front View VOUT VIN + TC1263 SHDN TC1263 C1 1 F 1 2 3 4 5 1 2 3 4 5 SHDN BYP SHDN GND VIN VOUT GND TC1263 VOUT BYP SHDN GND VIN VOUT VIN Tab is GND Tab is GND Typical Application 8-Pin SOIC VOUT 1 GND 2 8 VIN 7 NC TC1263 2002-2012 Microchip Technology Inc. NC 3 6 SHDN BYPASS 4 5 ERROR DS21374D-page 1 TC1263 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings Input Voltage .........................................................6.5V Output Voltage................ (GND - 0.3V) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 7) Voltage (max.) on Any Pin: (GND - 0.3V) to (VIN + 0.3V) Operating Temperature Range.... -40C < TJ < +125C Storage Temperature..........................-65C to +150C Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.0V, (Note 1), IL = 100 A, CL = 3.3 F, SHDN > VIH, TA = +25C. Boldface type specifications apply for junction temperatures of -40C to +125C. Parameters Input Operating Voltage Maximum Output Current Output Voltage Sym Min Typ Max Units VIN 2.7 -- 6.0 V IOUTMAX 500 -- -- mA VOUT VR - 2.5% VOUT/T -- 40 -- Line Regulation VOUT/VIN -- 0.05 0.35 % Load Regulation (Note 4) VOUT/VOUT -0.01 0.002 +0.01 %/mA Dropout Voltage (Note 5) VIN-VOUT mV VOUT Temperature Coefficient Supply Current VR 0.5% VR + 2.5% V Conditions Note 2 Note 1 ppm/C Note 3 (VR + 1V) VIN6V IL = 0.1 mA to IOUTMAX -- 20 30 -- 60 130 IL = 100 A IL = 100 mA -- 200 390 IL = 300 mA -- 350 650 IL = 500 mA IDD -- 80 130 A SHDN = VIH, IL = 0 Shutdown Supply Current ISHDN -- 0.05 1 A SHDN = 0V Power Supply Rejection Ratio PSRR -- 64 -- db F 1 kHz Output Short Circuit Current IOUTSC -- 1200 1400 mA VOUT = 0V VOUT/PD -- 0.04 -- V/W Note 6 eN -- 260 -- Thermal Regulation Output Noise Note 1: 2: 3: 4: 5: 6: 7: nV/Hz IL = IOUTMAX, F = 10 kHZ VR is the regulator output voltage setting. The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX. 6 V OUTMAX - V OUTMIN - 10 TCV OUT = -----------------------------------------------------------------------V OUT T Regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at a 1.0V differential. Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 "Thermal Considerations" for more details. DS21374D-page 2 2002-2012 Microchip Technology Inc. TC1263 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.0V, (Note 1), IL = 100 A, CL = 3.3 F, SHDN > VIH, TA = +25C. Boldface type specifications apply for junction temperatures of -40C to +125C. Parameters Sym Min Typ Max Units SHDN Input High Threshold VIH 45 -- -- %VIN SHDN Input Low Threshold VIL -- -- 15 %VIN Conditions SHDN Input ERROR Output (SOIC Only) Minimum Operating Voltage VMIN 1.0 -- -- V Output Logic Low Voltage VOL -- -- 400 mV ERROR Threshold Voltage VTH -- 0.95 x VR -- V ERROR Positive Hysteresis VHYS -- 50 -- mV Note 1: 2: 3: 4: 5: 6: 7: 1 mA Flows to ERROR VR is the regulator output voltage setting. The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX. 6 V OUTMAX - V OUTMIN - 10 TCV OUT = -----------------------------------------------------------------------V OUT T Regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at a 1.0V differential. Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 "Thermal Considerations" for more details. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.0V, IL = 100 A, CL = 3.3 F, SHDN > VIH, TA = +25C. Parameters Sym Min Typ Max Units Specified Temperature Range TA -40 -- +125 C Operating Temperature Range TJ -40 -- +125 C Storage Temperature Range TA -65 -- +150 C Thermal Resistance, 5L-DDPAK JA -- 57 -- C/W Thermal Resistance, 5L-TO-220 JA -- 71 -- C/W Thermal Resistance, 8L-SOIC JA -- 163 -- C/W Conditions Temperature Ranges Note 1 Thermal Package Resistances Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+125C). 2002-2012 Microchip Technology Inc. DS21374D-page 3 TC1263 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0.020 150 0.018 135 0.016 120 0.014 105 0.012 90 IDD (A) LINE REGULATION (%) Note: Unless otherwise indicated, VIN = VR + 1.0V, IL = 100 A, CL = 3.3 F, SHDN > VIH, TA = +25C. 0.010 0.008 45 0.004 30 0.002 15 0C 25C 70C 85C 5V 60 0.006 0.000 -40C 2.5V 75 0 -40C 125C Line Regulation vs. NOISE (V/Hz) 10.0 RLOAD = 50 COUT = 1F 1.0 0.1 0.0 0.01 0.01 1 10 100 FIGURE 2-4: 25C 125C 85C 0.40 70C 25C 0.30 0C 0.20 -40C 0.10 0.00 1000 Output Noise vs. Frequency. 0 FIGURE 2-5: ILOAD. 0.0100 100 200 300 ILOAD (mA) 0.50 DROPOUT VOLT AGE (V) LOAD REGULATION (%/mA) 0.0080 0.0070 0.0060 0.0040 1mA to 500mA 2.5V 0.0030 0.0020 1mA to 500mA 5V 0.40 85C 0.30 70C 25C 0.20 0C 0.10 -40C 0.00 0C 25C 70C 85C 125C DS21374D-page 4 Load Regulation vs. 0 100 200 300 400 500 ILOAD (mA) TEMPERATURE (C) FIGURE 2-3: Temperature. 500 125C 0.0010 0.0100 -40C 400 2.5V Dropout Voltage vs. 0.0090 0.0050 85C 125C IDD vs. Temperature. FREQUENCY (kHz) FIGURE 2-2: 70C 0.50 DROPOUT VOLT AGE (V) FIGURE 2-1: Temperature. 0C TEMPERATURE (C) TEMPERATURE (C) FIGURE 2-6: ILOAD. 5.0V Dropout Voltage vs. 2002-2012 Microchip Technology Inc. TC1263 Note: Unless otherwise indicated, VIN = VR + 1.0V, IL = 100 A, CL = 3.3 F, SHDN > VIH, TA = +25C. 2.70 IL = 0.1mA 2.50 2.10 VOUT (V) VOUT (V) 2.30 IL = 300mA IL = 500mA 5.20 5.10 5.00 4.90 4.80 4.70 4.60 4.50 1.90 4.40 4.30 1.70 4.20 4.10 4.00 -40C 1.50 -40C 0C 25C 70C 85C 125C TEMPERATURE (C) FIGURE 2-7: 2.5V VOUT vs. Temperature. 2002-2012 Microchip Technology Inc. IL = 0.1mA IL = 300mA IL = 500mA 0C 25C 70C 85C 125C TEMPERATURE (C) FIGURE 2-8: 5.0V VOUT vs. Temperature. DS21374D-page 5 TC1263 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin No. (8-Pin SOIC) Pin No. (5-Pin DDPAK) (5-Pin TO-220) Symbol 1 5 VOUT Regulated voltage output 2 3 GND Ground terminal 3 -- NC 4 1 BYPASS Reference bypass input 5 -- ERROR Out-of-Regulation Flag (open-drain output). 6 2 SHDN 7 -- NC No connect 8 4 VIN Unregulated supply input 3.1 Description No connect Shutdown control input Regulated Output Voltage (VOUT) VOUT is a regulated voltage output. 3.2 Ground (GND) 3.4 Out-of-Regulation Flag (ERROR) Out-of-Regulation Flag (open-drain output). ERROR goes low when VOUT is out-of-tolerance by approximately - 5%. Ground terminal. 3.5 3.3 Shutdown control input. The regulator is fully enabled when a logic-high is applied to SHDN. The regulator enters shutdown when a logic-low is applied to this input. During shutdown, output voltage falls to zero and supply current is reduced to 0.05 A (typical). Reference Bypass (BYPASS) Reference bypass input. Connect a 470 pF to the BYPASS input to further reduce output noise. 3.6 Shutdown Control (SHDN) Unregulated Supply (VIN) VIN is an unregulated supply input. DS21374D-page 6 2002-2012 Microchip Technology Inc. TC1263 4.0 DETAILED DESCRIPTION 4.2 The TC1263 is a precision, fixed-output LDO. Unlike bipolar regulators, the TC1263's supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0 mA to ILOADMAX load current range (an important consideration in RTC and CMOS RAM battery back-up applications). Figure 4-1 shows a typical application circuit. ERROR Output ERROR is driven low whenever VOUT falls out of regulation by more than - 5% (typ.). This condition may be caused by low input voltage, output current limiting or thermal limiting. The ERROR threshold is 5% below rated VOUT, regardless of the programmed output voltage value (e.g., ERROR = VOL at 4.75V (typ.) for a 5.0V regulator and 2.85V (typ.) for a 3.0V regulator). ERROR output operation is shown in Figure 4-2. Note that ERROR is active when VOUT is at or below VTH, and inactive when VOUT is above VTH + VHYS. + + 1 F C1 Battery VOUT VIN TC1263 + 1 F C2 VOUT GND V+ SHDN ERROR Shutdown Control (to CMOS Logic or Tie to VIN, if unused) C3 Required Only if ERROR is used as a Processor RESET Signal (See Text) R1 1M + 0.2 F C3 BATTLOW or RESET As shown in Figure 4-1, ERROR can be used as a battery-low flag or as a processor RESET signal (with the addition of timing capacitor C3). R1 x C3 should be chosen to maintain ERROR below VIH of the processor RESET input for at least 200 ms to allow time for the system to stabilize. Pull-up resistor R1 can be tied to VOUT, VIN or any other voltage less than (VIN + 0.3V). VOUT VTH FIGURE 4-1: 4.1 Typical Application Circuit. Output Capacitor A 1 F (min.) capacitor from VOUT to ground is required. The output capacitor should have an Effective Series Eesistance (ESR) greater than 0.1 and less than 5. A 1 F capacitor should be connected from VIN to GND if there is either more than 10 inches of wire between the regulator and the AC filter capacitor or a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. Since many aluminum electrolytic capacitors freeze at approximately -30C, solid tantalums are recommended for applications operating below -25C. When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors, and by employing passive filtering techniques. 2002-2012 Microchip Technology Inc. Hysteresis (VHYS) ERROR VOH VOL FIGURE 4-2: ERROR Output Operation. DS21374D-page 7 TC1263 5.0 THERMAL CONSIDERATIONS 5.1 Thermal Shutdown Integrated thermal protection circuitry shuts the regulator off when the die temperature exceeds 160C. The regulator remains off until the die temperature drops to approximately 150C. 5.2 Power Dissipation The amount of power the regulator dissipates is primarily a function of input and output voltage and output current. The following equation is used to calculate worst-case actual power dissipation: EQUATION 5-1: P D = V INMAX - VOUTMIN I LOADMAX Where: PD = Worst-case actual power dissipation VINMAX = Maximum voltage on VIN VOUTMIN = Minimum regulator output voltage ILOADMAX = Maximum output (load) current The maximum allowable power dissipation (Equation 5-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (JA). PDMAX Copper Area (Backside) Board Area Thermal Resistance JA) 2500 sq mm 2500 sq mm 2500 sq mm 25C/W 1000 sq mm 2500 sq mm 2500 sq mm 27C/W 125 sq mm 35C/W 2500 sq mm 2500 sq mm * Tab of device attached to top-side copper Equation 5-1 can be used in conjunction with Equation 5-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX = 3.3V 10% VOUTMIN = 2.7V 0.5% ILOADMAX = 275 mA TJMAX = 125C TAMAX = 95C JA = 60 C/W (SOIC) Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: THERMAL RESISTANCE GUIDELINES FOR TC1263 IN 8-PIN SOIC PACKAGE Copper Area (Backside) Board Area -3 P D = 260 mW Table 5-1 and Table 5-2 show various values of JA for the TC1263 package types. Copper Area (Topside)* Copper Area (Topside)* P D = 3.3 1.1 - 2.7 .995 275 10 T JMAX - T AMAX = ------------------------------------- JA PD = Worst-case actual power dissipation VINMAX = Maximum voltage on VIN VOUTMIN = Minimum regulator output voltage ILOADMAX = Maximum output (load) current TABLE 5-1: THERMAL RESISTANCE GUIDELINES FOR TC1263 IN 5-PIN DDPAK/TO-220 PACKAGE P D VINMAX - V OUTMIN I LOADMAX EQUATION 5-2: Where: TABLE 5-2: Thermal Resistance JA) 2500 sq mm 2500 sq mm 2500 sq mm 60C/W 1000 sq mm 2500 sq mm 2500 sq mm 60C/W 225 sq mm 2500 sq mm 2500 sq mm 68C/W 100 sq mm 2500 sq mm 2500 sq mm 74C/W Maximum allowable power dissipation: T JMAX - T AMAX P DMAX = ------------------------------------- JA 125 - 95 P DMAX = ------------------------60 P DMAX = 500 mW In this example, the TC1263 dissipates a maximum of 260 mW below the allowable limit of 500 mW. In a similar manner, Equation 5-1 and Equation 5-2 can be used to calculate maximum current and/or input voltage limits. For example, the maximum allowable VIN is found by substituting the maximum allowable power dissipation of 500 mW into Equation 5-1, from which VINMAX = 4.6V. * Pin 2 is ground. Device is mounted on top-side. DS21374D-page 8 2002-2012 Microchip Technology Inc. TC1263 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 5-Lead DDPAK XXXXXXXXX XXXXXXXXX YYWWNNN TC1263 3.3VET 0430256 5-Lead TO-220 XXXXXXXXX XXXXXXXXX YYWWNNN XXXXXXXX XXXXYYWW NNN e3 * Note: Example: TC12633.3VATX 0430256 8-Lead SOIC (150 mil) Legend: XX...X Y YY WW NNN Example: Example: 1263-3.3 VOA0430 256 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2002-2012 Microchip Technology Inc. DS21374D-page 9 TC1263 5-Lead Plastic (ET) (DDPAK) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E E1 L3 D2 D D1 1 BOTTOM VIEW e b TOP VIEW 1 (5X) c2 A A1 c L Units Dimension Limits Number of Pins Pitch Overall Height Standoff Overall Width Exposed Pad Width Molded Package Length Overall Length Exposed Pad Length Lead Thickness Pad Thickness Lead Width Foot Length Pad Length Foot Angle Mold Draft Angle MIN e A A1 E E1 D D1 D2 c c2 b L L3 1 .170 .000 .385 .330 .549 .014 .045 .026 .068 .045 -3 INCHES* NOM 5 .067 BSC .177 .005 .398 .256 REF .350 .577 .303 REF .020 -.032 .089 ---- MAX .183 .010 .410 .370 .605 .026 .055 .037 .110 .067 8 7 MILLIMETERS NOM 5 1.70 BSC 4.32 4.50 0.00 0.13 9.78 10.11 6.50 REF 8.38 8.89 13.94 14.66 7.75 REF 0.36 0.51 1.14 -0.66 0.81 1.73 2.26 1.14 ---3 -- MIN MAX 4.65 0.25 10.41 9.40 15.37 0.66 1.40 0.94 2.79 1.70 8 7 *Controlling Parameter Significant Characteristic Notes: Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC equivalent: TO-252 Drawing No. C04-012 DS21374D-page 10 2002-2012 Microchip Technology Inc. TC1263 5-Lead Plastic Transistor Outline (AT) (TO-220) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging L H1 Q b e3 e1 E e OP EJECTOR PIN a (5X) C1 A J1 F D Units Dimension Limits e Lead Pitch Overall Lead Centers Space Between Leads Overall Height Overall Width Overall Length Flag Length Flag Thickness Through Hole Center Through Hole Diameter Lead Length Base to Bottom of Lead Lead Thickness Lead Width Mold Draft Angle e1 e3 A E D H1 F Q P L J1 C1 b a INCHES* MAX MIN .060 .072 .263 .273 .030 .040 .190 .160 .385 .415 .560 .590 .234 .258 .045 .055 .103 .113 .146 .156 .560 .540 .090 .115 .022 .014 .025 .040 3 7 MILLIMETERS MIN MAX 1.52 1.83 6.68 6.93 0.76 1.02 4.83 4.06 9.78 10.54 14.22 14.99 5.94 6.55 1.14 1.40 2.62 2.87 3.71 3.96 13.72 14.22 2.29 2.92 0.36 0.56 0.64 1.02 3 7 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC equivalent: TO-220 Drawing No. C04-036 2002-2012 Microchip Technology Inc. DS21374D-page 11 TC1263 8-Lead Plastic Small Outline (SN) - Narrow, 150 mil Body (SOIC) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E E1 p D 2 B n 1 h 45 c A2 A L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic A A2 A1 E E1 D h L c B MIN .053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0 A1 INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 MAX .069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15 MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12 MIN MAX 1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 DS21374D-page 12 2002-2012 Microchip Technology Inc. TC1263 APPENDIX A: REVISION HISTORY Revision D (November 2012) Added a note to each package outline drawing. Revision C (January 2005) The following is the list of modifications: 1. 2. Changes to DC Characteristics table Added Appendix A: Revision History. Revision B (May 2002) No information for this revision. Revision A (March 2002) Original data sheet release. 2002-2012 Microchip Technology Inc. DS21374D-page 13 TC1263 NOTES: DS21374D-page 14 2002-2012 Microchip Technology Inc. TC1263 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X.X X XX XX Device Voltage Option Temperature Range Package Tape and Reel Device Voltage Option:* a) b) c) d) e) TC1263-2.5VAT TC1263-2.8VAT TC1263-3.0VAT TC1263-3.3VAT TC1263-5.0VAT 2.5V LDO, TO-220-5 pkg. 2.8V LDO, TO-220-5 pkg. 3.0V LDO, TO-220-5 pkg. 3.3V LDO, TO-220-5 pkg. 5.0V LDO, TO-220-5 pkg. a) TC1263-2.5VETTR 1.8V LDO, DDPAK-5 pkg., Tape and Reel TC1263-2.8VETTR 2.5V LDO, DDPAK-5 pkg., Tape and Reel TC1263-3.0VETTR 3.0V LDO, DDPAK-5 pkg., Tape and Reel TC1263-3.3VETTR 3.3V LDO, DDPAK-5 pkg., Tape and Reel TC1263 Fixed Output CMOS LDO with Shutdown 2.5 2.8 3.0 3.3 5.0 = = = = = 2.5V 2.8V 3.0V 3.3V 5.0V * Other output voltages are available. Please contact your local Microchip sales office for details. Temperature Range: V Package Examples: = -40C to +125C AT = ET = ETTR = OA = OATR = Plastic (TO-220), 5-Lead Plastic Transistor Outline (DDPAK), 5-Lead Plastic Transistor Outline (DDPAK), 5-Lead, Tape and Reel Plastic SOIC, (150 mil Body), 8-lead Plastic SOIC, (150 mil Body), 8-lead, Tape and Reel b) c) d) a) b) c) d) e) f) g) h) i) 2002-2012 Microchip Technology Inc. TC1263-2.5VOA 1.8V LDO, SOIC-8 pkg. TC1263-2.5VOATR 1.8V LDO, SOIC-8 pkg., Tape and Reel TC1263-2.8VOA 2.5V LDO, SOIC-8 pkg. TC1263-2.8VOATR 2.5V LDO, SOIC-8 pkg., Tape and Reel TC1263-3.0VOA 3.0V LDO, SOIC-8 pkg. TC1263-3.0VOATR 3.0V LDO, SOIC-8 pkg., Tape and Reel TC1263-3.3VOA 3.3V LDO, SOIC-8 pkg. TC1263-3.3VOATR 3.3V LDO, SOIC-8 pkg., Tape and Reel TC1263-5.0VOA 5.0V LDO, SOIC-8 pkg. DS21374D-page 15 TC1263 NOTES: DS21374D-page 16 2002-2012 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2002-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620767795 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2002-2012 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS21374D-page 17 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Japan - Osaka Tel: 81-66-152-7160 Fax: 81-66-152-9310 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 China - Hangzhou Tel: 86-571-2819-3187 Fax: 86-571-2819-3189 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 Taiwan - Kaohsiung Tel: 886-7-213-7828 Fax: 886-7-330-9305 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 DS21374D-page 18 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 11/27/12 2002-2012 Microchip Technology Inc.