MAIN FEATURES 8-bit resolution. ADC gain adjust. 2 GHz full power input bandwidth. 1 Gsps (min) sampling rate. SINAD = 45 dB (7.4 Effective Bits) SFDR = 58 dBc @ FS = 1 Gsps, FIN = 20 MHz : SINAD = 44 dB (7.2 Effective Bits) SFDR = 56 dBc @ FS = 1 Gsps, FIN = 500 MHz : SINAD = 42 dB (7.0 Effective Bits) SFDR = 52 dBc @ FS = 1 Gsps, FIN = 1000 MHz (-3 dB FS) 2-tone IMD : -52dBc (489 MHz, 490 MHz) @ 1GSPS. DNL = 0.4 LSB INL = 0.7 LSB. -13 Low Bit Error Rate (10 ) @ 1 Gsps Very low input capacitance : 0.4 pF 500 mVpp differential or single-ended analog inputs. Differential or single-ended 50 ECL compatible clock inputs. ECL or LVDS/HSTL output compatibility. Data ready output with asynchronous reset. Gray or Binary selectable output data ; NRZ output mode. Power consumption : 3.6 W @ Tj = 70C 3.8 W @ Tj =125C Dual power supply : 5 V Radiation tolerance oriented design (150 Krad (Si) measured). ADC 8-bit 1 Gsps JTS8388B APPLICATIONS Digital Sampling Oscilloscopes. Satellite receiver. Electronic countermeasures / Electronic warfare. Direct RF down - conversion. 1/ Delivered in die form 2/ Chip Evaluation Board : Available TSEV8388B SCREENING Atmel-Grenoble standard die flow. Mil-PRF-38535, QML level Q for package version. Space screening according to ESA/SCC 9000. Temperature range : -55C < Tc ; Tj < +125C 3/ CQFP68 packaged device available : refer to TS8388BF datasheet 4/ Other possible packaging : contact sales office DESCRIPTION The JTS8388B is a monolithic 8-bit analog-to-digital converter, designed for digitizing wide bandwidth analog signals at very high sampling rates of up to 1 Gsps. The JTS8388B is using an innovative architecture, including an on chip Sample and Hold (S/H), and is fabricated with an advanced high speed bipolar process (B6HF from Siemens). The on-chip S/H has a 2 GHz full power input bandwidth, providing excellent dynamic performance in undersampling applications (High IF digitizing). Novembre 2000 Product Specification Product Specification TABLE OF CONTENTS 1. SIMPLIFIED BLOCK DIAGRAM.................................................................................................................................... 3 2. FUNCTIONAL DESCRIPTION ........................................................................................................................................ 3 3. SPECIFICATIONS............................................................................................................................................................. 4 3.1. 3.2. 3.3. 3.4. 3.5. 3.6. 3.7. 3.8. 4. ABSOLUTE MAXIMUM RATINGS (SEE NOTES BELOW) ......................................................................................................................................4 RECOMMENDED CONDITIONS OF USE..........................................................................................................................................................4 ELECTRICAL OPERATING CHARACTERISTICS .............................................................................................................................................5 TIMING DIAGRAMS ..................................................................................................................................................................................................9 EXPLANATION OF TEST LEVELS ...................................................................................................................................................................10 WAFER SCREENING ........................................................................................................................................................................................10 FUNCTIONS DESCRIPTION.............................................................................................................................................................................11 DIGITAL OUTPUT CODING ..............................................................................................................................................................................11 PACKAGE DESCRIPTION............................................................................................................................................. 12 4.1. 4.2. 4.3. 4.4. 5. JTS8388B PIN DESCRIPTION..........................................................................................................................................................................12 JTS8388B CHIP PAD LIST, COORDINATES AND CORRESPONDING FUNCTIONS .................................................................................13 JTS8388B CHIP PADS DESIGNATION VH25B ...............................................................................................................................................14 DIE MECHANICAL INFORMATIONS................................................................................................................................................................15 TYPICAL CHARACTERIZATION RESULTS.............................................................................................................. 16 5.1. 5.2. 5.3. 5.4. 5.5. 5.6. 5.7. 5.8. 5.9. 5.10. STATIC LINEARITY - FS = 50 MSPS / FIN = 10 MHZ .....................................................................................................................................16 EFFECTIVE NUMBER OF BITS VERSUS POWER SUPPLIES VARIATION ................................................................................................17 TYPICAL FFT RESULTS ...................................................................................................................................................................................18 SPURIOUS FREE DYNAMIC RANGE VERSUS INPUT AMPLITUDE............................................................................................................19 DYNAMIC PERFORMANCE VERSUS ANALOG INPUT FREQUENCY.........................................................................................................20 EFFECTIVE NUMBER OF BITS (ENOB) VERSUS SAMPLING FREQUENCY .............................................................................................21 SFDR VERSUS SAMPLING FREQUENCY ......................................................................................................................................................21 JTS8388B ADC PERFORMANCES VERSUS JUNCTION TEMPERATURE .................................................................................................22 TYPICAL FULL POWER INPUT BANDWIDTH ................................................................................................................................................23 ADC STEP RESPONSE ................................................................................................................................................................................24 6. DEFINITION OF TERMS ............................................................................................................................................... 25 7. APPLYING THE JTS8388B ............................................................................................................................................ 27 7.1. 7.2. 7.3. 7.4. 7.5. 7.6. 7.7. 7.8. 7.9. 7.10. 7.11. 7.12. 8. TIMING INFORMATIONS ..................................................................................................................................................................................27 PRINCIPLE OF DATA READY SIGNAL CONTROL BY DRRB INPUT COMMAND ......................................................................................28 ANALOG INPUTS (VIN) (VINB).........................................................................................................................................................................28 CLOCK INPUTS (CLK) (CLKB)..........................................................................................................................................................................29 CLOCK SIGNAL DUTY CYCLE ADJUST .........................................................................................................................................................31 NOISE IMMUNITY INFORMATIONS ................................................................................................................................................................31 DIGITAL OUTPUTS............................................................................................................................................................................................32 OUT OF RANGE BIT..........................................................................................................................................................................................35 GRAY OR BINARY OUTPUT DATA FORMAT SELECT..................................................................................................................................35 TS8388 B THERMAL REQUIREMENTS ......................................................................................................................................................35 DIODE PAD 32...............................................................................................................................................................................................36 ADC GAIN CONTROL PAD 38 .....................................................................................................................................................................36 EQUIVALENT INPUT / OUTPUT SCHEMATICS ....................................................................................................... 37 8.1. 8.2. 8.3. 8.4. 8.5. 8.6. 9. EQUIVALENT ANALOG INPUT CIRCUIT AND ESD PROTECTIONS ...........................................................................................................37 EQUIVALENT ANALOG CLOCK INPUT CIRCUIT AND ESD PROTECTIONS..............................................................................................37 EQUIVALENT DATA OUTPUT BUFFER CIRCUIT AND ESD PROTECTIONS .............................................................................................38 ADC GAIN ADJUST EQUIVALENT INPUT CIRCUITS AND ESD PROTECTIONS .......................................................................................38 GORB EQUIVALENT INPUT SCHEMATIC AND ESD PROTECTIONS .........................................................................................................39 DRRB EQUIVALENT INPUT SCHEMATIC AND ESD PROTECTIONS .........................................................................................................40 TSEV8388B : DEVICE EVALUATION BOARD............................................................................................................ 41 10. 2 ORDERING INFORMATION..................................................................................................................................... 42 JTS8388B JTS8388B 1. SIMPLIFIED BLOCK DIAGRAM GAIN MASTER/SLAVE TRACK & HOLD AMPLIFIER VIN,VINB G=2 T/H G=1 T/H G=1 RESISTO R CHAIN ANALOG ENCODING BLOCK 4 INTERPOLATION STAGES 4 5 REGENERATION LATCHES 4 5 ERROR CORRECTION & DECODE LOGIC CLK, CLKB CLOCK BUFFER 8 OUTPUT LATCHES & BUFFERS 8 DRRB DR,DRB 2. GORB DATA,DATAB OR,ORB FUNCTIONAL DESCRIPTION The JTS8388B is an 8 bit 1Gsps ADC based on an advanced high speed bipolar technology (B6HF from SIEMENS) featuring a cutoff frequency of 25 GHz. The JTS8388B includes a front-end master/slave Track and Hold stage (S/H), followed by an analog encoding stage and interpolation circuitry. Successive banks of latches are regenerating the analog residues into logical data before entering an error correction circuitry and a resynchronization stage followed by 75 differential output buffers. The JTS8388B works in fully differential mode from analog inputs up to digital outputs. The JTS8388B features a full power input bandwidth of 2 GHz. Control pin GORB is provided to select either Gray or Binary data output format. Gain control pin is provided in order to adjust the ADC gain. The JTS8388B uses only vertical isolated NPN transistors together with oxide isolated polysilicon resistors, providing enhanced radiation tolerance (no performance drift measured at 150kRad total dose). Product Specification 3 Product Specification 3. SPECIFICATIONS 3.1. ABSOLUTE MAXIMUM RATINGS (SEE NOTES BELOW) Parameter Symbol GND to 6 V Digital negative supply voltage DVEE GND to -5.7 V Digital positive supply voltage VPLUSD GND-0.3 to 2.8 V Negative supply voltage VEE GND to -6 V Maximum difference between negative supply voltages DVEE to VEE 0.3 V Analog input voltages VIN or VINB -1 to +1 V Maximum difference between VIN and VINB VIN - VINB -2 to +2 V Digital input voltage VD GORB -0.3 to VCC +0.3 V Digital input voltage VD DRRB VEE -0.3 to +0.9 V Digital output voltage Vo VPLUSD-3 to VPLUSD -0.5 V VCLK or VCLKB -3 to +1.5 V VCLK - VCLKB -2 to +2 V Tj +135 o Tstg -65 to +150 o C Tleads +300 o C Maximum junction temperature Storage temperature Lead temperature (soldering 10s) C Absolute maximum ratings are limiting values (referenced to GND=0V), to be applied individually, while other parameters are within specified operating conditions. Long exposure to maximum rating may affect device reliability. The use of a thermal heat sink is mandatory (see Thermal characteristics page 19). RECOMMENDED CONDITIONS OF USE Parameter Symbol Positive supply voltage Comments VCC Positive digital supply voltage VPLUSD ECL output compatibility VPLUSD LVDS output compatibility Negative supply voltages VEE, DVEE Differential analog input voltage (Full Scale) VIN -VINB Clock input power level VIN, VINB PCLK PCLKB Operating temperature range 4 Unit VCC Maximum difference between VCLK and VCLKB 3.2. Value Positive supply voltage Clock input voltage Notes : Comments TJ JTS8388B 50 differential or single-ended 50 single-ended clock input Civil : "C" grade Industrial : "V" grade Military : "M" grade Min. Typ. Max. Unit 4.75 +5 5.25 V GND V +1.4 +2.4 +2.6 V -5.25 -5.0 -4.75 V 113 125 137 mV 450 500 550 mVpp 3 4 10 dBm 0 < Tc < 70 -40 < Tc < 85 -55 < Tc ; Tj < +125 o C JTS8388B 3.3. ELECTRICAL OPERATING CHARACTERISTICS VEE = DVEE = -5 V ; VCC = +5 V ; VIN -VINB = 500 mVpp Full Scale differential input ; Digital outputs 75 or 50 differentially terminated ; Tj (typical) = 70C. Full temperature range : up to -55C < Tc ; Tj < +125C Parameter Symb Temp Test level Min Typ Max Unit II,IV 4.75 5 5.25 V POWER REQUIREMENTS Positive supply voltage Positive supply current Analog VCC Digital (ECL) VPLUSD Digital (LVDS) VPLUSD Analog ICC Digital IPLUSD Negative supply voltage Negative supply current VEE Analog AIEE Digital DIEE Nominal power dissipation 0 1.4 II, IV Full Full (note 2) -5.25 II,IV PD Power supply rejection ratio IV PSRR V 2.4 2.6 V 400 425 mA 120 130 mA -5 -4.75 V 170 185 mA 140 160 mA II 3.6 3.7 W IV 3.8 3.9 W IV +/- 0.5 mV/V 8 bits RESOLUTION ANALOG INPUTS Full Scale Input Voltage range (differential mode) ( 0 Volt common mode voltage ) VIN Full IV VINB VIN Full Full Scale Input Voltage range (single-ended input option ) (see Application Notes) VINB Analog input capacitance CIN Full Input bias current IIN Input Resistance RIN Full Power input Bandwidth Small Signal input Bandwidth (10 % full scale) IV -125 125 mV -125 125 mV 250 mV -250 0 mV IV 0.4 pF Full IV 10 A Full IV 1 M FPBW Full IV 1.8 GHz SSBW Full IV 1.9 GHz CLOCK INPUTS Logic compatibility for clock inputs (see Application Notes) (note 10 ) ECL or specified clock input power level in dBm ECL Clock inputs voltages (VCLK or VCLKB) : Full IV * Logic "0" voltage VIL * Logic "1" voltage VIH * Logic "0" current IIL 5 A * Logic "1" current IIH 5 A -1.5 -1.1 Clock input power level into 50 termination V DBm into 50 Clock input power level Clock input capacitance V CCLK Full IV Full IV -2 4 10 dBm 0.4 3.5 pF Product Specification 5 Product Specification Parameter Symb Temp Test level Min Typ Max Unit DIGITAL OUTPUTS (notes 1,6) Single ended or differential input mode, 50 % clock duty cycle (CLK,CLKB), Binary output data format, Tj (typical) = 70C. Full temperature range : up to -55C < Tc ; Tj < +125C. Logic compatibility for digital outputs ( Depending on the value of VPLUSD ) (see Application Notes) ECL or LVDS Differential output voltage swings ( assuming VPLUSD = 0V) : Full IV 75 open transmission lines ( ECL levels ) 1.50 1.620 V 75 differentially terminated 0.70 0.825 V 50 differentially terminated 0.54 0.660 V Output levels ( assuming VPLUSD = 0V) 75 open transmission lines 25C * Logic "0" voltage VOL * Logic "1" voltage VOH Output levels ( assuming VPLUSD = 0V) 75 differentially terminated 25C Logic "0" voltage VOL * Logic "1" voltage VOH * Logic "0" voltage * Logic "1" voltage -1.62 -0.88 -1.54 -0.8 V V IV (note 6) * Output levels ( assuming VPLUSD = 0V) 50 differentially terminated IV (note 6) -1.41 -1.07 25C -1.34 -1 V V II (note 6) VOL -1.35 VOH Differential Output Swing DOS Output level drift with temperature Full VI Full IV -1.28 V -1.09 -1.02 V 250 290 mV 1.6 mV/C DC ACCURACY Single ended or differential input mode, 50 % clock duty cycle (CLK,CLKB), Binary output data format, Tj (typical) = 70C. Full temperature range :-55C < Tc ; Tj < +125C. Differential non linearity (notes 2,3) Integral non linearity (notes 2,3) No missing codes (note 3) DNL I 0.4 0.5 LSB Full VI 0.5 0.6 LSB I 0.7 1 LSB Full VI 0.9 1.2 LSB INL Full Gain error I -10 -2 VI -11 I -26 Full VI Gain error drift Full Offset error drift Full Full Input offset voltage 6 Guaranteed over specified temperature range JTS8388B 6 % FS -2 7 % FS -5 14 mV -30 -5 17 mV IV 100 125 150 ppm/C IV 40 50 60 ppm/C JTS8388B Parameter Symb Temp Test level BER Full IV Min Typ Max Unit TRANSIENT PERFORMANCE Bit Error Rate FS = 1 Gsps (notes 2, 4) 1E-12 Fin = 62.5 MHz Error/ sample ADC settling time VIn -VinB = 400 mVpp (note 2) TS IV 0.5 ns Overvoltage recovery time (note 2) ORT IV 0.5 ns AC PERFORMANCE Single ended or differential input and clock mode, 50 % clock duty cycle (CLK,CLKB), Binary output data format, Tj. = 70C, unless otherwise specified. Signal to Noise and Distortion ratio (note 2) SINAD Full IV FS = 1 Gsps Fin = 20 MHz 43 45 dB FS = 1 Gsps Fin = 500 MHz 42 44 dB FS = 1 Gsps Fin = 1000 MHz (-1dB Fs) 40 42 dB Effective Number Of bits ENOB Full IV FS = 1 Gsps Fin = 20 MHz 7.0 7.2 Bits FS = 1 Gsps Fin = 500 MHz 6.6 6.8 Bits FS = 1 Gsps Fin = 1000 MHz (-1dBFs) 6.2 6.4 Bits Signal to Noise Ratio (note 2) SNR Full IV FS = 1 Gsps Fin = 20 MHz 42 45 dB FS = 1 Gsps Fin = 500 MHz 41 44 dB FS = 1 Gsps Fin = 1000 MHz (-1dBFs) 41 44 dB Total Harmonic Distortion (note 2) THD Full IV FS = 1 Gsps Fin = 20 MHz 50 54 dB FS = 1 Gsps Fin = 500 MHz 46 50 dB FS = 1 Gsps Fin = 1000 MHz (-1dBFs) 42 46 dB Spurious Free Dynamic Range (note 2) SFDR Full IV FS = 1 Gsps Fin = 20 MHz - 52 - 57 dBc FS = 1 Gsps Fin = 500 MHz - 47 - 52 dBc FS = 1 Gsps Fin = 1000 MHz (-1dBFs) - 42 - 47 dBc FS = 1 Gsps Fin = 1000 MHz (-3dBFs) - 45 - 50 dBc - 47 - 52 dBc Two-tone inter-modulation distortion FIN1 = 489 MHz @ FS = 1 Gsps (note 2) IMD Full IV FIN2 = 490 MHz @ FS = 1 Gsps Product Specification 7 Product Specification Parameter Symb Temp Test level Min Typ Max Unit SWITCHING PERFORMANCE AND CHARACTERISTICS - See Timing Diagrams Figure 1, Figure 2 Maximum clock frequency FS Minimum clock frequency Minimum Clock pulse width (high) Minimum Clock pulse width (low) Aperture delay (Note 2) Aperture uncertainty (Notes 2, 5) Data output delay (Notes 2, 10, 11, 12) Full 1 1.4 FS Full IV TC1 Full IV 0.280 0.500 10 TC2 Full IV 0.350 TA Full IV 100 Jitter o 25 C IV GSPS MSPS 50 ns 0.500 50 ns +250 400 ps 0.4 0.6 ps (rms) TOD Full IV 1150 1360 1660 ps Output rise/fall time for DATA (20 % - 80 %) (note 11) TR/TF Full IV 250 350 550 ps Output rise/fall time for DATA READY TR/TF Full IV 250 350 550 ps TDR Full IV 1110 1320 1620 ps TRDR Full IV 720 1000 ps TODTDR Full IV 40 40 40 ps TD1 Full IV 460 460 460 ps TPD Full IV (20 % - 80 % ) (note 11) Data ready output delay (Notes 2,10, 11, 12) Data ready reset delay TOD-TODR (notes 9, 13) TC1+TDR-TOD See Timing Diagram (Note 2) @ 1Gsps Data pipeline delay 4 clock cycles Note 1 : Differential output buffers are internally loaded by 75 resistors. Buffer bias current = 11 mA. Note 2 : See definition of terms Note 3 : Histogram testing based on sampling of a 10 MHz sinewave at 50 MSPS. Note 4 : Output error amplitude < 4 LSB around worst code. Note 5 : Maximum jitter value obtained for single-ended clock input on the JTS8388B die (chip on board) : 200 fs. (500 fs expected on JTS8388B) Note 6 : Digital output back termination options depicted in Application Notes figures 3,4,5 . Note 7 : With a typical value of TD = 465 ps, at 1 Gsps, the timing safety margin for the data storing using the ECLinPS 10E452 output registers from Motorola is of 315 ps, equally shared before and after the rising edge of the Data Ready signals (DR, DRB). Note 8 : The clock inputs may be indifferently entered in differential or single-ended, using ECL levels or 4 dBm typical power level into the 50 termination resistor of the inphase clock input. (4 dBm into 50 clock input correspond to 10 dBm power level for the clock generator.) Note 9 : At 1GSPS, 50/50 clock duty cycle, TC2 = 500 ps (TC1). TDR - TOD = -100 ps (typ) does not depend on the sampling rate. Note 10 : Specified loading conditions for digital outputs : - 50 or 75 controlled impedance traces properly 50 / 75 terminated, or unterminated 75 controlled impedance traces. - Controlled impedance traces far end loaded by 1 standard ECLinPS register from Motorola.( e.g. : 10E452 ) ( Typical input parasitic capacitance of 1.5 pF including package and ESD protections. ) Note 11 : Termination load parasitic capacitance derating values : - 50 or 75 controlled impedance traces properly 50 / 75 terminated : 60 ps / pF or 75 ps per additionnal ECLinPS load. - Unterminated ( source terminated ) 75 controlled impedance lines : 100 ps / pF or 150 ps per additionnal ECLinPS termination load. Note 12 : apply proper 50 / 75 impedance traces propagation time derating values : 6 ps / mm (155 ps/inch) for TSEV8388B Evaluation Board. o Note 13 : Values for TOD and TDR track each other over temperature, ( 1 % variation for TOD - TDR per 100 C. temperature variation ). Therefore TOD - TDR variation over temperature is negligible. Moreover, the internal ( onchip ) and package skews between each Data TODs and TDR effect can be considered as negligible.Consequently, minimum values for TOD and TDR are never more than 100 ps apart. The same is true for the TOD and TDR maximum values (see Advanced Application Notes about TOD - TDR variation over temperature in section 7). 8 JTS8388B JTS8388B 3.4. TIMING DIAGRAMS TA= 250 ps TBC (VIN, VINB) X N X N-1 X N+1 X N+5 X N+4 X N+3 X N+2 TC=1000 ps TC1 TC2 (CLK, CLKB) DIGITAL OUTPUTS TOD = 1360 ps TPD: 4.0 Clock periods 1360 ps DATA N-4 DATA N-5 1000 ps DATA N-3 DATA N-2 DATA DATA N-1 DATA N N+1 TD1=TC1+TDR-TOD = TC1-40 ps = ps 460 ps TDR = 1320 ps TDR = 1320 ps Data Ready (DR, DRB) TD2 = TC2+TOD= TC2+40ps = 540 TDR ps TRDR = 920 ps DRR 1ns (min) Figure 1 JTS8388B TIMING DIAGRAM ( 1 GSPS CLOCK ) Data Ready Reset , Clock held at LOW TA= 250ps (VIN, VINB ) X N X N-1 X N+1 X N+2 X N+4 X N+3 X N+5 TC = 1000 ps TC1 TC2 (CLK, CLKB) DIGITAL OUTPUTS TOD = 1360 TPD: 4.0 Clock 1360 DATA N-5 1000 DATA N-4 DATA N-3 DATA N-2 DATA N DATA N+1 TD1=TC1+TDR-TOD = TC1-40 ps = 460 TDR = 1120 TDR = 1320 DATA N-1 Data Ready (DR, DRB) TD2 = TC2+TOD-TDR = TC2+40ps = 540 ps TRDR = 920ps DRRB 1ns Figure 2 JTS8388B TIMING DIAGRAM ( 1 GSPS CLOCK ) Data Ready Reset , Clock held at HIGH Product Specification 9 Product Specification 3.5. EXPLANATION OF TEST LEVELS (1) D 100 % wafer tested at +25C I 100% production tested at +25C II 100 % production tested at +25C III Sample tested only at specified temperatures IV Parameter is guaranteed by design and characterization testing (thermal steady-state conditions at specified temperature). V Parameter is a typical value only VI 100 % production tested over specified temperature range. (1) (1) (for packaged device). , and sample tested at specified temperatures Only MIN and MAX values are guaranteed (typical values are issuing from characterization results). (1) 3.6. Unless otherwise specified, all tests are pulsed tests : therefore Tj = Tc = Ta, WAFER SCREENING Parameter Temperature JTS8388B chip Min Unit Max DC Accuracy @ 50 MSPS / 10 MHz DNL INL LSB 25C LSB (2) No missing codes Guaranteed AC Performance TBD SNR 25C (2) ENOB (2) 10 Unless otherwise specified, all tests are pulsed tests : therefore Tj = Tc = Ta, JTS8388B 45 dB 7.1 bit JTS8388B 3.7. FUNCTIONS DESCRIPTION Name Function VCC Positive power supply VEE Analog negative power supply VPLUSD Digital positive power supply GND Ground VIN, VINB Differential analog inputs VINB CLK, CLKB Differential clock inputs CLK <D0:D7> <D0B:D7B> Differential output data port DR ; DRB Differential data ready outputs OR ; ORB Out of range outputs VCC = +5 V VPLUSD = +0 V (ECL) VPLUSD=+2.4V (LVDS) OR VIN ORB 16 JTS8388B CLKB D0 D7 D0B D7B DR GAIN GORB DRB DIOD/ 3.8. GAIN ADC gain adjust GORB Gray or Binary digital output select DIOD/DRRB Die junction temp. measurement/ asynchronous data ready reset DRRB DVEE=-5V VEE=-5V GND DIGITAL OUTPUT CODING NRZ (Non Return to Zero) mode, ideal coding : does not include gain, offset, and linearity voltage errors. Differential Voltage level Digital output Out of Range analog input Binary GORB = VCC or floating Gray GORB = GND > +251 mV > Positive full scale + 1/2 LSB 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 1 +251 mV +249 mV Positive full scale + 1/2 LSB Positive full scale - 1/2 LSB 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 1 0 0 0 0 0 0 0 1 0 0 0 0 0 0 1 0 0 +126 mV +124 mV Positive 1/2 scale + 1/2 LSB Positive1/2 scale - 1/2 LSB 1 1 0 0 0 0 0 0 1 0 1 1 1 1 1 1 1 0 1 0 0 0 0 0 1 1 1 0 0 0 0 0 0 0 +1 mV -1 mV Bipolar zero + 1/2 LSB Bipolar zero - 1/2 LSB 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 -124 mV -126 mV Negative 1/2 scale + 1/2 LSB Negative 1/2 scale - 1/2 LSB 0 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 0 1 1 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 -249 mV -251 mV Negative full scale + 1/2 LSB Negative full scale - 1/2 LSB 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 < -251 mV < Negative full scale - 1/2 LSB 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 Product Specification 11 Product Specification 4. PACKAGE DESCRIPTION. 4.1. JTS8388B PIN DESCRIPTION Symbol Pin number Function GND 20, 24, 26, 28, 33, 35, 37 Analog ground. Pads n20, 24,26,28,37 are double. Pads n26,33,35 are single. 14 bonding wires are available for analog ground access. VPLUSD 1, 11 Digital positive supply. (0V for ECL compatibility, +2.4V for LVDS compatibility). 2 double pads (note 3) VCC 19, 21, 23, 30, 39, 40 +5 V positive supply. VEE 22, 29, 31 -5 V analog supply. DVEE 6 -5 V digital supply. VIN 34 In phase (+) analog input signal of the Sample and Hold differential preamplifier. VINB 36 Inverted phase (-) of analog input signal. CLK 25 In phase (+) ECL clock input. CLKB 27 Inverted phase (-) of ECL clock input. D0, D1, D2, D3, D4, D5, D6, D7 16, 14, 12, 9, 4, 2, 45, 43 In phase (+) digital outputs. D0 is the LSB. D7 is the MSB. D0B, D1B, D2B, D3B, D4B, D5B, D6B, D7B 17, 15, 13, 10, 5, 3, 46, 44 Inverted phase (-) Digital outputs. B0B is the inverted LSB. D7B is the inverted MSB. OR 41 In phase (+) Out of Range Output. Out of Range goes high on the leading edge of code 0 and code 256. ORB 42 Inverted phase (+) of Out of Range Bit (OR). DR 7 In phase (+) output of Data Ready Signal. DRB 8 Inverted phase (-) output of Data Ready Signal. GORB 18 Gray or Binary select output format control pad. - Binary output format if GORB is floating or VCC. - Gray output format if GORB is connected at ground (0 V). GAIN 38 ADC gain adjust pin. DIOD/DRRB 32 DIOD : die junction temperature measurement pad. Can be left floating or grounded if not used. DRRB : asynchronous data ready reset function 12 JTS8388B JTS8388B 4.2. JTS8388B CHIP PAD LIST, COORDINATES AND CORRESPONDING FUNCTIONS Pad number 1 2 PosX PosY 880 670 1365 1365 Chip pad function VPLUSD D5 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 510 350 190 -20 -230 -390 -550 -710 -920 -1085 -1085 -1085 -1085 -1085 -1085 -1085 1365 1365 1365 1365 1365 1365 1365 1365 1365 1115 955 795 635 475 315 155 D5B D4 D4B DVEE DR DRB D3 D3B VPLUSD D2 D2B D1 D1B D0 D0B GORB 19 20 21 22 23 24 25 26 27 28 29 30 31 32 -1085 -1085 -1085 -1085 -1085 -905 -655 -455 -255 -5 245 495 745 945 -55 -325 -595 -865 -1135 -1365 -1365 -1365 -1365 -1365 -1365 -1365 -1365 -1365 VCC GND VCC VEE VCC GND CLK GND CLKB GND VEE VCC VEE DIOD/DRRB 33 34 35 36 37 38 39 40 41 42 43 44 45 46 1085 1085 1085 1085 1085 1085 1085 1085 1085 1085 1085 1085 1085 1085 -1195 -995 -795 -595 -345 -145 55 265 425 585 745 905 1065 1225 GND VIN GND VINB GND GAIN VCC VCC OR ORB D7 D7B D6 D6B Positive digital supply (double pad) (note 3) In phase (+) digital output, bit 5 (D7 is the MSB ; Bit 7, D0 is the LSB ; Bit 0) Inverted phase (-)digital output, bit 5 In phase (+) digital output, bit 4 Inverted phase (-) digital output, bit 4 -5V digital supply (double pad) In phase (+) Data Ready Inverted Phase (-) Data Ready In phase (+) digital output, bit 3 Inverted phase (-) digital output, bit 3 Positive digital supply (double pad) (note 3) In phase (+) digital output, bit 2 Inverted phase (-) digital output, bit 2 In phase (+) digital output, bit 1 Inverted phase (-) digital output, bit 1 In phase (+) digital output, bit 0, Least Significant Bit Inverted phase (-) digital output, bit 0, Least Significant Bit Gray or Binary data output format select. (Note 2) +5V supply (double pad) Analog Ground (double pad) +5V supply (double pad) -5V analog supply (double pad) +5V supply (double pad) Analog Ground (double pad) In phase (+) clock input (double pad) Analog Ground Inverted phase (-) clock input (double pad) Analog Ground (double pad) -5V analog supply (double pad) +5V supply (double pad) -5V analog supply (double pad) Diode input for Tj monitoring / Input for asynchronous Data Ready Reset Analog Ground In phase (+) analog input (double pad) Analog Ground Inverted phase (-) analog input (double pad) Analog Ground (double pad) ADC gain adjust input +5V supply (double pad) +5V supply In phase (+) Out of Range digital output Inverted phase (-) Out of Range digital output In phase (+) digital output, bit 7, Most Significant Bit Inverted phase (-) digital output bit 7 In phase (+) digital output, bit 6 Inverted phase (-) digital output, bit 6 Note 1 : Coordinates are relative to pad centers. The coordinates origin (0,0) is at the center of the die. All dimensions are given in microns. The pad 1 is the one pointed at by the arrow (see layout). Distance between pad (glass window) and inner edge of seal-ring : 40m. Die size (inner edge of seal-ring : (-1175, -1175, 1455). Die size (including scribe line) : (-1230, -1510) (1230, 1510) (2.46 x 3.02 mm). Actual die size (after separation) : (-1220, -1500) (1220, 1500) (2.44 mm x 3.00 mm). Note 2 : GORB tied to Vcc or floating : Binary output data format. GORB tied to GND : Gray output data format Note3 : The common mode level of the output buffers is 1.2V below the positive digital supply. For ECL compatibility the positive digital supply must be set at 0V (ground). For LVDS compatibility (output common mode at +1.2V) the positive digital supply must be set at 2.4V. If the subsequent LVDS circuitry can withstand a lower level for input common mode, it is recommended to lower the positive digital supply level in the name proportion in order to spare power dissipation. Product Specification 13 Product Specification 4.3. JTS8388B CHIP PADS DESIGNATION VH25B Die Size : 2.44 x 3.00 mm (after separation) 11 VPLUSD Die Area : 7.32 mm 10 9 8 D3B D3 DRB 7 DR 6 DVEE 5 D4B 4 3 2 D4 D5B D5 1 VPLUSD 46 D6B 12 45 D2 D6 13 44 D2B D7B 14 D1 43 D7 15 42 D1B ORB 16 D0 41 OR 17 40 D0B VCC 18 GORB 39 VCC 19 VCC 38 GAIN 20 37 GND GND 21 36 VCC VINB 35 GND 22 VEE 34 VIN 23 33 VCC GND GND 24 14 CLK GND CLKB GND VEE VCC VEE 25 26 27 28 29 30 31 JTS8388B DIOD/DRRB 32 JTS8388B 4.4. DIE MECHANICAL INFORMATIONS Mask reference........................................................... VH25B Die size between scribe line axis ...................... 2.46 mm x 3.02 mm after separation.................................... 2.44 mm x 3.00 mm Prad size (single pad) .......................................... 100 m x 100 m (double pad)......................................... 200 m x 100 m Die thickness .............................................................. 300 m 20 m Back side metallization............................................... none Metallization Number of layers ................................. 3 Material ................................................ Ti/TiN Al-Si-Cu TiN (on top) Diffusion barrier ................................... Ti/TiN Thickness............................................. Metal 1 : 600 nm : Metal 2 & Metal 3 : 800 nm (1) (2) Pad metallization ................................................. Ti/TiN Al-Si-Cu TiN (Metal 2) Ti/TiN Al-Si-Cu TiN (Metal 3) Passivation ............................................................. Oxide/Nitride (SiO2/SiN2) : 300nm / 550 nm Back side potential ..................................................... -5V Die transistor count .................................................... 4450 Die attach.................................................................... epoxy Ag filled high conductivity glue Bond wire.................................................................... Al or Au 30 m diameter Qualification package ................................................. CQFP68 (with restriction on electrical performance) Note 1 : The top TiN layer is etched in one step together with the passivation layer. Note 2 : The pad is a sandwich of Metal 2 and Metal 3 over field oxyde. Product Specification 15 Product Specification 5. TYPICAL CHARACTERIZATION RESULTS 5.1. 5.1.1. STATIC LINEARITY - FS = 50 MSPS / FIN = 10 MHZ INTEGRAL NON LINEARITY LSB INL = +/- 0.7 LSB code Clock Frequency = 50Msps Positive peak : 0.78 LSB 5.1.2. Signal Frequency = 10MHz Negative peak : -0.73 LSB DIFFERENTIAL NON LINEARITY LSB DNL = +/- 0.4 LSB code Clock Frequency = 50Msps Positive peak : 0.3 LSB 16 JTS8388B Signal Frequency = 10MHz Negative peak : -0.39 LSB JTS8388B EFFECTIVE NUMBER OF BITS VERSUS POWER SUPPLIES VARIATION Effective number of bits = f (VEEA) ; Fs = 500 MSPS ; Fin = 100 MHz 8 7 ENOB (bits) 6 5 4 3 2 1 0 -7 -6,5 -6 -5,5 -5 -4,5 -4 VEEA (V) Effective number of bits = f (VCC) ; Fs = 500 MSPS ; Fin = 100 MHz 8 7 6 ENOB (bits) 5.2. 5 4 3 2 1 0 3 3,5 4 4,5 5 5,5 6 6,5 7 VCC (V) Product Specification 17 Product Specification 5.3. 5.3.1. TYPICAL FFT RESULTS FS = 1 GSPS, FIN=20 MHZ Single Ended or differential H11 H2 Fs =1 GSPS Fin = 20 MHz H12 H3 Eff. Bits =7.2 SINAD = 45 dB SNR = 45 dB THD = -54 dBc SFDR = -57 dBc Binary output coding clock duty cycle = 50 % 5.3.2. FS = 1 GSPS, FIN = 495 MHZ H12 H14 H2 H3 H11 Single Ended or differential Fs =1 GSPS Fin=495MHz Eff. Bits =6.8 SINAD = 44 dB SNR = 44 dB THD = -50 dBc SFDR= -52 dBc Binary output coding clock duty cycle = 50 % 5.3.3. FS = 1 GSPS, FIN = 995 MHZ ( -3DB FULL SCALE INPUT) Single Ended or differential H3 H2 H10 Fs =1 GSPS Fin=995 MHz Eff. Bits =6.4 SINAD =42 dB SNR = 44 dB THD = -46 dBc SFDR= -50 dBc Binary output coding clock duty cycle = 50 % 18 JTS8388B JTS8388B 5.4. 5.4.1. SPURIOUS FREE DYNAMIC RANGE VERSUS INPUT AMPLITUDE SAMPLING FREQUENCY FS =1 GSPS ; INPUT FREQUENCY FIN=995 MHZ ; GRAY OR BINARY OUTPUT CODING Full Scale SFDR = -47 dBc H3 H2 Fs = 1 GSPS ENOB = 6.4 SINAD = 42 dB Fin = 995 MHz SNR = 44 dB Full Scale THD = 46 dBc SFDR = -47 dBc -3dB Full Scale SFDR = -50 dBc H3 H2 Fs = 1 GSPS ENOB = 6.6 SINAD = 43 dB Fin = 995 MHz (-3 dB Full Scale) SNR = 44 dB THD = -48 dBc SFDR = -50 dBc Product Specification 19 Product Specification 5.5. DYNAMIC PERFORMANCE VERSUS ANALOG INPUT FREQUENCY Fs=1 Gsps, Fin = 0 up to 1600 MHz, Full Scale input (FS), FS -3 dB Clock duty cycle 50 / 50, Binary/Gray output coding, fully differential or single-ended analog and clock inputs 8 -10 dB FS ENOB (dB) 7 6 -3 dB FS 5 FS 4 3 0 200 400 600 800 1000 1200 1400 1600 1800 Input frequency (MHz) 50 48 46 44 FS SNR (dB) 42 40 -3 dB FS 38 36 -10 dB FS 34 32 30 0 200 400 600 800 1000 1200 1400 1600 1800 Input frequency (MHz) -20 -25 FS SFDR (dBc) -30 -35 -3 dB FS -40 -45 -10 dB FS -50 -55 -60 0 200 400 600 800 1000 1200 Input frequency (MHz) 20 JTS8388B 1400 1600 1800 2000 JTS8388B 5.6. EFFECTIVE NUMBER OF BITS (ENOB) VERSUS SAMPLING FREQUENCY Analog Input Frequency : Fin = 495 MHz and Nyquist conditions ( Fin = Fs / 2 ) Clock duty cycle 50 / 50 , Binary output coding 8 Fin= FS/2 7 Fin=500 MHz ENOB (dB) 6 5 4 3 2 0 200 400 600 800 1000 1200 1400 1600 Sampling frequency (Msps) 5.7. SFDR VERSUS SAMPLING FREQUENCY Analog Input Frequency : Fin = 495 MHz and Nyquist conditions ( Fin = Fs / 2 ) Clock duty cycle 50 / 50 , Binary output coding -20 -25 -30 SFDR (dBc) -35 -40 -45 Fin= FS/2 -50 Fin=500 MHz -55 -60 0 200 400 600 800 1000 1200 1400 1600 Sampling frequency (Msps) Product Specification 21 Product Specification 5.8. JTS8388B ADC PERFORMANCES VERSUS JUNCTION TEMPERATURE Effective number of bits versus junction temperature Fs = 1 GSPS ; Fin = 500 MHz ; Duty cycle = 50% 8 ENOB (bits) 7 6 5 4 3 -40 -20 0 20 40 60 80 100 120 140 160 Temperature ( oC) Signal to noise ratio versus junction temperature Fs = 1 GSPS ; Fin = 507 MHz ; Differential clock, Single-ended analog input (Vin=-1dBFs) 46 SNR (dB) 45 44 43 42 -40 -20 0 20 40 60 80 100 120 140 o Temperature ( C) Total harmonic distorsion versus junction temperature Fs = 1 GSPS ; Fin = 507 MHz ; Differential clock, Single-ended analog input (Vin=-1dBFs) 53 51 49 47 45 43 -60 -40 -20 0 20 40 60 Temperature ( C) 22 JTS8388B 80 100 120 140 JTS8388B Power consumption (W) Power consumption versus junction temperature Fs = 1 GSPS ; Fin = 500 MHz ; Duty cycle = 50% 4 3 1 0 -40 -20 20 40 60 100 120 160 Temperature ( o TYPICAL FULL POWER INPUT BANDWIDTH at -3 dB (-2dBm full power input) Frequency (MHz) 100 300 500 700 900 1100 1300 1500 1700 0 -1 Magnitude (dB) 5.9. -2 -3 -4 -5 -6 Product Specification 23 Product Specification 5.10. ADC STEP RESPONSE Test pulse input characteristics : 20% to 80% input full scale and rise time ~ 200ps. 5.10.1. TEST PULSE DIGITIZED WITH 20 GHZ DSO Vpp ~ 260 mV Tr ~ 240 ps 50 mV/div 50 mV/div 500 ps/div 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 time (ns) 5.10.2. SAME TEST PULSE DIGITIZED WITH JTS8388B ADC 200 150 Tr ~ 280 ps 50 codes/div (Vpp ~260 mV) 500 ps/div 100 ADC calculated rise time : between 150 and 200 ps. 50 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 time (ns) N.B. : ripples are due to the test setup (they are present on both measurements) 24 JTS8388B 4.5 5.0 JTS8388B 6. DEFINITION OF TERMS (BER) Bit Error Rate Probability to exceed a specified error threshold for a sample. An error code is a code that differs by more than +/- 4 LSB from the correct code. (BW) Full power input Analog input frequency at which the fundamental component in the digitally reconstructed output has fallen by 3 dB with respect to its low frequency value (determined by FFT analysis) for input at Full Scale. bandwidth (SINAD) Signal to noise and distortion ratio Ratio expressed in dB of the RMS signal amplitude, set to 1dB below Full Scale, to the RMS sum of all other spectral components, including the harmonics except DC. (SNR) Signal to noise ratio Ratio expressed in dB of the RMS signal amplitude, set to 1dB below Full Scale, to the RMS sum of all other spectral components excluding the five first harmonics. (THD) Total harmonic Ratio expressed in dBc of the RMS sum of the first five harmonic components, to the RMS value of the measured fundamental spectral component. distortion (SFDR) Spurious free dynamic range (ENOB) Effective Number Of Bits (DNL) Differential non linearity Ratio expressed in dB of the RMS signal amplitude, set at 1dB below Full Scale, to the RMS value of the next highest spectral component (peak spurious spectral component). SFDR is the key parameter for selecting a converter to be used in a frequency domain application ( Radar systems, digital receiver, network analyzer ....). It may be reported in dBc (i.e., degrades as signal levels is lowered), or in dBFS (i.e. always related back to converter full scale). SINAD - 1.76 + 20 log (A/V/2) Where A is the actual input amplitude and V ENOB = is the full scale range of the ADC under test 6.02 The Differential Non Linearity for an output code i is the difference between the measured step size of code i and the ideal LSB step size. DNL (i) is expressed in LSBs. DNL is the maximum value of all DNL (i). DNL error specification of less than 1 LSB guarantees that there are no missing output codes and that the transfer function is monotonic. (INL) Integral non linearity The Integral Non Linearity for an output code i is the difference between the measured input voltage at which the transition occurs and the ideal value of this transition. INL (i) is expressed in LSBs, and is the maximum value of all |INL (i)|. (DG) Differential gain The peak gain variation (in percent) at five different DC levels for an AC signal of 20% Full Scale peak to peak amplitude. FIN = 5 MHz. (TBC) (DP) Differential phase Peak Phase variation (in degrees) at five different DC levels for an AC signal of 20% Full Scale peak to peak amplitude. FIN = 5 MHz. (TBC) (TA) Aperture delay Delay between the rising edge of the differential clock inputs (CLK,CLKB) (zero crossing point), and the time at which (VIN,VINB) is sampled. (JITTER) Aperture uncertainty Sample to sample variation in aperture delay. The voltage error due to jitter depends on the slew rate of the signal at the sampling point. (TS) Settling time Time delay to achieve 0.2 % accuracy at the converter output when a 80% Full Scale step function is applied to the differential analog input. (ORT) Overvoltage recovery Time to recover 0.2 % accuracy at the output, after a 150 % full scale step applied on the input is reduced to midscale. time (TOD) (TD1) Output delay Delay from the falling edge of the differential clock inputs (CLK,CLKB) (zero crossing point) to the next point of change in the differential output data (zero crossing) with specified load. Time delay from Data to Time delay from Data transition to Data ready. Digital data Data Ready (TD2) Time delay from Data General expression is TD1 = TC1 + TDR - TOD with TC = TC1 + TC2 = 1 encoding clock period. Ready to Data (TC) Encoding clock period TC1 = Minimum clock pulse width (high) TC = TC1 + TC2 TC2 = Minimum clock pulse width (low) (TPD) Pipeline Delay Number of clock cycles between the sampling edge of an input data and the associated output data being made available, (not taking in account the TOD). For the JTS8388B the TPD is 4 clock periods. Product Specification 25 Product Specification (TRDR) Data Ready reset delay Delay between the falling edge of the Data Ready output asynchronous Reset signal (DDRB) and the reset to digital zero transition of the Data Ready output signal (DR). (TR) Rise time Time delay for the output DATA signals to rize from 20% to 80% of delta between low level and high level. (TF) Fall time Time delay for the output DATA signals to fall from 80% to 20% of delta between low level and high level. (PSRR) Power supply Ratio of input offset variation to a change in power supply voltage. rejection ratio (NRZ) Non return to zero When the input signal is larger than the upper bound of the ADC input range, the output code is identical to the maximum code and the Out of Range bit is set to logic one. When the input signal is smaller than the lower bound of the ADC input range, the output code is identical to the minimum code, and the Out of range bit is set to logic one. (It is assumed that the input signal amplitude remains within the absolute maximum ratings). (IMD) InterModulation Distortion The two tones intermodulation distortion ( IMD ) rejection is the ratio of either input tone to the worst third order intermodulation products. The input tones levels are at - 7dB Full Scale. (NPR) Noise Power Ratio The NPR is measured to characterize the ADC performance in response to broad bandwidth signals. When using a notch-filtered broadband white-noise generator as the input to the ADC under test, the Noise Power Ratio is defined as the ratio of the average out-of-notch to the average in-notch power spectral density magnitudes for the FFT spectrum of the ADC output sample test. 26 JTS8388B JTS8388B 7. APPLYING THE JTS8388B 7.1. 7.1.1. TIMING INFORMATIONS TIMING VALUE FOR JTS8388B Timing values are given at chip inputs/outputs, taking into account pad and ESD protections capacitance, 2 mm (30 um diameter) bonding wire per pad, and specified termination loads. Propagation delays in 50/75 ohms impedance traces are NOT taken into account for TOD and TDR. Apply proper derating values corresponding to termination topology. The min/max timing values are valid over the full temperature range in the following conditions : Note 1 : Specified Termination Load (Differential output Datas and Data Ready) : 50 ohms resistor in parallel with 1 standard ECLinPS register from Motorola, (e.g : 10E452) (Typical ECLinPS inputs shows a typical input capacitance of 1.5 pF (including package and ESD protections) If addressing an output Dmux, take care if some Digital outputs do not have the same termination load and apply corresponding derating value given below. Note 2 : Output Termination Load derating values for TOD and TDR : ~ 60 ps/pF or 75 ps per additional ECLinPS load. Note 3 :Propagation time delay derating values have also to be applied for TOD and TDR : ~ 6 ps/mm (155 ps/inch) for TSEV8388B Evaluation Board. Apply proper time delay derating value if a different dielectric layer is used. 7.1.2. PROPAGATION TIME CONSIDERATIONS TOD and TDR Timing values are given from pin to pin and DO NOT include the additional propagation times between device pins and input/output termination loads. For the TSEV8388B Evaluation Board, the propagation time delay is 6ps/mm (155ps/inch) corresponding to 3.4 (@10GHz) dielectric constant of the RO4003 used for the Board. If a different dielectric layer is used (for instance Teflon), please use appropriate propagation time values. TD does NOT depend on propagation times because it is a differential data. (TD is the time difference between Data Ready output delay and digital Data output delay) TD is also the most straightforward data to measure, again because it is differential : TD can be measured directly onto termination loads, with matched Oscilloscopes probes. 7.1.3. TOD - TDR VARIATION OVER TEMPERATURE Values for TOD and TDR track each other over temperature (1 percent variation for TOD - TDR per 100 degrees Celsius temperature variation). Therefore TOD - TDR variation over temperature is negligible. Moreover, the internal (onchip) and package skews between each Data TODs and TDR effect can be considered as negligible. Consequently, minimum values for TOD and TDR are never more than 100 ps apart. The same is true for the TOD and TDR maximum values. In other terms : If TOD is at 950 ps, TDR will not be at 1420 ps ( maximum time delay for TDR ). If TOD is at 1460 ps, TDR will not be at 910 ps ( minimum time delay for TDR ) However, external TOD - TDR values may be dictated by total digital datas skews between every TODs (each digital data) and TDR : MCM Board , bonding wires and output lines lengths differences, and output termination impedance mismatches. The external (on board) skew effect has NOT been taken into account for the specification of the minimum and maximum values for TOD-TDR. 7.1.4. PRINCIPLE OF OPERATION The Analog input is sampled on the rising edge of external clock input (CLK,CLKB) after TA (aperture delay) of typically 250ps . The digitized data is available after 4 clock periods latency (pipeline delay (TPD)), on clock rising edge, after 1160 ps typical propagation delay TOD. The Data Ready differential output signal frequency (DR,DRB) is half the external clock frequency, that is it switches at the same rate as the digital outputs. The Data Ready output signal (DR,DRB) switches on external clock falling edge after a propagation delay TDR of typically 1120 ps. A Master Asynchronous Reset input command DRRB ( ECL compatible single-ended input) is available for initializing the differential Data Ready output signal ( DR,DRB ) .This feature is mandatory in certain applications using interleaved ADCs or using a single ADC with demultiplexed outputs. Actually, without Data Ready signal initialization, it is impossible to store the output digital datas in a defined order. Product Specification 27 Product Specification 7.2. PRINCIPLE OF DATA READY SIGNAL CONTROL BY DRRB INPUT COMMAND 7.2.1. DATA READY OUTPUT SIGNAL RESET The Data Ready signal is reset on falling edge of DRRB input command, on ECL logical low level (-1.8V). DRRB may also be tied to VEE = - 5V for Data Ready output signal Master Reset. So long DRRB remains at logical low level, (or tied to VEE = - 5V), the Data Ready output remains at logical zero and is independant of the external free running encoding clock. The Data Ready output signal (DR,DRB) is reset to logical zero after TRDR= 720 ps typical. TRDR is measured between the -1.3V point of the falling edge of DRRB input command and the zero crossing point of the differential Data Ready output signal (DR,DRB). The Data Ready Reset command may be a pulse of 1 ns minimum time width. 7.2.2. DATA READY OUTPUT SIGNAL RESTART The Data Ready output signal restarts on DRRB command rising edge, ECL logical high levels (-0.8V). DRRB may also be Grounded, or is allowed to float, for normal free running Data Ready output signal. The Data Ready signal restart sequence depends on the logical level of the external encoding clock, at DRRB rising edge instant : 1) The DRRB rising edge occurs when external encoding clock input (CLK,CLKB) is LOW : The Data Ready output first rising edge occurs after half a clock period on the clock falling edge, after a delay time TDR = 1320 ps already defined hereabove. The DRRB rising edge occurs when external encoding clock input (CLK,CLKB) is HIGH : The Data Ready output first rising edge occurs after one clock period on the clock falling edge, and a delay TDR = 1320ps. 2) Consequently, as the analog input is sampled on clock rising edge, the first digitized data corresponding to the first acquisition ( N ) after Data Ready signal restart ( rising edge ) is always strobed by the third rising edge of the data ready signal. The time delay (TD1) is specified between the last point of a change in the differential output data (zero crossing point) to the rising or falling edge of the differential Data Ready signal (DR,DRB) (zero crossing point). Note 1 : For normal initialization of Data Ready output signal, the external encoding clock signal frequency and level must be controlled. It is reminded that the minimum encoding clock sampling rate for the ADC is 10 MSPS and consequently the clock cannot be stopped. Note 2 : One single pin is used for both DRRB input command and die junction temperature monitoring. Pin denomination will be DRRB/DIOD.( On former version denomination was DIOD. ) Temperature monitoring and Data Ready control by DRRB is not possible simultaneously. 7.3. ANALOG INPUTS (VIN) (VINB) The analog input Full Scale range is 0.5 Volts peak to peak (Vpp), or -2 dBm into the 50 ohms termination resistor. In differential mode input configuration, that means 0.25 Volt on each input, or +/- 125 mV around zero volt. The input common mode is GROUND. The typical input capacitance is 0.4 pF in die form (JTS8388B), not taking into account the bond wires capacitance. The input capacitance is mainly due to the pad capacitance, as the ESD protections are not connected (but present) on the inputs. Differential inputs voltage span [mV] VIN 125 250 mV 500mV Full Scale analog input VINB -250 mV 0 Volt t -125 (VIN,VINB) = +/- 250 mV = 500 mV diff Differential versus single ended analog input operation The JTS8388B can operate at full speed in either differential or single ended configuration. This is explained by the fact the ADC uses a high input impedance differential preamplifier stage, (preceeding the Sample and hold stage), which has been designed in order to be entered either in differential mode or single-ended mode. 28 JTS8388B JTS8388B This is true so long as the out of phase analog input pin VINB is 50 ohms terminated very closely to one of the neighboring shield ground pins (33? 35? 37) which constitute the local ground reference for the inphase analog input pin (VIN). Thus the differential analog input preamplifier will fully reject the local ground noise ( and any capacitively and inductively coupled noise) as common mode effects. In typical single-ended configuration, enter on the (VIN) input pin, with the inverted phase input pin (VINB) grounded through the 50 ohms termination resistor. In single-ended input configuration, the in-phase input amplitude is 0.5 Volt peak to peak,centered on 0V. (or -2 dBm into 50 ohms.) The inverted phase input is at ground potential through the 50 ohms termination resistor. However, dynamic performances can be somewhat improved by entering either analog or clock inputs in differential mode. Typical Single ended analog input configuration [mV] VIN VIN or VINB double pad (pins 54, 55 or 56, 57) 250 500 mV Full Scale analog input VIN or VINB 500 mV VINB = 0V 3 pF VINB t -250 V IN = +/- 250 mV 500 mV diff 7.4. 1M 50 (external) 50 reverse termination CLOCK INPUTS (CLK) (CLKB) The JTS8388B can be clocked at full speed without noticeable performance degradation in either differential or single ended configuration. This is explained by the fact the ADC uses a differential preamplifier stage for the clock buffer, which has been designed in order to be entered either in differential or single-ended mode. 7.4.1. SINGLE ENDED CLOCK INPUT (GROUND COMMON M ODE) Although the clock inputs were intended to be driven differentially with nominal -0.8V / -1.8V ECL levels, the JTS8388B clock buffer can manage a single-ended sinewave clock signal centered around 0 Volt. This is the most convenient clock input configuration as it does not require the use of a power splitter. No performance degradation ( e.g. : due to timing jitter) is observed in this particular single-ended configuration up to 1.2GSPS Nyquist conditions ( Fin = 600 MHz ). This is true so long as the inverted phase clock input pin is 50 ohms terminated very closely to one of the neighbouring shield ground pin, which constitutes the local Ground reference for the inphase clock input. Thus the JTS8388B differential clock input buffer will fully reject the local ground noise ( and any capacitively and inductively coupled noise) as common mode effects. Moreover, a very low phase noise sinewave generator must be used for enhanced jitter performance. The typical inphase clock input amplitude is 1 Volt peak to peak, centered on 0 Volt (ground) common mode. This corresponds to a typical clock input power level of 4 dBm into the 50 ohms termination resistor. Do not exceed 10 dBm to avoid saturation of the preamplifier input transistors. The inverted phase clock input is grounded through the 50 ohms termination resistor. Product Specification 29 Product Specification Single ended Clock input (Ground common mode) VCLK common mode = 0 Volt VCLKB=0 Volt 4 dBm typical clock input power level (into 50 ohms termination resistor) [V] CLK or CLKB double pad (pins 37, 38 or 39, 40) VCLK CLK or CLKB +0.5V VCLKB = ( 0 V ) 0.4 pF 50 reverse termination t -0.5V 1M 50 (external) Note 1 : Do not exceed 10 dBm into the 50 ohms termination resistor for single clock input power level. 7.4.2. DIFFERENTIAL ECL CLOCK INPUT The clock inputs can be driven differentially with nominal -0.8V / -1.8V ECL levels. In this mode, a low phase noise sinewave generator can be used to drive the clock inputs, followed by a power splitter (hybrid junction) in order to obtain 180 degrees out of phase sinewave signals. Biasing tees can be used for offseting the common mode voltage to ECL levels. Note : As the biasing tees propagation times are not matching, a tunable delay line is required in order to ensure the signals to be 180 degrees out of phase especially at fast clock rates in the GSPS range. Differential Clock inputs (ECL Levels) [mV] CLK or CLKB double pad (pins 37, 38 or 39, 40) VCLK VCLKB -0.8V Common mode = -1.3 V CLK or CLKB 1M 50 (external) 0.4 pF -2V -1.8V t 50 reverse termination 7.4.3. SINGLE ENDED ECL CLOCK INPUT In single-ended configuration enter on CLK ( resp. CLKB ) pin , with the inverted phase Clock input pin CLKB (respectively CLK) connected to -1.3V through the 50 ohms termination resistor. The inphase input amplitude is 1 Volt peak to peak, centered on -1.3 Volt common mode. Single ended Clock input (ECL): VCLK common mode = -1.3 Volt. VCLKB = -1.3 Volt [V] VCLK -0.8V VCLKB = -1.3 V -1.8V 30 JTS8388B t JTS8388B 7.5. CLOCK SIGNAL DUTY CYCLE ADJUST At fast sampling rates, ( 1 Gsps and above), the device performance ( especially the SNR ) may be improved by tuning the Clock duty cycle (CLK,CLKB). In single ended configuration, when using a sinewave clock generator, the clock signal duty cycle can be easily adjusted by simply offseting the inphase clock signal using a biasing tee, (as the out of phase clock input is at ground level ). Single ended Clock input (Inphase clock input common mode shifted) VCLK common mode = -180mV VCLKB = 0 Volt [V] +0.5V VCLK - 180 mV VCLKB = ( 0 V ) 40 % -0.5V 60 % t Note 1 : Do not exceed 10 dBm into the 50 ohms termination resistor for single clock input power level. Note 2 : For an input CLK signal of 4 dBm into 50 ohms, the typical offset value to achieve a 40 / 60 clock duty cycle is -180 mV on CLK. 7.6. NOISE IMMUNITY INFORMATIONS Circuit noise immunity performance begins at design level. Efforts have been made on the design in order to make the device as insensitive as possible to chip environment perturbations resulting from the circuit itself or induced by external circuitry. (Cascode stages isolation, internal damping resistors, clamps, internal (onchip) decoupling capacitors.) Furthermore, the fully differential operation from analog input up to the digital outputs provides enhanced noise immunity by common mode noise rejection. Common mode noise voltage induced on the differential analog and clock inputs will be canceled out by these balanced differential amplifiers. Moreover, proper active signals shielding has been provided on the chip to reduce the amount of coupled noise on the active inputs : The analog inputs and clock inputs of the TS8388B device have been surrounded by ground pins, which must be directly connected to the external ground plane. Product Specification 31 Product Specification 7.7. DIGITAL OUTPUTS The JTS8388B differential output buffers are internally 75 ohms loaded. The 75 ohms resistors are connected to the digital ground pins through a 0.8v level shift diode (see Figures 3,4,5 on next page). The JTS8388B output buffers are designed for driving 75 ohms (default) or 50 ohms properly terminated impedance lines or coaxial cables. An 11 mA bias current flowing alternately into one of the 75 ohms resistors when switching ensures a 0.825 V voltage drop across the resistor (unterminated outputs). The VPLUSD positive supply voltage allows the adjustment of the output common mode level from -1.2V (VPLUSD=0V for ECL output compatibility) to +1.2V (VPLUSD=2.4V for LVDS output compatibility). Therefore,the single ended output voltages vary approximately between -0.8V and -1.625V, ( outputs unterminated ), around -1.2V common mode voltage. Three possible line driving and back-termination scenarios are proposed (assuming VPLUSD=0V) : 1 ) 75 Ohms impedance transmission lines, 75 ohms differentialy terminated (Fig. 3) : Each output voltage varies between -1V and -1.42V (respectively +1.4V and +1V), leading to +/- 0.41V =0.825 V in differential, around -1.21 V (respectively +1.21V) common mode for VPLUSD=0V (respectively 2.4V). 2 ) 50 ohms impedance transmission lines, 50 ohms differentialy termination (Fig. 4) : Each output voltage varies between -1.02V and -1.35V (respectively +1.38V and +1.05V), leading to +/- 0.33V=660 mV in differential, around -1.18V (respectively +1.21V) common mode for VPLUSD=0V (respevtively 2.4V). 3 ) 75 ohms impedance open transmission lines (Fig. 5) : Each output voltage varies between -1.6 V and -0.8 V (respectively +0.8V and +1.6V), which are true ECL levels, leading to +/- 0.8V=1.6V in differential, around -1.2V (respectively +1.2V) common mode for VPLUSD=0V (respectively 2.4V). Therefore, it is possible to drive directly high input impedance storing registers, without terminating the 75 ohms transmission lines. In time domain, that means that the incident wave will reflect at the 75 ohms transmission line output and travel back to the generator ( i.e. the 75 ohms data output buffer ). As the buffer output impedance is 75 ohms, no back reflection will occur. Note : This is no longer true if a 50 ohms transmission line is used, as the latter is not matching the buffer 75 ohms output impedance. Each differential output termination length must be kept identical . It is recommended to decouple the midpoint of the differential termination with a 10 nF capacitor to avoid common mode perturbation in case of slight mismatch in the differential output line lengths. Too large mismatches ( keep < a few mm ) in the differential line lengths will lead to switching currents flowing into the decoupling capacitor leading to switching ground noise. The differential output voltage levels ( 75 or 50 ohms termination ) are not ECL standard voltage levels, however it is possible to drive standard logic ECL circuitry like the ECLinPS logic line from MOTOROLA. At sampling rates exceeding 1GSPS, it may be difficult to trigger the HP16500 or any other Acquisition System with digital outputs. It becomes necessary to regenerate digital data and Data Ready by means of external amplifiers, in order to be able to test the JTS8388B at its optimum performance conditions. 32 JTS8388B JTS8388B 7.7.1. DIFFERENTIAL OUTPUT LOADING CONFIGURATIONS (LEVELS FOR ECL COMPATIBILITY) VPLUSD = 0V -0.8V 75 Out 75 75 Differential output : 0.41V = 0.825V 75 - + 75 impedance 10 nF -1V / -1.41V Common mode level : -1.2V (-1.2V below VPLUSD level) 75 OutB -1.41V / -1V 11 mA DVEE Figure 3 : DIFFERENTIAL OUTPUT : 75 TERMINATED VPLUSD = 0V -0.8V 75 Out 75 50 Differential output : 0.33V = 0.660V 50 - + 50 impedance 10 nF -1.02V / -1.35V Common mode level : -1.2V (-1.2V below VPLUSD level) 50 OutB -1.35V / -1.02V 11 mA DVEE Figure 4 : DIFFERENTIAL OUTPUT : 50 TERMINATED VPLUSD = 0V -0.8V 75 Out 75 75 - + 75 impedance -0.8V / -1.6V Differential output : 0.8V = 1.6V Common mode level : -1.2V (-1.2V below VPLUSD level) OutB -1.6V / -0.8V 11 mA DVEE Figure 5 : DIFFERENTIAL OUTPUT : OPEN LOADED Product Specification 33 Product Specification 7.7.2. DIFFERENTIAL OUTPUT LOADING CONFIGURATIONS (LEVELS FOR LVDS COMPATIBILITY) VPLUSD = 2.4V 1.6V 75 Out 75 75 Differential output : 0.41V = 0.825V 75 - + 75 impedance 10 nF 1.4V / 0.99V Common mode level : -1.2V (-1.2V below VPLUSD level) 75 OutB 0.99V / 1.4V 11 mA DVEE Figure 6 : DIFFERENTIAL OUTPUT : 75 TERMINATED VPLUSD = 2.4V 1.6V 75 Out 75 50 Differential output : 0.33V = 0.660V 50 - + 50 impedance 10 nF 1.38V / 1.05V Common mode level : -1.2V (-1.2V below VPLUSD level) 50 OutB 1.05V / 1.38V 11 mA DVEE Figure 7 : DIFFERENTIAL OUTPUT : 50 TERMINATED VPLUSD = 2.4V 1.6V 75 Out 75 75 - + 75 impedance 1.6V / 0.8V Differential output : 0.8V = 1.6V Common mode level : -1.2V (-1.2V below VPLUSD level) OutB 0.8V / 1.6V 11 mA DVEE 34 JTS8388B Figure 8 : DIFFERENTIAL OUTPUT : OPEN LOADED JTS8388B 7.8. OUT OF RANGE BIT An Out of Range (OR,ORB) bit is provided that goes to logical high state when the input exceeds the positive full scale or falls below the negative full scale. When the analog input exceeds the positive full scale, the digital output datas remain at high logical state, with (OR,ORB) at logical one. When the analog input falls below the negative full scale, the digital outputs remain at logical low state, with (OR,ORB) at logical one again. 7.9. GRAY OR BINARY OUTPUT DATA FORMAT SELECT The JTS8388B internal regeneration latches indecision (for inputs very close to latches threshold) may produce errors in the logic encoding circuitry and leading to large amplitude output errors. This is due to the fact that the latches are regenerating the internal analog residues into logical states with a finite voltage gain value (Av) within a given positive amount of time (t) : Av= exp((t)/) , with the positive feedback regeneration time constant. The JTS8388B has been designed for reducing the probability of occurence of such errors to approximately 10 1GSPS). -13 (targetted for the JTS8388B at A standard technique for reducing the amplitude of such errors down to +/-1 LSB consists to output the digital datas in Gray code format. -13 Though the JTS8388B has been designed for featuring a Bit Error Rate of 10 with a binary output format, it is possible for the user to select between the Binary or Gray output data format, in order to reduce the amplitude of such errors when occuring, by storing Gray output codes. Digital Datas format selection : BINARY output format if GORB is floating or VCC. GRAY output format if GORB is connected to ground (0V). 7.10. TS8388 B THERMAL REQUIREMENTS The JTS8388B is currently mounted on its dedicated Chip Evaluation Board (CEB), with fulfills the device thermal requirements in still air at room temperature. For operation in the military temperature range, forced convection is required to maintain the device junction temperature below the specified maximum value. The JTS8388B power dissipation is 3.6 Watt at 70C junction temperature, and 3.8 Watt at 125C junction temperature. The die dimensions are 2.44 mm x 3 mm = 7.32 mm. The maximum junction temperature is 145C. To manage correctly the power dissipation of the JTS8388B device, the following thermal fixture profile is used, taking into account the die dimensions and power dissipation : 7.5 C/W typical value for die attach Ag filled Epoxy glue, but depending on gllue film thickness. 0.5 C/W Copper block. 1 C/W isolation foil. 6.5 C/W heatsink (still air). The heatsink used is the 3334B pin fin heatsink from Thermalloy, (also used cooling the 604 Power PC P). Its dimensions are 50.70 mm x 50.39 mm = (1.996 inch x 1.984 inch x 0.650 inch). The measured die junction to ambient thermal resistance (RTHJA) for the Chip Evaluation Board is approximately 15.5 C/W in still air. At room temperature (25C), this yields to a device junction temperature of approximately 80C, in thermal steady state conditions. Product Specification 35 Product Specification 7.11. DIODE PAD 32 The DIODE pad 32 is provided for die junction temperature monitoring. The operating die junction temperature must be kept below145C, therefore an adequate cooling system has to be set up. The diode mounted transistor measured Vbe value versus junction temperature is given below. 1000 960 920 VBE (mV) 880 840 800 760 720 680 640 600 -55 -35 -15 5 25 45 65 85 105 125 Junction temperature (deg.C) 7.12. ADC GAIN CONTROL PAD 38 The ADC gain is adjustable by the means of the PAD 38 (input impedance is 1M in parallel with 2pF) The gain adjust transfer function is given below : 1,20 1,15 ADC Gain 1,10 1,05 1,00 0,95 0,90 0,85 0,80 -500 -400 -300 -200 -100 0 100 Vgain (command voltage) (mV) 36 JTS8388B 200 300 400 500 JTS8388B 8. EQUIVALENT INPUT / OUTPUT SCHEMATICS 8.1. EQUIVALENT ANALOG INPUT CIRCUIT AND ESD PROTECTIONS VCC=+5V VCC -0.8V VCLAMP= +2.4V -0.8V GND GND=0V -5.8V -5.8V +1.65V 50 50 VEE E21V E21V VEE 200 200 VIN VINB Pad capacitance 340fF Pad capacitance 340fF 5.8V -1.55V 0.8V VEE=-5V Note : the ESD protections are present but not connected for Vin and Vinb 8.2. EQUIVALENT ANALOG CLOCK INPUT CIRCUIT AND ESD PROTECTIONS VCC=+5V VCC +0.8V -5.8V -5.8V -5.8V -5.8V GND=0V -5.8V -5.8V VEE CLK VEE 150 Pad capacitance 340fF 150 5.8V 5.8V 380 A 380 A 0.8V 0.8V VEE=-5V Note : the ESD protections are present but not connected for Clk and Clkb Product Specification 37 CLKB Pad capacitance 340fF Product Specification 8.3. EQUIVALENT DATA OUTPUT BUFFER CIRCUIT AND ESD PROTECTIONS VPLUSD=0V to 2.4V -5.8V -5.8V 75 75 VEE VEE OUTB OUT Pad capacitance 180 fF 5.8V Pad capacitance 180 fF 5.8V I=11mA -3.7V 0.8V 0.8V 0.8V 0.8V DVEE=-5V VEE=-5V VEE=-5V Note : the ESD protection equivalent capacitance is 150 fF. 8.4. ADC GAIN ADJUST EQUIVALENT INPUT CIRCUITS AND ESD PROTECTIONS VCC=+5V VCC -0.8 V NP1032C2 -0.8 V +1.6V VEE NP1032C2 -5.8 V -5.8 V 1 k VEE 1 k GA GAB 0.8V Pad capacitance 180 fF 2 pF 2 pF 0.8V VEE GND 500 A 500 A VEE=-5V Note : the ESD protection equivalent capacitance is 150 fF. 38 JTS8388B Pad capacitance 180 fF 0.8V GND 5.8V 0.8V 5.8V VEE JTS8388B 8.5. GORB EQUIVALENT INPUT SCHEMATIC AND ESD PROTECTIONS GORB: gray or binary select input; floating or tied to VCC -> binary VCC=+5V -0.8V 1 k 1 k -0.8V 1 k -5.8V VEE GORB 5 k Pad capacitance 180fF 5.8V 5.8V 250 A 250 A 5.8V VEE=-5V GND=0V Note : the ESD protection equivalent capacitance is 150 fF. Product Specification 39 Product Specification 8.6. DRRB EQUIVALENT INPUT SCHEMATIC AND ESD PROTECTIONS VCC=+5V Actual protection range: 6.6V above VEE, In fact stress above GND are clipped by the CB diode used for Tj monitoring GND=0V NP1032C2 10 k DRRB -1.3V 200 Pad capacitance 180 fF -2.6V 5.8 V VEE 0.8 V VEE=-5V Note : the ESD protection equivalent capacitance is 150 fF. 40 JTS8388B JTS8388B 9. TSEV8388B : DEVICE EVALUATION BOARD For complete specification, see separate TSEV8388B document. GENERAL DESCRIPTION The TSEV8388B Evaluation Board (CEB) is a prototype board which has been designed in order to facilitate the evaluation and the characterization of the JTS8388B device up to its 2 GHz full power bandwidth at up to 1 Gsps in the military temperature range. The high speed of the JTS8388B requires careful attention to circuit design and layout to achieve optimal performance. This four metal layer board with internal ground plane has the adequate functions in order to allow a quick and simple evaluation of the JTS8388B ADC performances over the temperature range. The TSEV8388B Evaluation Board is very straightforward as it only implements the JTS8388B ADC, SMA connectors for input / output accesses and a 2.54 mm pitch connector compatible with HP16500C high frequency probes. The board also implements a de-embedding fixture in order to facilitate the evaluation of the high frequency insertion loss of the input microstrip lines, and a die junction temperature measurement setting. The board is constituted by a sandwich of two dielectric layers, featuring low insertion loss and enhanced thermal characteristics for operation in the high frequency domain and extended temperature range. The board dimensions are 130 mm x 130 mm. The board set comes fully assembled and tested, with the JTS8388B die installed. Product Specification 41 Product Specification 10. ORDERING INFORMATION Die form J TS (X) 8388B - 1 V 1 B Revision of the mask set B : for VH25B Die prefix Prob test configuration 1 : ambiant temperature 2 : Tamb + high temp Manufacturer prefix (1) Screening levels (2) Prototype version V : visual inspection Device or family Back side metallization 1 : Naked Silicon (1) ATMEL-GRENOBLE (2) For availability of the different versions, contact your ATMELGrenoble sales office Evaluation board TSEV Evaluation board prefix Device or family 42 JTS8388B 8388B JTS8388B APPENDIX DATASHEET STATUS VALIDITY Objective specification This datasheet contains target and goal specification for discussion with customer and application validation. Before design phase. Target specification This datasheet contains target and goal specification for product development. Valid during the design phase. Preliminary specification Alpha-site This datasheet contains preliminary data. Additional data may be Valid before the published later ; could include simulation results. characterization phase. Preliminary specification Beta-site This datasheet contains also characterization results. Valid before the industrialization phase. Product specification This datasheet contains final product specifiaction. Valid for production purpose. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. ATMEL customers using or selling these products for use in such applications do so their own risk and agree to fully indemnify ATMEL for any damages from improper use or sale. Product Specification 43 Product Specification Atmel Grenoble, formerly Thomson-CSF Semiconducteurs Specifiques, an Atmel Group Company. Information furnished is believed to be accurate and reliable. However Atmel-Grenoble assumes no responsability for the consequences of use of such information nor for any infringement of pattents or other rights of third parties which may result from its use. No license is garanted by implication or otherwise under any pattent or pattent rights of Atmel-Grenoble. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. Atmel-Grenoble products are not authorized for use as critical components in life support devices or systems without express written approval from Atmel Grenoble. 2000 Atmel Grenoble - Printed in France - all rights reserved. This product is manufactured and commercialized by Atmel Grenoble - Avenue de Rocheplaine - BP 123 - 38521 Aint-Egreve Cedex - France. For further information, please contact : Atmel Grenoble - Route Departementale 128 - BP 46 - 91901 Orsay Cedex - France Phone +33 (0) 1 69 33 03 24 - Fax +33 (0) 1 69 33 03 21 Email monique.lafrique@atmel-grenoble.com - Web site http://www.atmel-grenoble.com 44 JTS8388B