© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1026_COTS_C0G • 6/6/2011 1
One WORLD One Brand One Strategy One Focus One Team One KEMET
Overview
KEMET’s COTS program is an extension of KEMET knowledge
of high reliability test regimes and requirements. KEMET regularly
supplies “up-screened” products by working with customer drawings
and imposing specied design and test requirements. The COTS
program offers the same high quality and high reliability components
as up-screened products, but at a lower cost to the customer. This is
accomplished by eliminating the need for customer-specic drawings
to achieve the reliability level required for customer applications. A
series of tests and inspections have been selected to provide the
accelerated conditioning and 100% screening necessary to eliminate
infant mortal failures from the population.
KEMET’s C0G dielectric features a 125°C maximum operating
temperature and is considered “stable.” The Electronics
Components, Assemblies & Materials Association (EIA)
characterizes C0G dielectric as a Class I material. Components
of this classication are temperature compensating and are suited
for resonant circuit applications or those where Q and stability of
capacitance characteristics are required. C0G exhibits no change in
capacitance with respect to time and voltage and boasts a negligible
change in capacitance with reference to ambient temperature.
Capacitance change is limited to ±30ppm/ºC from -55°C to +125°C.
All COTS testing includes voltage conditioning and post-electrical
testing as per MIL-PRF-55681. For enhanced reliability, KEMET
also provides the following test level options and conformance
certications:
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-the-Shelf (COTS) for Higher Reliability
Applications, C0G Dielectric, 10VDC-200VDC
1 Additional capacitance tolerance offerings may be available. Contact KEMET for details.
2 Additional termination nish options may be available. Contact KEMET for details.
3 Additional reeling or packaging options may be available. Contact KEMET for details.
Ordering Information
C1206 T104 K 5 G A C TU
Ceramic Case Size
(L" x W")
Specication/
Series
Capacitance
Code (pF)
Capacitance
Tolerance1Voltage Dielectric Failure Rate/Design Termination Finish2Packaging/Grade
(C-Spec)3
0402
0603
0805
1206
1210
1812
2220
T = COTS 2 Sig. Digits +
Number of Zeros
Use 9 for
1.0 - 9.9pF
Use 8 for
0.5 - .99pF
ex. 2.2pF = 229
ex. 0.5pF = 508
C = ±0.25pF
D = ±0.5pF
F = ± 1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
8 = 10V
4 = 16V
3 = 25V
6 = 35V
5 = 50V
1 = 100V
2 = 200V
G = C0G A = Group A Testing per
MIL-PRF-55681 PDA 8%
B= Group A Testing per
MIL-PRF-55681 PDA
8%, DPA per EIA-469
C = Group A Testing per
MIL-PRF-55681 PDA 8%,
DPA per EIA-469, Humidity
per MIL-STD-202, Method
103, Condition A
C = 100% Matte Sn
L = SnPb (5% min)
Blank = Bulk
TU = 7" Reel
Unmarked
TM = 7" Reel
Marked
Test Level A Test Level B Test Level C
Voltage Conditioning
DWV
IR@25°C
CAP
DF
Voltage Conditioning
DWV
IR@25°C
CAP
DF
Voltage Conditioning
DWV
IR@25°C
CAP
DF
PDA 8% PDA 8% PDA 8%
C of C DPA DPA
C of C 85/85
C of C
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1026_COTS_C0G • 6/6/2011 2
SMD MLCCs – Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10VDC-200VDC
Dimensions – Millimeters (Inches)
Benets
• -55°C to +125°C operating temperature range
• Voltage conditioning and post-electrical testing per MIL-PRF-55681, Paragraph 4.8.3.1, Standard Voltage Conditioning
• Destructive Physical Analysis (DPA) per EIA-469
• Humidity, steady state, low voltage (85/85) per MIL-STD 202, Method 103, Condition A
• Certicate of compliance
• RoHS compliant (excluding SnPb end metallization option)
• EIA 0201, 0402, 0603, 0805, 1206, 1210, 1812, 1825, 2220 and 2225 case sizes
• DC voltage ratings of 10V, 16V, 25V, 50V, 100V and 200V
• Capacitance offerings ranging from 0.5pF up to 0.47μF
• Available capacitance tolerances of ±0.25pF, ±0.5pF, ±1%, ±2%, ±5%, ±10% and ±20%
• No piezoelectric noise
• Extremely low ESR and ESL
• High thermal stability
• High ripple current capability
• Preferred capacitance solution at line frequencies and into the MHz range
• No capacitance change with respect to applied rated DC voltage
• Negligible capacitance change with respect to temperature
• No capacitance decay with time
• Non-polar device, minimizing installation concerns
• SnPb end metallization option available upon request (5% min)
Applications
Typical applications include military, space quality and high reliability electronics.
Ceramic Surface Mount
WL
TB
S
100% Tin or SnPb Plate
Nickel Plate
Conductive Metalization
Electrodes
EIA
Size
Code
Metric
Size
Code
L
Length
W
Width
T
Thickness
B
Bandwidth
S
Separation
Min.
Mounting
Technique
0402 1005 1.00 (.040) ± 0.05 (.002) 0.50 (.020) ± 0.05 (.002)
See Table 2 for Thickness
0.30 (.012) ± 0.10 (.004) 0.30 (.012) Solder Reow Only
0603 1608 1.60 (.063) ± 0.15 (.006) 0.80 (.032) ± 0.15 (.006) 0.35 (.014) ± 0.15 (.006) 0.70 (.028) Solder Wave or
Solder Reow
0805 2012 2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008) 0.50 (0.02) ± 0.25 (.010) 0.75 (.030)
1206 3216 3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008) 0.50 (0.02) ± 0.25 (.010)
N/A
1210 3225 3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008) 0.50 (0.02) ± 0.25 (.010)
Solder Reow Only1812 4532 4.50 (.177) ± 0.30 (.012) 3.20 (.126) ± 0.30 (.012) 0.60 (.024) ± 0.35 (.014)
2220 5650 5.70 (.224) ± 0.40 (.016) 5.00 (.197) ± 0.40 (.016) 0.60 (.024) ± 0.35 (.014)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1026_COTS_C0G • 6/6/2011 3
SMD MLCCs – Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10VDC-200VDC
Qualication/Certication
Commercial grade products are subject to internal qualication. Details regarding test methods and conditions are referenced in Table
4, Performance and Reliability.
Environmental Compliance
RoHS compliant (excluding SnPb termination nish option)
Electrical Parameters/Characteristics
Item Parameters/Characteristics
Operating Temperature Range -55°C to +125°C
Capacitance Change with Reference to +25°C and 0 Vdc Applied (TCC) ±30PPM/ºC
Aging Rate (Max % Cap Loss/Decade Hour) 0%
Dielectric Withstanding Voltage
250% of rated voltage
(5 ± 1 seconds and charge/discharge not exceeding 50mA)
Dissipation Factor (DF) Maximum Limit @ 25ºC 0.1%
Insulation Resistance (IR) Limit @ 25°C
1000 megohm microfarads or 100GΩ
(Rated voltage applied for 120 ± 5 secs @ 25°C)
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and Dissipation Factor (DF) measured under the following conditions:
1MHz ± 100kHz and 1.0Vrms ± 0.2V if capacitance ≤1000pF
1kHz ± 50Hz and 1.0Vrms ± 0.2V if capacitance >1000pF
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as Automatic
Level Control (ALC). The ALC feature should be switched to "ON".
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric Rated DC Voltage Capacitance Value DF (%) Cap Shift IR
C0G All All 0.5 0.3% or ± 0.25 pF 10% of Initial Limit
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1026_COTS_C0G • 6/6/2011 4
SMD MLCCs – Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10VDC-200VDC
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within
the same form factor (conguration and dimensions).
These products are protected under US Patents 7,172,985 & 7,670,981, other patents pending, and any foreign counterparts.
Cap Cap
Code
Series C0402 C0603 C0805 C1206
Voltage Code 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2
Voltage DC
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
Cap Tolerance Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions
0.5-0.75 pF 508-758 CDBB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC
1.0-2.4 pF 109-249 CDBB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
2.7-5.1 pF 279-519 CDK M BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
5.6-9.1 pF 569-919 CDJ K M BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
10-13 pF 100-130 CDJ K M BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
15-24 pF 150-240 CD G J K M BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
27-36 pF 270-360 D G J K M BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
39-51 pF 390-510 D F G J K M BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
56 pF 560 F G J K M BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
62 pF 620 F G J K M BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
68 pF 680 F G J K M BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
75 pF 750 F G J K M BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
82 pF 820 F G J K M BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
91 pF 910 F G J K M BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
100 pF 101 F G J K M BB BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
110 pF 111 F G J K M BB BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
120 pF 121 F G J K M BB BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
130 pF 131 F G J K M BB BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
150 pF 151 F G J K M BB BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
160 pF 161 F G J K M BB BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
180 pF 181 F G J K M BB BB BB BB BB CB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
200 pF 201 F G J K M BB BB BB BB BB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
220 pF 221 F G J K M BB BB BB BB BB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
240 pF 241 F G J K M BB BB BB BB BB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
270 pF 271 F G J K M BB BB BB BB BB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
300 pF 301 F G J K M BB BB BB BB BB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
330 pF 331 F G J K M BB BB BB BB BB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
360 pF 361 F G J K M BB BB BB BB BB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
390 pF 391 F G J K M BB BB BB BB BB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
430 pF 431 F G J K M BB BB BB BB BB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
470 pF 471 F G J K M BB BB BB BB BB CB CB CB CB CB DC DC DC DC DC DD EB EB EB EB EB EB
510 pF 511 F G J K M BB BB BB BB BB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
560 pF 561 F G J K M BB BB BB BB BB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
620 pF 621 F G J K M BB BB BB BB BB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
680 pF 681 F G J K M BB BB BB BB BB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
750 pF 751 F G J K M BB BB BB BB BB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
820 pF 821 F G J K M BB BB BB BB BB CB CB CB CB CB DC DC DC DC DC DC EB EB EB EB EB EB
910 pF 911 F G J K M BB BB BB BB BB CB CB CB CB CB DC DC DC DC DD DD EB EB EB EB EB EB
1,000 pF 102 F G J K M BB BB BB BB BB CB CB CB CB CB DC DC DC DC DD DD EB EB EB EB EB EE
1,100 pF 112 F G J K M BB BB BB BB CB CB CB CB CB DC DC DC DC DC EB EB EB EB EB EB
1,200 pF 122 F G J K M BB BB BB BB CB CB CB CB CB DC DC DC DC DC EB EB EB EB EB EB
1,300 pF 132 F G J K M BB BB BB BB CB CB CB CB CB DD DD DD DD DD EB EB EB EB EC EC
1,500 pF 152 F G J K M BB BB BB BB CB CB CB CB CB DD DD DD DD DD EB EB EB EB ED EC
1,600 pF 162 F G J K M BB BB BB CB CB CB CB CB DD DD DD DD DD EB EB EB EB ED ED
1,800 pF 182 F G J K M BB BB BB CB CB CB CB CB DD DD DD DD DD EB EB EB EB ED ED
2,000 pF 202 F G J K M BB BB BB CB CB CB CB CB DC DC DC DC DC EB EB EB EB ED ED
2,200 pF 222 F G J K M BB BB BB CB CB CB CB CB DC DC DC DC DC EB EB EB EB EE ED
2,400 pF 242 F G J K M CB CB CB CB CB DC DC DC DC DC EB EB EB EB EC EC
2,700 pF 272 F G J K M CB CB CB CB CB DC DC DC DC DC EB EB EB EB EC EC
3,000 pF 302 F G J K M CB CB CB CB CB DD DD DD DD DC EC EC EC EC EC
3,300 pF 332 F G J K M CB CB CB CB CB DD DD DD DD DC EC EC EC EC EE
3,600 pF 362 F G J K M CB CB CB CB CB DD DD DD DD DC EC EC EC EC EE
3,900 pF 392 F G J K M CB CB CB CB CB DE DE DE DE DC EC EC EC EC EF
4,300 pF 432 F G J K M CB CB CB CB CB DE DE DE DE DC EC EC EC EC EC
4,700 pF 472 F G J K M CB CB CB CB CB DE DE DE DE DC EC EC EC EC EC
Cap Cap
Code
Voltage DC
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
Voltage Code 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2
Series C0402 C0603 C0805 C1206
Table 1A – (0402 - 1206 Case Sizes)
Roll Over for
Order Info.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1026_COTS_C0G • 6/6/2011 5
SMD MLCCs – Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10VDC-200VDC
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within
the same form factor (conguration and dimensions).
These products are protected under US Patents 7,172,985 & 7,670,981, other patents pending, and any foreign counterparts.
Cap Cap Code
Series C1210 C1812 C2220
Voltage Code 8 4 3 5 1 2 5 1 2 3 1 2
Voltage DC
10
16
25
50
100
200
50
100
200
50
100
200
Cap Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
0.5-0.75 pF 508-758 CD
1.0-2.4 pF 109-249 CDFB FB FB FB FB FB
2.7-5.1 pF 279-519 CDK M FB FB FB FB FB FB
5.6-9.1 pF 569-919 CDJ K M FB FB FB FB FB FB
10-13 pF 100-130 CDJ K M FB FB FB FB FB FB
15-24 pF 150-240 CD G J K M FB FB FB FB FB FB
27-36 pF 270-360 D G J K M FB FB FB FB FB FB
39-51 pF 390-510 D F G J K M FB FB FB FB FB FB
56-82 pF 560-820 F G J K M FB FB FB FB FB FB
91-180 pF 910-181 F G J K M FB FB FB FB FB FB
200-360 pF 201-361 F G J K M FB FB FB FB FB FB
390 pF 391 F G J K M FB FB FB FB FB FB
430 pF 431 F G J K M FB FB FB FB FB FB
470 pF 471 F G J K M FB FB FB FB FB FB GB GB GB
510 pF 511 F G J K M FB FB FB FB FB FB GB GB GB
560 pF 561 F G J K M FB FB FB FB FB FB GB GB GB
620 pF 621 F G J K M FB FB FB FB FB FB GB GB GB
680 pF 681 F G J K M FB FB FB FB FB FB GB GB GB
750 pF 751 F G J K M FB FB FB FB FB FB GB GB GB
Cap Cap Code
Voltage DC
10
16
25
50
100
200
50
100
200
50
100
200
Voltage Code 8 4 3 5 1 2 5 1 2 3 1 2
Series C1210 C1812 C2220
Cap Cap
Code
Series C0402 C0603 C0805 C1206
Voltage Code 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2
Voltage DC
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
Cap Tolerance Product Availability and Chip Thickness Codes See Table 2 for Chip Thickness Dimensions
5,100 pF 512 F G J K M CB CB CB CB DE DE DE DE DC ED ED ED ED ED
5,600 pF 562 F G J K M CB CB CB CB DC DC DC DC DC ED ED ED ED ED
6,200 pF 622 F G J K M CB CB CB CB DC DC DC DC DC EB EB EB EB EB
6,800 pF 682 F G J K M CB CB CB CB DC DC DC DC DC EB EB EB EB EB
7,500 pF 752 F G J K M CB CB CB DC DC DC DC DC EB EB EB EB EB
8,200 pF 822 F G J K M CB CB CB DC DC DC DC DC EC EC EC EC EB
9,100 pF 912 F G J K M CB CB CB DC DC DC DC DC EC EC EC EC EB
10,000 pF 103 F G J K M CB CB CB DC DC DC DC DD ED ED ED ED EB
12,000 pF 123 F G J K M CB CB CB DC DC DC DC DE EB EB EB EB EB
15,000 pF 153 F G J K M CB CB CB DC DC DC DD DG EB EB EB EB EB
18,000 pF 183 F G J K M DC DC DC DD EB EB EB EB EB
22,000 pF 223 F G J K M DD DD DD DF EB EB EB EB EC
27,000 pF 273 F G J K M DF DF DF EB EB EB EB EE
33,000 pF 333 F G J K M DG DG DG EB EB EB EB EE
47,000 pF 473 F G J K M DG DG DG EC EC EC EE EH
56,000 pF 563 F G J K M ED ED ED EF
68,000 pF 683 F G J K M EF EF EF EH
82,000 pF 823 F G J K M EH EH EH EH
0.10 µF 104 F G J K M EH EH EH
Cap Cap
Code
Voltage DC
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
Voltage Code 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2 8 4 3 5 1 2
Series C0402 C0603 C0805 C1206
Table 1A – (0402 - 1206 Case Sizes) con't
Table 1B – (1210 - 2220 Case Sizes)
Roll Over for
Order Info.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1026_COTS_C0G • 6/6/2011 6
SMD MLCCs – Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10VDC-200VDC
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage capability within
the same form factor (conguration and dimensions).
These products are protected under US Patents 7,172,985 & 7,670,981, other patents pending, and any foreign counterparts.
Cap Cap Code
Series C1210 C1812 C2220
Voltage Code 8 4 3 5 1 2 5 1 2 3 1 2
Voltage DC
10
16
25
50
100
200
50
100
200
50
100
200
Cap Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
820 pF 821 F G J K M FB FB FB FB FB FB GB GB GB
910 pF 911 F G J K M FB FB FB FB FB FB GB GB GB
1,000 pF 102 F G J K M FB FB FB FB FB FB GB GB GB
1,100 pF 112 F G J K M FB FB FB FB FB FB GB GB GB
1,200 pF 122 F G J K M FB FB FB FB FB FB GB GB GB
1,300 pF 132 F G J K M FB FB FB FB FB FC GB GB GB
1,500 pF 152 F G J K M FB FB FB FB FB FE GB GB GB
1,600 pF 162 F G J K M FB FB FB FB FB FE GB GB GB
1,800 pF 182 F G J K M FB FB FB FB FB FE GB GB GB
2,000 pF 202 F G J K M FB FB FB FB FC FE GB GB GB
2,200 pF 222 F G J K M FB FB FB FB FC FG GB GB GB
2,400 pF 242 F G J K M FB FB FB FB FC FC
2,700 pF 272 F G J K M FB FB FB FB FC FC GB GB GB
3,000 pF 302 F G J K M FB FB FB FB FC FF
3,300 pF 332 F G J K M FB FB FB FB FF FF GB GB GB
3,600 pF 362 F G J K M FB FB FB FB FF FF
3,900 pF 392 F G J K M FB FB FB FB FF FF GB GB GB
4,300 pF 432 F G J K M FB FB FB FB FF FG
4,700 pF 472 F G J K M FF FF FF FF FG FG GB GB GD
5,100 pF 512 F G J K M FB FB FB FB FG FG
5,600 pF 562 F G J K M FB FB FB FB FG GB GB GH
6,200 pF 622 F G J K M FB FB FB FB FG
6,800 pF 682 F G J K M FB FB FB FB FG GB GB GJ JB JB
7,500 pF 752 F G J K M FC FC FC FC FC
8,200 pF 822 F G J K M FC FC FC FC FC GB GH JB JB
9,100 pF 912 F G J K M FE FE FE FE FE
10,000 pF 103 F G J K M FF FF FF FF FF GB GH JB JB
12,000 pF 123 F G J K M FG FG FG FG FB GB GG JB JB
15,000 pF 153 F G J K M FG FG FG FG FB GB GB JB JB
18,000 pF 183 F G J K M FB FB FB FB FB GB GB JB JB
22,000 pF 223 F G J K M FB FB FB FB FB GB GB JB JB
27,000 pF 273 F G J K M FB FB FB FB FB GB GB JB JB
33,000 pF 333 F G J K M FB FB FB FB FB GB GB JB JB
47,000 pF 473 F G J K M FB FB FB FB FE GB GB JB JB
56,000 pF 563 F G J K M FB FB FB FB FF GB GB JB JB
68,000 pF 683 F G J K M FB FB FB FC FG GB GB JB JB
82,000 pF 823 F G J K M FC FC FC FF FH GB GB JB JB
0.10 µF 104 F G J K M FE FE FE FG FM GB GD JB JB
0.12 µF 124 F G J K M FG FG FG FH GB GH JB JB
0.15 µF 154 F G J K M FH FH FH FM GD GN JB JB
0.18 µF 184 F G J K M FJ FJ FJ GH JB JD
0.22 µF 224 F G J K M FK FK FK GK JB JD
0.27 µF 274 F G J K M JB JF
0.33 µF 334 F G J K M JD JG
0.47 µF 474 F G J K M JG
Cap Cap Code
Voltage DC
10
16
25
50
100
200
50
100
200
50
100
200
Voltage Code 8 4 3 5 1 2 5 1 2 3 1 2
Series C1210 C1812 C2220
Table 1B – (1210 - 2220 Case Sizes) con't
Roll Over for
Order Info.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1026_COTS_C0G • 6/6/2011 7
SMD MLCCs – Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10VDC-200VDC
Table 2 – Chip Thickness/Packaging Quantities
Thickness
Code
Chip
Size
Thickness ±
Range (mm)
QTY per Reel
7" Plastic
QTY per Reel
13" Plastic
QTY per Reel
7" Paper
QTY per Reel
13" Paper
QTY per Bulk
Cassette
AA 1005 0.20 ± 0.02 15000
AB 0201 0.30 ± 0.03 15000
BB 0402 0.50 ± 0.05 10000 50000 50000
BC 0402 0.50 ± 0.10 10000 50000 50000
PA 0508 0.80 ± 0.10 4000 10000
CB 0603 0.80 ± 0.07 4000 10000 15000
CC 0603 0.80 ± 0.10 4000 10000 15000
CD 0603 0.80 ± 0.15 4000 10000 15000
MA 0612 0.80 ± 0.10 4000 10000
DB 0805 0.60 ± 0.10 4000 10000 15000
DC 0805 0.78 ± 0.10 4000 10000 15000
DD 0805 0.90 ± 0.10 4000 10000 15000
DL 0805 0.95 ± 0.10 4000 10000
DE 0805 1.00 ± 0.10 2500 10000
DF 0805 1.10 ± 0.10 2500 10000
DG 0805 1.25 ± 0.15 2500 10000
DH 0805 1.25 ± 0.20 2500 10000
EB 1206 0.78 ± 0.10 4000 10000 4000 10000
EK 1206 0.80 ± 0.10 2000 8000
EC 1206 0.90 ± 0.10 4000 10000
EN 1206 0.95 ± 0.10 4000 10000
ED 1206 1.00 ± 0.10 2500 10000
EE 1206 1.10 ± 0.10 2500 10000
EF 1206 1.20 ± 0.15 2500 10000
EM 1206 1.25 ± 0.15 2500 10000
EG 1206 1.60 ± 0.15 2000 8000
EH 1206 1.60 ± 0.20 2000 8000
EJ 1206 1.70 ± 0.20 2000 8000
FB 1210 0.78 ± 0.10 4000 10000
FC 1210 0.90 ± 0.10 4000 10000
FD 1210 0.95 ± 0.10 4000 10000
FE 1210 1.00 ± 0.10 2500 10000
FF 1210 1.10 ± 0.10 2500 10000
FG 1210 1.25 ± 0.15 2500 10000
FL 1210 1.40 ± 0.15 2000 8000
FO 1210 1.50 ± 0.20 2000 8000
FH 1210 1.55 ± 0.15 2000 8000
FP 1210 1.60 ± 0.20 2000 8000
FM 1210 1.70 ± 0.20 2000 8000
FJ 1210 1.85 ± 0.20 2000 8000
FN 1210 1.85 ± 0.20 2000 8000
FT 1210 1.90 ± 0.20 1500 4000
FK 1210 2.10 ± 0.20 2000 8000
FR 1210 2.25 ± 0.20 2000 8000
FS 1210 2.50 ± 0.20 1000 4000
FV 1210 3.35 ± 0.10 500 1800
FW 1210 6.15 ± 0.15 200 1000
PA 1220 0.80 ± 0.10 4000 10000
MA 1632 0.80 ± 0.10 4000 10000
NA 1706 0.90 ± 0.10 4000 10000
NB 1706 1.00 ± 0.10 4000 10000
NC 1706 1.00 ± 0.15 4000 10000
LD 1808 0.90 ± 0.10 2500 10000
LE 1808 1.00 ± 0.10 2500 10000
LF 1808 1.00 ± 0.15 2500 10000
LA 1808 1.40 ± 0.15 1000 4000
LB 1808 1.60 ± 0.15 1000 4000
LC 1808 2.00 ± 0.15 1000 4000
GB 1812 1.00 ± 0.10 1000 4000
GC 1812 1.10 ± 0.10 1000 4000
GD 1812 1.25 ± 0.15 1000 4000
GE 1812 1.30 ± 0.10 1000 4000
GH 1812 1.40 ± 0.15 1000 4000
GF 1812 1.50 ± 0.10 1000 4000
GG 1812 1.55 ± 0.10 1000 4000
GK 1812 1.60 ± 0.20 1000 4000
GJ 1812 1.70 ± 0.15 1000 4000
GN 1812 1.70 ± 0.20 1000 4000
GL 1812 1.90 ± 0.20 1000 4000
GM 1812 2.00 ± 0.20 1000 4000
GO 1812 2.50 ± 0.20 500 2000
GP 1812 2.65 ± 0.35 500 1400
GR 1812 5.00 ± 0.50 350 1000
HB 1825 1.10 ± 0.15 1000 4000
HC 1825 1.15 ± 0.15 1000 4000
HD 1825 1.30 ± 0.15 1000 4000
HE 1825 1.40 ± 0.15 1000 4000
HF 1825 1.50 ± 0.15 1000 4000
Thickness
Code
Chip
Size
Thickness ±
Range (mm)
QTY per Bulk
Cassette
Package Quantity
Based on Finished Chip
Thickness Specications
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1026_COTS_C0G • 6/6/2011 8
SMD MLCCs – Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10VDC-200VDC
Table 2 – Chip Thickness/Packaging Quantities con’t
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC-7351
EIA
Size
Code
Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C Y X V1 V2 C Y X V1 V2 C Y X V1 V2
01005 0402 0.33 0.46 0.43 1.60 0.90 0.28 0.36 0.33 1.30 0.70 0.23 0.26 0.23 1.00 0.50
0201 0603 0.38 0.56 0.52 1.80 1.00 0.33 0.46 0.42 1.50 0.80 0.28 0.36 0.32 1.20 0.60
0402 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80
0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20
0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70
1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00
1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90
1808 4520 2.30 1.75 2.30 7.40 3.30 2.20 1.55 2.20 6.50 2.70 2.10 1.35 2.10 5.80 2.40
1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70
1825 4564 2.15 1.60 6.90 6.90 7.9 0 2.05 1.40 6.80 6.00 7.30 1.95 1.20 6.70 5.30 7.00
2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60
2225 5664 2.70 1.70 6.90 8.10 7.90 2.60 1.50 6.80 7.20 7.3 0 2.50 1.30 6.70 6.50 7.0 0
Density Level A: For low-density Product applications. Recommended for wave solder applications and provides a wider process window for reow solder
processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualication
testing based on the conditions outlined in IPC standard 7351 (IPC-7351).
Thickness
Code
Chip
Size
Thickness ±
Range (mm)
QTY per Reel
7" Plastic
QTY per Reel
13" Plastic
QTY per Reel
7" Paper
QTY per Reel
13" Paper
QTY per Bulk
Cassette
HG 1825 1.60 ± 0.20 1000 4000
JB 2220 1.00 ± 0.15 1000 4000
JC 2220 1.10 ± 0.15 1000 4000
JD 2220 1.30 ± 0.15 1000 4000
JE 2220 1.40 ± 0.15 1000 4000
JF 2220 1.50 ± 0.15 1000 4000
JP 2220 1.60 ± 0.20 1000 4000
JG 2220 1.70 ± 0.15 1000 4000
JH 2220 1.80 ± 0.15 1000 4000
JO 2220 2.40 ± 0.15 500 2000
JP 2220 3.50 ± 0.30 250 850
JR 2220 5.00 ± 0.50 150 600
KB 2225 1.00 ± 0.15 1000 4000
KC 2225 1.10 ± 0.15 1000 4000
KD 2225 1.30 ± 0.15 1000 4000
KE 2225 1.40 ± 0.15 1000 4000
KF 2225 1.60 ± 0.20 1000 4000
Thickness
Code
Chip
Size
Thickness ±
Range (mm)
QTY per Bulk
Cassette
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1026_COTS_C0G • 6/6/2011 9
SMD MLCCs – Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10VDC-200VDC
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reow only
Recommended Soldering Prole:
• KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
Terminal Strength JIS-C-6429 Appendix 1, Note: Force of 1.8kg for 60 seconds.
Board Flex JIS-C-6429 Appendix 2, Note: 2mm (min) for all except 3mm for C0G.
Solderability J-STD-002
Magnication 50 X. Conditions:
a) Method B, 4 hours @ 155°C, dry heat @ 235°C
b) Method B @ 215°C category 3
c) Method D, category 3 @ 260°C
Temperature Cycling JESD22 Method JA-104 1000 Cycles (-55°C to +125°C), Measurement at 24 hours. +/- 2 hours after test conclusion.
Biased Humidity MIL-STD-202 Method 103
Load Humidity: 1000 hours 85°C/85%RH and Rated Voltage. Add 100K ohm resistor. Measurement
at 24 hours. +/- 2 hours after test conclusion.
Low Volt Humidity: 1000 hours 85°C/85%RH and 1.5V. Add 100K ohm resistor.
Measurement at 24 hours. +/- 2 hours after test conclusion.
Moisture Resistance MIL-STD-202 Method 106
t = 24 hours/cycle. Steps 7a & 7b not required. Unpowered.
Measurement at 24 hours. +/- 2 hours after test conclusion.
Thermal Shock MIL-STD-202 Method 107
-55°C/+125°C. Note: Number of cycles required-300, Maximum transfer time-20 seconds, Dwell
time-15 minutes. Air-Air.
High Temperature Life
MIL-STD-202 Method 108
/ EIA -198
1000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.
Storage Life MIL-STD-202 Method 108 150°C, 0VDC, for 1000 Hours.
Mechanical Shock MIL-STD-202 Method 213 Figure 1 of Method 213, Condition F.
Resistance to Solvents MIL-STD-202 Method 215 Add aqueous wash chemical - OKEM Clean or equivalent.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp, and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC, and maximum storage humidity not exceed
70% relative humidity. In addition, temperature uctuations should be minimized to avoid condensation on the parts, and atmospheres
should be free of chlorine and sulfur bearing compounds. For optimized solderability, chip stock should be used promptly, preferably
within 1.5 years of receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1026_COTS_C0G • 6/6/2011 10
SMD MLCCs – Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10VDC-200VDC
Tape & Reel Packaging Information
KEMET offers Multilayer Ceramic Chip Capacitors packaged in
8mm, 12mm and 16mm tape on 7" and 13" reels in accordance
with EIA standard 481. This packaging system is compatible with
all tape fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
Table 5 – Carrier Tape Con guration (mm)
EIA Case Size Tape size (W)* Pitch (P1)*
01005 - 0402 8 2
0603 - 1210 8 4
1805 - 1808 12 4
≥ 1812 12 8
KPS 1210 12 8
KPS 1812 & 2220 16 12
Array 0508 & 0612 8 4
*Refer to Figure 1 for W and P1 carrier tape reference locations.
*Refer to Table 6 for tolerance speci cations.
8mm, 12mm
or 16mm Carrier Tape
178mm (7.00")
or
330mm (13.00")
Anti-Static Reel
Embossed Plastic* or
Punched Paper Carrier.
Embossment or Punched Cavity
Anti-Static Cover Tape
(.10mm (.004") Max Thickness)
Chip and KPS Orientation in Pocket
(except 1825 Commercial, and 1825 & 2225 Military)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
KEMET
®
Bar Code Label
Sprocket Holes
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1026_COTS_C0G • 6/6/2011 11
SMD MLCCs – Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10VDC-200VDC
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0
D
1
Min.
Note 1 E1P0 P2
R Ref.
Note 2
S
1
Min.
Note 3 T Max. T1 Max.
8mm
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
1.0
(0.039)
1.75 ± 0.10
(0.069 ± 0.004)
4.0 ± 0.10
(0.157 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
25.0
(0.984)
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
12mm 1.5
(0.059)
30
(1.181)
16mm
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch
B
1
Max.
Note 4
E2 Min. F P1 T2 Max W Max A0,B0 & K0
8mm Single (4mm) 4.35
(0.171)
6.25
(0.246)
3.5 ± 0.05
(0.138 ± 0.002)
4.0 ± 0.10
(0.157 ± 0.004)
2.5
(0.098)
8.3
(0.327)
Note 512mm Single (4mm) &
Double (8mm)
8.2
(0.323)
10.25
(0.404)
5.5 ± 0.05
(0.217 ± 0.002)
8.0 ± 0.10
(0.315 ± 0.004)
4.6
(0.181)
12.3
(0.484)
16mm Triple (12mm) 12.1
(0.476)
14.25
(0.561)
5.5 ± 0.05
(0.217 ± 0.002)
8.0 ± 0.10
(0.315 ± 0.004)
4.6
(0.181)
16.3
(0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 5).
3. If S1<1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Document 481 paragraph 4.3 (b)).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity de ned by A0, B0 and K0 shall surround the component with suf cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12mm tapes and 10° maximum for 16mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8mm and 12mm wide tape and to 1.0mm maximum for 16mm tape (see Figure 4).
(e) for KPS Series product A0 and B0 are measured on a plane 0.3mm above the bottom of the pocket.
(f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.
Po
T
F
W
Center Lines of Cavity
Ao
Bo
User Direction of Unreeling
Cover Tape
Ko
B
1
is for tape feeder reference only,
including draft concentric about B
o
.
T
2
ØD
1
ØDo
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 5
[10 pitches cumulative
tolerance on tape ±0.2 mm]
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1026_COTS_C0G • 6/6/2011 12
SMD MLCCs – Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10VDC-200VDC
Figure 2 – Punched (Paper) Carrier Tape Dimensions
User Direction of Unreeling
Top Cover Tape
T
Center Lines of Cavity
P
1
ØDo Po
P
2
E
1
F
E
2
W
G
A
0
B
0
Cavity Size,
See
Note 1, Table 7
Bottom Cover Tape
T
1
T
1
Bottom Cover Tape
[10 pitches cumulative
tolerance on tape ±0.2 mm]
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0E1P0P2T1Max G Min
R Ref.
Note 2
8mm 1.5 +0.10-0.0
(0.059 +0.004, -0.0)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
0.10
(.004) Max.
0.75
(.030)
25
(.984)
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch E2 Min F P1 T Max W Max A0 B0
8mm Half (2mm) 6.25
(0.246)
3.5 ± 0.05
(0.138 ± 0.002)
2.0 ± 0.05
(0.079 ± 0.002)
1.1
(0.098)
8.3
(0.327)
Note 5
8mm Single (4mm)
4.0 ± 0.10
(0.157 ± 0.004)
8.3
(0.327)
1. The cavity de ned by A0, B0 and T shall surround the component with suf cient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 5).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1026_COTS_C0G • 6/6/2011 13
SMD MLCCs – Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10VDC-200VDC
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg Minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the
carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA-556 and EIA-624.
Figure 3 – Maximum Component Rotation
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Tape Maximum
Width (mm) Rotation (°
T)
8,12 20
16-200 10 Tape Maximum
Width (mm) Rotation ( °
S)
8,12 20
16-56 10
72-200 5
Typical Pocket Centerline
Typical Component Centerline
Figure 4 – Maximum Lateral Movement
0.5 mm maximum
0.5 mm maximum
8mm & 12mm Tape
1.0 mm maximum
1.0 mm maximum
16mm Tape
Figure 5 – Bending Radius
RR
Bending
Radius
Embossed
Carrier
Punched
Carrier
Tape Width Peel Strength
8mm 0.1 Newton to 1.0 Newton (10gf to 100gf)
12mm & 16mm 0.1 Newton to 1.3 Newton (10gf to 130gf)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1026_COTS_C0G • 6/6/2011 14
SMD MLCCs – Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10VDC-200VDC
Figure 6 – Reel Dimensions
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size A B Min C D Min
8mm 178 ± 0.20
(7.008 ± 0.008)
or
330 ± 0.20
(13.000 ± 0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12mm
16mm
Variable Dimensions — Millimeters (Inches)
Tape Size N Min W1 W2 Max W3
8mm
50
(1.969)
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
14.4
(0.567)
Shall accommodate tape width
without interference
12mm 12.4 +2.0/-0.0
(0.488 +0.078/-0.0)
18.4
(0.724)
16mm 16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
22.4
(0.882)
AD(See Note)
Full Radius,
See Note
B(see Note)
Access Hole at
Slot Location
(Ø 40 mm min.)
If present,
tape slot in core
for tape start:
2.5 mm min. width x
10.0 mm min. depth
W3(Includes
flange distortion
at outer edge)
W2(Measured at hub)
W1(Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1026_COTS_C0G • 6/6/2011 15
SMD MLCCs – Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10VDC-200VDC
Figure 7 – Tape Leader & Trailer Dimensions
Trailer
160 mm minimum,
Carrier Tape
END START
Round Sprocket Holes
Elongated Sprocket Holes
(32 mm tape and wider)
Top Cover Tape
Top Cover Tape
Punched Carrier
8 mm & 12 mm only
Embossed Carrier
Components
100 mm Min.
Leader
400 mm Minimum,
Figure 8 – Maximum Camber
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
Elongated sprocket holes
(32 mm & wider tapes)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1026_COTS_C0G • 6/6/2011 16
SMD MLCCs – Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10VDC-200VDC
Figure 9 – Bulk Cassette Packaging (Ceramic Chips Only)
Meets Dimensional Requirements IEC-286 and EIAJ 7201
Unit mm *Reference
Table 9 – Capacitor Dimensions for Bulk Cassette
Cassette Packaging – Millimeters
Table 10 – Capacitor Marking
Laser marking is available as an extra-cost option for most KEMET ceramic chips. Such marking is two sided, and includes a K to
identify KEMET, followed by two characters (per EIA-198) to identify the capacitance value. Note that marking is not available for any
Y5V chip. ln addition, the 0603 marking option is limited to the K only. (Marking Optional – Not Available for 0402 Size)
Example shown is 1,000 pF capacitor
EIA Size
Code
Metric Size
Code
L Length W Width B Bandwidth
S Separation
minimum
T Thickness
Number of
Pcs/Cassette
0402 1005 1.0 ± 0.05 0.5 ± 0.05 0.2 to 0.4 0.3 0.5 ± .05 50,000
0603 1608 1.6 ± 0.07 0.8 ± 0.07 0.2 to 0.5 0.7 0.8 ± .07 15,000
110 ± 0.7
31.5 ± 0
0.2
36 ± 0
0.2
19.0*
5 0*
10*
53 3*
68 ± 0.1
88 ± 0.1
12.0 ± 0.1
3.0 ± 0
0.2
2.0 ± 0.1
0
1.5 ± 0
0.1
Numeral
Alpha
Character
Capacitance (pF) For Various Numeral Identiers
9
0
1
2
3
4
5
6
7
A
0.1
1
10
100
1000
10000
100000
1000000
10000000
B
0.11
1.1
11
110
1100
11000
110000
1100000
11000000
C
0.12
1.2
12
120
1200
12000
120000
1200000
12000000
D
0.13
1.3
13
130
1300
13000
130000
1300000
13000000
E
0.15
1.5
15
150
1500
15000
150000
1500000
15000000
F
0.16
1.6
16
160
1600
16000
160000
1600000
16000000
G
0.18
1.8
18
180
1800
18000
180000
1800000
18000000
H
0.2
2
20
200
2000
20000
200000
2000000
20000000
J
0.22
2.2
22
220
2200
22000
220000
2200000
22000000
K
0.24
2.4
24
240
2400
24000
240000
2400000
24000000
L
0.27
2.7
27
270
2700
27000
270000
2700000
27000000
M
0.3
3
30
300
3000
30000
300000
3000000
30000000
N
0.33
3.3
33
330
3300
33000
330000
3300000
33000000
P
0.36
3.6
36
360
3600
36000
360000
3600000
36000000
Q
0.39
3.9
39
390
3900
39000
390000
3900000
39000000
R
0.43
4.3
43
430
4300
43000
430000
4300000
43000000
S
0.47
4.7
47
470
4700
47000
470000
4700000
47000000
T
0.51
5.1
51
510
5100
51000
510000
5100000
51000000
U
0.56
5.6
56
560
5600
56000
560000
5600000
56000000
V
0.62
6.2
62
620
6200
62000
620000
6200000
62000000
W
0.68
6.8
68
680
6800
68000
680000
6800000
68000000
X
0.75
7.5
75
750
7500
75000
750000
7500000
75000000
Y
0.82
8.2
82
820
8200
82000
820000
8200000
82000000
Z
0.91
9.1
91
910
9100
91000
910000
9100000
91000000
a
0.25
2.5
25
250
2500
25000
250000
2500000
25000000
b
0.35
3.5
35
350
3500
35000
350000
3500000
35000000
d
0.4
4
40
400
4000
40000
400000
4000000
40000000
e
0.45
4.5
45
450
4500
45000
450000
4500000
45000000
f
0.5
5
50
500
5000
50000
500000
5000000
50000000
m
0.6
6
60
600
6000
60000
600000
6000000
60000000
n
0.7
7
70
700
7000
70000
700000
7000000
70000000
t
0.8
8
80
800
8000
80000
800000
8000000
80000000
y
0.9
9
90
900
9000
90000
900000
9000000
90000000
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1026_COTS_C0G • 6/6/2011 17
SMD MLCCs – Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10VDC-200VDC
Other KEMET Resources
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speci cally disclaim – any warranty concerning suitability for a speci c customer application or use. This Information is intended for use only by customers who have the requisite
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use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained.
Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur.
Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or
redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.
Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not
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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1026_COTS_C0G • 6/6/2011 18
SMD MLCCs – Commercial Off-the-Shelf (COTS) for Higher Reliability Applications, C0G Dielectric, 10VDC-200VDC
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