Super-luminosity(AlGaInP)LED Lamp GL3Z402B0S series Viewing Angle: 40 (21/2) o3mm, Cylinder Type, Colorless Transparency Super-luminosity LED Lamps for Outdoor Use (Unit : mm) Colorless transparency 3.5 o3.8 o3.0 2.5 24.0MIN (1.0) (Tie-bar cut) 10.10.5 6.0 Protruded resin 0.8MAX Outline Dimensions GL3Z402B0S series (1.0) 2.54NOM 1 2 Pin connections 1 Anode 2 Cathode Unspecified tolerance:0.2 *Outline dimensions are reference value. 0.4 1.7 (Dimension from the center of o3mm) 0.4 Absolute Maximum Ratings (Ta=25C) Power dissipation Forward current Peak forward current Derating factor Reverse voltage Operating temperature Storage temperature Soldering temperature (mA/C) P IF IFM*1 VR Topr Tstg Model No. Radiation color Radiation material Tsol*2 (mW) (mA) (mA) (V) (C) (C) (C) DC Pulse A1GaInP on GaAs 130 50 100 0.67 GL3ZJ402B0S Orange 130 50 100 0.67 GL3ZS402B0S Sunset orange A1GaInP on GaAs A1GaInP on GaAs 130 50 100 0.67 GL3ZV402B0S Amber 130 50 100 0.67 GL3ZE402B0S Yellow-green A1GaInP on GaAs *1 Duty ratio=1/10, Pulse width=0.1ms *2 5s or less(At the position of 1.6mm or more from the bottom face of resin package) 1.33 1.33 1.33 1.33 5 5 5 5 -40 to +85 -40 to +85 -40 to +85 -40 to +85 -40 to +100 -40 to +100 -40 to +100 -40 to +100 Electro-optical Characteristics Lens type Model No. GL3ZJ402B0S Colorless GL3ZS402B0S transparency GL3ZV402B0S GL3ZE402B0S 20 Notice Internet Forward voltage VF(V) TYP 2.1 2.1 2.1 2.1 MAX 2.6 2.6 2.6 2.6 260 260 260 260 (IF=20mA,Ta=25C) Peak emission wavelength p(nm) TYP 627 609 591 570 Dominant wavelength d(nm) TYP 618 605 588 570 Luminous intensity IV(mcd) TYP 1 000 1 000 900 250 Spectrum radiation bandwidth (nm) TYP 15 15 15 15 Reverse current IR(A) MAX 100 100 100 100 VR (V) 4 4 4 4 Page for characteristics (MHZ) diagrams Terminal capacitance Ct(pF) TYP 60 60 60 60 1 1 1 1 142 143 144 144 In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/ General Description of Light Emitting Diodes ,, ,,,,, , , , , , (4) Installation to the case A Do not fix part A with adhesives when fixed to the case as shown in the figure. A hole of the case should be designed not Case to be smaller than the outside diameter of LED lamp resin. A: Lead Pin Type Lead Forming Method Avoid forming a lead pin with the lead pin base as a fulcrum: be sure to hold a lead pin firmly when forming. Lead pins should be formed before soldering. ,, ,,, Soldering Conditions Solder the lead pins under the following conditions. Type of Soldering 1. Manual soldering 2. Wave soldering Hold a lead pin firmly when forming 3. Reflow soldering Conditions 295C 5C, within 3 seconds 260C 5C, within 5 seconds Preheating 70C to 80C, within 30 seconds Soldering 245C 5C, within 5 seconds (Notes)Avoid dipping resin into soldering bath. Avoid applying stress to lead pins while they are heated. For example, when the LED lamp is moved with the heat applied to the lead pins during manual soldering or solder repair, disconnection may occur. Installation (1) Installation on a PWB When mounting an LED lamp on a PWB, do not apply physical stress to the lead pins. (Notes)The lead pin pitch should match the PWB pin-hole pitch: absolutely avoid widening or narrowing the lead pins. When positioning an LED lamp, basically employ an LED with tie-bar cut or use a spacer. Not acceptable , ,, , ,, ,, ,, , , ,,, , ,,, ,, , Not acceptable PWB Acceptable Soldering iron Cleaning (1) Solvents The package resin may be penetrated by solvents used in cleaning. Refer to the table below for usable solvents. ,, , , ,,, ,,,, ,, ,,, , , ,, ,, , Holder A (Notes)Pay attention to the thermal expansion coefficient of the material used for the B holder. Since the holder expands and contracts due to preheat and soldering heat, mechanical stress may be applied to the lead pins, resulting in disconnection. 4 Notice Internet Usable TM TM x x x TM : Acceptable x : Not acceptable (Notes)There is a world-wide movement to restrict the use of chrolofluorocarbon (CFC) based solvents and we recommend that you avoid their use. However, before using a CFC substitute solvent, carefully check that it will not penetrate the package resin. (2) Cleaning Methods Cleaning Method Solvent cleaning Ultrasonic cleaning Usable TM Remarks Immersion up to one minute at room temperature Test the cleaning under actual conditions and check for abnormalities before actual use. TM : Acceptable : Acceptability depends on device type and conditions (Notes)The affect on the device from ultrasonic cleaning differs depending on the size of the cleaning bath, ultrasonic output, duration, board size and device mounting method. Test the cleaning method under actual conditions and check for abnormalities before actual use. Cleaning with water is not allowed with the lead pins resin-tubulated: water may remain, thus causing rust to the lead pins. Please contact our representative before using a cleaning solvent or method not given above. v (3) Installation using a holder During an LED lamp positioning, in case of using a holder, holder A should be designed to be smaller than the inside diameter of lead pins. Holder B should be designed to be larger than the outside diameter of lead pins. Solvent Ethyl alcohol Isopropyl alcohol Chlorosen Acetone Trichloroethylene v (2) When an LED lamp is mounted directly on a PWB If the bottom face of an LED lamp is mounted directly on single-sided PWB, the base of the lead pins may be subjected to have physical stress due to PWB warp, cutting or clinching of lead pins. Prior to use, be sure to check that no disconnection inside of the resin or damage to resin etc., is found. 1.6A When an LED lamp is mounted on a doublesided PWB, the heat during soldering affects the resin; therefore, keep the LED lamp more than 1.6mm afloat above the PWB. Acceptable In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/ Tape-packaged Products General Description Sharp can supply tape-packaged LED lamps for automatic mounting. They will contribute to the high-efficiency mounting, high-precision, power saving. Please confirm before use because some products are not available in taping package. Taping specification(Unit : mm) P P Straight type LED Lamp Forming type F W WO W WO H HO H F DO DO PO PO Parameter Symbol A B D Parameter Symbol P W Case end height H*1 23.35 19.5 21.5 Case end height H*1 18.0 23.35 Lead clinch height HO 16.00.5 Lead clinch height HO ----- Tape width W 18.0 --0.5 13.00.3 Tape width W Adhesive tape width 18.0 --0.5 13.00.3 12.71 12.70.3 Sprocket hole pitch Adhesive tape width +1 WO Product pitch P Sprocket hole pitch PO Lead pitch +0.8 F Sprocket hole diameter Product pitch Lead pitch 5.0 --0.2 o4.00.2 DO Sprocket hole diameter *1. Tolerance : 1mm WO P PO F DO +1 12.71 12.70.3 2.54NOM o4.00.2 *1. Tolerance : 1mm P Dichromatic emission type WO W H F1 F2 DO PO Parameter Symbol Size (mm) 19.51.0 Case end height H*1 Lead clinch height HO Tape width W 18.0 --0.5 WO 13.00.3 12.71.0 12.70.3 Adhesive tape width Product pitch Sprocket hole pitch Lead pitch Sprocket hole diameter P PO F1 , F2 DO ---+1.0 2.54NOM o4.00.2 *1. Tolerance : 1mm Notice Internet In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/ 153 Application Circuits NOTICE The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). Contact a SHARP representative in advance when intending to use SHARP devices for any "specific" applications other than those recommended by SHARP or when it is unclear which category mentioned above controls the intended use. If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export such SHARP devices. This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. Contact and consult with a SHARP representative if there are any questions about the contents of this publication. 115 LED Lamp Characteristics Diagrams ZR series Forward Current Derating Curve Forward Current vs. Forward Voltage(Note) 60 Luminous Intensity vs. Ambient Temperature(Note) (Ta=25C) 100 (1F=20mA) 1000 50 500 40 30 20 Relative luminous intensity(%) Forward current IF(mA) Forward current IF(mA) 50 10 5.0 1.0 0.5 100 50 10 5.0 10 0 -40 0 25 50 75 85 100 0.1 1.0 125 1.0 1.2 1.4 Ambient temperature Ta(C) 1.6 1.8 2.0 2.2 2.4 2.6 -40 -20 Forward voltage VF(V) Luminous Intensity vs. Forward Current(Note) Peak Forward Current Derating Curve 20 40 60 80 100 Duty Ratio vs. Peak Forward Current (Ta=25C) 1000 120 0 Ambient temperature Ta(C) (Ta=25C) 500 500 200 200 80 60 40 Peak forward current IFM(mA) Relative luminous intensity(%) Peak forward current IFM(mA) 100 100 50 20 10 5.0 100 50 20 10 5.0 20 2.0 0 -40 0 25 50 75 85 100 1.0 0.1 125 2.0 1.0 0.2 0.5 1 2 5 10 20 50 1/50 1/20 1/10 Forward current IF(mA) Ambient temperature Ta(C) 1/5 1/2 1 Duty ratio DR ZJ series Forward Current Derating Curve Forward Current vs. Forward Voltage(Note) Luminous Intensity vs. Ambient Temperature(Note) (Ta=25C) 100 60 (1F=20mA) 1000 50 500 40 30 20 Relative luminous intensity(%) Forward current IF(mA) Forward current IF(mA) 50 10 5.0 1.0 0.5 100 50 10 5.0 10 0 -40 0 25 50 75 85 00 0.1 1.0 125 1.0 1.2 1.4 Ambient temperature Ta(C) 1.6 1.8 2.0 2.2 2.4 2.6 -40 -20 Forward voltage VF(V) Luminous Intensity vs. Forward Current(Note) Peak Forward Current Derating Curve 20 40 60 80 100 Duty Ratio vs. Peak Forward Current (Ta=25C) 1000 120 0 Ambient temperature Ta(C) (Ta=25C) 500 500 200 200 80 60 40 Peak forward current IF(mA) Relative luminous intensity(%) Peak forward current IFM(mA) 100 100 50 20 10 100 50 30 10 5.0 5.0 2.0 2.0 20 0 -40 0 25 50 75 85 Ambient temperature Ta(C) 100 125 1.0 0.1 1 0.2 0.5 1 2 5 10 20 Forward current IF(mA) 50 1/50 1/20 1/10 1/5 1/2 1 Duty ratio DR Note)Characteristics shown in diagrams are typical values. (not assurance value) 142 Notice Internet In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/ LED Lamp Characteristics Diagrams ZS series Forward Current Derating Curve Forward Current vs. Forward Voltage(Note) Luminous Intensity vs. Ambient Temperature(Note) (Ta=25C) 100 60 (1F=20mA) 1000 50 500 30 20 10 5.0 1.0 0.5 100 50 LED Lamp 40 Relative luminous intensity(%) Forward current IF(mA) Forward current IF(mA) 50 10 5.0 10 0 -25 0 25 50 75 85 100 0.1 1.0 125 1.0 1.2 1.4 Ambient temperature Ta(C) 1.6 1.8 2.0 2.2 2.4 2.6 -40 -20 Forward voltage VF(V) Luminous Intensity vs. Forward Current(Note) Peak Forward Current Derating Curve 20 40 60 80 100 Duty Ratio vs. Peak Forward Current (Ta=25C) 1000 120 0 Ambient temperature Ta(C) (Ta=25C) 500 500 200 200 80 60 40 Peak forward current IFM(mA) Relative luminous intensity(%) Peak forward current IFM(mA) 100 100 50 20 10 5.0 100 50 20 10 5.0 20 2.0 0 -40 0 25 50 75 85 100 1.0 0.1 125 2.0 1.0 0.2 0.5 1 2 5 10 20 50 1/50 1/20 1/10 Forward current IF(mA) Ambient temperature Ta(C) 1/5 1/2 1 Duty ratio DR GL5XS022BOS Forward Current vs. Forward Voltage(Note) Forward Current Derating Curve (Ta=25C) 100 60 Luminous Intensity vs. Ambient Temperature(Note) (IF=20mA) 1000 50 500 40 30 20 Relative luminous intensity(%) Forward current IF(mA) Forward current IF(mA) 50 10 5.0 1.0 0.5 100 50 10 5.0 10 0 -40 0 25 50 75 85 100 0.1 1.4 125 1.6 1.8 2.0 2.2 2.4 2.6 2.8 1.0 3.0 -40 -20 Forward voltage VF(V) Ambient temperature Ta(C) Peak Forward Current Derating Curve Luminous Intensity vs. Forward Current(Note) 120 0 20 40 60 80 100 Ambient temperature Ta(C) Duty Ratio vs. Peak Forward Current (Ta=25C) 1000 (Ta=25C) 1000 500 500 200 200 80 60 40 Peak forward current IFM(mA) Relative luminous intensity(%) Peak forward current IFM(mA) 100 100 50 20 10 5.0 100 50 20 10 5.0 20 2.0 0 -40 0 25 50 75 85 Ambient temperature Ta(C) 100 125 1.0 0.1 2.0 1.0 0.2 0.5 1 2 5 10 20 Forward current IF(mA) 50 100 1/50 1/20 1/10 1/5 1/2 1 10 Duty ratio DR Note)Characteristics shown in diagrams are typical values. (not assurance value) Notice Internet In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/ 143 LED Lamp Characteristics Diagrams ZV series Forward Current Derating Curve Forward Current vs. Forward Voltage(Note) 60 Luminous Intensity vs. Ambient Temperature(Note) (Ta=25C) 100 (1F=20mA) 1000 50 500 40 30 20 Relative luminous intensity(%) Forward current IF(mA) Forward current IF(mA) 50 10 5.0 1.0 0.5 100 50 10 5.0 10 0 -40 0 25 50 75 85 100 0.1 1.0 125 1.0 1.2 1.4 Ambient temperature Ta(C) 1.6 1.8 2.0 2.2 2.4 2.6 -40 -20 Forward voltage VF(V) Luminous Intensity vs. Forward Current(Note) Peak Forward Current Derating Curve 20 40 60 80 100 Duty Ratio vs. Peak Forward Current (Ta=25C) 1000 120 0 Ambient temperature Ta(C) (Ta=25C) 500 500 200 200 80 60 40 Peak forward current IF(mA) Relative luminous intensity(%) Peak forward current IFM(mA) 100 100 50 20 10 5.0 100 50 30 10 5.0 20 0 -40 0 25 50 75 85 100 125 2.0 20 1.0 0.1 1.0 0.2 0.5 1 2 5 10 20 50 1/50 1/20 1/10 Forward current IF(mA) Ambient temperature Ta(C) 1/5 1/2 1 Duty ratio DR ZE series Forward Current Derating Curve Forward Current vs. Forward Voltage(Note) 60 Luminous Intensity vs. Ambient Temperature(Note) (Ta=25C) 100 (1F=20mA) 1000 50 500 40 30 20 Relative luminous intensity(%) Forward current IF(mA) Forward current IF(mA) 50 10 5.0 1.0 0.5 100 50 10 5.0 10 0 -40 0 25 50 75 85 100 0.1 1.0 125 1.0 1.2 1.4 Ambient temperature Ta(C) 1.6 1.8 2.0 2.2 2.4 2.6 -40 -20 Forward voltage VF(V) Luminous Intensity vs. Forward Current(Note) Peak Forward Current Derating Curve 20 40 60 80 100 Duty Ratio vs. Peak Forward Current (Ta=25C) 1000 120 0 Ambient temperature Ta(C) (Ta=25C) 500 500 200 200 80 60 40 Peak forward current IFM(mA) Relative luminous intensity(%) Peak forward current IFM(mA) 100 100 50 20 10 5.0 100 50 20 10 5.0 20 2.0 0 -40 0 25 50 75 85 Ambient temperature Ta(C) 100 125 1.0 0.1 2.0 1.0 0.2 0.5 1 2 5 10 20 Forward current IF(mA) 50 1/50 1/20 1/10 1/5 1/2 1 Duty ratio DR Note)Characteristics shown in diagrams are typical values. (not assurance value) 144 Notice Internet In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/ Application Circuits NOTICE The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). Contact a SHARP representative in advance when intending to use SHARP devices for any "specific" applications other than those recommended by SHARP or when it is unclear which category mentioned above controls the intended use. If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export such SHARP devices. This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. Contact and consult with a SHARP representative if there are any questions about the contents of this publication. 115