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256 x 64 Graphic OLED
FEATURES
• Type: graphic
• Display format: 256 x 64 dots
• Built-in controller: SSD1322
• Duty cycle: 1/64
• +3 V power supply
• Interface: 6800, 8000, and SPI
• With polarizer
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Notes
(1) All the above voltages are on the basis of “VSS = 0 V”.
(2) When this module is used beyond the above absolute maximum
ratings, permanent breakage of the module may occur. Also, for
normal operations, it is desirable to use this module under the
conditions according to section 6 “Electrical Characteristics”. If
this module is used beyond these conditions, malfunctioning of
the module can occur and the reliability of the module may
deteriorate.
Note
(1) Supply voltage for logic = VDD core power supply can be regulated from VCI.
SSD1322
MECHANICAL DATA
ITEM STANDARD VALUE UNIT
Module dimension 88.0 x 27.8 x 2.05
mm
Viewing area 78.78 x 21.18
Active area 76.778 x 19.178
Dot size 0.278 x 0.278
Dot pitch 0.3 x 0.3
Mounting hole n/a
ABSOLUTE MAXIMUM RATINGS
ITEM SYMBOL STANDARD VALUE UNIT
MIN. MAX.
Supply voltage
for operation (1)(2) VCI -0.3 4
V
Supply voltage
for logic (1)(2) VDD -0.5 2.75
Supply voltage
for I/O pins (1)(2) VDDI/O -0.5 VCI
Supply voltage
for display (1)(2) VCC -0.5 20
Operating temperature TOP -40 +80 °C
Storage temperature TSTG -40 +80
ELECTRICAL CHARACTERISTICS
ITEM SYMBOL CONDITION STANDARD VALUE UNIT
MIN. TYP. MAX.
Supply voltage for logic VCI (1) 2.8 3.0 3.3
V
Supply voltage for display VCC - 101215
Input high voltage VIH - 0.8 VDDI/O -V
DDI/O
Input low voltage VIL - 0 - 0.2 VDDI/O
Output high voltage VOH - 0.9 VDDI/O -V
DDI/O
Output low voltage VOL - 0 - 0.1 VDDI/O
50 % check board operating current IDD VCC = 12.0 V 22 24 27 mA
CIEx (white) (CIE 1931) 0.26 0.28 0.30
CIEy (white) (CIE 1931) 0.30 0.32 0.34
OPTIONS
EMITTING COLOR MOQ
YELLOW GREEN RED BLUE WHITE YELLOW GREEN RED BLUE WHITE
-Yes----Yes---
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INTERFACE PIN FUNCTION
PIN NO. SYMBOL I/O FUNCTION
POWER SUPPLY
26 VCI P
Power supply for operation
This is a voltage supply pin. It must be connected to external source and always be equal to or higher
than VDD and VDDI/O.
25 VDD P
Power supply for core logic circuit
This is a voltage supply pin. It can be supplied externally (within the range of 2.4 V to 2.6 V) or regulated
internally from VCI. A capacitor should be connected between this pin and VSS under all circumstances.
24 VDDI/O P
Power supply for I/O pin
This pin is a power supply pin of I/O buffer. It should be connected to VDD or external source. All
I/O signal should have VIH reference to VDDI/O. When I/O signal pins (BS0 to BS1, D0 to D7, control
signals…) pull high, they should be connected to VDDI/O.
2V
SS P
Ground of logic circuit
This is a ground pin. It also acts as a reference for the logic pins. It must be connected to external
ground.
3, 29 VCC PPower supply for OLED panel
These are the most positive voltage supply pin of the chip. They must be connected to external source.
5, 28 VLSS PGround of analog circuit
These are the analog ground pins. They should be connected to VSS externally.
DRIVER
22 IREF I
Current reference for brightness adjustment
This pin is segment current reference pin. A resistor should be connected between this pin and VSS.
Set the current lower than 10 μA.
4V
COMH P
Voltage output high level for COM signal
This pin is the input pin for the voltage output high level for COM signals. A tantalum capacitor should
be connected between this pin and VSS.
27 VSL P
Voltage output low level for SEG signal
This is segment voltage reference pin. When external VSL is not used, this pin should be left open. When
external VSL is used, this pin should connect with resistor and diode to ground.
TESTING PADS
21 FR O
Frame frequency triggering signal
This pin will send out a signal that could be used to identify the driver status. Nothing should be
connected to this pin. It should be left open individually.
16 BS0
I
Communicating protocol select
These pins are MCU interface selection input. See the following table:
3-wire SPI 4-wire SPI 8-bit 68XX parallel 8-bit 80XX parallel
17 BS1
BS0 1 0 1 0
BS1 0 0 1 1
20 RES# I Power reset for controller and driver
This pin is reset signal input. When the pin is low, initialization of the chip is executed.
19 CS# I
Chip select
This pin is the chip select input. The chip is enabled for MCU communication only when CS# is pulled
low.
18 D / C# I
Data / command control
This pin is data / command control pin. When the pin is pulled high, the input at D7 to D0 is treated as
display data. When the pin is pulled low, the input at D7 to D0 will be transferred to the command
register. For detail relationship to MCU interface signals, please refer to the timing characteristics
diagrams.
14 E / RD# I
Read / write enable or read
This pin is MCU interface input. When interfacing to a 68XX-series microprocessor, this pin will be used
as the enable (E) signal. Read / write operation is initiated when this pin is pulled high and the CS# is
pulled low. When connecting to an 80XX microprocessor, this pin receives the read (RD#) signal. Data
read operation is initiated when this pin is pulled low and CS# is pulled low. When serial mode is
selected, this pin must be connected to VSS.
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15 R / W# I
Read / write select or write
This pin is MCU interface input. When interfacing to a 68XX-series microprocessor, this pin will be used
as read / write (R / W#) selection input. Pull this pin to “high” for read mode and pull it to “low” for write
mode. When 80XX interface mode is selected, this pin will be the write (WR#) input. Data write operation
is initiated when this pin is pulled low and the CS# is pulled low. When serial mode is selected, this pin
must be connected to VSS.
6 to 13 D7 to D0 I/O
Host data input / output bus
These pins are 8-bit bi-directional data bus to be connected to the microprocessor’s data bus. When
serial mode is selected, D1 will be the serial data input SDIN and D0 will be the serial clock input SCLK.
Unused pins must be connected to VSS except for D2 in serial mode.
RESERVE
23 NC - Reserved pin
The NC pin between function pins are reserved for compatible and flexible design.
1, 30 NC
(GND) -
Reserved pin (supporting pin)
The supporting pins can reduce the influences from stresses on the function pins. These pins must be
connected to external ground.
DIMENSIONS in millimeters
INTERFACE PIN FUNCTION
PIN NO. SYMBOL I/O FUNCTION
19.7 ± 0.3
11.01
9.2
8.7
4.36
3.0
14.0 60.0 ± 0.2
40.0 ± 0.1
P 0.5 x 29 = 14.5
0.3
2 x R 0.5 ± 0.05
1 30
SSD1322
88.0 ± 0.3 (panel size)
88.0 ± 0.3 (cap size)
0.5 ± 0.5 87.0 ± 0.3 (polarizer)
4.61 78.78 (VA)
5.61 76.778 (AA)
27.8 ± 0.3 (panel size)
25.8 (cap size)
0.5 ± 0.5
24.8 ± 0.3 (polarizer)
2.0
21.18 (VA)
3.0
19.178 (AA)
Active area 3.12"
256 x 64 pixels
2.05
0.3 ± 0.05
Contact side
Stiffener
4.0
0.8 max.
Remove tape
T = 0.15 max.
Polarizer
0.7
1.1
4.0
15.50
The non-specied tolerance of dimension is ± 0.3 mm.
DOT SIZE
SCALE 30/1
0.278
0.3
0.278
0.3
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1.Module Classification Information
OLED -256 Y 064 B W P P 3 N 0 0 000
1 2 3 4 5 6 7 8 9 10 11 12 13
1 Brand烉Vishay Intertechnology, Inc.
2 Horizontal Format: 256 columns
3 Display Type烉NĺCharacter Type, HĺGraphic Type, YĺTab Type ,OĺCOG Type
4 Vertical format: 64 rows (lines)
5 Series code: B
6 Emitting Color
A烉R rebmA 烉RED
B烉W eulB 烉White
G烉L neerG 烉Yellow
S烉Sky Blue
7 Polarizer P烉With Polarizer; N: Without Polarizer
8 Display Mode P烉Passive Matrix ; A: Active Matrix
9 Driver Voltage 3: 3.0 V; 5: 5.0V
10 Touch Panel N烉Without touch panel; T: With touch panel
11 Product type
0烉Standard type
1. Sunlight Readable type
2. Transparent OLED (TOLED)
3. Flexible OLED
4. OLED for Lighting
12 Product grade
Product grades:
0烉Standard(A-level)
2烉B-level
3烉C-level
4烉high class(AA-level)
5烉Customer offerings
13 Serial No. Application serial number(000~ZZZ)
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2.General Specification
tinU noisnemiD metI
stoD 46 x 652 xirtaM toD ˉ
Module dimension 88.0 × 27.8 × 2.05 mm
Active Area 76.778h19.178 mm
Pixel Size 0.278h0.278 mm
Pixel Pitch 0.3h0.3 mm
xirtaM evissaP edoM yalpsiD
etihW roloC yalpsiD
ytuD 46/1 ytuD evirD
2231DSS CI
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3. Contour Drawing & Block Diagram
E/RD#
VSS
VCC
VCOMH
VLSS
2
3
5
6
4
D6
D5
D4
D3
9
8
10
11
7
D7
1NC(GND)
D1
D013
14
12
D2
15
16
18
19
17
20
21
22
23
24
26
27
25
28
29
30
R/W#
BS1
DC#
CS#
RES#
BS0
IREF
NC
FR
VDDIO
VDD
VSL
VLSS
VCI
VCC
NC(GND)
130
19.7±0.3
11.01
9.2
8.7
4.36
3.0
14.0 60.0±0.2
40.0±0.1
P0.5*29=14.5
0.3 2-R0.5±0.05
130
SSD1322
88.0±0.3(Panel Size)
88.0±0.3(Cap Size)
0.5±0.5 87.0±0.3(Polarizer)
4.61 78.78(VA)
5.61 76.778(AA)
27.8±0.3(Panel Size)
25.8(Cap Size)
0.5±0.5
24.8±0.3(Polarizer)
2.0
21.18(VA)
3.0
19.178(AA)
Active Area 3.12"
256*64 Pixels
2.05
0.3±0.05
Contact Side
Stiffener
4.0
0.8MAX
REMOVE TAPE
T=0.15Max
Polarizer
0.7
1.1
4.0
15.50
The non-specified tolerance of dimension is 0.3mm.
DOT SIZE
SCALE 30/1
0.278
0.3
0.278
0.3
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FUNCTION BLOCK DIAGRAM
*For more information, please refer to the SSD1322 datasheet.
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4. Interface Pin Function
Pin
Number
Symbol I/O Function
Power Supply
26 VCI
P Power Supply for Operation
This is a voltage supply pin. It must be connected to
external source & always be equal to or higher than VDD
& VDDIO.
25 VDD
P Power Supply for Core Logic Circuit
This is a voltage supply pin. It can be supplied externally (within
the range of 2.4~2.6V) or regulated internally from VCI. A
capacitor should be connected between this pin & VSS under
all circumstances.
24 VDDIO
P Power Supply for I/O Pin
This pin is a power supply pin of I/O buffer. It should be
connected to VDD or external source. All I/O signal should have
VIH reference to VDDIO. When I/O signal pins (BS0~BS1,
D0~D7, control signals…) pull high, they should be connected
to VDDIO.
2 VSS
P Ground of Logic Circuit
This is a ground pin. It also acts as a reference for the logic
pins. It must be connected to external ground.
3,29 VCC
P Power Supply for OLED Panel
These are the most positive voltage supply pin of the chip. They
must be connected to external source.
5,28 VLSS
P Ground of Analog Circuit
These are the analog ground pins. They should be connected
to VSS externally.
Driver
22 IREF
I Current Reference for Brightness Adjustment
This pin is segment current reference pin. A resistor should be
connected between this pin and VSS. Set the current lower
than 10uA.
4 VCOMH
P Voltage Output High Level for COM Signal
This pin is the input pin for the voltage output high level for
COM signals. A tantalum capacitor should be connected
between this pin and VSS.
27 VSL
P Voltage Output Low Level for SEG Signal
This is segment voltage reference pin.
When external VSL is not used, this pin should be left open.
When external VSL is used, this pin should connect with
resistor and diode to ground.
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Testing Pads
21 FR
O Frame Frequency Triggering Signal
This pin will send out a signal that could be used to identify the
driver status. Nothing should be connected to this pin. It should
be left open individually.
16 BS0
I Communicating Protocol Select
These pins are MCU interface selection input. See the following
table:
17 BS1
20 RES#
I Power Reset for Controller and Driver
This pin is reset signal input. When the pin is low, initialization
of the chip is executed.
19 CS#
I Chip Select
This pin is the chip select input. The chip is enabled for MCU
communication only when CS# is pulled low.
18 D/C#
I Data/Command Control
This pin is Data/Command control pin. When the pin is pulled
high, the input at D7~D0 is treated as display data.
When the pin is pulled low, the input at D7~D0 will be
transferred to the command register. For detail relationship to
MCU interface signals, please refer to the
Timing Characteristics Diagrams.
14 E/RD#
I Read/Write Enable or Read
This pin is MCU interface input. When interfacing to a
68XX-series microprocessor, this pin will be used as the
Enable (E) signal. Read/write operation is initiated when this
pin is pulled high and the CS# is pulled low.
When connecting to an 80XX-microprocessor, this pin receives
the Read (RD#) signal. Data read operation is initiated when
this pin is pulled low and CS# is pulled low.
When serial mode is selected, this pin must be connected to
VSS.
15 R/W#
I Read/Write Select or Write
This pin is MCU interface input. When interfacing to a
68XX-series microprocessor, this pin will be used as
Read/Write (R/W#) selection input. Pull this pin to “High” for
read mode and pull it to “Low” for write mode.
When 80XX interface mode is selected, this pin will be the
Write (WR#) input. Data write operation is initiated when this
pin is pulled low and the CS# is pulled low.
When serial mode is selected, this pin must be connected to
VSS.
6~13 D7~D0
I/O Host Data Input/Output Bus
These pins are 8-bit bi-directional data bus to be connected to
the microprocessor’s data bus. When serial mode is selected,
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D1 will be the serial data input SDIN and D0 will be the serial
clock input SCLK.
Unused pins must be connected to VSS except for D2 in serial
mode.
Reserve
23 N.C.
- Reserved Pin
The N.C. pin between function pins are reserved for compatible
and flexible design.
1,30 N.C.
(GND)
- Reserved Pin (Supporting Pin)
The supporting pins can reduce the influences from stresses
on the function pins. These pins must be connected to external
ground.
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5.Absolute Maximum Ratings
Parameter Symbol Min Max Unit Notes
Supply Voltage for
Operation VCI -0.3 4 V 1, 2
Supply Voltage for Logic VDD -0.5 2.75 V 1, 2
Supply Voltage for I/O Pins VDDIO -0.5 VCI V 1, 2
Supply Voltage for Display VCC -0.5 20 V 1, 2
Operating Temperature TOP -40 80 °C -
Storage Temperature TSTG -40 80 °C -
Note 1: All the above voltages are on the basis of “VSS = 0V”.
Note 2: When this module is used beyond the above absolute maximum ratings, permanent
breakage of the module may occur. Also, for normal operations, it is desirable to use this
module under the conditions according to Section 6 ‘’Electrical Characteristics’’. If this module
is used beyond these conditions, malfunctioning of the module can occur and the reliability of
the module may deteriorate
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6.Electrical Characteristics
Item Symbol Condition Min Typ Max Unit
Supply Voltage for
Operation VCI Note 2.8 3.0 3.3
V
Supply Voltage for Display VCC 炼 10 12 15 V
High Level Input VIH 炼 0.8×VDDIO 炼 VDDIO V
Low Level Input VIL 炼 0 炼 0.2×VDDIO V
High Level Output VOH 炼 0.9×VDDIO 炼 VDDIO V
Low Level Output VOL 炼 0 炼 0.1×VDDIO V
50% Check Board operating Current VCC =12.0V 22 24 27 mA
Note: Supply Voltage for Logic = VDD core power supply can be regulated from VCI.
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7.Optical Characteristics
Item Symbol Condition Min Typ Max Unit
View Angle
(V)ș ged 061
(H)ij ged 061
Contrast Ratio CR Dark 2000:1 炼 炼
Response Time
T rise 炼 10 ȝs
T fall 炼 10 ȝs
Display with 50% check Board Brightness 60 80 cd/m2
CIEx(White) (CIE1931) 0.26 0.28 0.30
CIEy(White) (CIE1931) 0.30 0.32 0.34
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8.OLED Lifetime
krameR pyT niM snoitidnoC METI
Operating
Life Time
Ta=25 ɗ
/ Initial 50% check board
brightness Typical Value
20,000 Hrs 炼 Note
Notes:
1. Life time is defined the amount of time when the luminance has decayed to <50% of the
initial value.
2. This analysis method uses life data obtained under accelerated conditions to extrapolate
an estimated probability density function (pdf) for the product under normal use conditions.
3. Screen-saver strategies will extend OLED lifetime.
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9.Reliability
Content of Reliability Test
Environmental Test
noitidnoC tseT tseT fo tnetnoC metI tseT Applicable
Standard
High
Temperature
storage
Endurance test applying the high
storage temperature for a long time. 240hrs ——
Low
Temperature
storage
Endurance test applying the low storage
temperature for a long time. 240hrs ——
High
Temperature
Operation
Endurance test applying the electric
stress (Voltage & Current) and the
thermal stress to the element for a long
time.
240hrs ——
Low
Temperature
Operation
Endurance test applying the electric
stress under low temperature for a long
time. 240hrs ——
High
Temperature/
Humidity
Storage
Endurance test applying the high
temperature and high humidity storage
for a long time. 240hrs ——
Temperature
Cycle
Endurance test applying the low and
high temperature cycle.
30min 5min 30min
1 cycle
100 cycles ——
Mechanical Test
Vibration test Endurance test applying the vibration
during transportation and using.
10~22Hzĺ1.5mmp-p
22~500Hzĺ1.5G
Tota l 0.5 h r
——
Shock test
Constructional and mechanical
endurance test applying the shock
during transportation.
50G Half sin
wave 11 ms
3 times of each
direction
——
Atmospheric
pressure test
Endurance test applying the
atmospheric pressure during
transportation by air.
115mbar
40hrs ——
Others
Static
electricity test
Endurance test applying the electric
stress to the terminal.
VS=800V,RS=1.5k
CS=100pF
1 time
——
*** Supply voltage for OLED system =Operating voltage at 25ɗ
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10.Inspection Specification
LQA noiretirC metI ON
01 Electrical
Testin g
1.1 Missing vertical, horizontal segment, segment contrast
defect.
1.2 Missing character, dot or icon.
1.3 Display malfunction.
1.4 No function or no display.
1.5 Current consumption exceeds product specifications.
1.6 OLED viewing angle defect.
1.7 Mixed product types.
1.8 Contrast defect.
0.65
02 Black or
white
spots on
OLED
(display
only)
2.1 White and black spots on display 䵐
0.25mm, no more than
three white or black spots present.
2.2 Densely spaced: No more than two spots or lines within
3mm. 2.5
03 OLED
black
spots,
white
spots,
contamina
tion
(non-displ
ay)
3.1 Round type : As
following drawing
ĭ=( x + y ) / 2
SIZE Acceptable Q
TY
ĭʀ0.10 Accept no
dense
0.10烋
ĭʀ0.20
2
0.20烋
ĭʀ0.25
1
0.25烋ĭ 0
2.5
3.2 Line type : (As following drawing)
Length Width Acceptable Q TY
--- Wʀ0.02 Accept no dense
Lʀ3.0 0.02烋Wʀ0.03 2
Lʀ2.5 0.03烋Wʀ0.05
--- 0.05烋W As round type
2.5
04 Polarizer
bubbles
If bubbles are visible,
judge using black spot
specifications, not easy
to find, must check in
specify direction.
Size ĭ Acceptable Q TY
ĭʀ0.20 Accept no dense
0.20烋ĭʀ0.50 3
0.50烋ĭʀ1.00 2
1.00烋ĭ 0
Tota l Q TY 3
2.5
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Revision: 13-Oct-16 18 Document Number: 37964
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LQA noiretirC metI ON
05 Scratches Follow NO.3 OLED black spots, white spots, contamination
06 Chipped
glass
Symbols Define:
x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: OLED side length
L: Electrode pad length:
6.1 General glass chip :
6.1.1 Chip on panel surface and crack between panels:
z: Chip thickness y: Chip width x: Chip length
Zʀ1/2t Not over viewing
area
xʀ1/8a
1/2t烋zʀ2t Not exceed 1/3k xʀ1/8a
˞If there are 2 or more chips, x is total length of each chip.
6.1.2 Corner crack:
z: Chip thickness y: Chip width x: Chip length
Zʀ1/2t Not over viewing
area
xʀ1/8a
1/2t烋zʀ2t Not exceed 1/3k xʀ1/8a
˞If there are 2 or more chips, x is the total length of each chip.
2.5
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Revision: 13-Oct-16 19 Document Number: 37964
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NO Item Criterion AQL
06 Glass
crack
Symbols :
x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: OLED side length
L: Electrode pad length
6.2 Protrusion over terminal :
6.2.1 Chip on electrode pad :
y: Chip width x: Chip length z: Chip thickness
yʀ0.5mm xʀ1/8a 0 烋 z ʀ t
6.2.2 Non-conductive portion:
y: Chip width x: Chip length z: Chip
thickness
yʀ L xʀ1/8a 0 烋 z ʀ t
˞If the chipped area touches the ITO terminal, over 2/3 of the ITO
must remain and be inspected according to electrode terminal
specifications.
˞If the product will be heat sealed by the customer, the alignment
mark not be damaged.
6.2.3 Substrate protuberance and internal crack.
y: width x: length
yʀ1/3L x ʀ a
2.5
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Revision: 13-Oct-16 20 Document Number: 37964
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uvG Item Criterion AQL
W^G Cracked
glass The OLED with extensive crack is not acceptable. 2.5
W_G Backlight
elements
8.1 Illumination source flickers when lit.
8.2 Spots or scratched that appear when lit must be judged.
Using OLED spot, lines and contamination standards.
8.3 Backlight doesn’t light or color wrong.
0.65
2.5
0.65
W`G Bezel
9.1 Bezel may not have rust, be deformed or have
fingerprints, stains or other contamination.
9.2 Bezel must comply with job specifications.
2.5
0.65
XWG PCBૠCOB
10.1 COB seal may not have pinholes larger than 0.2mm or
contamination.
10.2 COB seal surface may not have pinholes through to the
IC.
10.3 The height of the COB should not exceed the height
indicated in the assembly diagram.
10.4 There may not be more than 2mm of sealant outside the
seal area on the PCB. And there should be no more than
three places.
10.5 No oxidation or contamination PCB terminals.
10.6 Parts on PCB must be the same as on the production
characteristic chart. There should be no wrong parts,
missing parts or excess parts.
10.7 The jumper on the PCB should conform to the product
characteristic chart.
10.8 If solder gets on bezel tab pads, OLED pad, zebra pad
or screw hold pad, make sure it is smoothed down.
2.5
2.5
0.65
2.5
2.5
0.65
0.65
2.5
XXG Soldering
11.1 No un-melted solder paste may be present on the PCB.
11.2 No cold solder joints, missing solder connections,
oxidation or icicle.
11.3 No residue or solder balls on PCB.
11.4 No short circuits in components on PCB.
2.5
2.5
2.5
0.65
G
G
G
G
OLED-256Y064B-WPP3N00000
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Revision: 13-Oct-16 21 Document Number: 37964
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NO Item Criterion AQL
12 General
appearance
12.1 No oxidation, contamination, curves or, bends on
interface Pin (OLB) of TCP.
12.2 No cracks on interface pin (OLB) of TCP.
12.3 No contamination, solder residue or solder balls on
product.
12.4 The IC on the TCP may not be damaged, circuits.
12.5 The uppermost edge of the protective strip on the
interface pin must be present or look as if it cause the
interface pin to sever.
12.6 The residual rosin or tin oil of soldering (component or
chip component) is not burned into brown or black color.
12.7 Sealant on top of the ITO circuit has not hardened.
12.8 Pin type must match type in specification sheet.
12.9 OLED pin loose or missing pins.
12.10 Product packaging must the same as specified on
packaging specification sheet.
12.11 Product dimension and structure must conform to
product specification sheet.
2.5
0.65
2.5
2.5
2.5
2.5
2.5
0.65
0.65
0.65
0.65
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
OLED-256Y064B-WPP3N00000
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Revision: 13-Oct-16 22 Document Number: 37964
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Check Item Classification Criteria
No Display Major
Missing Line Major
Pixel Short Major
Darker Short Major
Wrong Display Major
Un-uniform
B/A x 100% < 70%
A/C x 100% < 70%
Major
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11.Precautions in Use of OLED Modules
Modules
(1)Avoid applying excessive shocks to module or making any alterations or modifications to it.
(2)Don’t make extra holes on the printed circuit board, modify its shape or change the
components of OLED display module.
(3)Don’t disassemble the OLED display module.
(4)Don’t operate it above the absolute maximum rating.
(5)Don’t drop, bend or twist OLED display module.
(6)Soldering: only to the I/O terminals.
(7)Storage: please store in anti-static electricity container and clean environment.
(8)Use a "Screen Saver" to extend the lifetime. Do not show fixed information for a long time in
the application.
(9)Don't use fixed information in OLED panel for long time that will cause "screen burn" effect.
(10)The manufacturer has the right to change the passive components, including R2and R3
adjust resistors. (Resistors, capacitors and other passive components will have different
appearance and color caused by the different supplier.)
(11)The manufacturer has the right to change the PCB Rev. (In order to satisfy supply stability,
management optimization, and the best product performance..., under the premise of not
affecting the electrical characteristics and external dimensions. The manufacturer has the right
to modify the version.)
11.1. Handling Precautions
(1) Since the display panel is made of glass, do not apply mechanical impacts such us dropping
from a high position.
(2) If the display panel is broken by some accident and the internal organic substance leaks out,
be careful not to inhale or ingest the organic substance.
(3) If pressure is applied to the display surface or its neighborhood of the OLED display module,
the cell structure may be damaged, be careful not to apply pressure to these sections.
(4) The polarizer covering the surface of the OLED display module is soft and easily scratched.
Please be careful when handling the OLED display module.
(5) When the surface of the polarizer of the OLED display module has soil, clean the surface. It
takes advantage of by using following adhesion tape.
* Scotch Mending Tape No. 810 or an equivalent
Never try to breathe upon the soiled surface or wipe the surface using cloth containing solvent
such as ethyl alcohol, since the surface of the polarizer will become cloudy.
Also, pay attention that the following liquid and solvents can damage the polarizer:
* Water
* Ketone
* Aromatic Solvents
(6) Hold OLED display module very carefully when placing OLED display module into the
system housing. Do not apply excessive stress or pressure to OLED display module. And, do
not over bend the film with electrode pattern layouts.
These stresses will influence the display performance. Also, secure sufficient rigidity for the
outer cases.
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(7) Do not apply stress to the LSI chips and the surrounding molded sections.
(8) Do not disassemble or modify the OLED display module.
(9) Do not apply input signals while the logic power is off.
(10) Pay sufficient attention to the working environments when handing OLED display
modules to prevent occurrence of element breakage accidents by static electricity.
* Be sure to make human body grounding when handling OLED display modules.
* Be sure to ground tools to use or assembly such as soldering irons.
* To suppress generation of static electricity, avoid carrying out assembly work under dry
environments.
* Protective film is being applied to the surface of the display panel of the OLED display
module. Be careful since static electricity may be generated when removing the protective
film.
(11) Protective film is applied to the surface of the display panel. Remove the
protective film before assembly. If the OLED display module has been stored
for a long period of time, residue adhesive material from the protective film may remain on the
surface of the display panel after the film is removed. In such case, remove the residue
material by the method introduced in the above Section 5.
(12) If electric current is applied when the OLED display module has moisture condensation or
when it is placed under high humidity environments, the electrodes may corrode.
11.2. Storage Precautions
(1) When storing OLED display modules, put them in static electricity preventive bags
avoiding exposure to direct sun light and fluorescent lamps. Avoid high temperature and high
humidity environment or low temperature (less than 0°C) environments.
(We recommend storing these modules in the packaged state as they were shipped.)
At that time, be careful not to let water drops adhere to the packages or bags or let condensation
occur with them.
(2) If electric current is applied when condensation is present or when it is placed under
high humidity environments, the electrodes may corrode.
11.3. Designing Precautions
(1) The absolute maximum ratings are the ratings which cannot be exceeded for OLED
display module, and if these values are exceeded, panel damage may be happen.
(2) To prevent occurrence of malfunctioning by noise, pay attention to satisfy the VIL and VIH
specifications and, at the same time, to make the signal line cable as short as possible.
(3) We recommend you to install excess current preventive unit (fuses, etc.) to the power
circuit (VDD). (Recommend value: 0.5A)
(4) Pay sufficient attention to avoid occurrence of mutual noise interference with the
neighboring devices.
(5) For EMI, take necessary measures in the application equipment.
(6) When fastening the OLED display module, fasten the external plastic housing section.
(7) If power supply to the OLED display module is forcibly shut down by such errors as taking
out the main battery while the OLED display panel is in operation, we cannot guarantee the
quality of this OLED display module.
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* Connection (contact) to any other potential than the above may lead to rupture of
the IC.11.4.
Precautions when disposing of the OLED display modules
1) Request the qualified companies to handle industrial wastes when disposing of the OLED
display modules. Or, when burning them, be sure to observe the environmental and hygienic
laws and regulations.
11.5. Other Precautions
(1) When an OLED display module is operated for a long time with a fixed pattern, the pattern
may remain as an after image with slight contrast or brightness variation.
Nonetheless, if the operation is interrupted and left unused for a while, normal state can be
restored. Also, there will be no problem in the reliability of the module.
(2) To protect OLED display modules from performance drops by static electricity rapture, etc.,
do not touch the following sections whenever possible while handling the OLED display
modules.
* Pins and electrodes
* Pattern layouts such as the TCP & FPC
(3) With this OLED display module, the OLED driver is exposed. Generally, semiconductor
elements change their characteristics when exposed to light, similar to the principle of the solar
battery. Consequently, if this OLED driver is exposed to light, malfunctioning may occur.
* Design the product and installation method so that the OLED driver may be shielded from light
in actual usage.
* Design the product and installation method so that the OLED driver may be shielded from light
during the inspection processes.
(4) Although this OLED display module stores the operational state data by the commands and
the indication data, when excessive external noise, etc. enters into the module, the internal
states may be changed. It therefore is necessary to take appropriate measures to suppress
noise generation or to protect from influences of noise on the system design.
(5) We recommend you to construct its software to make periodical refreshment of the operation
statuses (re-setting of the commands and re-transference of the display data) to cope with
catastrophic noise.
(6)Resistors, capacitors and other passive components will have different appearance and color
caused by the different supplier.
(7)The manufacturer has the right to upgrade and modify the product function.
Legal Disclaimer Notice
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Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of
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particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
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including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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