LM3561TME/NOPB - Texas Instruments

2.9 mm

5.3 mm

HWEN

SCL

SDA

STROBE

TX1

TX2 LEDI/

NTC LED

OUT

CIN

COUT L

LM3561

10 PF

IN OUT

LED

LEDI/NTC

HWEN

TX1/TORCH

TX2

SDA

SCL

LM3561

GND

1 PH/2.2 PH

10 PF

Flash

LED

STROBE

Optional Indicator LED or

Thermistor input for LED

temperature measurement

2.5V to 5.5V

LM3561

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SNOSB44C –MARCH 2011–REVISED MAY 2013

Synchronous Boost Converter

With 600-mA High-Side LED Driver and I

C-Compatible Interface

Check for Samples: LM3561

1FEATURES

2• High-Side Current Source Allows Grounded • 12-Bump (1.215mm × 1.615mm × 0.6mm)

LED Cathode DSBGA Package

• Up to 90% Efficient APPLICATIONS

• Ultra-Small Solution Size: <16mm2

• Camera Phone LED Flash Controller

• Three Operating Modes: Torch, Flash, and LED • LED Current Source Biasing

Indicator

• Accurate and Programmable LED Current from DESCRIPTION

18mA to 600mA The LM3561 is a 2-MHz fixed-frequency current-

• Hardware Flash and Torch Enable mode synchronous boost converter. The device is

• LED Thermal Sensing and Current Scaleback designed to operate as a single 600-mA constant

• Software Selectable Input Voltage Monitor current driver for high-current white LEDs. The high-

side current source allows for grounded cathode LED

• Programmable Flash Timeout operation while the 250-mV regulated headroom

• Dual Synchronization Inputs for RF Power voltage ensures that the LED current is well regulated

Amplifier Pulse Events and efficiency remains high.

• Open and Short LED Detection

• Active High Hardware Enable for Protection

Against System Faults

• 400kHz I2C-compatible Interface

Typical Application Circuits

Figure 1. Figure 2. Example Layout

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

A1 A2

B1 B3

Top View

C1 C3

D1 D3

LM3561

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DESCRIPTION (CONTINUED)

The main features of the LM3561 include: an I2C-compatible interface for controlling the LED current, a hardware

Flash enable input for direct triggering of the Flash pulse, dual TX inputs (TX1 and TX2) which force the Flash

pulse into a low-current Torch mode during high battery current instances, an active high hardware enable

(HWEN) allowing for fast hardware shutdown during system software failures, a dual mode pin which serves as

either an indicator LED driver at up to 18mA or as a dedicated comparator input with an internal 1V reference,

designed to monitor the voltage across a negative temperature coefficient thermistor (NTC), and a programmable

input voltage monitor which monitors IN and can reduce the flash current or shutdown the device during low

battery conditions.

Seven fault flags are available for read back over the I2C-compatible bus. These include: a flash timeout flag

indicating the flash pulse has reached the end of the programmable timeout duration, a thermal shutdown flag

indicating the LM3561's die temperature has exceeded 150°C, an LED fault flag indicating the output voltage has

tripped the over-voltage threshold, or the LED has become shorted, TX1 and TX2 interrupt flags indicating if

either of the TX inputs have been triggered, an NTC flag indicating the LED has experienced an over

temperature condition, and a VIN Monitor flag indicating the input voltage has fallen below the VIN Monitor

threshold.

The LM3561 is available in a tiny (1.215mm × 1.615mm × 0.6mm) 12-bump DSBGA and operates over the

temperature range -40°C to +85°C.

Table 1. Application Circuit Component List

Component Manufacturer Value Part Number Size (mm) Rating

L TDK 1µH MLP2520-1R0 2x2.5x1.2 1.5A

COUT Murata 10µF GRM188R60J106M 1.6×0.8×0.8 (0603) 6.3V

CIN Murata 10µF GRM188R60J106M 1.6×0.8×0.8 (0603) 6.3V

LEDs Lumiled 3.6V@1A LXCL-PWF4 1.5A

Connection Diagram

Figure 3. DSBGA Package

see package number YFQ0012AAA

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Table 2. Pin Descriptions

Name Pin Description

GND A1 Ground

IN A2 Input Voltage Connection. Connect IN to the input supply and bypass to GND with a minimum 10µF

ceramic capacitor.

HWEN A3 Active Low Hardware Reset Input. This input is high impedance and cannot be left floating. Typically this

would be tied to a pullup resistor and to a logic high voltage, or VIN, in order to enable the LM3561.

SW B1 Drain Connection for Internal NMOS and Synchronous PMOS Switches

STROBE Active High Hardware Flash Enable. Drive STROBE high to turn on the Flash pulse. STROBE has an

B2 internal 300kΩpulldown to GND.

SCL B3 Serial Clock Input.

OUT C1 Step-Up DC/DC Converter Output. Bypass OUT to GND with a 10µF Ceramic Capacitor.

TX1/TORCH/GPIO C2 Configurable as a Flash Interrupt Input, a Hardware Torch Enable, or a Programmable General Purpose

Logic Input/Output. This pin has an internal 300kΩpulldown to GND.

SDA C3 Serial Data Input/Output.

LED D1 High Side Current Source Output for Flash LED.

Configurable as a High Side Current Source Output for Indicator LEDs or as a Threshold Detector for

LEDI/NTC D2 LED Temperature Sensing.

Configurable as a Flash Interrupt Input, a Programmable General Purpose Logic Input/Output, or as an

TX2/GPIO2/INT D3 Interrupt output for fault notification. This pin has an internal 300kΩpulldown to GND.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings(1) (2)(3)

VIN, VSW, VOUT -0.3V to 6V

VSCL, VSDA, VHWEN, VSTROBE, VTX1, VTX2, VLED, VLEDI/NTC -0.3V to (VIN+0.3V) w/ 6.0V max

Continuous Power Dissipation(4) Internally Limited

Junction Temperature (TJ-MAX) +150°C

Storage Temperature Range -65°C to +150°C

Maximum Lead Temperature (Soldering) See (5)

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics table.

(2) All voltages are with respect to the potential at the GND pin.

(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150ºC (typ.) and

disengages at TJ=135ºC (typ.).

(5) For detailed soldering specifications and information, see Application Note 1112: Micro SMD Wafer Level chip Scale Package SNVA009

Operating Ratings(1) (2)

VIN 2.5V to 5.5V

Junction Temperature (TJ) -40°C to +125°C

Ambient Temperature (TA)(3) -40°C to +85°C

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics table.

(2) All voltages are with respect to the potential at the GND pin.

(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

+125ºC), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the

part/package in the application (θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).

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Thermal Properties

Junction-to-Ambient Thermal Resistance (θJA)(1) 68°C/W

(1) Junction-to-ambient thermal resistance (θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set

forth in the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 102mm x 76mm x 1.6mm with a 2x1 array of

thermal via's. The ground plane on the board is 50mm x 50mm. Thickness of copper layers are 36µm/18µm/18µm/36µm

(1.5oz/1oz/1oz/1.5oz). Ambient temperature in simulation is 22°C, still air. Power dissipation is 1W.

Electrical Characteristics

Limits in standard typeface are for TA= +25°C. Limits in boldface type apply over the full operating ambient temperature

range (-40°C ≤TA≤+85ºC). Unless otherwise specified, VIN = 3.6V, VHWEN = VIN.(1) (2)

Parameter Test Conditions Min Typ Max Unit

Current Source Specifications

600mA Flash LED -40C ≤TA≤+85C -5% 600 +6%

Setting, VOUT =

4.5V, 3V ≤VIN ≤TA= +25C -3% 600 +6%

ILED Current source accuracy mA

4.2V

18mA Torch Current Setting, -10% 18 +10%

VOUT = 4.5V, 3V ≤VIN ≤4.2V

Current Source Regulation

VHR 600mA setting, VOUT = 4.5V 240 mV

Voltage (VOUT - VLED)

Step-Up DC/DC Converter Specifications

On Threshold 4.90 55.05

Output over-voltage protection

VOVP V

trip point(3) Off Threshold 4.88

RPMOS PMOS switch on-resistance IPMOS = 500mA 270 mΩ

RNMOS NMOS switch on-resistance INMOS = 500mA 250 mΩ

Flash Duration 0.88 11.12

ICL Switch current limit(4) 3.0V ≤VIN ≤4.2V A

Flash Duration 1.35 1.5 1.65

IOUT_SC Output short circuit current limit VOUT < 2.3V 200 mA

Indicator Register = 0xFF,

ILED/NTC Indicator current 16 18 20 mA

VLEDI/NTC = 2V, 2.7V ≤VIN ≤4.2V

Configuration Register 1 Bit [4] = 1,

VTRIP Comparator trip threshold 0.97 11.03 V

3.0V ≤VIN ≤4.2V

fSW Switching frequency 2.7V ≤VIN ≤5.5V 1.8 22.2 MHz

tTIMEOUT Timeout duration(5),(6) 2.7V ≤VIN ≤5.5V -10 +10 %

Device Not Switching 676

Quiescent supply current into Device Switching 1140

IQµA

IN Indicate Mode, 560

Indicator Register = 0x07

ISHDN Shutdown supply current 2.7V ≤VIN ≤5.5V, HWEN = GND 0.02 1µA

(1) All voltages are with respect to the potential at the GND pin.

(2) Min and Max limits are specified by design, test, or statistical analysis. Typical (Typ) numbers are not ensured, but do represent the

most likely norm. Unless otherwise specified, conditions for typical specifications are: VIN = 3.6V and TA= +25°C.

(3) The typical curve for Over-Voltage Protection (OVP) is measured in closed loop using the typical application circuit. The OVP value is

found by forcing an open circuit in the LED current path and recording the peak value of VOUT. The value given in the Electrical Table is

found in an open loop configuration by ramping the voltage at OUT until the OVP comparator trips. The closed loop data can appear

higher due to the stored energy in the inductor being dumped into the output capacitor after the OVP comparator trips. This results in an

open circuit condition where the output voltage can continue to rise after the OVP comparator trips by approximately IIN × sqrt(L/COUT).

(4) The typical curve for Current Limit is measured in closed loop using the typical application circuit by increasing IOUT until the peak

inductor current stops increasing. The value given in the Electrical Table is measured open loop and is found by forcing current into SW

until the current limit comparator threshold is reached. Closed loop data appears higher due to the delay between the comparator trip

point and the NFET turning off. This delay allows the closed loop inductor current to ramp higher after the trip point by approximately

40ns × VIN/L

(5) Specified by design. Not production tested.

(6) The timeout duration period is a divided down representation of the 2MHz clock and thus the accuracy spec. is the same as the

switching frequency. This accuracy specification applies to all settings in Table 10.

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Electrical Characteristics (continued)

Limits in standard typeface are for TA= +25°C. Limits in boldface type apply over the full operating ambient temperature

range (-40°C ≤TA≤+85ºC). Unless otherwise specified, VIN = 3.6V, VHWEN = VIN.(1) (2)

Parameter Test Conditions Min Typ Max Unit

2.7V ≤VIN ≤5.5V, HWEN = IN,

ISTBY Standby supply current 1.1 2.3 µA

Enable Register bit [1:0] = 00

Flash-to-torch LED current TX_ Low-to-High, 2

settling time ILED = 600mA to 93.2mA

tTX µs

Torch-to-flash LED current TX_ Low-to-High, 80

settling time ILED = 93.2mA to 600mA

VIN Falling,

VIN_TH VIN monitor trip threshold VIN Monitor Register = 0x01 2.84 2.90 2.95 V

(Enabled with VIN_TH = 2.9V)

HWEN, STROBE, TX1/TORCH/GPIO1, TX2/INT/GPIO2 Voltage Specifications

VIL Input logic low 2.7V ≤VIN ≤5.5V 00.4 V

VIH Input logic high 2.7V ≤VIN ≤5.5V 1.2 VIN V

Output logic low

VOL ILOAD = 3mA, 2.7V ≤VIN ≤5.5V 0.4 V

(GPIO1,GPIO2, INT)

Internal pulldown resistance at

RTX1 300 kΩ

TX1/TORCH/GPIO1

Internal pulldown resistance at

RTX2 300 kΩ

TX2/GPIO2

Internal pulldown resistance at

RSTROBE 300 kΩ

STROBE

I2C-Compatible Voltage Specifications (SCL, SDA)

VIL Input Logic Low 2.7V ≤VIN ≤5.5V 0 0.4 V

VIH Input Logic High 2.7V ≤VIN ≤5.5V 1.3 VIN V

VOL Output Logic Low (SDA) ILOAD = 3mA, 2.7V ≤VIN ≤5.5V 400 mV

I2C-Compatible Timing Specifications (SCL, SDA) (5) see Figure 4

fSCL SCL(Clock Frequency) 0 400 kHz

Rise Time of Both SDA and 20 + 0.1 ×

tRISE(7) 300 ns

SCL CBUS

20 + 0.1 ×

tFALL(8) Fall Time of Both SDA and SCL 300 ns

CBUS

tLOW Low Period of SCL Clock 1.3 µs

tHIGH High Period of SCL Clock 600 ns

Hold Time for Start (or

tHD;STA 600 ns

Repeated Start) Condition

Set-up Time for a Repeated

tSU;STA 600 ns

Start

tHD;DAT Data Hold Time 0ns

tSU;DAT Data Setup Time 100 ns

tSU;STO Set-up Time for Stop Condition 600 ns

tVD;DAT Data Valid Time 900 ns

tVD;ACK Data Valid Acknowledge Time 900 ns

Bus Free Time Between a Start

tBUF 1.3 µs

and a Stop Condition

(7) Min rise and fall times on SDA and SCL can typically be less than 20ns.

(8) Min rise and fall times on SDA and SCL can typically be less than 20ns.

Product Folder Links: LM3561

tRISE

tFALL

70%

30%

70%

30%

tFALL

70%

30%

tRISE

70%

30%

tHD;STA 1/fSCL

tHD;DAT

tSU;DAT

tHIGH

tLOW

tVD;DAT

70%

30%

9th Clock

Pulse

Start

Stop

tSU;STA tHD;STA tVD;ACK

9th Clock

Pulse

70%

30%

tSU;STO

tBUF

Start

Repeated

Start

70%70%

70%

30%

70%

30%

70% 70%

30%

70%

SCL

SDA

(Continued)

SCL

(Continued)

30%

LM3561

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I2C TIMING

Figure 4. I2C Timing

Product Folder Links: LM3561

2.6 2.9 3.2 3.5 3.8 4.1 4.4 4.7 5.0

VIN (V)

620.0

610.0

600.0

590.0

580.0

570.0

560.0

550.0

540.0

530.0

520.0

510.0

500.0

490.0

480.0

470.0

460.0

Code 1100

Code 1101

Code 1110

Code 1111

ILED (mA)

2.6 2.9 3.2 3.5 3.8 4.1 4.4 4.7 5.0

VIN (V)

460.0

450.0

440.0

430.0

420.0

410.0

400.0

390.0

380.0

370.0

360.0

350.0

340.0

330.0

320.0

310.0

Code 1000

Code 1001

Code 1010

Code 1011

ILED (mA)

2.6 2.9 3.2 3.5 3.8 4.1 4.4 4.7 5.0

VIN (V)

93.0

91.0

89.0

87.0

85.0

83.0

81.0

79.0

77.0

75.0

73.0

71.0

69.0

67.0

65.0

63.0

Code 0100

Code 0101

Code 0111

Code 0110

EFFICIENCY (%)

2.6 2.9 3.2 3.5 3.8 4.1 4.4 4.7 5.0

VIN (V)

90.0

85.0

80.0

75.0

70.0

65.0

60.0

55.0

50.0

Code 0000

Code 0001

Code 0010

Code 0011

EFFICIENCY (%)

2.6 2.9 3.2 3.5 3.8 4.1 4.4 4.7 5.0

VIN (V)

90.0

87.0

84.0

81.0

78.0

75.0

72.0

69.0

66.0

Code 1000

Code 1001

Code 1010

Code 1011

EFFICIENCY (%)

2.6 2.9 3.2 3.5 3.8 4.1 4.4 4.7 5.0

VIN (V)

89.0

87.0

85.0

83.0

81.0

79.0

77.0

75.0

73.0

71.0

69.0

Code 1100

Code 1101

Code 1110

Code 1111

EFFICIENCY (%)

LM3561

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SNOSB44C –MARCH 2011–REVISED MAY 2013

Typical Performance Characteristics

VIN = 3.6V, LEDs are Lumiled PWF-4, COUT = 10µF, CIN = 10µF, L = MLP2520-1R0 (1µH, RL= 0.085Ω), TA= +25°C unless

otherwise specified.

LED Efficiency vs VIN LED Efficiency vs VIN

Flash Brightness Codes (1111 - 1100) Flash Brightness Codes (1011 - 1000)

(Typical Application Circuit) (Typical Application Circuit)

Figure 5. Figure 6.

LED Efficiency vs VIN LED Efficiency vs VIN

Flash Brightness Codes (0111 - 0100) Flash Brightness Codes (0011 - 0000)

(Typical Application Circuit) (Typical Application Circuit)

Figure 7. Figure 8.

LED Current vs VIN LED Current vs VIN

Flash Brightness Codes (1111 - 1100) Flash Brightness Codes (1011 - 1000)

Figure 9. Figure 10.

Product Folder Links: LM3561

0.05 0.08 0.11 0.14 0.17 0.20 0.23

VHR (VIN - VLED)

Indicator Current (mA)

18.5

18.0

17.5

17.0

16.5

16.0

15.5

15.0

14.5

14.0

13.5

13.0

12.5

12.0

11.5

11.0

10.5 Code 100

Code 101

Code 110

Code 111

0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14

VHR (VIN - VLED)

Indicator Current (mA)

10.0

9.0

8.0

7.0

6.0

5.0

4.0

3.0

2.0

1.0

0.0

Code 000

Code 001

Code 010

Code 011

2.5 3.0 3.5 4.0 4.5 5.0 5.5

VIN (V)

Shutdown Current (IN + SW) (nA)

1.0e3

1.0e2

1.0e1

1.0

TA = +85°C

TA = +25°C

TA = -40°C

2.5 3.0 3.5 4.0 4.5 5.0 5.5

VIN (V)

Shutdown Current (IN + SW) (#A)

2.3

2.2

2.1

2.0

1.9

1.8

1.7

1.6

1.5

1.4

1.3

1.2

1.1

1.0

0.9

0.8

0.7

0.6

TA = +25°, -40°C

TA = +85°C

2.6 2.9 3.2 3.5 3.8 4.1 4.4 4.7 5.0

VIN (V)

320.0

310.0

300.0

290.0

280.0

270.0

260.0

250.0

240.0

230.0

220.0

210.0

200.0

190.0

180.0

170.0

Code 0100

Code 0101

Code 0110

Code 0111

ILED (mA)

2.6 2.9 3.2 3.5 3.8 4.1 4.4 4.7 5.0

VIN (V)

160.0

150.0

140.0

130.0

120.0

110.0

100.0

90.0

80.0

70.0

60.0

50.0

40.0

30.0

20.0

Code 0000

Code 0001

Code 0010

Code 0011

ILED (mA)

LM3561

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Typical Performance Characteristics (continued)

VIN = 3.6V, LEDs are Lumiled PWF-4, COUT = 10µF, CIN = 10µF, L = MLP2520-1R0 (1µH, RL= 0.085Ω), TA= +25°C unless

otherwise specified. LED Current vs VIN LED Current vs VIN

Flash Brightness Codes (0111 - 0100) Flash Brightness Codes (0011 - 0000)

Figure 11. Figure 12.

Shutdown Current vs VIN Shutdown Current vs VIN

( VHWEN = GND) ( VHWEN = VIN)

Figure 13. Figure 14.

Indicator Current vs Headroom Voltage (VIN - VLED) Indicator Current vs Headroom Voltage (VIN - VLED)

Indicator Brightness Codes (111 - 100) Indicator Brightness Codes (011 - 000)

Figure 15. Figure 16.

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SNOSB44C –MARCH 2011–REVISED MAY 2013

Typical Performance Characteristics (continued)

VIN = 3.6V, LEDs are Lumiled PWF-4, COUT = 10µF, CIN = 10µF, L = MLP2520-1R0 (1µH, RL= 0.085Ω), TA= +25°C unless

otherwise specified. Torch Mode to Flash Mode Transition

Startup into Flash Mode Torch Brightness Code (100)

Max Flash Setting Flash Brightness Code (111)

Figure 17. Figure 18.

TX Interrupt Operation

Torch Brightness Code (100) Line Transient

Flash Brightness Code (111) Flash Brightness Code (111)

Figure 19. Figure 20.

NTC Mode Response

Flash Brightness Code (111)

Circuit of Figure 38

HWEN Operation (R(T) = 10kΩ(at +25°C), RBIAS = 1.3kΩ, VBIAS = 1.2V)

Figure 21. Figure 22.

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Typical Performance Characteristics (continued)

VIN = 3.6V, LEDs are Lumiled PWF-4, COUT = 10µF, CIN = 10µF, L = MLP2520-1R0 (1µH, RL= 0.085Ω), TA= +25°C unless

otherwise specified. VIN Monitor Response

Flash Brightness Code (111)

3.0V Setting

Figure 23.

Product Folder Links: LM3561

VREF

PWM

Control

2 MHz

Oscillator

Thermal

Shutdown

+150°C

IN VREF

I2C

Interface

Error

Amplifier

Slope

Compensation

SDA

SCL

Control

Logic/

Soft-Start

GND

OUT

LED

LEDI/NTC

TX2/GPIO2/

INT STROBE

TX1/TORCH/

GPIO1 HWEN

Feedback

ISET

250 m:

270 m:

Over Voltage

Comparator

VTRIP

ILEDI

ILED

VIN_TH

INT

Mode

Control

Current Sense/

Current Limit

LM3561

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BLOCK DIAGRAM

Figure 24. Block Diagram

Product Folder Links: LM3561

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DETAILED DESCRIPTION

Circuit Description

OVERVIEW

The LM3561 is a high power white LED flash driver capable of delivering up to 600mA of LED current into a

single white LED. The device incorporates a 2MHz constant frequency, synchronous boost converter, and a high

side current source to regulate the LED current over the 2.5V to 5.5V input voltage range.

When the LM3561 is enabled and the output voltage is greater than VIN – 150mV, the PWM converter switches

and maintains at least 250mV (VHR) across the current source (VOUT - VLED). This minimum headroom voltage

ensures that the current sinks remain in regulation. When the input voltage is above VLED + VHR the device

operates in pass mode with the device not switching and the PFET on continuously. In pass mode the difference

between (VIN - ILED×RON_P) and VLED is dropped across the current source. If the device is operating in pass

mode and VIN drops to a point that forces the device into switching, the LM3561 will make a one-time decision to

jump into switching mode. The LM3561 remains in switching mode until the device is shutdown and re-enabled.

This is true even if VIN were to rise back above VLED + 250mV during the active Flash or Torch cycle. This

prevents the LED current from oscillating back and forth between pass and boost mode when VIN is close to

VOUT.

The main features of the LM3561 include: dual TX inputs (TX1 and TX2) for forcing the device into a lower

current state during high battery current conditions, a hardware flash enable input (STROBE), an active low

shutdown input (HWEN), an input voltage monitor for detecting low battery voltage conditions, and a dual

function pin that can be configured as a low power indicator LED current source or as a comparator input for

LED thermal sensing via an external NTC thermistor.

Control of the LM3561 is done via an I2C-compatible interface. This includes: adjustment of the LED current in

TORCH and FLASH mode, adjustment of the indicator LED current, programming the flash LED current timeout

duration, and programming of the switch current limit. Additionally, there are 7 flag bits that can be read back

indicating that the programmed flash current timeout has expired, a device over temperature condition has

happened, an LED failure (open or short), an LED thermal failure (tripping of the internal NTC comparator), an

input under voltage fault (VIN Monitor), and a separate flag for each TX input.

STARTUP

Turn on of the LM3561 via the I2C-compatible interface is done through bits [1:0] of the Enable Register. The

device can be enabled in either Indicate mode, Torch mode, or Flash mode (see Table 4). On startup in Flash or

Torch mode, when VOUT is less than VIN, the internal synchronous PFET turns on as a current source and

delivers typically 200mA to the output capacitor. During this time the flash LED current source (LED) is off. When

the voltage across the output capacitor reaches 2.3V the current source can turn on. At turn-on, the current

source steps through each FLASH and TORCH level until the target LED current is reached (32µs/step). This

gives the device a controlled turn-on and limits inrush current from the VIN supply.

PASS MODE

On turn on, when the output voltage charges up to ( VIN – 150 mV), the LM3561 will decide if the part operates in

Pass Mode or Boost mode. If the voltage difference between VOUT and VLED is less than 250mV, the device will

transition into Boost Mode. If the difference between VOUT and VLED is greater than 250mV, the device will

operate in Pass Mode. In Pass Mode the boost converter stops switching and the synchronous PFET turns fully

on, bringing VOUT up to (VIN – IIN×RPMOS) where (RPMOS = 240mΩ). In Pass Mode the inductor current is not

limited by the peak current limit. In this situation the output current must be limited to 1.5A.

OVER-VOLTAGE PROTECTION

The output voltage is limited to typically 5V (4.9V min). In situations such as the current source open, the

LM3561 will raise the output voltage in order to try and keep the LED current at its target value. When VOUT

reaches 5V, the over-voltage comparator will trip and turn off both the internal NFET and PFET switches. When

VOUT falls below 4.8V (typical) the LM3561 will begin switching again.

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CURRENT LIMIT

The LM3561 features 2 selectable current limits — 1A and 1.5A. These are selectable through the I2C-

compatible interface via bit [5] of the Flash Duration Register. When the current limit is reached the LM3561

stops switching for the remainder of the switching cycle.

Since the current limit is sensed in the NMOS switch there is no mechanism to limit the current when the device

operates in Pass Mode. In situations where there could potentially be large load currents at OUT, and the

LM3561 is operating in Pass mode, the load current must be limited to 1.5A. In Boost mode or Pass mode if

VOUT falls below approximately 2.3V the part stops switching and the PFET operates as a current source limiting

the current to typically 200mA. This prevents damage to the LM3561 and excessive current draw from the battery

during output short circuit conditions.

THERMAL SHUTDOWN

The LM3561 features a thermal shutdown threshold of typically +150°C. When the die temperature reaches

+150°C, the active current source (LED) will shutdown, and the TSD flag in the Flags register is written high. The

device cannot be started up again until the Flags register is read back. Once the Flags register is read back the

current source can be re-enabled into Torch, or Flash Mode. The thermal shutdown (TSD) circuitry has an

internal 250µs de-glitch timer which helps prevent unwanted noise from falsely triggering a TSD event. However,

when the LM3561 is in boost mode at higher flash currents, the de-glitch timer can get reset by the high currents

in the LM3561's GND. As a result the thermal shutdown's internal de-glitch timer can get reset before the TSD

event can get latched in. This causes a TSD event to not get triggered until the LM3561's flash pulse reaches the

end of the flash duration, when the noisy currents have dropped to a lower level. However, once the noise is

lower and a TSD event is triggered, the next flash pulse is not allowed until the flags register is read back. In

pass mode the boost switcher is off and the lower noise environment allows the devices TSD circuitry to

shutdown immediately when the die temperature reaches +150°C.

FLASH MODE

In Flash mode the LED current source (LED) provides 16 different current levels from typically 36mA to 600mA.

The Flash currents are set by writing to bits [3:0] of the Flash Brightness Resister. Flash mode is activated by

either writing a (1, 1) to bits [1:0] of the Enable Register, or by pulling the STROBE pin high. Once the Flash

sequence is activated the current source (LED) will ramp up to the programmed Flash current by stepping

through all Torch and Flash levels (32µs/step) until the programmed current is reached.

FLASH TERMINATION

Bit [2] of the Enable Register determines how the Flash pulse terminates. With this bit = '1' the Flash current

pulse will only terminate by reaching the end of the Flash timeout period (see Figure 29). With STR = '0', Flash

mode can be terminated by pulling STROBE low, programming bits [1:0] of the Enable Register with (0,0), or by

allowing the Flash timeout period to elapse (see Figure 28). If STR = '0' and STROBE is toggled before the end

of the Flash timeout period, the timeout period resets on the rising edge of STROBE. See LM3561 Timing

Diagrams regarding the Flash pulse termination for the different STR bit settings.

After the Flash pulse terminates, either by a flash timeout, pulling STROBE low, or disabling it via the I2C-

compatible interface, the current source (LED) turns completely off. This happens even when Torch is enabled

via the I2C-compatible interface and the Flash pulse is turned on by toggling STROBE. After a Flash event ends

(bits [1:0] of the Enable Register are automatically re-written with (0, 0).

FLASH TIMEOUT

The Flash timeout period sets the maximum duration of the flash current pulse. Bits [4:0] of the Flash Duration

1024ms (see Table 10).

TORCH MODE

In Torch mode the current source (LED) provides 8 different current levels (see Table 8). The Torch currents are

adjusted by writing to bits [2:0] of the Torch Brightness Register. Torch mode is activated by setting Enable

Torch current level by stepping through all of the Torch currents at (32µs/step) until the programmed Torch

current level is reached.

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FLASH PULSE INTERRUPT (TX1), HARDWARE TORCH INPUT (TORCH) AND GENERAL PURPOSE I/O

(GPIO1)

The TX1/TORCH/GPIO1 input has a triple function; either as a flash pulse interrupt (TX1), a hardware torch

mode enable (TORCH), or as a general purpose I/O (GPIO1).

Flash Interrupt (TX1)

With Configuration Register 1 Bit [7] = '0' (default), TX1/TORCH/GPIO1 is a flash pulse interrupt input. This is

designed to force the flash pulse into a lower current state in order to reduce the current pulled from the battery

during high battery current situations. For example, when the LM3561 is engaged in a Flash event and TX1 is

pulled high (active high polarity) the current source (LED) is forced into Torch mode at the programmed Torch

current setting. If TX1 is then pulled low before the Flash pulse terminates, the LED current will ramp back to the

previous Flash current level. At the end of the Flash timeout, whether TX1 is high or low, the LED current will

turn off.

TX1 Polarity

In TX1 mode, TX1 can be programmed as an active low TX1 input where pulling TX1 to GND will cause a TX1

event. TX1 polarity inversion is done via Configuration Register 1 bit [5].

Hardware Torch Mode

With Configuration Register 1 Bit [7] = '1', TX1/TORCH/GPIO1 is configured as a hardware Torch mode enable.

In this mode (TORCH mode), a high at TORCH turns on the LED current at the programmed Torch current

setting. The STROBE input and I2C Enabled flash take precedence over TORCH mode. In hardware torch mode,

the LED current source will turn off after a flash event and Configuration Register 1 Bit [7] will be reset to '0'. In

this situation, to re-enter torch mode via hardware torch, the hardware torch enable bit (Configuration Register 1

Bit [7] must be reset to '1'). Figure 26,Figure 27 , and Figure 34 detail the functionality of the TX1/TORCH input.

GPIO1 Mode

With GPIO Register bit[0] = '1', the TX1/TORCH/GPIO1 pin is configured as a general purpose I/O. In GPIO1

mode this pin can be either a logic input or a logic output depending on the bit settings in bits [2:1] of the GPIO

FLASH PULSE INTERRUPT (TX2), GENERAL PURPOSE I/O (GPIO2), AND INTERRUPT OUTPUT (INT)

The TX2/GPIO2/INT pin has a triple function: either a flash interrupt input (TX2), a general purpose I/O (GPIO2),

or as an interrupt output (INT).

Flash Interrupt (TX2 Mode)

In TX2 mode (default), TX2 is a flash pulse interrupt input. This is designed to force the flash pulse into a lower

current state in order to reduce the current pulled from the battery during high battery current situations. For

example, when the LM3561 is engaged in a Flash event, and TX2 is pulled high (active high polarity, the current

source (LED) is forced into torch mode at the programmed Torch current setting. If TX2 is then pulled low before

the flash pulse terminates, the LED current will step back to the previous flash current level. At the end of the

flash timeout, whether the TX2 pin is high or low, the LED current will turn off. In addition to forcing torch mode

with a TX2 event, the TX2 input can be set to force shutdown. Configuration Register 2 bit[0] sets this mode (see

Table 13). In TX2 shutdown mode, a TX2 event will shut down the flash pulse. Once shut down, the flash pulse

must be re-enabled via STROBE or the flash enable bits in the Enable Register.

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TX2 Forcing Shutdown

TX2 also has the capability to force shutdown (see Figure 30). When bit [0] of Configuration Register 2 is set to a

'1', TX2 will force shutdown when active. For example, if TX2 is configured for TX2 mode with active high

polarity, and bit [0] of Configuration Register 2 is set to '1' then when TX2 is driven high, (LED) will be forced into

shutdown. Once the current source is forced into shutdown by activating TX2, the current source can only be re-

enabled in flash mode if TX2 is pulled low, and the Flags register is read back. If only the Flags register is read

back and TX2 is kept high, the device will be re-enabled into torch mode and not shutdown. This occurs because

the TX2 shutdown feature is an edge-triggered event. With active high polarity the TX2 shutdown requires a

rising edge at TX2 in order to force the current source back into shutdown. Once shut down, it takes a read back

of the flags Register and another rising edge at TX2 to force shut down again.

TX2 Polarity

In TX2 mode (default), TX2 is a flash pulse interrupt input. This is designed to force the flash pulse into a lower

current state in order to reduce the current pulled from the battery during high battery current situations. For

example, when the LM3561 is engaged in a Flash event and TX2 is pulled high (active high polarity) the current

source (LED) is forced into torch mode at the programmed Torch current setting. If TX2 is then pulled low before

the flash pulse terminates, the LED current will step back to the previous flash current level. At the end of the

flash timeout, whether the TX2 pin is high or low, the LED current will turn off. In addition to forcing torch mode

with a TX2 event, the TX2 input can be set to force shutdown. Configuration Register 2 bit[0] sets this mode (see

Figure 31). In TX2 shutdown mode, a TX2 event will shutdown the flash pulse. Once shut down, the flash pulse

must be re-enabled via STROBE or the flash enable bits in the Enable Register.

GPIO2 Mode

The TX2/GPIO2/INT pin is configured as a general purpose logic input/output by setting GPIO Register bit[3] =

'1'. In GPIO2 mode this pin can be either a logic input or output depending on the bit settings for GPIO Register

bit [4] (see Table 6).

Interrupt Output Mode

The TX2/GPIO2/INT pin is configured as an interrupt output by setting the TX2/GPIO2/INT as a GPIO output and

setting bit [6] of the GPIO register to '1'. When in INT mode, the TX2/GPIO2/INT pin will pull low when either of

the following occur:

1. The LM3561 is in NTC Mode, the LED current source is enabled, and VNTC falls below VTRIP.

2. The LM3561's Input Voltage Monitor is enabled and VIN falls below VIN_TH.

INDICATOR LED/THERMISTOR (LEDI/NTC)

The LEDI/NTC pin serves a dual function, either as an LED indicator driver or as a threshold detector for a

negative temperature coefficient (NTC) thermistor circuit.

Led Indicator Mode (LEDI)

LEDI/NTC is configured as an LED indicator driver by setting Configuration Register 1 bit [4] = '0' (default). The

indicator current source is enabled by setting Enable Register bits [1:0] = '01'. In Indicator mode there are 8

different current levels available (2.25mA - 18mA) which are programmed through the Indicator Register (see

Table 5).

Led Thermal Comparator (NTC Mode)

Writing a '1' to Configuration Register 1 bit [4] disables the indicator current source and configures LEDI/NTC as

a comparator input for monitoring an NTC thermistor circuit. In this mode LEDI/NTC becomes the negative input

of an internal comparator, with the positive input internally connected to an internal reference (VTRIP = 1V).

Additionally, Configuration Register 2 bit [1] determines the action NTC Mode takes if the voltage at LEDI/NTC

falls below VTRIP . With Configuration register 2 bit [1] = '0', the LED current source will be forced into Torch

mode when the voltage at LEDI/NTC falls below VTRIP. With Configuration Register 2 bit [1] = '1' the device will

shut down the current source (LED) when VLEDI/NTC falls below VTRIP. When the LM3561 is forced from Flash to

Torch, normal LED operation (during the same Flash pulse) can only be re-started by reading from the Flags

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STROBE

ITORCH

Timeout

Duration

I2C Torch

Command

IFLASH

ILED

LM3561

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mode or goes into shutdown. This deglitch time prevents noise from inadvertently tripping the NTC comparator.

For a more detailed description of this mode and designing the NTC circuit (see NTC THERMISTOR

SELECTION section in the Applications Information section of this datasheet).

In NTC mode the NTC flag (see Flags Register and Fault Indicators section) can be output on the

TX2/GPIO2/INT pin. This is accomplished by making the TX2/GPIO2/INT an interrupt output (see Interrupt

Output Mode section).

ALTERNATE EXTERNAL TORCH (AET MODE)

With Configuration Register 2 bit [2] set to '1' the operation of TX1/TORCH becomes dependent on its

occurrence relative to STROBE. In this mode if TX1/TORCH goes high first, followed by STROBE going high, the

LEDs are forced into torch mode with no timeout. In this mode if TX1/TORCH goes high after STROBE has gone

high, then the TX1/TORCH pin operates as a normal flash interrupt, and the LEDs will turn off at the end of the

timeout duration. (See LM3561 Timing Diagrams: Figure 32 and Figure 33). AET mode can only be used with

STROBE configured as a level sensitive input. Configuring STROBE for edge sensitive operation (STR bit = 1),

will force TX1 to act as a simple flash interrupt.

INPUT VOLTAGE MONITOR

The LM3561 has an internal comparator that monitors the voltage at IN and can force the LED current into torch

mode or into shutdown if VIN falls below the programmable VIN Monitor Threshold (VIN_TH). Bit [0] in the VIN

Monitor register enables or disables this feature. When enabled, Bits [2:1] program the 4 adjustable thresholds of

2.9V, 3V, 3.1V, and 3.2V. Bit [3] in Configuration Register 2 selects whether an under-voltage event forces Torch

mode or forces the LED current source off. (See Table 7 and Table 13.)

When the VIN Monitor is active and VIN falls below the programmed threshold (VIN_TH) the LEDs will either turn

off or their current will be reduced to the programmed Torch current setting. To reset the LED current to its

previous level, two things must occur. First, VIN must go above VIN_TH, and the Flags register must be read back.

In VIN Monitor mode the VIN Monitor Flag (see Flags Register and Fault Indicators section) can be output on the

TX2/GPIO2/INT pin. This is accomplished by making the TX2/GPIO2/INT an interrupt output (see Interrupt

Output Mode section).

LM3561 Timing Diagrams

Figure 25. Torch to Flash Operation

Product Folder Links: LM3561

STROBE

Timeout

Duration

Start of

Timeout

Counter

Timeout

Counter

Reset

ILED

IFLASH

ITORCH

I2C Torch

Command

STROBE

TX1/TORCH

Timeout

Duration

ILED

ITORCH

STROBE

TX1/TORCH

Timeout

Duration

ILED

ITORCH

IFLASH

LM3561

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Figure 26. TX Event During a Flash Pulse (TX1/TORCH is an Active High TX Input)

Figure 27. TX Event Before and After a Flash Event (TX1/TORCH is an Active High TX Input)

Figure 28. STROBE Input is Level Sensitive (Enable Register Bit [2] = '0')

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STROBE

TX2

I2C Torch

Command

ITORCH

ILED

IFLASH

Timeout

Duration

Shutdown

STROBE

Timeout

Duration

I2C Torch

Command

IFLASH

ITORCH

ILED

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Figure 29. STROBE Input is Edge Sensitive (Enable Register Bit [2] = '1')

Figure 30. TX2 Configured as an Active High Flash Interrupt and Set to Force Shutdown

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STROBE

TX1/TORCH

Timeout

Duration

ILED ITORCH

IFLASH

STROBE

TX1/TORCH

Timeout

Duration

IFLASH

ITORCH

ILED

STROBE

TX2

Timeout

Duration

I2C Torch

Command

IFLASH

ITORCH

ILED

LM3561

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Figure 31. TX2 Configured as an Active Low TX Input and Set to Force Torch Mode

Figure 32. Alternate External Torch Mode

(TX1/TORCH Turns on Before STROBE; when TX1/TORCH goes low, Flash mode is initiated)

Figure 33. Alternative External Torch Mode

(STROBE Goes High Before TX1/TORCH, Same as Normal TX1 Operation)

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STROBE

TX1/TORCH

Timeout

Duration

IFLASH

ILED

ITORCH

LM3561

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Figure 34. TX1/TORCH Pin is Configured as a Hardware Torch Input

Flags Register and Fault Indicators

The Flags Register contains the Interrupt and Fault indicators. Seven flags are available in the Flags Register.

These include a Flash Timeout flag (TO), a Thermal Shutdown flag (TSD) , an LED Failure flag (LEDF) , an LED

Thermal flag (NTC), and a VIN Monitor flag. Additionally, two interrupt flag bits TX1 interrupt and TX2 interrupt

indicate a change of state of the TX1/TORCH pin (TX1 mode) and TX2/GPIO2/INT pin (TX2 mode) . Reading

back a '1' indicates the TX lines have changed state since the last read of the Flags Register. A read of the Flags

FLASH TIMEOUT

The Flash Timeout Flag (TO), (bit [0] of the Flags Register) reads back a '1' if the LM3561 is active in Flash

Mode and the timeout period expires before the flash pulse is terminated. The flash pulse can be terminated

before the timeout period expires by pulling the STROBE pin low (with STR bit '0'), or by writing a ‘0’ to bits [1:0]

of the Enable Register. The TO flag is reset to (0) by pulling HWEN low, removing power to the LM3561, reading

the Flags Register, or when the next Flash pulse is triggered.

THERMAL SHUTDOWN

When the LM3561’s die temperature reaches +150°C the boost converter shuts down and the NFET and PFET

turn off. Additionally, both current sources (LED and LEDI/NTC) turn off. When the thermal shutdown threshold is

tripped a '1' gets written to bit [1] of the Flag Register (Thermal Shutdown bit). The LM3561 will start up again

when the die temperature falls to below +135°C, the Flags Register is read back, and the device is re-enabled.

LED FAULT

The LED Fault flag (bit 2 of the Flags Register) reads back a '1' if the part is active in Flash or Torch mode and

the current source (LED) experiences an open or short condition. An LED open condition is signaled if the OVP

threshold is crossed at OUT. An LED short condition is signaled if the voltage at LED goes below 500mV.

There is a delay of 250µs before the LEDF flag is valid on a LED short. This is the time from when VLED falls

below the LED short threshold of 500mV (typical) to when the fault flag is valid. There is a 2µs delay from when

the LEDF flag is valid on an LED open. This delay is the time between when the OVP threshold is triggered and

when the fault flag is valid. The LEDF flag can only be reset to (0) by pulling HWEN low, removing power to the

LM3561, or reading the Flags Register.

LED THERMAL FAULT

The NTC flag (bit [5] of the Flags Register) reads back a '1' if the LM3561 is active in Flash or Torch mode, the

device is in NTC mode, and the voltage at LEDI/NTC has fallen below VTRIP (1V typical). When this has

happened and the LM3561 has been forced into Torch or LED shutdown, depending on the state of

Configuration Register 2 bit [1], the voltage at LEDI/NTC must rise above the VTRIP threshold and the Flags

Mode) section for more details).

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SDA

Start Condition Stop Condition

SCL S P

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INPUT VOLTAGE MONITOR FAULT

The VIN Monitor Flag (bit [7] of the Flags Register) reads back a '1' when the Input Voltage Monitor is enabled

and VIN falls below the programmed (VIN_TH). The input voltage must rise above VIN_TH and the Flags register

must be read back in order to resume normal operation after the LED current has been forced to Torch mode or

turned off due to a VIN Monitor event.

TX1 AND TX2 INTERRUPT FLAGS

The TX1 and TX2 interrupt flags (bits [3] and [4] of the Flags register) indicate a TX event on the TX1 or TX2

pins. Bit 3 will read back a '1' if TX1/TORCH is in TX1 mode and the pin has changed from low to high since the

last read of the Flags Register. Bit [4] will read back a '1' if TX2 is in TX2 mode and the pin has had a TX event

since the last read of the Flags Register. A read of the Flags Register automatically resets these bits.

A TX event can be either a high to low transition or a low to high transition depending on the setting of the TX1

or TX2 polarity bits (see Table 12).

I2C-Compatible Interface

START AND STOP CONDITIONS

The LM3561 is controlled via an I2C-compatible interface. START and STOP conditions classify the beginning

and end of the I2C session. A START condition is defined as SDA transitioning from HIGH to LOW while SCL is

HIGH. A STOP condition is defined as SDA transitioning from LOW to HIGH while SCL is HIGH. The I2C master

always generates the START and STOP conditions.

Figure 35. Start and Stop Sequences

The I2C bus is considered busy after a START condition and free after a STOP condition. During data

transmission the I2C master can generate repeated START conditions. A START and a repeated START

condition are equivalent function-wise. The data on SDA must be stable during the HIGH period of the clock

signal (SCL). In other words, the state of SDA can only be changed when SCL is LOW. Figure 4 and Figure 36

show the SDA and SCL signal timing for the I2C-compatible Bus. See the Electrical Characteristics Table for

timing values.

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R/W

Bit 0

Bit 1

Bit 2

Bit 3

Bit 4

Bit 5

Bit 7 0

Bit 6

MSB LSB

I2C Slave Address (chip address)

tRISE

tFALL

70%

30%

70%

30%

tFALL

70%

30%

tRISE

70%

30%

tHD;STA 1/fSCL

tHD;DAT

tSU;DAT

tHIGH

tLOW

tVD;DAT

70%

30%

9th Clock

Pulse

Start

Stop

tSU;STA tHD;STA tVD;ACK

9th Clock

Pulse

70%

30%

tSU;STO

tBUF

Start

Repeated

Start

70%70%

70%

30%

70%

30%

70% 70%

30%

70%

SCL

SDA

(Continued)

SCL

(Continued)

30%

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Figure 36. I2C-Compatible Timing

I2C-COMPATIBLE CHIP ADDRESS

The 7 bit I2C-compatible device address for the LM3561 is 1010011 (53). After the START condition, the I2C

master sends the 7-bit address followed by an eighth bit, read or write (R/W). R/W = 0 indicates a WRITE (0xA6)

and R/W = '1' indicates a READ (0xA7). The second byte following the device address selects the register

address to which the data will be written. The third byte contains the data for the selected register.

Figure 37. Device Address

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TRANSFERRING DATA

Every byte on the SDA line must be eight bits long with the most significant bit (MSB) transferred first. Each byte

of data must be followed by an acknowledge bit (ACK). The acknowledge related clock pulse (9th clock pulse) is

generated by the master. The master releases SDA (HIGH) during the 9th clock pulse (write mode). The LM3561

pulls down SDA during the 9th clock pulse, signifying an acknowledge. An acknowledge is generated after each

byte has been received.

Table 3. LM3561 Internal Registers

Enable Register 0x10 0xF8

Indicator Brightness Register 0x12 0xF8

GPIO Register 0x20 0x80

VIN Monitor Register 0x80 0xF8

Torch Brightness Register 0xA0 0xFA

Flash Brightness Register 0xB0 0xFD

Flash Duration Register 0xC0 0xEF

Flags Register 0xD0 0x00

Configuration Register 1 0xE0 0x6A

Configuration Register 2 0xF0 0xF0

ENABLE REGISTER (ADDRESS 0x10)

The Enable Register contains the enable bits that turn on the device in Indicate Mode, Torch Mode, or Flash

Mode (bits[1:0]). These bits are always reset at the end of a flash pulse. Bit [2] sets the STROBE level or edge

control.

Table 4. Enable Register Bit Settings

Bits[7:3] Bit 2 Bits [1:0]

Not Used (Strobe Level or Edge, STR bit) Enable Bits

N/A 0 = STROBE Input set for Level. Flash current turns on when Enable Bits

STROBE input is high and turns off when STROBE either goes low 00 = Shutdown (default)

or the Timeout Duration expires (default) 01 = Indicator Mode

1 = STROBE Input set for edge triggered. Flash current turns on 10 = Torch Mode

when STROBE sees a rising edge. Flash pulse turns off when 11 = Flash Mode (bits reset at timeout)

timeout duration expires

INDICATOR BRIGHTNESS REGISTER (ADDRESS 0x12)

The Indicator Register contains the bits to set the indicator current level in indicate mode.

Table 5. Indicator Brightness Register Bit Settings

Bits [7:3] Bits [2:0]

Not Used Indicate Current Settings

N/A 000 = 2.25mA (default)

001 = 4.5mA

010 = 6.75mA

011 = 9mA

100 = 11.25mA

101 = 13.5mA

110 = 15.75mA

111 = 18mA

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GPIO REGISTER (ADDRESS 0x20)

The GPIO register contains the control bits which change the state of the TX1/TORCH/GPIO1 pin and the

TX2/GPIO2 pin to general purpose I/O’s (GPIO’s).

Table 6. GPIO Register Bit Settings

Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Bit 7 TX2/GPIO2/INT TX2/GPIO2 TX2/GPIO2 TX2/GPIO2 TX1/GPIO1 TX1/GPIO1 TX1/GPIO1

Not Used Interrupt Output data data direction Control data data direction Control

N/A 0 = INT mode This bit is the 0 = TX2/GPIO2 0 = TX2/GPIO2 This bit is the 0 = TX1/GPIO1 0 = TX1/GPIO1

is disabled read or write is a GPIO Input is a flash read or write is a GPIO input is configured as

(default) data for (default) interrupt input data for (default) flash interrupt

1 = When TX2/GPIO2 in 1 = TX2/GPIO2 (default) TX1/GPIO1 in 1 = TX1/GPIO1 input(default)

TX2/GPIO2 is GPIO mode is a GPIO 1 = TX2/GPIO2 GPIO mode is a GPIO 1 = TX1/GPIO1

configured as a (default is 0) Output is configured as (default is 0) output is configured as

GPIO output a GPIO a GPIO

TX2/GPIO2/INT

is set for INT

mode and will

pull low when

either the LED

Thermal Fault

Flag is set or

the VIN Monitor

Flag is set

VIN MONITOR REGISTER (ADDRESS 0X80)

The VIN Monitor Register controls the on/off state of the VIN Monitor comparator as well as selects the 4

programmable thresholds.

Table 7. VIN Monitor Register Bit Settings

Bits [7:3] Bits [2:1] Bit 0

Not Used VIN Monitor Threshold Settings VIN Monitor Enable

N/A 00 = 2.9V threshold (VIN falling) Default 0 = VIN Monitor Comparator is disabled (default)

01=3.0V threshold (VIN falling) 1 = VIN Monitor Comparator is enabled.

10 = 3.1V threshold (VIN falling)

11 = 3.2V threshold (VIN falling)

TORCH BRIGHTNESS REGISTER (0XA0)

The Torch Brightness Register contains the bits to program the LED current in Torch Mode.

Table 8. Torch Brightness Register Bit Settings

Bits [7:3] Bits [2:0]

Not Used Torch Current Settings

N/A 000 = 18mA

001 = 36.8mA

010 = 55.6mA (default)

011 = 74.4mA

100 = 93.2mA

101 = 112mA

110 = 130.8mA

111 = 149.6mA

Product Folder Links: LM3561

LM3561

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SNOSB44C –MARCH 2011–REVISED MAY 2013

FLASH BRIGHTNESS REGISTER (ADDRESS 0XB0)

The Flash Brightness Register contains the bits to program the LED current in flash mode.

Table 9. Flash Brightness Register Bit Settings

Bits [7:4] Bits [3:0]

Not Used Flash Current Settings

N/A 0000 = 36mA

0001 = 73.6mA

0010 = 111.2mA

0011 = 148.8mA

0100 = 186.4mA

0101 = 224mA

0110 = 261.6mA

0111 = 299.2mA

1000 = 336.8mA

1001 = 374.4mA

1010 = 412mA

1011 = 449.6mA

1100 = 487.2mA

1101 = 524.8mA Default

1110 = 562.4mA

1111 = 600mA

FLASH DURATION REGISTER (ADDRESS 0XC0)

Bits [4:0] of the Flash Duration Register set the Flash timeout duration. Bit [5] sets the switch current limit.

Table 10. Flash Timeout Duration Register Bit Settings

Bit [7:6] Bit 5 Bits [4:0]

Not Used Current Limit Select Flash Timeout Duration Settings

N/A 0 = 1A Peak Current Limit 00000 = 32ms timeout

1 = 1.5A Peak Current Limit (default) 00001 = 64ms timeout

00010 = 96ms timeout

00011 = 128ms timeout

00100 = 160ms timeout

00101 = 192ms timeout

00110 = 224ms timeout

00111 = 256ms timeout

01000 = 288ms timeout

01001 = 320ms timeout

01010 = 352ms timeout

01011 = 384ms timeout

01100 = 416ms timeout

01101 = 448ms timeout

01110 = 480ms timeout

01111 = 512ms timeout (default)

10000 = 544ms timeout

10001 = 576ms timeout

10010 = 608ms timeout

10011 = 640ms timeout

10100 = 672ms timeout

10101 = 704ms timeout

10110 = 736ms timeout

10111 = 768ms timeout

11000 = 800ms timeout

11001 = 832ms timeout

11010 = 864ms timeout

11011 = 896ms timeout

11100 = 928ms timeout

11101 = 960ms timeout

11110 = 992ms timeout

11111 = 1024ms timeout

Product Folder Links: LM3561

LM3561

SNOSB44C –MARCH 2011–REVISED MAY 2013

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FLAGS REGISTER (ADDRESS 0XD0)

The Flags Register holds the status of the flag bits indicating LED Failure, Over-Temperature, the Flash Timeout

expiring, VIN Monitor Fault, LED over temperature (NTC), and a TX1 or TX2 interrupt.

Table 11. Flags Register Bit Settings

Bit 5 Bit 1

Bit 7 Bit 2 Bit 0

Bit 6 LED Thermal Bit 4 Bit 3 Thermal

VIN Monitor Led Fault Flash Timeout

Not Used Fault TX2 Interrupt TX1 Interrupt Shutdown

Flag (LEDF) (TO)

(NTC) (TSD)

0 = No Fault at N/A 0 =LEDI/NTC 0=TX2 has not 0=TX1/TORCH 0 = Proper LED 0 = Die 0 = Flash

VIN (default) pin is above changed state has not Operation Temperature timeout did not

1 = Input VTRIP (default) (default) changed state (default) below Thermal expire (default)

Voltage Monitor 1=LEDI/NTC 1=TX2 has (default) 1 = LED Failed Shutdown Limit 1 = Flash

is enabled and has fallen changed state 1=TX1/TORCH (Open or Short) (default) timeout Expired

VIN has fallen below (TX2 mode pin has 1 = Die

below (VIN_TH) VTRIP(NTC only) changed state Temperature

mode only) (TX1 mode has crossed the

only) Thermal

Shutdown

Threshold of

+150°C

CONFIGURATION REGISTER 1 (ADDRESS 0XE0)

Configuration Register 1 contains the STROBE enable/disable bit, the STROBE polarity bit, the NTC enable bit,

the polarity selection for TX1 and TX2 flash interrupts, and the hardware torch mode enable for TX1/TORCH.

Table 12. Configuration Register 1 Bit Settings

Bit 7 Bit 4 Bit 3 Bit 2

Hardware Bit 6 Bit 5 Bit 1 Bit 0

NTC Mode STROBE STROBE Input

Torch Mode TX2 Polarity TX1 Polarity Not Used Not Used

Enable Polarity Enable

Enable

0 = 0 = TX2 is set 0 = TX1 is set 0 = LEDI/NTC 0 = STROBE 0 = STROBE N/A N/A

TX1/TORCH is for active low for active low is a Indicator set for active Input Disabled

a TX1 flash polarity polarity Current Source low polarity (default)

interrupt input 1 = TX2 is set 1 = TX1 is set Output 1 = STROBE 1 = STROBE

(default) for active high for active high (default) set for active Input Enabled

1 = polarity polarity 1 = LEDI/NTC high polarity

TX1/TORCH (default) (default) is a (default)

pin is a Comparator

hardware Input for LED

TORCH Temperature

enable. This bit Sensing

is reset to 0

after a flash

event.

Product Folder Links: LM3561

LM3561

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SNOSB44C –MARCH 2011–REVISED MAY 2013

CONFIGURATION REGISTER 2 (ADDRESS 0XF0)

Configuration Register 2 contains the TX2 shutdown bit, the NTC shutdown bit, the Alternate External Torch

Enable bit, and the VIN Monitor Shutdown bit.

Table 13. Configuration Register 2 Bit Settings

Bit 3

Bits [7:4] Bit 2 Bit 1 Bit 0

VIN Monitor

Not Used AET mode NTC Shutdown TX2 Shutdown

Shutdown

N/A 0 = If IN drops 0 = Normal 0 = LEDI/NTC 0 = TX2

below VIN_TH operation for pin going below interrupt event

and the VIN TX1/TORCH VTRIP forces the forces the flash

Monitor feature high before LEDs into LED into Torch

is enabled, the STROBE (TX1 Torch mode mode (TX2

LEDs are mode only) (NTC mode mode only)

forced into default only) default default

Torch mode 1 = Alternate 1 = LEDI/NTC 1 = TX2

(default) External Torch pin going below interrupt event

1 = If IN drops Mode. VTRIP forces the forces the flash

below VIN_TH TX1/TORCH LEDs into LED into

and the VIN high before shutdown (NTC shutdown (TX2

Monitor feature STROBE mode only) mode only)

is enabled, the forces Torch

LEDs turn off mode with no

timeout (TX1

mode only)

Product Folder Links: LM3561

where IN INOUT

( )

- VV

L=I'

OUTSW V

I+

xR=V L

ESRESR '

'VxI OUTLED VIN ¹

Q=V'( )

INOUTLED - VVxI

OUTOUTSW CxVxf

LM3561

SNOSB44C –MARCH 2011–REVISED MAY 2013

www.ti.com

APPLICATIONS INFORMATION

OUTPUT CAPACITOR SELECTION

The LM3561 is designed to operate with a at least a 10µF ceramic output capacitor. When the boost converter is

running the output capacitor supplies the load current during the boost converters on-time. When the NMOS

switch turns off the inductor energy is discharged through the internal PMOS switch supplying power to the load

and restoring charge to the output capacitor. This causes a sag in the output voltage during the on-time and a

rise in the output voltage during the off-time. The output capacitor is therefore chosen to limit the output ripple to

an acceptable level depending on load current and input/output voltage differentials and also to ensure the

converter remains stable.

For proper LED operation the output capacitor must be at least a 10µF ceramic. Larger capacitors such as 22µF

can be used if lower output voltage ripple is desired. To estimate the output voltage ripple considering the ripple

due to capacitor discharge (ΔVQ) and the ripple due to the capacitors ESR (ΔVESR) use the following equations:

For continuous conduction mode, the output voltage ripple due to the capacitor discharge is:

(1)

The output voltage ripple due to the output capacitors ESR is found by:

(2)

In ceramic capacitors the ESR is very low so assume that 80% of the output voltage ripple is due to capacitor

discharge and 20% from ESR. Table 14 lists different manufacturers for various output capacitors and their case

sizes suitable for use with the LM3561.

INPUT CAPACITOR SELECTION

Choosing the correct size and type of input capacitor helps minimize the voltage ripple caused by the switching

of the LM3561’s boost converter and reduces noise on the devices input terminal that can feed through and

disrupt internal analog signals. In the Typical Application Circuit a 10µF ceramic input capacitor works well. It is

important to place the input capacitor as close as possible to the LM3561’s input (IN) terminals. This reduces the

series resistance and inductance that can inject noise into the device due to the input switching currents.

Table 14 lists various input capacitors recommended for use with the LM3561.

Table 14. Recommended Input/Output Capacitors (X5R Dielectric)

Manufacturer Part Number Value Case Size Voltage Rating

TDK Corporation C1608JB0J106M 10µF 0603(1.6mm×0.8mm×0.8mm) 6.3V

TDK Corporation C2012JB1A106M 10µF 0805(2mm×1.25mm×1.25mm) 10V

TDK Corporation C2012JB0J226M 22µF 0805(2mm×1.25mm×1.25mm) 6.3V

Murata GRM21BR61A106KE19 10µF 0805(2mm×1.25mm×1.25mm) 10V

Murata GRM21BR60J226ME39L 22µF 0805(2mm×1.25mm×1.25mm) 6.3V

INDUCTOR SELECTION

The LM3561 is designed to use a 1µH to 2.2µH inductor. Table 15 lists various inductors that can work well with

the LM3561. When the device is boosting (VOUT > VIN) the inductor will typically be the biggest area of efficiency

loss in the circuit. Therefore, choosing an inductor with the lowest possible series resistance is important.

Additionally, the saturation rating of the inductor should be greater than the maximum operating peak current of

the LM3561. This prevents excess efficiency loss that can occur with inductors that operate in saturation. For

proper inductor operation and circuit performance ensure that the inductor saturation and the peak current limit

setting of the LM3561 is greater than IPEAK. This can be calculated by:

Product Folder Links: LM3561

( )

TRIP

- V

BIAS

)TRIP(T

TRIP

BIAS

( ) C25

R=TR °298

273+C°T 1

E-¹

R(T)

VBIAS

RBIAS

NTC

LED

OUT

IN SW

SDA

SCL

LM3561

Low Thermal

Resistance

Between LED

and R(T)

GND

VIN

PEAK

ILOAD

=KxL

I+'where L=I'IN xV ( )

INOUT - VV

OUTSW VxLxfx2

OUT

LM3561

www.ti.com

SNOSB44C –MARCH 2011–REVISED MAY 2013

(3)

ƒSW = 2MHz, and ηcan be found in the Typical Performance Characteristics plots.

Table 15. Recommended Inductors

Manufacturer L Part Number Dimensions (L×W×H) RDC ISAT

Coilcraft 1µH XPL2010-102ML 2mm×1.9mm×1mm 81mΩ1.6A

TDK 1µH VLS252012T-1R0N 2mm×2.5mm×1.2mm 73mΩ2.7A

TDK 1µH VLS2010-1R0N 2mm x 2mm x 1mm 90mΩ1.65A

TDK 1µH VLS2012ET-1R0N 2mm x 2mm x 1.2mm 71mΩ1.65A

TDK 1µH VLS20160ET-1R0N 2mm x 1.6mm x 0.95mm 100mΩ1.5A

TDK 1µH VLS252010ET-1R0N 2.5mm x 2mm x 1mm 70mΩ1.9A

NTC THERMISTOR SELECTION

Programming bit [4] of Configuration Register 1 with a (1) selects Thermal Comparator mode, making the

LEDI/NTC pin a comparator input for flash LED thermal sensing. The thermal sensing circuit consists of a

negative temperature coefficient (NTC) thermistor and a series resistor which forms a resistive divider (see

Figure 38).

Figure 38. NTC Circuit

The NTC thermistor senses the LEDs temperature via conducting the LEDs heat into the NTC thermistor. Heat

conduction is improved with a galvanic connection at GND (LED cathode and NTC thermistor GND terminal) and

by placing the thermistor in very close proximity to the flash LED.

NTC thermistors have a temperature to resistance relationship of:

(4)

where βis given in the thermistor datasheet and R25C is the thermistor's value at +25°C. RBIAS is chosen so that

it is equal to:

(5)

Product Folder Links: LM3561

C°x298EC°273

CT =° )(

LNC x°298 »

ª(VV TRIPBIAS x- )RC°25

RBIASVTRIP x

Temperature (°C)

60 50 60 70 80 90 100

VLED/NTC (V)

1.8

1.6

1.4

1.2

0.8

0.6

0.4

0.2

(TR )x:= k10 e -

+ 298

27393 1



1.215 k:

RBIAS is then: =

V1( )

V - 1Vx 1.8

1.215 k:972:

LM3561

SNOSB44C –MARCH 2011–REVISED MAY 2013

www.ti.com

where R(T)TRIP is the thermistor's value at the temperature trip point, VBIAS is the bias voltage for the thermistor

circuit, and VTRIP = 1V (typical). Choosing RBIAS here gives a more linear response around the temperature trip

voltage. For example with VBIAS = 1.8V and a thermistor whose nominal value at +25°C is 10kΩand a β=

3380K, the trip point is chosen to be +93°C. The value of R(T) at 93°C is:

(6)

Figure 39 shows the linearity of the thermistor resistive divider of the previous example.

Figure 39. Thermistor Resistive Divider Response vs Temperature

VLEDI/NTC vs Temp (VBIAS = 1.8V, THERMISTOR = 10kΩat +25C, β= 3380, RBIAS =972Ω)

Another useful equation for the thermistor resistive divider is developed by combining the equations for RBIAS,

and R(T) and solving for temperature. This gives the following relationship.

(7)

Using a spreadsheet such as Excel, different curves for the temperature trip point T(°C) can be created vs RBIAS,

Beta, or VBIAS in order to help better choose the thermal components for practical values of thermistors, series

resistors (R3), or reference voltages VBIAS.

NTC THERMISTOR PLACEMENT

The termination of the thermistor must be done directly to the cathode of the Flash LED in order to adequately

couple the heat from the LED into the thermistor. Consequentially, the noisy environment generated from the

switching of the LM3561's boost converter can introduce noise from GND into the thermistor sensing input. To

filter out this noise it is necessary to place a 0.1µF or larger ceramic capacitor close to the LEDI/NTC pin. The

filter capacitor's return must also connect with a low-impedance trace, as close as possible to the GND pin of the

LM3561.

Product Folder Links: LM3561

LM3561

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SNOSB44C –MARCH 2011–REVISED MAY 2013

Layout Recommendations

The high frequency and relatively large switching currents of the LM3561 make the choice of layout important.

The following steps should be used as a reference to ensure the device is stable and maintains proper voltage

and current regulation across its intended operating voltage and current range.

1. Place CIN on the top layer (same layer as the LM3561) and as close to the device as possible. The input

capacitor conducts the driver currents during the low-side MOSFET turn-on and turn-off and can see current

spikes over 500mA in amplitude. Connecting the input capacitor through short wide traces on both the IN

and GND terminals will reduce the inductive voltage spikes that occur during switching and which can corrupt

the VIN line.

2. Place COUT on the top layer (same layer as the LM3561) and as close as possible to the OUT and GND

terminal. The returns for both CIN and COUT should come together at one point, and as close to the GND pin

as possible. Connecting COUT through short wide traces will reduce the series inductance on the OUT and

GND terminals that can corrupt the VOUT and GND line and cause excessive noise in the device and

surrounding circuitry.

3. Connect the inductor on the top layer close to the SW pin. There should be a low-impedance connection

from the inductor to SW due to the large DC inductor current, and at the same time the area occupied by the

SW node should be small so as to reduce the capacitive coupling of the fast dV/dt present at SW that can

couple into nearby traces.

4. Avoid routing logic traces near the SW node so as to avoid any capacitively coupled voltages from SW onto

any high impedance logic lines such as TX1/TORCH/GPIO1, TX2/GPIO2/INT, HWEN, LEDI/NTC (NTC

mode), SDA, and SCL. A good approach is to insert an inner layer GND plane underneath the SW node and

between any nearby routed traces. This creates a shield from the electric field generated at SW.

5. Terminate the Flash LED cathode directly to the GND pin of the LM3561. If possible, route the LED return

with a dedicated path so as to keep the high amplitude LED current out of the GND plane. For a Flash LED

that is routed relatively far away from the LM3561, a good approach is to sandwich the forward and return

current paths over the top of each other on two adjacent layers. This will help in reducing the inductance of

the LED current paths.

6. The NTC Thermistor is intended to have its return path connected to the LED's cathode. This allows the

thermistor resistive divider voltage (VNTC) to trip the comparators threshold as VNTC is falling. Additionally, the

thermistor to LED cathode junction can have low thermal resistivity since both the LED and the thermistor

are electrically connected at GND. The draw back is that the thermistor's return will see the switching

currents from the LM3561's boost converter. Because of this, it is necessary to have a filter capacitor at the

NTC pin which terminates close to the GND of the LM3561 and which can conduct the switched currents to

GND.

Product Folder Links: LM3561

LM3561

SNOSB44C –MARCH 2011–REVISED MAY 2013

www.ti.com

REVISION HISTORY

Changes from Revision B (April 2013) to Revision C Page

• Changed layout of National Data Sheet to TI format .......................................................................................................... 31

Product Folder Links: LM3561

PACKAGE OPTION ADDENDUM

www.ti.com 16-Sep-2016

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM3561TME/NOPB ACTIVE DSBGA YFQ 12 250 Green (RoHS

& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 DV

LM3561TMX/NOPB ACTIVE DSBGA YFQ 12 3000 Green (RoHS

& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 DV

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

PACKAGE OPTION ADDENDUM

www.ti.com 16-Sep-2016

Addendum-Page 2

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM3561TME/NOPB DSBGA YFQ 12 250 178.0 8.4 1.35 1.75 0.76 4.0 8.0 Q1

LM3561TMX/NOPB DSBGA YFQ 12 3000 178.0 8.4 1.35 1.75 0.76 4.0 8.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 8-May-2013

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM3561TME/NOPB DSBGA YFQ 12 250 210.0 185.0 35.0

LM3561TMX/NOPB DSBGA YFQ 12 3000 210.0 185.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 8-May-2013

Pack Materials-Page 2

MECHANICAL DATA

YFQ0012xxx

www.ti.com

TMD12XXX (Rev B)

0.600

±0.075

. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.

B. This drawing is subject to change without notice.

NOTES:

4215079/A 12/12

D: Max =

E: Max =

1.64 mm, Min =

1.24 mm, Min =

1.58 mm

1.18 mm

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Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such

products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards

and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must

ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in

life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.

Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life

support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all

medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.

TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).

Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications

and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory

requirements in connection with such selection.

Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-

compliance with the terms and provisions of this Notice.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

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LM3561TMX/NOPB LM3561TME/NOPB