1
Copyright © 2010,Everlight Americas Inc. All Rights Reserved. Release Date :12-Mar-2015 Issue No:DSE-0012869 Rev.2
www.everlightamericas.com
SMD B
EASV1003GA0
Features
․Package in 8mm tape on 7〞diameter reel.
․Compatible with automatic placement equipment.
․Compatible with infrared and vapor phase reflow solder process.
․Mono-color type.
․Pb-free.
․The product itself will remain within RoHS compliant version.
․Compliance with EU REACH.
․Compliance Halogen Free .(Br <900 ppm ,Cl <900 ppm , Br+Cl < 1500 ppm).
Description
․The SMD LED is much smaller than lead frame type components,
thus enable smaller board size, higher packing density,
reduced storage space and finally smaller equipment to be obtained.
․Besides, lightweight makes them ideal for miniature applications. etc.
Applications
․Telecommunication: indicator and backlighting in telephone and fax.
․Flat backlight for LCD, switch and symbol.
․General
DATASHEET
SMD B
EASV1003GA0
2
Copyright © 2010,Everlight Americas Inc. All Rights Reserved. Release Date :12-Mar-2015 Issue No:DSE-0012869 Rev.2
www.everlightamericas.com
Device Selection Guide
Chip
Materials
Emitted Color
Resin Color
AlGaInP
Brilliant Yellow Green
Water Clear
Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Rating
Unit
Reverse Voltage
VR
5
V
Forward Current
IF
25
mA
Peak Forward Current
(Duty 1/10 @1KHz)
IFP
60
mA
Power Dissipation
Pd
60
mW
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +90
℃
Electrostatic Discharge
ESDHBM
2000
V
Soldering Temperature
Tsol
Reflow Soldering : 260 ℃ for 10 sec.
Hand Soldering : 350 ℃ for 3 sec.
Electro-Optical Characteristics (Ta=25℃)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Luminous Intensity
Iv
14.5
-----
36.0
mcd
IF=20mA
Viewing Angle
2θ1/2
-----
125
-----
deg
Peak Wavelength
λp
-----
575
-----
nm
Dominant Wavelength
λd
567.5
-----
575.5
nm
Spectrum Radiation
Bandwidth
△λ
-----
20
-----
nm
Forward Voltage
VF
1.75
----
2.35
V
Reverse Current
IR
-----
-----
10
μA
VR=5V
Note:
1.Tolerance of Luminous Intensity: ±11%
2.Tolerance of Dominant Wavelength ±1nm
3.Tolerance of Forward Voltage: ±0.05V
DATASHEET
SMD B
EASV1003GA0
3
Copyright © 2010,Everlight Americas Inc. All Rights Reserved. Release Date :12-Mar-2015 Issue No:DSE-0012869 Rev.2
www.everlightamericas.com
Bin Range of Luminous Intensity
Bin Code
Min.
Max.
Unit
Condition
L2
14.5
18.0
mcd
IF =20mA
M1
18.0
22.5
M2
22.5
28.5
N1
28.5
36.0
Bin Range Of Dom. Wavelength
Group
Bin Code
Min.
Max.
Unit
Condition
B
C15
567.5
569.5
nm
IF =20mA
C16
569.5
571.5
C17
571.5
535.5
C18
573.5
575.5
Bin Range Of Luminous Voltage
Group
Bin Code
Min.
Max.
Unit
Condition
B
0
1.75
1.95
V
IF =20mA
1
1.95
2.15
2
2.15
2.35
Note:
1.Tolerance of Luminous Intensity: ±11%
2.Tolerance of Dominant Wavelength ±1nm
3.Tolerance of Forward Voltage: ±0.05V
DATASHEET
SMD B
EASV1003GA0
4
Copyright © 2010,Everlight Americas Inc. All Rights Reserved. Release Date :12-Mar-2015 Issue No:DSE-0012869 Rev.2
www.everlightamericas.com
Typical Electro-Optical Characteristics Curves
Relative luminous intensity
Forward Current Derating Curve
Forward Current F
I (mA) %)
(
Luminous Intensity vs.
Ambient Temperature
Relative luminous intensity %)
(
Forward Current I (mA)
F
Forward Current I (mA)
F
Spectrum Distribution
Ta=25°C
Forward Current vs.
Forward Voltage Ta=25°C
Wavelength λ (nm) F
Forward Voltage V (V)
Forward Current
Luminous Intensity vs. Ta=25°C
Radiation Diagram Ta=25°C
Relative luminous intensity (%)
Ambient Temperature Ta (°C)
Ambient Temperature Ta (°C)
DATASHEET
SMD B
EASV1003GA0
5
Copyright © 2010,Everlight Americas Inc. All Rights Reserved. Release Date :12-Mar-2015 Issue No:DSE-0012869 Rev.2
www.everlightamericas.com
Package Dimension
Suggested pad dimension is just for reference only.
Please modify the pad dimension based on individual need.
Note: Tolerances unless mentioned ±0.1mm. Unit = mm
DATASHEET
SMD B
EASV1003GA0
6
Copyright © 2010,Everlight Americas Inc. All Rights Reserved. Release Date :12-Mar-2015 Issue No:DSE-0012869 Rev.2
www.everlightamericas.com
Moisture Resistant Packing Materials
Label Explanation
‧CPN: Customer’s Product Number
‧P/N: Product Number
‧QTY: Packing Quantity
‧CAT: Luminous Intensity Rank
‧HUE: Chromaticity Coordinates & Dom. Wavelength Rank
‧REF: Forward Voltage Rank
‧LOT No: Lot Number
Reel Dimensions
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
RoHS
Pb
CPN :
P N : XXXXXXXXXXXXX
XXXXXXXXXXXXX
QTY : XXX
LOT NO : XXXXXXXXXX
Reference : XXXXXXXX
CAT : XXX
HUE : XXX
REF : XXX
EVERLIGHT
MADE IN TAIWAN
DATASHEET
SMD B
EASV1003GA0
7
Copyright © 2010,Everlight Americas Inc. All Rights Reserved. Release Date :12-Mar-2015 Issue No:DSE-0012869 Rev.2
www.everlightamericas.com
Carrier Tape Dimensions: Loaded quantity 3000 PCS per reel
Bottom view Front view
Note: The tolerances unless mentioned is ±0.1mm ,Unit = mm
Moisture Resistant Packaging
Label Desiccant Label
Aluminum moisture-proof bag
DATASHEET
SMD B
EASV1003GA0
8
Copyright © 2010,Everlight Americas Inc. All Rights Reserved. Release Date :12-Mar-2015 Issue No:DSE-0012869 Rev.2
www.everlightamericas.com
Precautions For Use
1. Over-current-proof
Customer must apply resistors for protection, otherwise slight voltage shift will cause big
current change ( Burn out will happen ).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package: The LEDs should be kept at 30℃ or less and 90%RH or less.
2.3 After opening the package: The LED's floor life is 1 year under 30℃ or less and 60% RH or less.
If unused LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±5℃ for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile
Pre-heating
150~200°C
60~120sec.
Above 217°C
60~150sec.
260°C Max.
10sec. Max.
6°C/sec.Max.
Above255°C
30sec.Max.
3°C/sec.Max.
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
4.Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the
soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because
the damage of the product is often started at the time of the hand solder.
5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering
iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will
not be damaged by repairing.
DATASHEET
SMD B
EASV1003GA0
9
Copyright © 2010,Everlight Americas Inc. All Rights Reserved. Release Date :12-Mar-2015 Issue No:DSE-0012869 Rev.2
www.everlightamericas.com
Application Restrictions
High reliability applications such as military/aerospace, automotive safety/security systems,
and medical equipment may require different product. If you have any concerns, please contact
Everlight before using this product in your application. This specification guarantees the quality
and performance of the product as an individual component. Do not use this product beyond the
specification described in this document.
