March 2003 / B
Page 1
SEMICONDUCTOR
TAK CHEON
G
®
1.3 Watt DO-41 Hermetically
Sealed Glass Zener Voltage
Regulators
Absolute Maximum Ratings TA = 25°C unless otherwise noted
Parameter Value Units
Power Dissipation 1.3 W
Storage Temperature Range -65 to +200 °C
Operating Junction Temperature +200 °C
Lead Temperature (1/16” from case for 10 seconds) +230 °C
These ratings are limiting values above which the serviceability of the diode may be impaired.
Specification Features:
Zener Voltage Range 3.3 to 56 Volts
DO-41 Package (JEDEC)
Through-Hole Device Type Mounting
Hermetically Sealed Glass
Compression Bonded Construction
All external surfaces are corrosion resistant and leads are readily solderable
Cathode indicated by polarity band
Electrical Characteristics TA = 25°C unless otherwise noted
VZ @ IZT
(Volts)
Device Type VZ
Min
VZ
Max
IZT
(mA)
ZZT @ IZT
(Ω)
Max
IZK
(mA)
ZZK @ IZK
(Ω)
Max
IR @ VR
(µA)
Max
VR
(Volts)
TCBZX85C 3V3 3.1 3.5 80 20 1 400 40 1
TCBZX85C 3V6 3.4 3.8 60 20 1 500 20 1
TCBZX85C 3V9 3.7 4.1 60 15 1 500 20 1
TCBZX85C 4V3 4 4.6 50 13 1 500 3 1
TCBZX85C 4V7 4.4 5 45 13 1 500 3 1
TCBZX85C 5V1 4.8 5.4 45 10 1 500 1 1.5
TCBZX85C 5V6 5.2 6 45 7 1 400 1 2
TCBZX85C 6V2 5.8 6.6 35 4 1 300 1 3
TCBZX85C 6V8 6.4 7.2 35 3.5 1 300 1 4
TCBZX85C 7V5 7 7.9 35 3 0.5 200 1 4.5
TCBZX85C 8V2 7.7 8.7 25 5 0.5 200 1 6.2
TCBZX85C 9V1 8.5 9.6 25 5 0.5 200 1 6.9
TCBZX85C 10 9.4 10.6 25 7 0.5 200 0.5 7.5
TCBZX85C 11 10.4 11.6 20 8 0.5 300 0.5 8.2
TCBZX85C 12 11.4 12.7 20 9 0.5 350 0.5 9.1
TCBZX85C 13 12.4 14.1 20 10 0.5 400 0.5 10
TCBZX85C 15 13.8 15.6 15 15 0.5 500 0.5 11
TCBZX85C 16 15.3 17.1 15 15 0.5 500 0.5 12
TCBZX85C 18 16.8 19.1 15 20 0.5 500 0.5 13
TCBZX85C 20 18.8 21.2 10 24 0.5 600 0.5 15
TCBZX85C 22 20.8 23.3 10 25 0.5 600 0.5 16
TCBZX85C3V3 through TCBZX85C56 Series
Cathode Anode
ELECTRICAL SYMBOL
AXIAL LEAD
DO41
L
85C
xxx
DEVICE MARKING DIAGRAM
L : Lo
g
o
Device Code : TCBZX85C3V3
March 2003 / B
Page 2
SEMICONDUCTOR
TAK CHEON
G
®
Electrical Characteristics TA = 25°C unless otherwise noted
VZ @ IZT
(Volts)
Device Type VZ
Min
VZ
Max
IZT
(mA)
ZZT @ IZT
(Ω)
Max
IZK
(mA)
ZZK @ IZK
(Ω)
Max
IR @ VR
(µA)
Max
VR
(Volts)
TCBZX85C 24 22.8 25.6 10 25 0.5 600 0.5 18
TCBZX85C 27 25.1 28.9 8 30 0.25 750 0.5 20
TCBZX85C 30 28 32 8 30 0.25 1000 0.5 22
TCBZX85C 33 31 35 8 35 0.25 1000 0.5 24
TCBZX85C 36 34 38 8 40 0.25 1000 0.5 25
TCBZX85C 39 37 41 6 45 0.25 1000 0.5 27
TCBZX85C 43 40 46 6 50 0.25 1000 0.5 30
TCBZX85C 47 44 50 4 90 0.25 1500 0.5 33
TCBZX85C 51 48 54 4 115 0.25 1500 0.5 36
TCBZX85C 56 52 60 4 120 0.25 2000 0.5 39
VF Forward Voltage = 1.2 V Maximum @ IF = 200 mA for all types
Notes:
1. The type numbers listed have zener voltage min/max limits as shown and have a standard tolerance on the nominal zener
voltage.
2. For detailed information on price, availability and delivery of nominal zener voltages between the voltages shown and tighter
voltage tolerances, contact your nearest Tak Cheong Electronics representative.
3. The zener impedance is derived from the 60-cycle ac voltage, which results when an ac current having an rms value equal to
10% of the dc zener current (IZT or IZK) is superimposed to IZT or IZK.
Electrical Symbol Definition Typical Characteristics
Symbol Parameter
VZ Reverse Zener Voltage @ IZT
IZT Reverse Current
ZZT Maximum Zener Impedance @ IZT
IZK Reverse Current
ZZK Maximum Zener Impedance @ IZK
IR Reverse Leakage Current @ VR
VR Breakdown Voltage
IF Forward Current
VF Forward Voltage @ IF
Ordering Information
Device Package Quantity
TCBZX85Cxxx Bulk 5,000
TCBZX85Cxxx.TB Tape and Ammo 3,000
TCBZX85Cxxx.TR Tape and Reel 5,000
TCBZX85Cxxx Others (…contact Tak Cheong sales representatives)
Axial-Lead Tape Packaging Standards
This axial-lead component’s packaging requirements use in automatic testing and assembly equipment. And this standard practices for
lead-tape packaging of axial-lead components meets the requirements of EIA Standard RS-296-D “Lead-taping of Components on Axial
Lead Configuration for Automatic Insertion”.
V
I
(
mV
)
(
V
)
(
mA
)
(
mA
)
VF
IF
VR
IR
VZ
IZT
(
nA
)
March 2003 / B
Page 3
SEMICONDUCTOR
TAK CHEON
G
®
Tape & Reel Packaging Information
Tape & Reel
Outline
Reel Dimensions
DIM Millimeters
D1 356
D2 30
D3 84
W1 77.5
Quantity Per Reel
PKG Type Quantity Per Reel
DO-41 5,000
March 2003 / B
Page 4
SEMICONDUCTOR
TAK CHEON
G
®
Tape & Ammo Packaging Information
Tape & Ammo
Outline
Quantity Per Ammo
Box
PKG Type Quantity Per Box
DO-41 3,000
Taping Dimensions
Description Millimeters
Standard Width 52 26
Tape Spacing (B) 52 ± 0.69 26 +0.5 / -0
Component Pitch (C) 5.08 ± 0.4 5.08 ± 0.4
Untaped Lead (L1 – L2) ± 0.69 ± 0.69
Glass Offset (F) ± 0.69 ± 0.69
Bent (D) 1.2 Max 1.2 Max
Tape Width (G) 6.138 ± 0.576 6.138 ± 0.576
Tape Mismatch (E) 0.55 Max 0.55 Max
Taped Lead (G) 3.2 Min 3.2 Min
Lead Beyond Tape (H) 0 0
250mm x 80mm x 80mm
March 2003 / B
Page 5
SEMICONDUCTOR
TAK CHEON
G
®
Bulk Packaging Information
Bulk Outline
Quantity Per Box
PKG Type Quantity Per Box
DO-41 5,000
Plastic Bag
DO-41 500 x 10 Plastic Bag
Quantity Per Plastic Bag
190mm x 150mm x 65mm
March 2003 / B
Page 6
SEMICONDUCTOR
TAK CHEON
G
®
Package Outline
Package Case Outline
DO-41
D0-41
Millimeters Inches
DIM
Min Max Min Max
A 0.72 0.86 0.028 0.034
B 4.07 5.20 0.160 0.205
C 25.40 --- 1.000 ---
D 2.04 2.71 0.080 0.107
Notes:
1. All dimensions are within JEDEC standard.
2. DO41 polarity denoted by cathode band.
