0.2×(N-3)
0.05
0.2
0.05
0.4
0.05 0.2
0.05
0.16
0.05
(0.3)
0.5
0.052.25
0.050.5
0.05
0.42
0.05 0.2×(N-1)
0.05 0.42
0.05
0.65
0.050.2
0.05
0.27
0.05
0.4
0.05
0.16
0.05
0.2
0.05
0.27
0.05
推奨メタルマスク
開口部寸法
フットパターン幅寸法
フットパターン幅寸法
推奨メタルマスク開口部寸法
(PITCH)
(PITCH)
2
1
.
6
8
0.2
0.03
(STRUCTURE OF FPC)
FPC構成推奨仕様
64.00
56.008.00
4.00
4.00
4.00
56.00
20.00
4.00
8.004.00
4.00
13.00
15.00
24.00
36.00
1.00
3.00R
0.05
0.025
0.2
0.5MIN.
(OVERLAP)
2.8
0.5
(補強板)
(STIFFENER BOARD)
(PITCH)
(PITCH)
R0.15
0.05
TYP.(2)
0.2×(N+1)
0.05
0.2×(N-1)
0.02
0.2
0.05
0.4
0.02 0.2
0.2
0.05
0.2
0.15
0.65
0.1
0.75
0.1
1.3
0.1
1.8
0.3
0.2
0.02 0.4
0.02
+0.03
-0.02
-0.02
+0.03
・FPCについて(ABOUT FPC):
抜き方向は、導体側から補強板側を推奨致します。
補強フィルム材質は、ポリイミドを推奨致します。
接着剤は熱硬化接着剤を推奨します。
尚、接着剤の接点部への付着は導通不良の原因になりますので、染み出しが無い様、お願い致します。
RECOMMENDED PUNCHER DIRECTION : FROM CONDUCTOR SIDE TO STIFFNER FILM SIDE.
RECOMMENDED MATERIAL: STIFFENER FILM : POLYIMIDE
BONDING AGENT : THERMOSETTING AGENT
PLEASE PUT APPROPRIATE AMOUNT OF ADHESIVE ON ADHEREND
BECAUSE THERE IS A POSSIBILITY THAT THE EXTRA ADHESIVE
CAUSES THE DEFECT IN ELECTICAL CONTINUITY.
補強板長さが図面通り確保できない場合は、カバーレイと
補強板のオーバーラップ寸法を0.5mm以上としてください.
WHEN STIFFENER BOARD DIMENSION CAN NOT
SECURE AS DRAWING, PLEASE GIVE THE OVERLAP
SIZE OF COVER FILM AND STIFFENER BOARD AS 0.5mm MINIMUM.
1
1
1
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
CURRENT REV DESC:
EC NO: 611109
DRWN:
AISHII
2019/01/23
CHK'D:
TRSUZUKI
2019/01/28
APPR:
RTAKEUCHI
2019/01/28
INITIAL REVISION:
DRWN:
SKITAZAWA
2016/06/30
APPR:
TKUSUHARA01
2017/07/24
THIRD ANGLE PROJECTION
DRAWING SERIES
A3-SIZE
504070
DIMENSION UNITS
SCALE
mm
2:1
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
1.0 °
4 PLACES
±
3 PLACES
±
2 PLACES
±
1 PLACE
±
0 PLACES
±
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
0.2 FPC CONN. BACK FLIP
HOUSING ASSY LOW-HALOGEN
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
5040701000
PSD
000
B
MATERIAL NUMBER CUSTOMER SHEET NUMBER
SEE TABLE GENERAL 2 OF 2
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
DOCUMENT STATUS P1 RELEASE DATE 2019/01/28 04:33:57
1
A
1
A
2
B
2
B
3
C
3
C
4
D
4
D
5
E
5
E
6
F
6
F
7
7
8
8
9
9
10
10
推奨基板寸法
推奨マスク開口率
推奨ペースト厚
RECOMMEND SCREEN THICKNESS : 100μm
RECOMMEND SCREEN OPEN RATIO : 80%
RECOMMENDED
P.C.B PATTERN LAYOUT
: 80%
: 100μm
端子部メッキ:ソフト金メッキ(0.1μm以上)、
PLATING:SOFT GOLD PLATING(0.1μm MIN.),
THICKNESS
仕上がり厚さ
COVER FILM: POLYIMIDE(25μm)
カバーレイ:ポリイミド(25μm)
熱硬化接着剤
THERMOSETTING ADHESHIVE
導体部:銅箔(12μm)
COPPER FOIL(12μm)
BASE FILM: POLYIMIDE(25μm)
ベースフィルム:ポリイミド(25μm)
THERMOSETTING ADHESHIVE
熱硬化接着剤
STIFFNER BOARD: POLYIMIDE
補強板:ポリイミド
下地ニッケルメッキ(2~6μm)
NICKEL UNDER PLATING(2~6μm)
(仕上がり厚さ:0.2±0.03)
(THICKNESS:0.2±0.03)
適合する金めっきFPC推奨寸法
APPLICABLE FPC OF GOLD PLATING
RECOMMENDED DIMENSION