THIS DRAWING IS THE PROPERTY OF FAIRCHILD SEMICONDUCTOR CORPORATION. NO USE TH OTHER THAN AS A REFER R_ PR BM JEREOF SHALL BE MADE ITTED TO FAIRCHILD SEMICONDUCTOR CORPORATION FOR JOBS TO BE EXECUTED IN CONFORMITY WITH SUCH PROPOSALS UNLESS THE CONSENT OF SAID FAIRCHILD SEMICONDUCTOR RPORATION COPIED OR DUPLICATED OR ITS CONTENTS DISCLOSED. THE INFORMATION CONTAINED ON THIS DRAWING IS CONFIDENTIAL AND PROPRIETARY. ENCE FOR PROPOSALS AS SU HAS PREVIOUSLY BEEN OBTAINED. NO PART OF THIS DRAWING SHALL BE TOP VIEW 18 1716 1514 13 19 12 20 11 21 10 0 22 9" 23 8 24 @ 7 123456 4.00 | 1.00 MAX BOTTOM VIEW RO.15 jt _t NOTES: A. THIS PACKAGE CONFORMS TO JEDEC MO220 VGGD-5 VARIATION B. ALL DIMENSIONS ARE IN MILLIMETERS AND TYPICAL. C. PACKAGE BASE MATERIAL: COPPER a = EXPOSED METAL CONTACT PADS: Ni/Pd/Au PPF OR MATT Sn D. DIE PADDLE SIZE: 2.7 X 2.7 E. SMT EXPOSURE: THIS DEVICE WILL WITHSTAND EXPOSURE TO TEMPERATURES OF 240C MAXIMUM FOR DWELL TIME OF 10 SECONDS MAXIMUM. MKTMLP24DrevA REVISIONS LTR DESCRIPTION EDCN DATE BY/APPD A [RELEASE 10 DOCUMENT CONTROL}MASS ECN UPDATE] 10/4/06] Haim UUUUUU UVUUUU o0q0qg00g oo00g00 4.00 SEE BOTTOM VIEW FOR RECOMMENDED LAND PATTERN DIMENSIONS PIN 1 INDICATOR ISOMETRIC VIEW APPROVALS DATE FAIRCHILD TYNGSBORO, MA. 01879 MARC DUBOIS 1/7/05 BEMICONDUCTORe 300 POTASH HILL RD. ENGR: CH 24LD,MLP,QUAD, JEDEC MO220,4MM SQUARE _}+ LN n/al MKT-MLP240 [A DO NOT SCALE DRAWING| SHEET 1 of 1