DS90CF363B
www.ti.com
SNLS180D –JULY 2004–REVISED APRIL 2013
+3.3V Programmable LVDS Transmitter 18-Bit Flat Panel Display (FPD) Link -65 MHz
Check for Samples: DS90CF363B
1FEATURES • 345 mV (typ) Swing LVDS Devices for Low EMI
• PLL Requires no External Components
2• No Special Start-up Sequence Required
between Clock/Data and /PD Pins. Input Signal • Compatible with TIA/EIA-644 LVDS Standard
(Clock and Data) can be Applied Either Before • Low Profile 48-lead TSSOP Package
or After the Device is Powered. • Improved Replacement for:
• Support Spread Spectrum Clocking up to – SN75LVDS84, DS90CF363A
100KHz Frequency Modulation & Deviations of
±2.5% Center Spread or −5% Down Spread. DESCRIPTION
• "Input Clock Detection" Feature will Pull all The DS90CF363B transmitter converts 21 bits of
LVDS Pairs to Logic Low when Input Clock is CMOS/TTL data into three LVDS (Low Voltage
Missing and when /PD Pin is Logic High. Differential Signaling) data streams. A phase-locked
transmit clock is transmitted in parallel with the data
• 18 to 68 MHz Shift Clock Support streams over a fourth LVDS link. Every cycle of the
• Best–in–Class Set & Hold Times on TxINPUTs transmit clock 21 bits of input data are sampled and
• Tx Power Consumption < 130 mW (typ) transmitted. At a transmit clock frequency of 65 MHz,
@65MHz Grayscale 18 bits of RGB data and 3 bits of LCD timing and
control data (FPLINE, FPFRAME, DRDY) are
• 40% Less Power Dissipation than BiCMOS transmitted at a rate of 455 Mbps per LVDS data
Alternatives channel. Using a 65 MHz clock, the data throughput
• Tx Power-Down Mode < 37μW (typ) is 170 Mbytes/sec. The DS90CF363B is fixed as a
• Supports VGA, SVGA, XGA and Dual Pixel Falling edge strobe transmitter and will interoperate
SXGA. with a Falling edge strobe Receiver (DS90CF366)
without any translation logic.
• Narrow Bus Reduces Cable Size and Cost
• Up to 1.3 Gbps Throughput This chipset is an ideal means to solve EMI and
cable size problems associated with wide, high speed
• Up to 170 Megabytes/sec Bandwidth TTL interfaces.
Block Diagram
Figure 1. DS90CF363B
See Package Number DGG0048A
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2004–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
DS90CF363B
SNLS180D –JULY 2004–REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1)(2)
Value Unit
Supply Voltage (VCC)−0.3 to +4 V
CMOS/TTL Input Voltage −0.3 to (VCC + 0.3) V
LVDS Driver Output Voltage −0.3 to (VCC + 0.3) V
LVDS Output Short Circuit
Duration Continuous
Junction Temperature +150 °C
Storage Temperature −65 to +150 °C
Lead Temperature
(Soldering, 4 sec) +260 °C
Maximum Package Power Dissipation Capacity @ 25°C
DGG-48 (TSSOP) Package: DS90CF363B 1.98 W
Package Derating:
DS90CF363B 16 mW/°C above +25°C
ESD Rating (HBM, 1.5 kΩ, 100 pF) 7 kV
ESD Rating (EIAJ, 0Ω, 200 pF) 500 V
(1) Absolute Maximum Ratings are those values beyond which the safety of the device cannot be verified. They are not meant to imply that
the device should be operated at these limits. Electrical Characteristics specify conditions for device operation.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
Recommended Operating Conditions Min Nom Max Units
Supply Voltage (VCC) 3.0 3.3 3.6 V
Operating Free Air Temperature (TA)−10 +25 +70 °C
Supply Noise Voltage (VCC) 200 mVPP
TxCLKIN frequency 18 68 MHz
Electrical Characteristics(1)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol Parameter Conditions Min Typ(2) Max Units
CMOS/TTL DC SPECIFICATIONS
VIH High Level Input Voltage 2.0 VCC V
VIL Low Level Input Voltage GND 0.8 V
VCL Input Clamp Voltage ICL =−18 mA −0.79 −1.5 V
IIN Input Current V IN = 0.4V, 2.5V or VCC +1.8 +10 μA
VIN = GND −10 0 μA
LVDS DC SPECIFICATIONS
VOD Differential Output Voltage RL= 100Ω250 345 450 mV
ΔVOD Change in VOD between complimentary 35 mV
output states
VOS Offset Voltage (3) 1.13 1.25 1.38 V
ΔVOS Change in VOS between complimentary 35 mV
output states
IOS Output Short Circuit Current VOUT = 0V, RL= 100Ω −3.5 −5 mA
(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground
unless otherwise specified (except VOD and ΔVOD ).
(2) Typical values are given for VCC = 3.3V and T A= +25°C unless specified otherwise.
(3) VOS previously referred as VCM.
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SNLS180D –JULY 2004–REVISED APRIL 2013
Electrical Characteristics(1) (continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol Parameter Conditions Min Typ(2) Max Units
IOZ Output TRI-STATE Current Power Down = 0V, ±1 ±10 μA
VOUT = 0V or V CC
TRANSMITTER SUPPLY CURRENT
ICCTW Transmitter Supply Current RL= 100Ω, f = 25 MHz 29 40 mA
Worst Case CL= 5 pF, f = 40 MHz 34 45 mA
Worst Case Pattern f = 65 MHz 42 55 mA
(Figure 2 and Figure 5 )"
Typ " values are given for
VCC = 3.6V and T A=
+25°C, " Max " values are
given for V CC = 3.6V and T
A=−10°C
ICCTG Transmitter Supply Current RL= 100Ω, f = 25 MHz 28 40 mA
16 Grayscale CL= 5 pF, f = 40 MHz 32 45 mA
16 Grayscale Pattern f = 65 MHz 39 50 mA
(Figure 3 and Figure 5 )"
Typ " values are given for
VCC = 3.6V and T A=
+25°C, " Max " values are
given for V CC = 3.6V and T
A=−10°C
ICCTZ Transmitter Supply Current Power Down = Low 11 150 μA
Power Down Driver Outputs in TRI-STATE under
Power Down Mode
Recommended Transmitter Input Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol Parameter Min Typ Max Units
TCIT TxCLK IN Transition Time (Figure 6 )5 ns
TCIP TxCLK IN Period (Figure 7 )14.7 T 50.0 ns
TCIH TxCLK IN High Time (Figure 7 )0.35T 0.5T 0.65T ns
TCIL TxCLK IN Low Time (Figure 7 )0.35T 0.5T 0.65T ns
TXIT TxIN, and Power Down pin transition Time 1.5 6.0 ns
TXPD Minimum pulse width for Power Down pin signal 1 us
Transmitter Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol Parameter Min Typ Max Units
LLHT LVDS Low-to-High Transition Time (Figure 5 )0.75 1.4 ns
LHLT LVDS High-to-Low Transition Time (Figure 5 )0.75 1.4 ns
TPPos0 Transmitter Output Pulse Position for Bit 0 (Figure 12 )(1) f = 65 −0.20 0 +0.20 ns
MHz
TPPos1 Transmitter Output Pulse Position for Bit 1 2.00 2.20 2.40 ns
TPPos2 Transmitter Output Pulse Position for Bit 2 4.20 4.40 4.60 ns
TPPos3 Transmitter Output Pulse Position for Bit 3 6.39 6.59 6.79 ns
TPPos4 Transmitter Output Pulse Position for Bit 4 8.59 8.79 8.99 ns
TPPos5 Transmitter Output Pulse Position for Bit 5 10.70 10.99 11.19 ns
TPPos6 Transmitter Output Pulse Position for Bit 6 12.99 13.19 13.39 ns
(1) The Minimum and Maximum Limits are based on statistical analysis of the device performance over process, voltage, and temperature
ranges. This parameter is functionality tested only on Automatic Test Equipment (ATE).
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Transmitter Switching Characteristics (continued)
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol Parameter Min Typ Max Units
TPPos0 Transmitter Output Pulse Position for Bit 0 (Figure 12 )(1) f = 40 −0.25 0 +0.25 ns
MHz
TPPos1 Transmitter Output Pulse Position for Bit 1 3.32 3.57 3.82 ns
TPPos2 Transmitter Output Pulse Position for Bit 2 6.89 7.14 7.39 ns
TPPos3 Transmitter Output Pulse Position for Bit 3 10.46 10.71 10.96 ns
TPPos4 Transmitter Output Pulse Position for Bit 4 14.04 14.29 14.54 ns
TPPos5 Transmitter Output Pulse Position for Bit 5 17.61 17.86 18.11 ns
TPPos6 Transmitter Output Pulse Position for Bit 6 21.18 21.43 21.68 ns
TPPos0 Transmitter Output Pulse Position for Bit 0 (Figure 12 )(1) f = −0.45 0 +0.45 ns
25MHz
TPPos1 Transmitter Output Pulse Position for Bit 1 5.26 5.71 6.16 ns
TPPos2 Transmitter Output Pulse Position for Bit 2 10.98 11.43 11.88 ns
TPPos3 Transmitter Output Pulse Position for Bit 3 16.69 17.14 17.59 ns
TPPos4 Transmitter Output Pulse Position for Bit 4 22.41 22.86 23.31 ns
TPPos5 Transmitter Output Pulse Position for Bit 5 28.12 28.57 29.02 ns
TPPos6 Transmitter Output Pulse Position for Bit 6 33.84 34.29 34.74 ns
TSTC TxIN Setup to TxCLK IN (Figure 7 )2.5 ns
THTC TxIN Hold to TxCLK IN (Figure 7 )0.5 ns
TCCD TxCLK IN to TxCLK OUT Delay (Figure 8 )50% duty cycle input clock is assumed, T 3.011 6.082 ns
A=−10°C, and 65MHz for " Min ", T A= 70°C, and 25MHz for " Max ", VCC = 3.6V
SSCG Spread Spectrum Clock support; Modulation frequency with a linear f = 25 100KHz ±
profile (2) MHz 2.5%/−5%
f = 40 100KHz ±
MHz 2.5%/−5%
f = 65 100KHz ±
MHz 2.5%/−5%
TPLLS Transmitter Phase Lock Loop Set (Figure 9 )10 ms
TPDD Transmitter Power Down Delay (Figure 11 )100 ns
(2) Care must be taken to ensure TSTC and THTC are met so input data are sampling correctly. This SSCG parameter only shows the
performance of tracking Spread Spectrum Clock applied to TxCLK IN pin, and reflects the result on TxCLKOUT+ and TxCLK−pins.
AC Timing Diagrams
Figure 2. “Worst Case” Test Pattern
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SNLS180D –JULY 2004–REVISED APRIL 2013
The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and CMOS/TTL I/O.
The 16 grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern
approximates signal switching needed to produce groups of 16 vertical stripes across the display.
Figure 2 and Figure 3 show a falling edge data strobe (TxCLK IN/RxCLK OUT).
Recommended pin to signal mapping. Customer may choose to define differently.
Figure 3. “16 Grayscale” Test Pattern
Figure 4. DS90CF363B (Transmitter) LVDS Output Load
Figure 5. DS90CF363B (Transmitter) LVDS Transition Times
Figure 6. DS90CF363B (Transmitter) Input Clock Transition Time
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Figure 7. DS90CF363B (Transmitter) Setup/Hold and High/Low Times (Falling Edge Strobe)
Figure 8. DS90CF363B (Transmitter) Clock In to Clock Out Delay (Falling Edge Strobe)
Figure 9. DS90CF363B (Transmitter) Phase Lock Loop Set Time
Figure 10. 21 Parallel TTL Data Inputs Mapped to LVDS Outputs
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SNLS180D –JULY 2004–REVISED APRIL 2013
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DS90CF363B PIN DESCRIPTIONS — FPD LINK TRANSMITTER
Pin Name I/O No. Description
TxIN I 21 TTL level input. This includes: 6 Red, 6 Green, 6 Blue, and 3 control lines—FPLINE, FPFRAME and
DRDY (also referred to as HSYNC, VSYNC, Data Enable).
TxOUT+ O 3 Positive LVDS differential data output.
TxOUT−O 3 Negative LVDS differential data output.
FPSHIFT IN I 1 TTL Ievel clock input. The falling edge acts as data strobe. Pin name TxCLK IN.
TxCLK OUT+ O 1 Positive LVDS differential clock output.
TxCLK OUT−O 1 Negative LVDS differential clock output.
PWR DOWN I 1 TTL level input. Assertion (low input) TRI-STATES the outputs, ensuring low current at power down.
See Applications Information .
VCC I 4 Power supply pins for TTL inputs.
GND I 4 Ground pins for TTL inputs.
PLL VCC I 1 Power supply pin for PLL.
PLL GND I 2 Ground pins for PLL.
LVDS VCC I 1 Power supply pin for LVDS outputs.
LVDS GND I 3 Ground pins for LVDS outputs.
NC 1 No connect
APPLICATIONS INFORMATION
The DS90CF363B are backward compatible with the DS90C363/DS90CF363A and are a pin-for-pin
replacement.
This device may also be used as a replacement for the DS90CF563 (5V, 65MHz) and DS90CF561 (5V, 40MHz)
FPD-Link Transmitters with certain considerations/modifications:
1. Change 5V power supply to 3.3V. Provide this supply to the VCC, LVDS VCC and PLL VCC of the transmitter.
TRANSMITTER INPUT PINS
The DS90CF363B transmitter input and control inputs accept 3.3V LVTTL/LVCMOS levels. They are not 5V
tolerant.
TRANSMITTER INPUT CLOCK/DATA SEQUENCING
The DS90CF363B does not require any special requirement for sequencing of the input clock/data and PD
(PowerDown) signal. The DS90CF363B offers a more robust input sequencing feature where the input clock/data
can be inserted after the release of the PD signal. In the case where the clock/data is stopped and reapplied,
such as changing video mode within Graphics Controller, it is not necessary to cycle the PD signal. However,
there are in certain cases where the PD may need to be asserted during these mode changes. In cases where
the source (Graphics Source) may be supplying an unstable clock or spurious noisy clock output to the LVDS
transmitter, the LVDS Transmitter may attempt to lock onto this unstable clock signal but is unable to do so due
the instability or quality of the clock source. The PD signal in these cases should then be asserted once a stable
clock is applied to the LVDS transmitter. Asserting the PWR DOWN pin will effectively place the device in reset
and disable the PLL, enabling the LVDS Transmitter into a power saving standby mode. However, it is still
generally a good practice to assert the PWR DOWN pin or reset the LVDS transmitter whenever the clock/data is
stopped and reapplied but it is not mandatory for the DS90CF363B.
SPREAD SPECTRUM CLOCK SUPPORT
The DS90CF363B can support Spread Spectrum Clocking signal type inputs. The DS90CF363B outputs will
accurately track Spread Spectrum Clock/Data inputs with modulation frequencies of up to 100KHz (max.)with
either center spread of ±2.5% or down spread -5% deviations.
POWER SOURCES SEQUENCE
In typical applications, it is recommended to have VCC, LVDS VCC and PLL VCC from the same power source with
three separate de-coupling bypass capacitor groups. There is no requirement on which VCC entering the device
first.
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SNLS180D –JULY 2004–REVISED APRIL 2013
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REVISION HISTORY
Changes from Revision C (April 2013) to Revision D Page
• Changed layout of National Data Sheet to TI format ............................................................................................................ 9
10 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated
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PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
DS90CF363BMT/NOPB ACTIVE TSSOP DGG 48 38 RoHS & Green SN Level-2-260C-1 YEAR -10 to 70 DS90CF363BMT
DS90CF363BMTX/NOPB ACTIVE TSSOP DGG 48 1000 RoHS & Green SN Level-2-260C-1 YEAR -10 to 70 DS90CF363BMT
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
DS90CF363BMTX/NOPB TSSOP DGG 48 1000 330.0 24.4 8.6 13.2 1.6 12.0 24.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Apr-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DS90CF363BMTX/NOPB TSSOP DGG 48 1000 367.0 367.0 45.0
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Apr-2013
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
8.3
7.9 TYP
1.2
1.0
46X 0.5
48X 0.27
0.17
2X
11.5
(0.15) TYP
0 - 8 0.15
0.05
0.25
GAGE PLANE
0.75
0.50
A
12.6
12.4
NOTE 3
B6.2
6.0
4214859/B 11/2020
TSSOP - 1.2 mm max heightDGG0048A
SMALL OUTLINE PACKAGE
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-153.
148
0.08 C A B
25
24
PIN 1 ID
AREA
SEATING PLANE
0.1 C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 1.350
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EXAMPLE BOARD LAYOUT
(7.5)
0.05 MAX
ALL AROUND 0.05 MIN
ALL AROUND
48X (1.5)
48X (0.3)
46X (0.5)
(R0.05)
TYP
4214859/B 11/2020
TSSOP - 1.2 mm max heightDGG0048A
SMALL OUTLINE PACKAGE
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE:6X
1
24 25
48
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
(7.5)
46X (0.5)
48X (0.3)
48X (1.5)
(R0.05) TYP
4214859/B 11/2020
TSSOP - 1.2 mm max heightDGG0048A
SMALL OUTLINE PACKAGE
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
SYMM
SYMM
1
24 25
48
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:6X
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUAR Y 1998
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
4040078/F 12/97
48 PINS SHOWN
0,25
0,15 NOM
Gage Plane
6,00
6,20 8,30
7,90
0,75
0,50
Seating Plane
25
0,27
0,17
24
A
48
1
1,20 MAX
M
0,08
0,10
0,50
0°–8°
56
14,10
13,90
48
DIM
A MAX
A MIN
PINS **
12,40
12,60
64
17,10
16,90
0,15
0,05
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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