10
Types NC 12 NC 20
IEC SIZE : 0805 IEC SIZE : 1206
Terminations Silver – palladium – platinum metallization
Marking On packaging only
Climatic category 40/125/56
Operating temperature -55°C to +150°C
Tolerance on Rn (25°C) ±5%, ±10%, ±20%
Maximum dissipation at 25°C 0.12 W 0.24 W
Thermal dissipation factor 2 mW/°C 4 mW/°C
Thermal time constant 5 s 7 s
NTC SMD Thermistors
NC 12 – NC 20
Chip thermistors are a high quality and low cost device espe-
cially developed for surface mounting applications. They are
widely used for temperature compensation but can also
achieve temperature control of printed circuits. Its silver -
palladium - platinum metallization provides a high degree of
resistance to dewetting of the terminations during soldering
(typically 260°C / 30 s).
APPLICATIONS
• LCD compensation
• Battery packs
• Mobile phones
• CD players
• Heating systems
• Air-conditioning systems
• Temperature control of Switch Mode Power Supplies
• Compensation of pressure sensors
• Protection of power transistors in various electronic circuits
2 (.079) ± 0.3 (.012)
1.25 (.049)
± 0.2 (.008)
0.5 (.020)
... 1.3 (.051)
0.2 (.008) min 0.2 (.008) min
3.2 (.126) ± 0.4 (.016)
0.2 (.008) min 0.2 (.008) min
1.6 (.063)
± 0.25 (.010)
0.5 (.020)
... 1.5 (.059)
Resistance - Temperature characteristics: pages 36 to 40.
HOW TO ORDER
NC 20
Type
K 0
Material Code
K
(See tables pages 11, 36-40)
0103
Resistance
10,000 Ω
M
Tolerance
M (±20%)
J (±5%)
K (±10%)
BA
Suffix: Packaging
– –: Bulk
BA: Plastic tape
(180mm diam. reel)
BE: Plastic tape (1/2 reel)
BC: Plastic tape
(330mm diam. reel)
BB: Cardboard tape
(180mm diam. reel)
BF: Cardboard tape (1/2 reel)
BD: Cardboard tape
(330mm diam. reel)
DIMENSIONS: millimeters (inches)
11
NTC SMD Thermistors
NC 12 – NC 20
NC 12
IEC SIZE : 0805
Types Rn at 25°C Material B (K) at 25°C
(Ω) Code (B/B )(%/°C)
NC 12 KC 0 180 18
NC 12 KC 0 220 22
NC 12 KC 0 270 27
NC 12 KC 0 330 33
NC 12 KC 0 390 39 KC 3470 ± 5% – 3.9
NC 12 KC 0 470 47
NC 12 KC 0 560 56
NC 12 KC 0 680 68
NC 12 KC 0 820 82
NC 12 KC 0 101 100
NC 12 MC 0 121 120
NC 12 MC 0 151 150
NC 12 MC 0 181 180
NC 12 MC 0 221 220
NC 12 MC 0 271 270
NC 12 MC 0 331 330
NC 12 MC 0 391 390
NC 12 MC 0 471 470
NC 12 MC 0 561 560 MC 3910 ± 3% – 4.4
NC 12 MC 0 681 680
NC 12 MC 0 821 820
NC 12 MC 0 102 1,000
NC 12 MC 0 122 1,200
NC 12 MC 0 152 1,500
NC 12 MC 0 182 1,800
NC 12 MC 0 222 2,200
NC 12 MC 0 272 2,700
NC 12 MC 0 332 3,300
NC 12 J 0 0332 3,300
NC 12 J 0 0392 3,900 J 3480 ± 3% – 3.9
NC 12 J 0 0472 4,700
NC 12 J 0 0562 5,600
NC 12 K 0 0682 6,800
NC 12 K 0 0822 8,200 K 3630 ± 3% – 4.0
NC 12 K 0 0103 10,000
NC 12 K 0 0123 12,000
NC 12 L 0 0153 15,000 L 3790 ± 3% – 4.2
NC 12 L 0 0183 18,000
NC 12 M 0 0223 22,000
NC 12 M 0 0273 27,000 M 3950 ± 3% – 4.4
NC 12 M 0 0333 33,000
NC 12 M 0 0393 39,000
NC 12 N 0 0473 47,000 N 4080 ± 3% – 4.6
NC 12 N 0 0563 56,000
NC 12 L 2 0683 68,000 L2 3805 ± 3% – 4.1
NC 12 N 0 0823 82,000 N 4080 ± 3% – 4.6
NC 12 P 0 0104 100,000
NC 12 P 0 0124 120,000 P 4220 ± 3% – 4.7
NC 12 P 0 0154 150,000
NC 12 P 0 0184 180,000
NC 12 Q 0 0224 220,000 Q 4300 ± 3% -4.7
NC 20
IEC SIZE : 1206
Types Rn at 25°C Material B (K) at 25°C
(Ω) Code (B/B )(%/°C)
NC 20 KC 0 100 10
NC 20 KC 0 120 12
NC 20 KC 0 150 15
NC 20 KC 0 180 18
NC 20 KC 0 220 22
NC 20 KC 0 270 27 KC 3470 ± 5% – 3.9
NC 20 KC 0 330 33
NC 20 KC 0 390 39
NC 20 KC 0 470 47
NC 20 KC 0 560 56
NC 20 KC 0 680 68
NC 20 KC 0 820 82
NC 20 KC 0 101 100
NC 20 MC 0 121 120
NC 20 MC 0 151 150
NC 20 MC 0 181 180
NC 20 MC 0 221 220
NC 20 MC 0 271 270
NC 20 MC 0 331 330
NC 20 MC 0 391 390 MC 3910 ± 3% – 4.4
NC 20 MC 0 471 470
NC 20 MC 0 561 560
NC 20 MC 0 681 680
NC 20 MC 0 821 820
NC 20 MC 0 102 1,000
NC 20 MC 0 122 1,200
NC 20 MC 0 152 1,500
NC 20 I 0 0182 1,800
NC 20 I 0 0222 2,200
NC 20 I 0 0272 2,700 I 3250 ± 5% – 3.7
NC 20 I 0 0332 3,300
NC 20 J 0 0392 3,900
NC 20 J 0 0472 4,700 J 3480 ± 3% – 3.9
NC 20 J 0 0562 5,600
NC 20 J 0 0682 6,800
NC 20 K 0 0822 8,200
NC 20 K 0 0103 10,000 K 3630 ± 3% – 4.0
NC 20 K 0 0123 12,000
NC 20 K 0 0153 15,000
NC 20 L 0 0183 18,000 L 3790 ± 3% – 4.2
NC 20 L 0 0223 22,000
NC 20 M 0 0273 27,000
NC 20 M 0 0333 33,000 M 3950 ± 3% – 4.4
NC 20 M 0 0393 39,000
NC 20 M 0 0473 47,000
NC 20 N 0 0563 56,000
NC 20 N 0 0683 68,000 N 4080 ± 3% – 4.6
NC 20 N 0 0823 82,000
NC 20 N 0 0104 100,000
NC 20 P 0 0124 120,000
NC 20 P 0 0154 150,000 P 4220 ± 3% – 4.7
NC 20 P 0 0184 180,000
NC 20 P 0 0224 220,000
NC 20 Q 0 0274 270,000
NC 20 Q 0 0334 330,000 Q 4300 ± 3% – 4.7
NC 20 Q 0 0394 390,000
NC 20 Q 0 0474 470,000
NC 20 R 0 0564 560,000
NC 20 R 0 0684 680,000 R 4400 ± 3% – 4.8
NC 20 R 0 0824 820,000
NC 20 R 0 0105 1,000,000
(1) ± 5%
(2) ± 3%
(1) ± 5%
(2) ± 3%
TABLE OF VALUES
16
Packaging for Automatic Insertion
NTC Chip Thermistors / NC/NB Series
AUTOMATIC INSERTION
Super 8 Plastic Tape Packaging:
The mechanical and dimensional reel characteristics are in
accordance with the IEC publication 286-3.
R = 0.3 (.012) Max.
Max
3°
Max
3°
Max
3°
Max
3°
Cover Tape
30µ ± 5µ
T
K
A1
B1
B0
D0 P2
P0
W
Hole
F
E
A0
5.5 (.217)
±0.2 (.008)
Direction of
unreeling
+0.2 (.008)
-0
1 (.039)
Designation Symbol Value Tolerance
Tape width W 8 ±0.2
Tape thickness T 0.4 max.
Pitch of the sprocket holes P0 4 ±0.1
Diameter of the sprocket holes D0 1.5 ±0.1
-0
Distance E 1.75 ±0.1
Distance (center to center) F 3.5 ±0.05
Distance (center to center) P2 2 ±0.1
Sizes of the NC 12 (0805) A0 1.5 ±0.1
cavities B0 2.4 ±0.1
K 1.4 max. K ±0.1
(size is adjustable)
(K = t1 +0.2)
NC 20 (1206) A0 1.95 ±0.1
B0 3.55 ±0.1
K 1.5 max. K ±0.1
(size is adjustable)
(K = t1 +0.2)
Bottom side
Reel
Upper side
Direction of unreeling
Reel
according to
ISO/DIS 3639-2
ø 12.75 (.502)
+ 0.15 (.006)
- 0
ø180 (7.09)
+ 0
- 2 (.079)
ø 20.5 (.087)
+ 0.5 (.020)
- 0
8.4 (.331)
+0.15 (.006)
14.4 (.567)
max.
ø 62 (2.44)
± 1.5 (.059)
QUANTITY PER REEL
Type Suffix Qty Per Reel
NC - NB 12 BA 4000
BE 2000
NC 20 - NB 20 BA 3000
BE 1500
17
Packaging for Automatic Insertion
NTC Chip Thermistors / NC/NB Series
AUTOMATIC INSERTION
8mm Paper Tape Packaging:
The mechanical and dimensional reel characteristics
are in accordance with the IEC publication 286-3.
P0
B0
P1
P2
D0
T
TOP
COVER
TAPE
BOTTOM
COVER
TAPE
CENTER LINES
OF CAVITY
CAVITY SIZE
SEE NOTE 1
10 PITCHES CUMULATIVE
TOLERANCE ON TAPE
0.20mm (0.008)
E1
F
G
User Direction of Feed
E2
W
T1
T1A0
Designation Symbol Value Tolerance
Tape width W 8 -.0.1/+0.3
Tape thickness T 1.1 max.
Pitch of the sprocket holes P04 ±0.1
Diameter of the sprocket holes D0
1.5 ±0.1
-0/+0.1
Distance E11.75 ±0.1
Distance (center to center) F 3.5 ±0.05
Distance (center to center) P22 ±0.05
Cover tape thickness T10.10 max.
Distance E26.25 min.
Distance G 0.75 min.
Component pitch 0805/0603 P1
4 ±0.1
0402 2 ±0.1
Bottom side
Reel
Upper side
Direction of unreeling
Reel
according to
ISO/DIS 3639-2
ø 12.75 (.502)
+ 0.15 (.006)
- 0
ø180 (7.09)
+ 0
- 2 (.079)
ø 20.5 (.087)
+ 0.5 (.020)
- 0
8.4 (.331)
+0.15 (.006)
14.4 (.567)
max.
ø 62 (2.44)
± 1.5 (.059)
QUANTITY PER REEL
Type Suffix Qty Per Reel
NB - NC 12 BB 4000
NB 21 BF 2000
NB 23 BB 10000
BF 5000
STORAGE
Good solderability is maintained for at least twelve months,
provided the components are stored in their “as received”
packaging at less than 40°C and 70% RH.
SOLDERABILITY / LEACHING
Terminations to be well soldered after immersion in a 60/40
tin/lead solder bath at 235 ± 5°C for 2 ± 1 seconds.
Terminations will resist leaching for at least the immersion
times and conditions recommendations shown below.
NB products are compatible with a wide range of soldering
conditions consistent with good manufacturing practice for
surface mount components. This includes Pb free reflow
processes with peak temperatures up to 270ºC.
Recommended profiles for reflow and wave soldering are
shown below for reference.
NC products are recommended for lead soldering application
or gluing techniques.
Surface Mounting Guide
Chip Thermistor – Application Notes
REFLOW SOLDERING
WAVE SOLDERING
18
P/N Termination Solder Solder Immersion
Type Tin/Lead Temp ºC Time Seconds
NC AgPdPt 60/40 260 ± 5 15 max
NB Nickel Barrier 60/40 260 ± 5 30 ± 1
Case P/N D1 D2 D3 D4 D5
Size
0402 NB23 1.70 0.60 0.50 0.60 0.50
(.067) (.024) (.020) (.024) (.020)
0603 NB21 2.30 0.80 0.70 0.80 0.75
(.091) (.031) (.028) (0.31) (.030)
0805 NB12 3.00 1.00 1.00 1.00 1.25
(.118) (.039) (.039) (.039) (.049)
1206 NB20 4.00 1.00 2.00 1.00 2.50
(.157) (.039) (.079) (.039) (.098)
Case P/N D1 D2 D3 D4 D5
Size
0603 NB21 3.10 1.20 0.70 1.20 0.75
(.122) (.047) (.028) (.047) (.030)
0805 NB12 4.00 1.50 1.00 1.50 1.25
(.157) (.059) (.039) (.059) (.049)
1206 NB20 5.00 1.50 2.00 1.50 1.60
(.197) (.059) (.079) (.059) (.063)
Reflow
300
250
200
150
100
50
0
Solder Temp.
10 sec. max
1min
1min
(Minimize soldering time)
Natural
Cooling
220ºC
to
250ºC
Preheat
a) The visual standards used for evaluation of solder joints
will need to be modified as lead free joints are not as bright
as with tin-lead pastes and the fillet may not be as large.
b) Resin color may darken slightly due to the increase in
temperature required for the new pastes.
c) Lead-free solder pastes do not allow the same self align-
ment as lead containing systems. Standard mounting
pads are acceptable, but machine set up may need to be
modified.
300
250
200
150
100
50
00 50 100 150 200 250 300
• Pre-heating: 150°C ±15°C / 60-90s
• Max. Peak Gradient: 2.5°C/s
• Peak Temperature: 245°C ±5°C
• Time at >230°C: 40s Max.
Temperature °C
Time (s)
Wave
300
250
200
150
100
50
0
Solder Temp.
3 sec. max
1 to 2 min
(Preheat chips before soldering)
T/maximum 150°C
Preheat
Natural
Cooling
230ºC
to
250ºC
T
D1
D2
D3
D4
D5
RECOMMENDED
SOLDERING PAD
LAYOUT
Dimensions in
mm (inches)
