ll _ _ . Tyco Elect ronics Our commitment. Your advantage. Products Documentation Resources My Account Corporate Home | P Electronic Components | Segments | Who We Are My Account Search | Customer Support Home = Products > By Type = Socket'Card Products > Product Feature Selector > Product Details 390262-7 Product Details Live Product Chat DIP Sockets Quick Links Mot EU RoHS of ELY Comoliant (Find RoHS Comoliant Alternates) Check Pricing & Availability ee : Search for Tooling slant acetate Product Feature Selector . piel socket Contact Us About This Product # 48 Positions # Row-to-Row Spacing = 15.24 mm # Through Hole Contact Termination Type Mount Style = Vertical View all Features S Superseded Add to My Part List Request Sample Find Similar Products Buy Product Search for Replacement Parts Documentation & Additional Information Product Drawings: e DIP SOCKET, .600 CENTER LINE LADDER STYLE (PDF, English) Catalog Pages, Data Sheets: # None Available Product Specifications: e None Available Application Specifications: # None Available Instruction Sheets: None Available CAD Files: None Available Additional Information: Product Line Information Related Products: # Tooling List all Documents Product Features (Please use the Product Drawing for all design activity) Product Type Features: # Product Type = DIP Socket Number of Positions = 48 Profile = Standard Frame Style = Ladder Leg Stvle = Straight PCB Mount Angle = Horizontal Electrical Characteristics: # Insulation Resistance (M2) = 10,000 Contact Resistance (mm) = 30 Termination Related Features: Termination Post Length (mm [in]) = 3.00 [0.118] Solder Tail Contact Plating = Tin-Lead Body Related Features: Row-to-Row Spacing (mm [in]) = 15.24 [0.600] # Mount Style = Vertical Centerline (mm [in]) = 2.54 [0.100] Contact Related Features: # (Contact Termination Type = Through Hole Contact Base Material = Phosphor Bronze (Contact Plating, Mating 4rea, Material = Tin-Lead Contact Stvle = Stamped + Formed Mating Contact Type = Dual Leaf Configuration Related Features: e Height Above PC Board (mm [in]} = 5.10 [0.200] Industry Standards: # RoHS/ELVY Compliance = Not ELV/RoHS compliant Lead Free Solder Processes = Wave solder capable to 240C, Wave enlder capable to 260C, Wave solder capable to 265C Conditions for Usage: # Temperature Range (C) = -40 - +105 Packaging Related Features: # Packaging Method = Tube Other: # Brand = AMP Provide Website Feedback | Need Help? no Tow i = Home | Customer Support | Suppliers Site Map | Privacy Policy | Browser Support 2009 Tyco Electronics Corporation All Rights Reserved