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notice_e-01
Notice for TAIYO YUDEN products 
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
Product information in this catalog is as of October 2011. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-
rating such products, which are caused under the conditions other than those specified in this catalog or individual
specification.
Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is
available.
Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called TAIYO YUDENs official sales channel).
It is only applicable to the products purchased from any of TAIYO YUDEN s ofcial sales channel.
Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-
cur in connection with a third party's intellectual property rights and other related rights arising from your usage of
products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
Caution for export
Certain items in this catalog may require specific procedures for export according to Foreign Exchange and For-
eign Trade Control Law of Japan, U.S. Export Administration Regulations, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
26
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mlcc06_e-01
FEATURES
PART NUMBER
STANDARD EXTERNAL DIMENSIONS/STANDARD QUANTITY
AVAILABLE CAPACITANCE RANGE
APPLICATIONS
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Packaging
Tφ178mm Taping
4mm pitch
◦The use of nickel as electrode material prevents migration and pro-
vides high reliability.
◦Small case sizes with high rated voltage.
◦General telephone exchange
◦Inverter
◦Wireless and Telecommunication base
◦For DC/DC Converter
MEDIUM-HIGH VOLTAGE MULTILAYER CERAMIC CAPACITORS
REFLOW
H M K 3 1 6 B J 1 0 4 K L T
Rated
voltageVDC
H 100
Q 250
S 630
Thickness
mm
A 0.8
D 0.85
G 1.25
F 1.15
L 1.6
N 1.9
M 2.5
Special code
Standard
Internal code
Standard
Blank space
Special code
K±10%
M±20%
Series name
MMultilayer ceramic
capacitor
Temperature
characteristics code
BJ B
X5R
C7 X7S
B7 X7R
Dimension
Type inchL×W mm
107 06031.6×0.8
212 08052.0×1.25
316 12063.2×1.6
325 12103.2×2.5
432 18124.5×3.2 Dimension
tolerance
Standard
Blank space
End
termination
K Plated
Nominal
capacitancepF
example
104 100,000
105 1,000,000
Type Dimension [mm] Standard quantity [pcs]
L W T e Paper tape Embossed tape
MK107
0603 inch1.6±0.10 0.8±0.10 0.8±0.10 A 0.35±0.25 4000
MK212
0805 inch2.0±0.10 1.25±0.10 0.85±0.10 D 0.5±0.25 4000
1.25±0.10 G 3000
MK316
1206 inch3.2±0.15 1.6±0.15 1.15±0.10 F 0.5 0.35/0.25 3000
1.6±0.20 L 2000
MK325
1210 inch3.2±0.3 2.5±0.20 1.15±0.10 F 0.6±0.3 2000
1.9±0.20 N
MK432
1812 inch4.5±0.4 3.2±0.30 2.5±0.20 M 0.9±0.6 500
Cap
[μF]
Type 107 212 316 325 432
X7R X7S
B/X5R
X7R B/X5R X7R B/X5R X7R B/X5R X7R B/X5R
VDC 100 100 100 100 250 100 250 100 250 630 100 250 630 100 250 630 100 250 630 100 250 630 100 250 630
[3-digit]
0.001 102 A A D D F F
0.0015 152 A A D D F F
0.0022 222 A A D D F F
0.0033 332 A A D D F F
0.0047 472 A A G G F F
0.0068 682 A A G G F F
0.01 103 A A G G G G F F
0.015 153 A A G G G G L L
0.022 223 A A G G G G L L N N
0.033 333 A A G G L L N N
0.047 473 G G L L L L N N N N M M
0.068 683 G G L L L L M M
0.1 104 A A G G L L L L F N F N M M M M
0.15 154 L L N N N N
0.22 224 G G L L N N N N M M
0.33 334 L L N N M M
0.47 474 L L N N M M M M
0.68 684 N N
1.0 105 L L N N M M
1.5 155 M M
2.2 225 N N M M
Letters in the table indicate thickness.
27
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CAPACITORS
mlcc06_e-01
REPRESENTATIVE PART NUMBERS
AVAILABLE CAPACITANCE RANGE
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Temp.char.Code Temperature characteristics Capacitance tolerance
〔%
Applicable standard Temperature range〔℃Ref. Temp.〔℃〕
Capacitance change
〔%
BJ JIS B 2585 20 ±10
±10K
±20M
EIA X5R 55~+85 25 ±15
C7 EIA X7S 55~+125 25 ±22
B7 EIA X7R 55~+125 25 ±15
107TYPE
Temperature Characteristic BJ:B/X5R
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pF
Capacitance
tolerance
%
tanδ
%
Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1
Note
% Rated
voltage
100V HMK107 BJ102A B/X5R*11000 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 BJ152A B/X5R*11500 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 BJ222A B/X5R*12200 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 BJ332A B/X5R*13300 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 BJ472A B/X5R*14700 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 BJ682A B/X5R*16800 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 BJ103A B/X5R*110000 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 BJ153A B/X5R*115000 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 BJ223A B/X5R*122000 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 BJ333A B/X5R*133000 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 BJ104A B/X5R*1100000 ±10, ±20 3.5 0.8±0.1 R 200%
Capacitance tolerance code is applied to of part number.
*1 We may provide X7R for some itemes according to the individual specification.
212TYPE
Temperature Characteristic BJB/X5R
1.25mm thicknessG
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pF
Capacitance
tolerance
%
tanδ
%
Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1
Note
% Rated
voltage
100V HMK212 BJ103G B/X5R*110000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 BJ153G B/X5R*115000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 BJ223G B/X5R*122000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 BJ333G B/X5R*133000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 BJ473G B/X5R*147000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 BJ683G B/X5R*168000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 BJ104G B/X5R*1100000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 BJ224G B/X5R*1220000 ±10, ±20 3.5 1.25±0.1 R 200%
250V QMK212 BJ472G B/X5R*14700 ±10, ±20 2.5 1.25±0.1 R 150%
QMK212 BJ682G B/X5R*16800 ±10, ±20 2.5 1.25±0.1 R 150%
QMK212 BJ103G B/X5R*110000 ±10, ±20 2.5 1.25±0.1 R 150%
QMK212 BJ153G B/X5R*115000 ±10, ±20 2.5 1.25±0.1 R 150%
QMK212 BJ223G B/X5R*122000 ±10, ±20 2.5 1.25±0.1 R 150%
Temperature Characteristic B7X7R, C7X7S
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pF
Capacitance
tolerance
%
tanδ
%
Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1
Note
% Rated
voltage
100V HMK107 B7102A X7R 1000 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 B7152A X7R 1500 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 B7222A X7R 2200 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 B7332A X7R 3300 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 B7472A X7R 4700 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 B7682A X7R 6800 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 B7103A X7R 10000 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 B7153A X7R 15000 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 B7223A X7R 22000 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 B7333A X7R 33000 ±10, ±20 3.5 0.8±0.1 R 200%
HMK107 C7104A X7S 100000 ±10, ±20 3.5 0.8±0.1 R 200%
Capacitance tolerance code is applied to of part number.
0.85mm thicknessD
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pF
Capacitance
tolerance
%
tanδ
%
Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1
Note
% Rated
voltage
250V QMK212 BJ102D B/X5R*11000 ±10, ±20 2.5 0.85±0.1 R 150%
QMK212 BJ152D B/X5R*11500 ±10, ±20 2.5 0.85±0.1 R 150%
QMK212 BJ222D B/X5R*12200 ±10, ±20 2.5 0.85±0.1 R 150%
QMK212 BJ332D B/X5R*13300 ±10, ±20 2.5 0.85±0.1 R 150%
Capacitance tolerance code is applied to of part number.
*1 We may provide X7R for some itemes according to the individual specification.
28
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mlcc06_e-01
REPRESENTATIVE PART NUMBERS
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Temperature Characteristic B7X7R
1.25mm thicknessG
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pF
Capacitance
tolerance
%
tanδ
%
Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1
Note
% Rated
voltage
100V HMK212 B7103G X7R 10000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 B7153G X7R 15000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 B7223G X7R 22000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 B7333G X7R 33000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 B7473G X7R 47000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 B7683G X7R 68000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 B7104G X7R 100000 ±10, ±20 3.5 1.25±0.1 R 200%
HMK212 B7224G X7R 220000 ±10, ±20 3.5 1.25±0.1 R 200%
250V QMK212 B7472G X7R 4700 ±10, ±20 2.5 1.25±0.1 R 150%
QMK212 B7682G X7R 6800 ±10, ±20 2.5 1.25±0.1 R 150%
QMK212 B7103G X7R 10000 ±10, ±20 2.5 1.25±0.1 R 150%
QMK212 B7153G X7R 15000 ±10, ±20 2.5 1.25±0.1 R 150%
QMK212 B7223G X7R 22000 ±10, ±20 2.5 1.25±0.1 R 150%
Temperature Characteristic B7X7R
1.6mm thicknessL
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pF
Capacitance
tolerance
%
tanδ
%
Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1
Note
% Rated
voltage
100V HMK316 B7473L X7R 47000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 B7683L X7R 68000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 B7104L X7R 100000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 B7154L X7R 150000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 B7224L X7R 220000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 B7334L X7R 330000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 B7474L X7R 470000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 B7105L X7R 1000000 ±10, ±20 3.5 1.6±0.2 R 200%
250V QMK316 B7333L X7R 33000 ±10, ±20 2.5 1.6±0.2 R 150%
QMK316 B7473L X7R 47000 ±10, ±20 2.5 1.6±0.2 R 150%
QMK316 B7683L X7R 68000 ±10, ±20 2.5 1.6±0.2 R 150%
QMK316 B7104L X7R 100000 ±10, ±20 2.5 1.6±0.2 R 150%
630V SMK316 B7153L X7R 15000 ±10, ±20 2.5 1.6±0.2 R 120%
SMK316 B7223L X7R 22000 ±10, ±20 2.5 1.6±0.2 R 120%
0.85mm thicknessD
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pF
Capacitance
tolerance
%
tanδ
%
Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1
Note
% Rated
voltage
250V QMK212 B7102D X7R 1000 ±10, ±20 2.5 0.85±0.1 R 150%
QMK212 B7152D X7R 1500 ±10, ±20 2.5 0.85±0.1 R 150%
QMK212 B7222D X7R 2200 ±10, ±20 2.5 0.85±0.1 R 150%
QMK212 B7332D X7R 3300 ±10, ±20 2.5 0.85±0.1 R 150%
Capacitance tolerance code is applied to of part number.
316TYPE
Temperature Characteristic BJB/X5R
1.6mm thicknessL
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pF
Capacitance
tolerance
%
tanδ
%
Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1
Note
% Rated
voltage
100V HMK316 BJ473L B/X5R*147000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 BJ683L B/X5R*168000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 BJ104L B/X5R*1100000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 BJ154L B/X5R*1150000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 BJ224L B/X5R*1220000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 BJ334L B/X5R*1330000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 BJ474L B/X5R*1470000 ±10, ±20 3.5 1.6±0.2 R 200%
HMK316 BJ105L B/X5R*11000000 ±10, ±20 3.5 1.6±0.2 R 200%
250V QMK316 BJ333L B/X5R*133000 ±10, ±20 2.5 1.6±0.2 R 150%
QMK316 BJ473L B/X5R*147000 ±10, ±20 2.5 1.6±0.2 R 150%
QMK316 BJ683L B/X5R*168000 ±10, ±20 2.5 1.6±0.2 R 150%
QMK316 BJ104L B/X5R*1100000 ±10, ±20 2.5 1.6±0.2 R 150%
630V SMK316 BJ153L B/X5R*115000 ±10, ±20 2.5 1.6±0.2 R 120%
SMK316 BJ223L B/X5R*122000 ±10, ±20 2.5 1.6±0.2 R 120%
1.15mm thicknessF
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pF
Capacitance
tolerance
%
tanδ
%
Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1
Note
% Rated
voltage
630V SMK316 BJ102F B/X5R*11000 ±10, ±20 2.5 1.15±0.1 R 120%
SMK316 BJ152F B/X5R*11500 ±10, ±20 2.5 1.15±0.1 R 120%
SMK316 BJ222F B/X5R*12200 ±10, ±20 2.5 1.15±0.1 R 120%
SMK316 BJ332F B/X5R*13300 ±10, ±20 2.5 1.15±0.1 R 120%
SMK316 BJ472F B/X5R*14700 ±10, ±20 2.5 1.15±0.1 R 120%
SMK316 BJ682F B/X5R*16800 ±10, ±20 2.5 1.15±0.1 R 120%
SMK316 BJ103F B/X5R*110000 ±10, ±20 2.5 1.15±0.1 R 120%
Capacitance tolerance code is applied to of part number.
*1 We may provide X7R for some itemes according to the individual specification.
29
1
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CAPACITORS
mlcc06_e-01
REPRESENTATIVE PART NUMBERS
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
325TYPE
Temperature Characteristic BJB/X5R
1.9mm thicknessN
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pF
Capacitance
tolerance
%
tanδ
%
Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1
Note
% Rated
voltage
100V HMK325 BJ154N B/X5R*1150000 ±10, ±20 3.5 1.9±0.2 R 200%
HMK325 BJ224N B/X5R*1220000 ±10, ±20 3.5 1.9±0.2 R 200%
HMK325 BJ334N B/X5R*1330000 ±10, ±20 3.5 1.9±0.2 R 200%
HMK325 BJ474N B/X5R*1470000 ±10, ±20 3.5 1.9±0.2 R 200%
HMK325 BJ684N B/X5R*1680000 ±10, ±20 3.5 1.9±0.2 R 200%
HMK325 BJ105N B/X5R*11000000 ±10, ±20 3.5 1.9±0.2 R 200%
HMK325 BJ225N B/X5R*12200000 ±10, ±20 3.5 1.9±0.2 R 200%
250V QMK325 BJ473N B/X5R*147000 ±10, ±20 2.5 1.9±0.2 R 150%
QMK325 BJ104N B/X5R*1100000 ±10, ±20 2.5 1.9±0.2 R 150%
QMK325 BJ154N B/X5R*1150000 ±10, ±20 2.5 1.9±0.2 R 150%
QMK325 BJ224N B/X5R*1220000 ±10, ±20 2.5 1.9±0.2 R 150%
630V SMK325 BJ223NB/X5R*122000 ±10, ±20 2.5 1.9±0.2 R 120%
SMK325 BJ333N B/X5R*133000 ±10, ±20 2.5 1.9±0.2 R 120%
SMK325 BJ473N B/X5R*147000 ±10, ±20 2.5 1.9±0.2 R 120%
Temperature Characteristic B7X7R
1.9mm thicknessN
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pF
Capacitance
tolerance
%
tanδ
%
Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1
Note
% Rated
voltage
100V HMK325 B7154N X7R 150000 ±10, ±20 3.5 1.9±0.2 R 200%
HMK325 B7224N X7R 220000 ±10, ±20 3.5 1.9±0.2 R 200%
HMK325 B7334N X7R 330000 ±10, ±20 3.5 1.9±0.2 R 200%
HMK325 B7474N X7R 470000 ±10, ±20 3.5 1.9±0.2 R 200%
HMK325 B7684N X7R 680000 ±10, ±20 3.5 1.9±0.2 R 200%
HMK325 B7105N X7R 1000000 ±10, ±20 3.5 1.9±0.2 R 200%
HMK325 B7225N X7R 2200000 ±10, ±20 3.5 1.9±0.2 R 200%
250V QMK325 B7473N X7R 47000 ±10, ±20 2.5 1.9±0.2 R 150%
QMK325 B7104N X7R 100000 ±10, ±20 2.5 1.9±0.2 R 150%
QMK325 B7154N X7R 150000 ±10, ±20 2.5 1.9±0.2 R 150%
QMK325 B7224N X7R 220000 ±10, ±20 2.5 1.9±0.2 R 150%
630V SMK325 B7223N X7R 22000 ±10, ±20 2.5 1.9±0.2 R 120%
SMK325 B7333N X7R 33000 ±10, ±20 2.5 1.9±0.2 R 120%
SMK325 B7473N X7R 47000 ±10, ±20 2.5 1.9±0.2 R 120%
1.15mm thicknessF
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pF
Capacitance
tolerance
%
tanδ
%
Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1
Note
% Rated
voltage
630V SMK316 B7102F X7R 1000 ±10, ±20 2.5 1.15±0.1 R 120%
SMK316 B7152F X7R 1500 ±10, ±20 2.5 1.15±0.1 R 120%
SMK316 B7222F X7R 2200 ±10, ±20 2.5 1.15±0.1 R 120%
SMK316 B7332F X7R 3300 ±10, ±20 2.5 1.15±0.1 R 120%
SMK316 B7472F X7R 4700 ±10, ±20 2.5 1.15±0.1 R 120%
SMK316 B7682F X7R 6800 ±10, ±20 2.5 1.15±0.1 R 120%
SMK316 B7103F X7R 10000 ±10, ±20 2.5 1.15±0.1 R 120%
Capacitance tolerance code is applied to of part number.
1.15mm thicknessF
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pF
Capacitance
tolerance
%
tanδ
%
Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1
Note
% Rated
voltage
100V HMK325 BJ104F B/X5R*1100000 ±10, ±20 3.5 1.15±0.1 R 200%
Capacitance tolerance code is applied to of part number.
*1 We may provide X7R for some itemes according to the individual specification.
1.15mm thicknessF
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pF
Capacitance
tolerance
%
tanδ
%
Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1
Note
% Rated
voltage
100V HMK325 B7104F X7R 100000 ±10, ±20 3.5 1.15±0.1 R 200%
Capacitance tolerance code is applied to of part number.
30
1
2
mlcc06_e-01
ELECTRICAL CHARACTERISTICS
REPRESENTATIVE PART NUMBERS
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Temperature characteristics
432TYPE
Temperature Characteristic BJB/X5R
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pF
Capacitance
tolerance
%
tanδ
%
Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1
Note
% Rated
voltage
100V HMK432 BJ474M B/X5R*1470000 ±10, ±20 3.5 2.5±0.2 R 200%
HMK432 BJ105M B/X5R*11000000 ±10, ±20 3.5 2.5±0.2 R 200%
HMK432 BJ155M B/X5R*11500000 ±10, ±20 3.5 2.5±0.2 R 200%
HMK432 BJ225M B/X5R*12200000 ±10, ±20 3.5 2.5±0.2 R 200%
250V QMK432 BJ104M B/X5R*1100000 ±10, ±20 2.5 2.5±0.2 R 150%
QMK432 BJ224M B/X5R*1220000 ±10, ±20 2.5 2.5±0.2 R 150%
QMK432 BJ334M B/X5R*1330000 ±10, ±20 2.5 2.5±0.2 R 150%
QMK432 BJ474M B/X5R*1470000 ±10, ±20 2.5 2.5±0.2 R 150%
630V SMK432 BJ473M B/X5R*147000 ±10, ±20 2.5 2.5±0.2 R 120%
SMK432 BJ683M B/X5R*168000 ±10, ±20 2.5 2.5±0.2 R 120%
SMK432 BJ104M B/X5R*1100000 ±10, ±20 2.5 2.5±0.2 R 120%
Capacitance tolerance code is applied to of part number.
*1 We may provide X7R for some itemes according to the individual specification.
Temperature Characteristic B7X7R
Rated
voltage Part number 1 Part number 2 Temp.
char.
Capacitance
pF
Capacitance
tolerance
%
tanδ
%
Thickness
mm
Soldering
R:Reflow
W:Wave
HALT Internal
code
P/N 1
Note
% Rated
voltage
100V HMK432 B7474M X7R 470000 ±10, ±20 3.5 2.5±0.2 R 200%
HMK432 B7105M X7R 1000000 ±10, ±20 3.5 2.5±0.2 R 200%
HMK432 B7155M X7R 1500000 ±10, ±20 3.5 2.5±0.2 R 200%
HMK432 B7225M X7R 2200000 ±10, ±20 3.5 2.5±0.2 R 200%
250V QMK432 B7104M X7R 100000 ±10, ±20 2.5 2.5±0.2 R 150%
QMK432 B7224M X7R 220000 ±10, ±20 2.5 2.5±0.2 R 150%
QMK432 B7334M X7R 330000 ±10, ±20 2.5 2.5±0.2 R 150%
QMK432 B7474M X7R 470000 ±10, ±20 2.5 2.5±0.2 R 150%
630V SMK432 B7473M X7R 47000 ±10, ±20 2.5 2.5±0.2 R 120%
SMK432 B7683M X7R 68000 ±10, ±20 2.5 2.5±0.2 R 120%
SMK432 B7104M X7R 100000 ±10, ±20 2.5 2.5±0.2 R 120%
Capacitance tolerance code is applied to of part number.
HMK212 BJ104KG / HMK212 B7104KG
SMK432 BJ104KM / SMK432 B7104KM
QMK325 BJ224KN / QMK325 B7224KN
SMK316 BJ223KL / SMK316 B7223KL
QMK432 BJ474KM / QMK432 B7474KM
HMK325 BJ105KN / HMK325 B7105KN
HMK325 BJ105KN / HMK325 B7105KN
Taiyo Yuden medium-high voltage ceramic capacitor
Example of Impedance ESR vs. Frequency characteristics
31
1
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CAPACITORS
mlcc06_e-01
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
1
2
mlcc_pack-P1 mlcc_pack_e-01
PACKAGING
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Taped package
Minimum Quantity
Taping material
No bottom tape for pressed carrier tape
Representative taping dimensions
 ◦Paper Tape8mm wide
 Pressed carrier tape 2mm pitch
T1
0.1/−0
Paper tape
Embossed tape Type Chip Cavity Insertion Pitch Tape Thickness
A B F T
MK107
WK107 1.0 1.8
4.0±0.1
1.1max.
2K110 1.15 1.55 1.0max.
MK212
WK212 1.65 2.4 1.1max.4K212
2K212
MK316 2.0 3.6
Type Chip Cavity Insertion Pitch Tape Thickness
A B F T
2K096 0.72 1.02
52.0±0.05
0.6max.
MK105
VK105 0.65 1.15 0.8max.
0.1/−0
0.1/−0
Punched carrier tape 4mm pitch
NoteTaping size might be different depending on the size of the product.
Punched carrier tape 2mm pitch
Chip filled
Type
Thickness Standard quantity [pcs]
mm code Paper tape Embossed
tape
MK042
0.2 C,D 40000
MK063 0.3 P,T 15000
2K096 0.3 P
100000.45 K
WK105 0.3 P
MK105
0.2 C 20000
0.3 P 15000
0.5 V, W 10000
VK105 0.5 W
MK107
WK107
0.45 K 4000
0.5 V 4000
0.8 A
4000
2K110
0.5 V
0.6 B
0.8 A
MK212
WK212
0.45 K
0.85 D
1.25 G 3000
4K212 0.85 D
4000 2K212 0.85 D
MK316
0.85 D
1.15 F
3000
1.25 G
1.6 L
2000
MK325
0.85 D
1.15 F
1.9 N
2.0max Y
2.5 M
500T, 1000P
MK432 2.5 M 500
Unitmm
Unitmm
Unitmm
Type Chip Cavity
Insertion Pitch
Tape Thickness
T1
MK063 0.37 0.67
2.0±0.05
0.45max. 0.42max.2K096 0.65 1.02
WK105
0.65 1.15MK105*1C0.4max. 0.3max.
MK105*1P0.45max. 0.42max.
*1 Thickness, C0.2mmP0.3mm
1
2
mlcc_pack-P2
mlcc_pack_e-01
PACKAGING
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Embossed tape8mm wide
Embossed tape12mm wide
Type Chip Cavity
Insertion Pitch
Tape Thickness
A B F K T
WK107 1.0 1.8
4.0±0.1
1.3max 0.25±0.1
MK212 1.65 2.4
3.4max. 0.6max.MK316 2.0 3.6
MK325 2.8 3.6
Trailer and Leader
Reel size
Top Tape Strength
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow
as illustrated below.
The exchange of individual specification is necessary.
Please contact Taiyo Yuden sales channels.
0.1/−0
0.1/−0
2.0±0.1
F
360/0.2
110±0.7
12±0.1
0.2/0
0/0.2
12.0±0.1
8.8±0.1
6.8±0.1
1.00/0.1 2.00/0.1 1.50.1/0
Unitmm
Bulk Cassette
1.0±0.02
0.8±0.04 0.9±0.05
1.8±0.02
4.0±0.05
2.0±0.04
Embossed tape4mm wide
Type Chip Cavity
Insertion Pitch
Tape Thickness
A B F K T
MK042 0.23 0.43 1.0±0.02 0.5max. 0.25max.
A B C
φ178±2.0 φ50min.
φ13.0±0.2
D E R
φ21.0±0.8 2.0±0.5
1.0
t W
4mm wide tape 1.5max.
5±1.0
8mm wide tape 2.5max.
10±1.5
12mm wide tape 2.5max.
14±1.5
Unitmm
Unitmm
Unitmm
Type Chip Cavity
Insertion Pitch
Tape Thickness
A B F K T
MK432 3.7 4.9 8.0±0.1 4.0max. 0.6max.
Unitmm
E
W
C
RDB
t
A
E
W
C
RDB
t
A
1
2
mlcc06_reli-R1 mlcc06_reli_e-01
RELIABILITY DATA
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
MediumHigh Voltage Multilayer Ceramic Capacitor
1. Operating Temperature Range
Specified Value X7R, X7S55~+125 X5R5585 B2585
2. Storage Temperature Range
Specified Value X7R, X7S55~+125 X5R5585 B2585
3. Rated Voltage
Specified Value 100VDC, 250VDC, 630VDC
4. Withstanding VoltageBetween terminals
Specified Value No breakdown or damage
Test Methods and Remarks
Applied voltage:Rated voltage×2.5HMK, Rated voltage×2QMK, Rated voltage×1.2SMK
Duration1 to 5sec.
Charge/discharge current50mA max.
Insulation Resistance
Specified Value 100MΩμF or 10GΩ, whichever is smaller.
Test Methods and Remarks
Applied voltage:Rated voltageHMK, QMK, 500VSMK
Duration60±5sec.
Charge/discharge current50mA max.
6CapacitanceTolerance
Specified Value ±10%、±20
Test Methods and Remarks
Measuring frequency:1kHz±10%
Measuring voltage:1±0.2Vrms
Bias application:None
Dissipation Factor
Specified Value 3.5%maxHMK
2.5%maxQMK, SMK
Test Methods and Remarks
Measuring frequency:1kHz±10%
Measuring voltage:1±0.2Vrms
Bias application:None
8Temperature Characteristic of Capacitance
Specified Value
B ±10
(-2585
X5R ±15(-5585
X7R ±15(-55125
X7S ±22(-55125
Test Methods and Remarks
Capacitance value at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation.
CC2 ×100(%
 C2
C Capacitance value in Step 1 or Step 3
C2 Capacitance value in Step 2
Step B X5RX7RX7S
1 Minimum operating temperature
2 2025
3 Maximum operating temperature
9Deflection
Specified Value Appearance:No abnormality
Capacitance change:Within±10%
Test Methods and Remarks
Warp:1mm
Duration:10sec.
Test board:glass epoxy-resin substrate
Thickness:1.6mm
Capacitance measurement shall be conducted with the board bent.
R-230
10Adhesive Strength of Terminal Electrodes
Specified Value No terminal separation or its indication.
Test Methods and Remarks
Applied force:5N
Duration:30±5sec.
   
11Solderability
Specified Value At least 95% of terminal electrode is covered by new solder
Test Methods and Remarks
Solder type Solder temperature Duration
Eutectic solder H60A or H63A 230±54±1 sec.
Lead-free solder Sn3.0Ag0.5Cu 245±3
Multilayer Ceramic Capacitors and Super Low Distortion Multilayer Ceramic
Capacitors are noted separately.
1
2
mlcc06_reli-R2
mlcc06_reli_e-01
RELIABILITY DATA
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
12Resistance to Soldering
Specified Value
Appearance: No abnormality
Capacitance change: Within±15%HMK, ±10%QMK, SMK
Dissipation factor : Initial value
Insulation resistance: Initial value
Withstanding voltagebetween terminals: No abnormality
Test Methods and Remarks
Preconditioning:Thermal treatmentat 150 for 1hr Note1
Solder temperature:270±5
Duration:3±0.5sec.
Preheating conditions: 80 to 100, 2 to 5 min.
150 to 200, 2 to 5min.
Recovery : 24±2hrs under the standard condition Note3
13Temperature CycleThermal Shock
Specified Value
Appearance: No abnormality
Capacitance change: Within±15%HMK, ±7.5%QMK, SMK
Dissipation factor: Initial value
Insulation resistance: Initial value
Test Methods and Remarks
Preconditioning:Thermal treatmentat 150 for 1hr Note1
Conditions for 1 cycle Step 1: Minimum operating temperature 0
3 30±3min.
Step 2: Normal temperature 2 to 3min.
Step 3: Maximum operating temperature 0
3 30±3min.
Step 4: Normal temperature 2 to 3min.
Number of cycles:5 times
Recovery : 24±2hrs under the standard condition Note3
14HumiditySteady state
Specified Value
Appearance: No abnormality
Capacitance change: Within±15%
Dissipation factor : 7%maxHMK, 5%maxQMK, SMK.
Insulation resistance: 25MΩ
μF or 1000MΩ, whichever is smaller.
Test Methods and Remarks
Preconditioning:Thermal treatmentat 150 for 1hr Note1
Temperature:40±2
Humidity90 to 95%RH
Duration: 500 24
0hrs
Recovery : 24±2hrs under the standard condition Note3
15Humidity Loading
Specified Value
Appearance: No abnormality
Capacitance change: Within±15%
Dissipation factor: 7%maxHMK, 5%maxQMK, SMK.
Insulation resistance: 10MΩ
μF or 500MΩ, whichever is smaller.
Test Methods and Remarks
According to JIS 5102 clause 9.9.
Preconditioning:Voltage treatment Note2
Temperature:40±2
Humidity90 to 95%RH
Applied voltage:Rated voltage
Charge/discharge current50mA max.
Duration: 500 24
0hrs
Recovery : 24±2hrs under the standard condition Note3
16High Temperature Loading
Specified Value
Appearance: No abnormality
Capacitance change: Within±15%
Dissipation factor: 7%maxHMK, 5%maxQMK, SMK.
Insulation resistance: 50MΩ
μF or 1000MΩ, whichever is smaller.
Test Methods and Remarks
According to JIS 5102 clause 9.10.
Preconditioning:Voltage treatment Note2
Temperature:125±3 B7, C7, 85±2BJ
Applied voltage:Rated voltage×2HMK
Rated voltage×1.5QMK
Rated voltage×1.2SMK
Charge/discharge current50mA max.
Duration: 1000 24
0hrs
Recovery : 24±2hrs under the standard condition Note3
Note1 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 1500/10 for an hour and kept at room temperature for 24±2hours.
Note2 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in the test conditions, and
kept at room temperature for 24±2hours.
Note3 Standard condition: Temperature: 5 to 35, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa
When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under the following condi-
tion.
Temperature: 20±2, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa
Unless otherwise specified, all the tests are conducted under the "standard condition".
1
2
mlcc_prec-P1 mlcc_prec_e-01
PRECAUTIONS
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
1. Circuit Design
Precautions
Verification of operating environment, electrical rating and performance
1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications.
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general pur-
pose applications.
Operating Voltage Verification of Rated voltage
1. The operating voltage for capacitors must always be their rated voltage or less.
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage
having rapid rise time is used in a circuit.
2. PCB Design
Precautions
Pattern configurations Design of Land-patterns
1. When capacitors are mounted on PCBs, the amount of solder used size of fillet can directly affect the capacitor performance. Therefore, the following items must
be carefully considered in the design of land patterns:
1Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper
amount of solder.
2When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by solder-resist.
Pattern configurationsCapacitor layout on PCBs
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes PCB cutting, board inspection,
mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.. For this reason, land pattern configurations and positions of capacitors
shall be carefully considered to minimize stresses.
Technical
consider-
ations
Pattern configurations Design of Land-patterns
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.
1Recommended land dimensions for typical chip capacitors
Multilayer Ceramic Capacitors : Recommended land dimensions unit: mm
 Wave-soldering Land patterns for PCBs
Type 107 212 316 325
Size L 1.6 2.0 3.2 3.2
W 0.8 51.25 1.6 2.5
A 0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5
B 0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7
C 0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5
Solder-resist
Chip capacitor
L
L
W
B
C
B
A
W
LWDC
Land
Chip capacitor
Reflow-soldering
Type 042 063 105 107 212 316 325 432
Size L 0.4 0.6 1.0 1.6 2.0 3.2 3.2 4.5
W 0.2 0.3 0.5 0.8 51.25 1.6 2.5 3.2
A
0.15 to 0.25 0.20 to 0.30 0.45 to 0.55
0.8 to 1.0 0.8 to 1.2 1.8 to 2.5 1.8 to 2.5 2.5 to 3.5
B
0.15 to 0.20 0.20 to 0.30 0.40 to 0.50
0.6 to 0.8 0.8 to 1.2 1.0 to 1.5 1.0 to 1.5 1.5 to 1.8
C
0.15 to 0.30 0.25 to 0.40 0.45 to 0.55
0.6 to 0.8 0.9 to 1.6 1.2 to 2.0 1.8 to 3.2 2.3 to 3.5
NoteRecommended land size might be different according to the allowance of the size of the product.
LWDC: Recommended land dimensions for reflow-solderingunit: mm
Type 105 107 212
Size L 0.52 50.8 1.25
W 1.0 1.6 2.0
A 0.18 to 0.22 0.25 to 0.3 0.5 to 0.7
B 0.2 to 0.25 0.3 to 0.4 0.4 to 0.5
C 0.9 to 1.1 1.5 to 1.7 1.9 to 2.1
Array type: Recommended land dimensions for reflow-soldering unit: mm
2 circuits 4 circuits
Type 0962 circuits1102 circuits2122 circuits2124 circuits
Size L 0.9 1.37 2.0 2.0
W 0.6 1.0 1.25 1.25
a 0.25 to 0.35 0.35 to 0.45 0.5 to 0.6 0.5 to 0.6
b 0.15 to 0.25 0.55 to 0.65 0.5 to 0.6 0.5 to 0.6
c 0.15 to 0.25 0.3 to 0.4 0.5 to 0.6 0.2 to 0.3
d 0.45 0.64 1.0 0.5
Chip capacitor
a
a
b
d
c
Land
c
d
a
a
b
2Examples of good and bad solder application
Items Not recommended Recommended
Mixed mounting of
SMD and leaded
components
Component
placement close to
the chassis
Hand-soldering
of leaded
components
near mounted
components
Horizontal
component
placement
Precautions on the use of Multilayer Ceramic Capacitors
To next page
1
2
mlcc_prec-P2
mlcc_prec_e-01
PRECAUTIONS
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer Ceramic Capacitors
2. PCB Design
Technical
consider-
ations
Pattern configurationsCapacitor layout on PCBs
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any possible mechanical stresses from board warp or de-
flection.
Items Not recommended Recommended
Deflection of board
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from
least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB, split methods as well as chip location.
3. Mounting
Precautions
Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2.Maintenance and inspection of mounting machines shall be conducted periodically.
Selection of Adhesives
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the following factors are appro-
priately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, please contact us for further
information.
Technical
consider-
ations
Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid this, the following points
shall be considerable.
1 The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
2 The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
3 To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be used on the other side of the
PCB. The following diagrams show some typical examples of good and bad pick-up nozzle placement:
Items Not recommended Recommended
Single-sided
mounting
Double-sided
mounting
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical impact on the capacitors.
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of the pin shall be conducted
periodically.
Selection of Adhesives
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in stresses on the capaci-
tors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect components. Therefore, the following precautions
shall be noted in the application of adhesives.
1Required adhesive characteristics
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have sufficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
f . The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
2The recommended amount of adhesives is as follows;
Recommended condition
Figure 212/316 case sizes as examples
a 0.3mm min
b 100 to 120 μm
c Adhesives shall not contact land   
1
2
mlcc_prec-P3 mlcc_prec_e-01
PRECAUTIONS
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer Ceramic Capacitors
4. Soldering
Precautions
Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
1Flux used shall be less than or equal to 0.1 wt% in CI equivalent of halogenated content. Flux having a strong acidity content shall not be applied.
2When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
3When water-soluble flux is used, special care shall be taken to properly clean the boards.
Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
Technical
consider-
ations
Selection of Flux
1-1. When too much halogenated substance Chlorine, etc. content is used to activate ux, or highly acidic ux is used, it may lead to corrosion of terminal elec-Chlorine, etc. content is used to activate ux, or highly acidic ux is used, it may lead to corrosion of terminal elec-Chlorine, etc. content is used to activate ux, or highly acidic ux is used, it may lead to corrosion of terminal elec- content is used to activate ux, or highly acidic ux is used, it may lead to corrosion of terminal elec- content is used to activate flux, or highly acidic flux is used, it may lead to corrosion of terminal elec-
trodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted and may adversely affect
the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high humidity conditions may cause
a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning methods and the capability of the machines used shall also be
considered carefully when water-soluble flux is used.
Soldering
Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock.
Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within 100 to 130.
Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100.
Reflow soldering
Recommended conditions for eutectic soldering Recommended condition for Pb-free soldering
Temperature(℃)
0
100
200
300
230
Within 10 sec.
60sec.
Min.
60sec.
Min.
Slow cooling
Preheating
Temperature (℃)
0
100
200
300
Temperature (℃
0
100
200
300
Temperature (℃
Temperature (℃
0
100
200
300
Peak 260 Max.
Within 10sec.
Heating above
230
40sec. Max.
Slow
cooling
Preheating 150
60sec. Min.
230250
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260 Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150
0
100
200
300
400
230280
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature (℃
0
100
200
300
400
Temperature (℃
0
100
200
300
400
Peak 350 Max.
Within 3sec.
Peak 280 Max.
Within 3sec.
Slow cooling Slow cooling
T
T
Preheating
150 Min.
60sec. Min.
Preheating
150 Min.
60sec. Min.
Caution
The ideal condition is to have solder mass fillet controlled to 1/2 to 1/3 of the thickness of a capacitor.
Capacitor
PC board
T
Solder
Because excessive dwell times can adversely affect solderability, soldering duration shall be kept as
close to recommended times as possible.
Wave soldering
Recommended conditions for eutectic soldering Recommended condition for Pb-free soldering
Temperature (℃
0
100
200
300
Temperature (℃)
0
100
200
300
Temperature (℃
Temperature (℃
0
100
200
300
Peak 260 Max.
Within 10sec.
Heating above
230
40sec. Max.
Slow
cooling
Preheating 150
60sec. Min.
230250
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260 Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150
0
100
200
300
400
230280
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature (℃
0
100
200
300
400
Temperature (℃
0
100
200
300
400
Peak 350 Max.
Within 3sec.
Peak 280 Max.
Within 3sec.
Slow cooling Slow cooling
T
T
Preheating
150 Min.
60sec. Min.
Preheating
150 Min.
60sec. Min.
Temperature (℃
0
100
200
300
Temperature (℃
0
100
200
300
Temperature (℃)
Temperature (℃
0
100
200
300
Peak 260 Max.
Within 10sec.
Heating above
230
40sec. Max.
Slow
cooling
Preheating 150
60sec. Min.
230250
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260 Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150
0
100
200
300
400
230280
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature (℃
0
100
200
300
400
Temperature (℃
0
100
200
300
400
Peak 350 Max.
Within 3sec.
Peak 280 Max.
Within 3sec.
Slow cooling Slow cooling
T
T
Preheating
150 Min.
60sec. Min.
Preheating
150 Min.
60sec. Min.
Caution
Wave soldering must not be applied to capacitors designated as for reflow soldering only.
Hand soldering
Recommended conditions for eutectic soldering Recommended condition for Pb-free soldering
Temperature (℃
0
100
200
300
Temperature (℃
0
100
200
300
Temperature (℃
Temperature (℃)
0
100
200
300
Peak 260 Max.
Within 10sec.
Heating above
230
40sec. Max.
Slow
cooling
Preheating 150
60sec. Min.
230250
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260 Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150
0
100
200
300
400
230280
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature (℃
0
100
200
300
400
Temperature (℃
0
100
200
300
400
Peak 350 Max.
Within 3sec.
Peak 280 Max.
Within 3sec.
Slow cooling Slow cooling
T
T
Preheating
150 Min.
60sec. Min.
Preheating
150 Min.
60sec. Min.
Temperature (℃
0
100
200
300
Temperature (℃
0
100
200
300
Temperature (℃
Temperature (℃
0
100
200
300
Peak 260 Max.
Within 10sec.
Heating above
230
40sec. Max.
Slow
cooling
Preheating 150
60sec. Min.
230250
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260 Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150
0
100
200
300
400
230280
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature (℃)
0
100
200
300
400
Temperature (℃
0
100
200
300
400
Peak 350 Max.
Within 3sec.
Peak 280 Max.
Within 3sec.
Slow cooling Slow cooling
T
T
Preheating
150 Min.
60sec. Min.
Preheating
150 Min.
60sec. Min.
Temperature (℃
0
100
200
300
Temperature (℃
0
100
200
300
Temperature (℃
Temperature (℃
0
100
200
300
Peak 260 Max.
Within 10sec.
Heating above
230
40sec. Max.
Slow
cooling
Preheating 150
60sec. Min.
230250
Within 3sec.
Preheating
120sec. Min.
Slow cooling
Peak 260 Max.
Within 10sec.
Slow
cooling
120sec. Min.
Preheating
150
0
100
200
300
400
230280
Within 3 sec.
Preheating
60sec. Min.
Slow cooling
Temperature (℃
0
100
200
300
400
Temperature (℃)
0
100
200
300
400
Peak 350 Max.
Within 3sec.
Peak 280 Max.
Within 3sec.
Slow cooling Slow cooling
T
T
Preheating
150 Min.
60sec. Min.
Preheating
150 Min.
60sec. Min.
T
316type or less
T150
T
325type or more
T130
Caution
Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
The soldering iron shall not directly touch capacitors.
1
2
mlcc_prec-P4
mlcc_prec_e-01
PRECAUTIONS
This catalog contains the typical specication only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
Precautions on the use of Multilayer Ceramic Capacitors
5. Cleaning
Precautions
Cleaning conditions
1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use of the cleaning.e.g. to
remove soldering flux or other materials from the production process.
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect capacitor's characteristics.
Technical
consider-
ations
1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate their outer coating, resulting in
a degradation of the capacitor's electrical properties especially insulation resistance.
2. Inappropriate cleaning conditions insufficient or excessive cleaning may adversely affect the performance of the capacitors.
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the cracking of capacitors or the soldered
portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall be carefully checked;
Ultrasonic output : 20 W/ or less
Ultrasonic frequency : 40 kHz or less
Ultrasonic washing period : 5 min. or less
6. Resin coating and mold
Precautions
1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal stor-
age conditions resulting in the deterioration of the capacitor's performance.
2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat may lead to damage or
destruction of capacitors.
The use of such resins, molding materials etc. is not recommended.
7. Handling
Precautions
Splitting of PCB
1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.
2. Board separation shall not be done manually, but by using the appropriate devices.
Mechanical considerations
Be careful not to subject capacitors to excessive mechanical shocks.
1If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.
2Please be careful that the mounted components do not come in contact with or bump against other boards or components.
8. Storage conditions
Precautions
Storage
1.
To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control temperature and humidity in
the storage area. Humidity should especially be kept as low as possible.
Recommended conditions
Ambient temperature : Below 30
Humidity : Below 70% RH
The ambient temperature must be kept below 40. Even under ideal storage conditions, solderability of capacitor is deteriorated as time passes, so capaci-
tors shall be used within 6 months from the time of delivery.
Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.
2.
The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, o care shall be taken to design circuits . Even if
capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150 for 1hour.
Technical
consider-
ations
If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and quality loss of taping/
packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the above period, please check solderability be-
fore using the capacitors.
RCR-2335BSafety Application Guide for fixed ceramic capacitors for use in electronic equipmentis published by JEITA.
 Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.