Sample & Buy Product Folder Technical Documents Support & Community Tools & Software TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676 TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195 SLVSAI0J - OCTOBER 2010 - REVISED MAY 2016 TPS8267x 600-mA, High-Efficiency MicroSiPTM Step-Down Converter (Profile <1.0mm) 1 Features 3 Description * * * * * * * * * * * * The TPS8267x device is a complete 600mA, DC/DC step-down power supply intended for low-power applications. Included in the package are the switching regulator, inductor and input/output capacitors. No additional components are required to finish the design. 1 * * * 90% Efficiency at 5.5 MHz Operation 17A Quiescent Current Wide VIN Range From 2.3 V to 4.8 V 5.5MHz Regulated Frequency Operation Spread Spectrum, PWM Frequency Dithering Best in Class Load and Line Transient 2% Total DC Voltage Accuracy Automatic PFM/PWM Mode Switching Low Ripple Light-Load PFM Mode 35dB VIN PSRR (1kHz to 10kHz) Internal Soft Start, 120-s Start-Up Time Integrated Active Power-Down Sequencing (Optional) Current Overload and Thermal Shutdown Protection Sub 1-mm Profile Solution Total Solution Size <6.7 mm2 2 Applications * * * * * The TPS8267x is based on a high-frequency synchronous step-down dc-dc converter optimized for battery-powered portable applications. The MicroSiPTM DC/DC converter operates at a regulated 5.5-MHz switching frequency and enters the powersave mode operation at light load currents to maintain high efficiency over the entire load current range. The PFM mode extends the battery life by reducing the quiescent current to 17A (typ) during light load operation. For noise-sensitive applications, the device has PWM spread spectrum capability providing a lower noise regulated output, as well as low noise at the input. These features, combined with high PSRR and AC load regulation performance, make this device suitable to replace a linear regulator to obtain better power conversion efficiency. The TPS8267x is packaged in a compact (2.3mm x 2.9mm) and low profile (1.0mm) BGA package suitable for automated assembly by standard surface mount equipment. Cell Phones, Smart-Phones Camera Module, Optical Data Module Wearable Electronics Digital TV, WLAN, GPS and BluetoothTM Applications POL Applications Device Information(1) PART NUMBER TPS8267x PACKAGE SIP (8) BODY SIZE (NOM) 2.30 x 2.90 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. 4 Simplified Schematic spacer Efficiency vs Output Current 90 TPS82671SIP VIN L VOUT 1.8 V @ 600mA SW CO CI GND EN FB MODE MODE SELECTION Efficiency - % VIN 2.3 V .. 4.8 V VI = 3.6 V, VO = 1.8 V 225 80 DC/DC Converter ENABLE 250 100 Efficiency PFM/PWM Operation 70 175 60 150 50 125 40 100 75 30 Power Loss PFM/PWM Operation 20 GND 200 Power Loss - mW spacer 50 25 10 Copyright (c) 2016, Texas Instruments Incorporated 0 0.1 1 10 100 IO - Load Current - mA 0 1000 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA. TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676 TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195 SLVSAI0J - OCTOBER 2010 - REVISED MAY 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 9 Features .................................................................. Applications ........................................................... Description ............................................................. Simplified Schematic............................................. Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 1 2 4 5 5 8.1 8.2 8.3 8.4 8.5 8.6 5 6 6 6 6 8 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description .............................................. 9 9.1 Overview ................................................................... 9 9.2 Functional Block Diagram ......................................... 9 9.3 Feature Description................................................. 10 9.4 Device Functional Modes........................................ 12 10 Applications and Implementation...................... 13 10.1 Application Information.......................................... 13 10.2 Typical Application ............................................... 13 11 Power Supply Recommendations ..................... 20 12 Layout................................................................... 21 12.1 Layout Guidelines ................................................. 21 12.2 Layout Example .................................................... 21 12.3 Surface Mount Information ................................... 21 13 Device and Documentation Support ................. 22 13.1 13.2 13.3 13.4 13.5 13.6 Documentation Support ........................................ Related Links ........................................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 22 22 22 22 22 23 14 Mechanical, Packaging, and Orderable Information ........................................................... 23 5 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision I (November 2014) to Revision J Page * Added TPS8267195 part number to data sheet .................................................................................................................... 1 * Added TPS8267195 to Electrical Characteristics table ......................................................................................................... 7 * Changed Layout Example figure, Note 4 value from "...less than 0.5 mm.." to "...less than 0.5 m.." ............................... 21 Changes from Revision H (October 2014) to Revision I Page * Moved Tstg spec to Absolute Maximum Ratings table for clarification .................................................................................. 5 * Changed Handling Ratings to ESD Ratings and replaced MIN/MAX values with VALUE for clarification ........................ 6 * Added TPS826716 data and removed Product Preview note. .............................................................................................. 7 Changes from Revision G (September 2014) to Revision H * Page Added TPS826716 to Device Comparison Table as Product Preview. ................................................................................. 4 Changes from Revision F (November 2012) to Revision G Page * Added Device Information and Handling Rating tables, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. .................................... 1 * Added device TPS826721 ..................................................................................................................................................... 4 Changes from Revision E (October 2012) to Revision F * 2 Page Added TPS826745 to Header ................................................................................................................................................ 1 Submit Documentation Feedback Copyright (c) 2010-2016, Texas Instruments Incorporated Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195 TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676 TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195 www.ti.com SLVSAI0J - OCTOBER 2010 - REVISED MAY 2016 Changes from Revision D (April 2012) to Revision E * Page Added TPS826765 to Header ................................................................................................................................................ 1 Changes from Revision C (November 2011) to Revision D * Page Added devices TPS82670, TPS82673, and TPS82674 to Header ....................................................................................... 1 Changes from Revision B (August 2011) to Revision C * Page Added device TPS82672 to Header info ................................................................................................................................ 1 Changes from Revision A (April 2011) to Revision B * Page Added TPS82676 part number to data sheet header ........................................................................................................... 1 Changes from Original (October 2010) to Revision A Page * Added devices TPS82677 and TPS82678 to Header info ..................................................................................................... 1 * Added copyright attribution for spectrum illustrations........................................................................................................... 11 Copyright (c) 2010-2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195 3 TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676 TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195 SLVSAI0J - OCTOBER 2010 - REVISED MAY 2016 www.ti.com 6 Device Comparison Table PART NUMBER (1) 4 (1) OUTPUT VOLTAGE DEVICE SPECIFIC FEATURE PACKAGE MARKING TPS82670 1.86V PWM Spread Spectrum Modulation Low PFM Output Ripple Voltage Output Capacitor Discharge YK TPS82671 1.8V PWM Spread Spectrum Modulation Low PFM Output Ripple Voltage RA TPS826711 1.8V PWM Spread Spectrum Modulation Low PFM Output Ripple Voltage Output Capacitor Discharge YW TPS826716 1.6V PWM Spread Spectrum Modulation Low PFM Output Ripple Voltage GS TPS82672 1.5V PWM Spread Spectrum Modulation Low PFM Output Ripple Voltage WD TPS826721 2.1V PWM Spread Spectrum Modulation Low PFM Output Ripple Voltage EO TPS82673 1.26V PWM Spread Spectrum Modulation Low PFM Output Ripple Voltage Output Capacitor Discharge YL TPS82674 1.2V PWM Spread Spectrum Modulation Low PFM Output Ripple Voltage Output Capacitor Discharge SW TPS826745 1.225V PWM Spread Spectrum Modulation Low PFM Output Ripple Voltage Output Capacitor Discharge B5 TPS82675 1.2V PWM Spread Spectrum Modulation Low PFM Output Ripple Voltage RB TPS82676 1.1V PWM Spread Spectrum Modulation Low PFM Output Ripple Voltage Output Capacitor Discharge TU TPS826765 1.05V PWM Spread Spectrum Modulation Low PFM Output Ripple Voltage Output Capacitor Discharge AN TPS82677 1.2V Output Capacitor Discharge SK TPS8267195 1.95V PWM Spread Spectrum Modulation Low PFM Output Ripple Voltage 4A For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com Submit Documentation Feedback Copyright (c) 2010-2016, Texas Instruments Incorporated Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195 TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676 TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195 www.ti.com SLVSAI0J - OCTOBER 2010 - REVISED MAY 2016 7 Pin Configuration and Functions space SIP-8 (TOP VIEW) VOUT A1 A2 MODE B1 B2 GND C1 C2 A3 C3 SIP-8 (BOTTOM VIEW) VIN VIN EN EN GND GND A3 C3 A2 A1 VOUT B2 B1 MODE C2 C1 GND space Pin Functions PIN NAME VOUT I/O NO. DESCRIPTION A1 O Power output pin. Apply output load between this pin and GND. VIN A2, A3 I The VIN pins supply current to the TPS8267x internal regulator. EN B2 I This is the enable pin of the device. Connect this pin to ground to force the converter into shutdown mode. Pull this pin to VI to enable the device. This pin must not be left floating and must be terminated. This is the mode selection pin of the device. This pin must not be left floating and must be terminated. MODE B1 I C1, C2, C3 - MODE = LOW: The device is operating in regulated frequency pulse width modulation mode (PWM) at high-load currents and in pulse frequency modulation mode (PFM) at light load currents. MODE = HIGH: Low-noise mode is enabled and regulated frequency PWM operation is forced. GND Ground pin. 8 Specifications 8.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN -0.3 6 Voltage at VIN (TPS826721) (3) -0.3 5.5 Voltage at VOUT -0.3 3.6 V -0.3 VIN + 0.3 V Voltage at VIN VI (2) Voltage at EN, MODE Power dissipation TA Operating temperature range (4) TINT (max) Maximum internal operating temperature Tstg Storage temperature (1) (2) (3) (4) MAX UNIT (3) V Internally limited -40 -55 85 C 125 C 125 C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to network ground terminal. Operation above 4.8V input voltage for extended periods may affect device reliability. In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating temperature (TINT(max)), the maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package in the application (RJA), as given by the following equation: TA(max)= TJ(max)-(RJA X PD(max)). To achieve optimum performance, it is recommended to operate the device with a maximum internal temperature of 105C. Copyright (c) 2010-2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195 5 TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676 TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195 SLVSAI0J - OCTOBER 2010 - REVISED MAY 2016 www.ti.com 8.2 ESD Ratings VALUE VESD (1) (1) (2) (3) (4) Human body model (HBM) ESD stress voltage (2) 2000 Charge device model (CDM) ESD stress voltage (3) 1000 Machine model (MM) ESD stress voltage (4) 200 UNIT V V Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in to the device. Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. The machine model is a 200-pF capacitor discharged directly into each pin. 8.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) VIN Input voltage range IO Output current range MIN NOM MAX 2.3 4.8 (1) 0 600 mA TPS82671 to TPS826765 Additional output capacitance (PFM/PWM operation) (2) UNIT V TPS82670 to TPS82676 TPS826711, TPS826716, TPS826721, TPS826765, TPS8267195 0 2.5 F TPS82677 0 4 F 0 7 F Additional output capacitance (PWM operation) (2) TA Ambient temperature -40 +85 C TJ Operating junction temperature -40 +125 C (1) (2) Operation above 4.8V input voltage for extended periods may affect device reliability. In certain applications larger capacitor values can be tolerable, see Output Capacitor Selection section for more details. 8.4 Thermal Information TPS8267x THERMAL METRIC (1) SIP UNIT 8 PINS RJA Junction-to-ambient (top) thermal resistance 125 Junction-to-ambient (bottom) thermal resistance 70 RJCtop Junction-to-case (top) thermal resistance - RJB Junction-to-board thermal resistance - JT Junction-to-top characterization parameter - JB Junction-to-board characterization parameter - RJCbot Junction-to-case (bottom) thermal resistance - (1) C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 8.5 Electrical Characteristics Minimum and maximum values are at VIN = 2.3V to 5.5V, VOUT = 1.8V, EN = 1.8V, AUTO mode and TA = -40C to 85C; Circuit of Parameter Measurement Information section (unless otherwise noted). Typical values are at VIN = 3.6V, VOUT = 1.8V, EN = 1.8V, AUTO mode and TA = 25C (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX IO = 0mA. Device not switching 17 40 IO = 0mA. PWM operation 5.8 UNIT SUPPLY CURRENT IQ Operating quiescent current ISD Shutdown current UVLO 6 Undervoltage lockout threshold Submit Documentation Feedback EN = GND A mA 0.5 5 TPS8267195 only 2.08 2.14 all other versions 2.05 2.1 A V Copyright (c) 2010-2016, Texas Instruments Incorporated Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195 TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676 TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195 www.ti.com SLVSAI0J - OCTOBER 2010 - REVISED MAY 2016 Electrical Characteristics (continued) Minimum and maximum values are at VIN = 2.3V to 5.5V, VOUT = 1.8V, EN = 1.8V, AUTO mode and TA = -40C to 85C; Circuit of Parameter Measurement Information section (unless otherwise noted). Typical values are at VIN = 3.6V, VOUT = 1.8V, EN = 1.8V, AUTO mode and TA = 25C (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT PROTECTION Thermal shutdown Thermal shutdown hysteresis ILIM Peak Input Current Limit ISC Input current limit under short-circuit conditions VO shorted to ground 140 C 10 C 1100 mA 13.5 mA ENABLE, MODE VIH High-level input voltage VIL Low-level input voltage Ilkg Input leakage current 1.0 V 0.4 V 0.01 1.5 A 4.9 5.45 6.0 MHz 2.5V VI 4.8V, 0mA IO 600 mA PFM/PWM operation 0.98xVNOM VNOM 1.03xVNOM V 2.5V VI 5.5V, 0mA IO 600 mA PFM/PWM operation 0.98xVNOM VNOM 1.04xVNOM V 2.5V VI 5.5V, 0mA IO 600 mA PWM operation 0.98xVNOM VNOM 1.02xVNOM V 2.5V VI 4.8V, 0mA IO 600 mA PFM/PWM operation 0.975xVNOM VNOM 1.035xVNOM V 2.5V VI 5.5V, 0mA IO 600 mA PFM/PWM operation 0.975xVNOM VNOM 1.045xVNOM V 2.5V VI 5.5V, 0mA IO 600 mA PWM operation 0.975xVNOM VNOM 1.025xVNOM V 2.5V VI 4.8V, 0mA IO 600 mA PFM/PWM operation 0.98xVNOM VNOM 1.04xVNOM V 2.5V VI 5.5V, 0mA IO 600 mA PWM operation 0.98xVNOM VNOM 1.02xVNOM V Input connected to GND or VIN OSCILLATOR fSW Oscillator frequency IO = 0mA. PWM operation OUTPUT VOUT Regulated DC output voltage TPS82670 TPS82671 TPS826711 TPS826716 TPS82672 TPS826721 TPS82673 TPS82674 TPS826745 TPS82675 TPS82676 TPS826765 TPS8267195 TPS82677 Line regulation VI = VO + 0.5V (min 2.5V) to 5.5V, IO = 200 mA Load regulation IO = 0mA to 600 mA. PWM operation Feedback input resistance VO Power-save mode ripple voltage Start-up time rDIS Discharge resistor for power-down sequence 0.23 %/V -0.00085 %/mA 480 k IO = 1mA, VO = 1.8V 19 mVPP TPS826716 IO = 1mA, VO = 1.6V 19 mVPP TPS826721 IO = 1mA, VO = 2.1V 19 mVPP TPS82673 TPS82674 TPS826745 TPS82675 IO = 1mA, VO = 1.2V 16 mVPP TPS82671 TPS826711 TPS82676 IO = 1mA, VO = 1.1V 16 mVPP TPS826765 IO = 1mA, VO = 1.05V 16 mVPP TPS82677 IO = 1mA, VO = 1.2V 25 mVPP TPS82671 TPS826711 IO = 0mA, Time from active EN to VO 120 s Devices featuring active discharge Copyright (c) 2010-2016, Texas Instruments Incorporated 70 150 Submit Documentation Feedback Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195 7 TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676 TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195 SLVSAI0J - OCTOBER 2010 - REVISED MAY 2016 www.ti.com 8.6 Typical Characteristics 6 28 26 IO = 150 mA TA = 85C 5.5 TA = 25C fS - Switching Frequency - MHz 24 IQ - Quiescent Current - mA 22 20 18 16 14 12 TA = -40C 10 8 6 IO = 300 mA 5 IO = 400 mA 4.5 IO = 500 mA 4 3.5 3 4 2 0 2.7 3 3.3 3.6 3.9 4.2 VI - Input Voltage - V 4.5 2.5 2.5 2.7 4.8 2.9 3.1 3.3 3.5 3.7 3.9 VI - Input Voltage - V 4.1 4.3 4.5 VO = 1.8 V 85 80 IO = 10 mA 75 PFM Operation 70 IO = 150 mA 65 60 PWM Operation 55 50 45 40 35 IO = 400 mA 30 PWM Operation 25 20 15 10 5 0 0.01 0.1 1 10 100 f - Frequency - kHz VI = 3.6 V VO = 1.8 V Figure 2. PWM Switching Frequency vs. Input Voltage 5m 4.5 m Spurious Output Noise (PFM Mode) - V PSRR - Power Supply Rejection Ratio - dB Figure 1. Quiescent Current vs. Input Voltage Figure 3. Power Supply Rejection Ratio vs. Frequency VI = 4.2 V 300 m 250 m VI = 2.7 V 150 m 100 m VI = 3.6 V 50 m VO = 1.8 V Span = 4 MHz f - Frequency - MHz VI = 4.2 V 1.5 m VI = 3.6 V 1m 500 m Span = 1 MHz f - Frequency - MHz RL = 150 10 (TPS82671) RL = 12 Submit Documentation Feedback 1 IOUT = 10 mA (PFM Mode) 0.1 IOUT = 150 mA (PWM Mode) 0.01 40 0.001 0.1 (TPS82671) VI = 3.6 V Figure 5. Spurious Output Noise (PWM Mode) vs. Frequency 8 2m Figure 4. Spurious Output Noise (PFM Mode) vs. Frequency Output Spectral Noise Density - V/VHz Spurious Output Noise (PWM Mode) - V 400 m 5n 0 VI = 2.7 V 2.5 m 10 450 m 200 m 3m VO = 1.8 V 500 m 350 m 3.5 m 50 n 0 1000 (TPS82671) 5m 1 10 100 f - Frequency - kHz VO = 1.8 V 1000 (TPS82671) Figure 6. Output Spectral Noise Density vs. Frequency Copyright (c) 2010-2016, Texas Instruments Incorporated Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195 TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676 TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195 www.ti.com SLVSAI0J - OCTOBER 2010 - REVISED MAY 2016 9 Detailed Description 9.1 Overview The TPS8267x is a stand-alone, synchronous, step-down converter. The converter operates at a regulated 5.5MHz frequency pulse width modulation (PWM) at moderate to heavy load currents. At light load currents, the TPS8267x converter operates in power-save mode with pulse frequency modulation (PFM). The converter uses a unique frequency-locked ring-oscillating modulator to achieve best-in-class load and line response. One key advantage of the non-linear architecture is that there is no traditional feed-back loop. The loop response to change in VO is essentially instantaneous, which explains the transient response. Although this type of operation normally results in a switching frequency that varies with input voltage and load current, an internal frequency lock loop (FLL) holds the switching frequency constant over a large range of operating conditions. Combined with best-in-class load and line-transient response characteristics, the low quiescent current of the device (approximately 17A) helps to maintain high efficiency at light load while that current preserves a fast transient response for applications that require tight output regulation. The TPS8267x integrates an input current limit to protect the device against heavy load or short circuits and features an undervoltage lockout circuit to prevent the device from misoperation at low input voltages. Fully functional operation is permitted down to 2.1V input voltage. 9.2 Functional Block Diagram MODE EN VIN CI 2.2 F DC/DC CONVERTER VIN Undervoltage Lockout Bias Supply Bandgap Soft-Start V REF = 0.8 V Negative Inductor Current Detect Power Save Mode Switching Thermal Shutdown Current Limit Detect Frequency Control R1 - L Gate Driver R2 AntiShoot Through VREF VOUT 1H CO + 4.7 F Feedback Divider GND Copyright (c) 2010-2016, Texas Instruments Incorporated Copyright (c) 2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195 9 TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676 TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195 SLVSAI0J - OCTOBER 2010 - REVISED MAY 2016 www.ti.com 9.3 Feature Description 9.3.1 Power-Save Mode If the load current decreases, the converter enters power-save mode automatically. During power-save mode, the converter operates in discontinuous current, (DCM) single-pulse PFM mode, which produces a low output ripple compared with other PFM architectures. When in power-save mode, the converter resumes its operation when the output voltage falls below the nominal voltage. The converter ramps up the output voltage with a minimum of one pulse and goes into power-save mode when the output voltage is within its regulation limits. The IC exits PFM mode and enters PWM mode when the output current can no longer be supported in PFM mode. As a consequence, the DC output voltage is typically positioned approximately 0.5% above the nominal output voltage. The transition between PFM and PWM is seamless. PFM Mode at Light Load PFM Ripple Nominal DC Output Voltage PWM Mode at Heavy Load Figure 7. Operation In PFM Mode And Transfer To PWM Mode 9.3.2 Mode Selection The MODE pin selects the operating mode of the device. Connecting the MODE pin to GND enables the automatic PWM and power-save mode operation. The converter operates in regulated frequency PWM mode at moderate to heavy loads, and operates in PFM mode during light loads. This type of operation maintains high efficiency over a wide load current range. Pulling the MODE pin high forces the converter to operate in PWM mode even at light-load currents. The advantage is that the converter modulates its switching frequency according to a spread spectrum PWM modulation technique that allows simple filtering of the switching harmonics in noise-sensitive applications. In this mode, the efficiency is lower when compared to the power-save mode during light loads. For additional flexibility, it is possible to switch from power-save mode to PWM mode during operation. This type of operation allows efficient power management by adjusting the operation of the converter to the specific system requirements. 9.3.3 Spread Spectrum, PWM Frequency Dithering The goal of spread spectrum architecture is to spread out the emitted RF energy over a larger frequency range so that any resulting electromagnetic interference (EMI) is similar to white noise. The end result is a spectrum that is continuous and lower in peak amplitude. Spread spectrum makes it easier to comply with EMI standards. It also makes it easier to comply with the power supply ripple requirements in cellular and non-cellular wireless applications. Radio receivers are typically susceptible to narrowband noise that is focused on specific frequencies. Switching regulators can be particularly troublesome in applications where electromagnetic interference (EMI) is a concern. Switching regulators operate on a cycle-by-cycle basis to transfer power to an output. In most cases, the frequency of operation is either fixed or regulated, based on the output load. This method of conversion creates large components of noise at the frequency of operation (fundamental) and multiples of the operating frequency (harmonics). 10 Submit Documentation Feedback Copyright (c) 2010-2016, Texas Instruments Incorporated Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195 TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676 TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195 www.ti.com SLVSAI0J - OCTOBER 2010 - REVISED MAY 2016 Feature Description (continued) The spread spectrum architecture varies the switching frequency by approximately 10% of the nominal switching frequency, thereby significantly reduces the peak radiated and conducting noise on both the input and output supplies. The frequency dithering scheme is modulated with a triangle profile and a modulation frequency fm. 0 dBV FENV,PEAK Dfc Dfc Non-modulated harmonic F1 Side-band harmonics window after modulation 0 dBVref B = 2 x fm x (1 + mf ) = 2 x ( Dfc + fm ) Bh = 2 x fm x (1 + mf x h ) B = 2 x fm x (1 + mf ) = 2 x ( Dfc + fm ) Figure 8. Spectrum Of A Frequency Modulated Sin. Wave With Sinusoidal Variation In Time Figure 9. Spread Bands Of Harmonics In Modulated Square Signals (1) Figure 8 and Figure 9 show that after modulation the sideband harmonic is attenuated when compared to the non-modulated harmonic, and when the harmonic energy is spread into a certain frequency band. The higher the modulation index (mf) the larger the attenuation. m = c m (1) With: fc is the carrier frequency (i.e. nominal switching frequency) fm is the modulating frequency (approx. 0.016*fc) is the modulation ratio (approx 0.1) d= D c c (2) The maximum switching frequency is limited by the process and by the parameter modulation ratio (), together with fm, which is the bandwidth of the side-band harmonics around the carrier frequency fc. The bandwidth of a frequency modulated waveform is approximately given by the Carson's rule and can be summarized as: ( B = 2 |m 1 + m | )=2 (D |c + |m ) (3) fm < RBW: The receiver is not able to distinguish individual side-band harmonics; so, several harmonics are added in the input filter and the measured value is higher than expected in theoretical calculations. fm > RBW: The receiver is able to properly measure each individual side-band harmonic separately, so that the measurements match the theoretical calculations. (1) Spectrum illustrations and formulae (Figure 8 and Figure 9) copyright IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, VOL. 47, NO.3, AUGUST 2005. See References Section for full citation. Copyright (c) 2010-2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195 11 TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676 TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195 SLVSAI0J - OCTOBER 2010 - REVISED MAY 2016 www.ti.com 9.4 Device Functional Modes 9.4.1 Enable The TPS8267x device starts operation when EN is set high and starts up with the soft start as previously described. For proper operation, the EN pin must be terminated and must not be left floating. Pulling the EN pin low forces the device into shutdown. In this mode, all internal circuits are turned off and the VIN current reduces to the device leakage current, which is typically a few hundred nanoamps. The TPS8267x device can actively discharge the output capacitor when it turns off. The integrated discharge resistor has a typical resistance of 100 . The required time to ramp down the output voltage depends on the load current and the capacitance present at the output node. 9.4.2 Soft Start The TPS8267x has an internal soft-start circuit that limits the in-rush current during start-up. This circuit limits input voltage drop when a battery or a high-impedance power source is connected to the input of the MicroSiPTM DC/DC converter. The soft-start system progressively increases the switching on-time from a minimum pulse-width of 35ns as a function of the output voltage. This mode of operation continues for approximately 100s after the enable. If the output voltage does not reach its target value within the soft-start time, the soft-start transitions to a second mode of operation. If the output voltage rises above approximately 0.5V, the converter increases the input current limit and thus enables the power supply to come up properly. The start-up time mainly depends on the capacitance present at the output node and the load current. 12 Submit Documentation Feedback Copyright (c) 2010-2016, Texas Instruments Incorporated Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195 TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676 TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195 www.ti.com SLVSAI0J - OCTOBER 2010 - REVISED MAY 2016 10 Applications and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 10.1 Application Information The TPS8267x devices are complete power supply modules, not needing further external devices. The devices are optimized to work best with the components populated. However application conditions might demand for different input and/or output capacitance values. 10.2 Typical Application TPS8267XSIP DC/DC Converter VIN VIN SW GND FB CI VOUT CO EN ENABLE L MODE GND MODE SELECTION Copyright (c) 2016, Texas Instruments Incorporated Figure 10. MicroSIP Converter Module Schematic 10.2.1 Design Requirements For applications requiring additional input and/or output capacitance, the following procedures should be considered. For the maximum recommended values see Recommended Operating Conditions. 10.2.2 Detailed Design Procedure 10.2.2.1 Input Capacitor Selection Because of the pulsating input current nature of the buck converter, a low ESR input capacitor is required to prevent large voltage transients that can cause misbehavior of the device or interference in other circuits in the system. For most applications, the input capacitor that is integrated into the TPS8267x should be sufficient. If the application exhibits a noisy or erratic switching frequency, experiment with additional input ceramic capacitance to find a remedy. The TPS8267x uses a tiny ceramic input capacitor. When a ceramic capacitor is combined with trace or cable inductance, such as from a wall adapter, a load step at the output can induce ringing at the VIN pin. This ringing can couple to the output and be mistaken as loop instability or can even damage the part. In this circumstance, additional "bulk" capacitance, such as electrolytic or tantalum, should be placed between the input of the converter and the power source lead to reduce ringing that can occur between the inductance of the power source leads and CI. 10.2.2.2 Output Capacitor Selection The advanced, fast-response, voltage mode, control scheme of the TPS8267x allows the use of a tiny ceramic output capacitor (CO). For most applications, the output capacitor integrated in the TPS8267x is sufficient. Copyright (c) 2010-2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195 13 TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676 TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195 SLVSAI0J - OCTOBER 2010 - REVISED MAY 2016 www.ti.com Typical Application (continued) At nominal load current, the device operates in PWM mode; the overall output voltage ripple is the sum of the voltage step that is caused by the output capacitor ESL and the ripple current that flows through the output capacitor impedance. At light loads, the output capacitor limits the output ripple voltage and provides holdup during large load transitions. The TPS8267x is designed as a Point-Of-Load (POL) regulator, to operate stand-alone without requiring any additional capacitance. Adding a 2.2F ceramic output capacitor (X7R or X5R dielectric) generally works from a converter stability point of view, but does not necessarily help to minimize the output ripple voltage. For best operation (i.e. optimum efficiency over the entire load current range, proper PFM/PWM auto transition), the TPS8267xSIP requires a minimum output ripple voltage in PFM mode. The typical output voltage ripple is ca. 1% of the nominal output voltage VO. The PFM pulses are time controlled resulting in a PFM output voltage ripple and PFM frequency that depends (first order) on the capacitance seen at the MicroSiPTM DC/DC converter's output. In applications requiring additional output bypass capacitors located close to the load, care should be taken to ensure proper operation. If the converter exhibits marginal stability or erratic switching frequency, experiment with additional low value series resistance (e.g. 50 to 100m) in the output path to find a remedy. Because the damping factor in the output path is directly related to several resistive parameters (e.g. inductor DCR, power-stage rDS(on), PWB DC resistance, load switches rDS(on) ...) that are temperature dependant, the converter small and large signal behavior must be checked over the input voltage range, load current range and temperature range. The easiest sanity test is to evaluate, directly at the converter's output, the following aspects: * * PFM/PWM efficiency PFM/PWM and forced PWM load transient response During the recovery time from a load transient, the output voltage can be monitored for settling time, overshoot or ringing that helps judge the converter's stability. Without any ringing, the loop has usually more than 45 of phase margin. 14 Submit Documentation Feedback Copyright (c) 2010-2016, Texas Instruments Incorporated Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195 TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676 TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195 www.ti.com SLVSAI0J - OCTOBER 2010 - REVISED MAY 2016 Typical Application (continued) 10.2.3 Application Curves 100 90 80 VI = 2.7 V PFM/PWM Operation Efficiency - % 70 60 VI = 3.6 V PFM/PWM Operation 50 VI = 4.2 V PFM/PWM Operation 40 VI = 3.6 V Forced PWM Operation 30 20 10 0 0.1 1 10 100 1000 IO - Load Current - mA VO = 1.8 V VO = 1.95V Figure 11. Efficiency vs. Load Current VO = 1.2 V Figure 13. Efficiency vs. Load Current VO = 1.8 V PFM/PWM Operation (TPS82671) Figure 15. Peak-to-Peak Output Ripple Voltage vs. Load Current Copyright (c) 2010-2016, Texas Instruments Incorporated Figure 12. Efficiency vs. Load Current VO = 1.8 V PFM/PWM Operation Figure 14. Efficiency vs. Input Voltage VO = 1.2 V PFM/PWM Operation (TPS82675) Figure 16. Peak-to-Peak Output Ripple Voltage vs. Load Current Submit Documentation Feedback Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195 15 TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676 TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195 SLVSAI0J - OCTOBER 2010 - REVISED MAY 2016 www.ti.com Typical Application (continued) VO = 1.2 V (TPS82671) Figure 17. Peak-to-Peak Output Ripple Voltage vs. Load Current VO = 1.2 V (TPS82675) Figure 19. DC Output Voltage vs. Load Current VO = 1.8 V MODE = Low (TPS82671) Figure 21. Combined Line/Load Transient Response 16 Submit Documentation Feedback VO = 1.8 V PFM/PWM Operation (TPS82671) Figure 18. DC Output Voltage vs. Load Current VO = 1.2 V PFM/PWM Operation (TPS82677) Figure 20. DC Output Voltage vs. Load Current VO = 1.8 V MODE = Low (TPS82671) Figure 22. Combined Line/Load Transient Response Copyright (c) 2010-2016, Texas Instruments Incorporated Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195 TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676 TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195 www.ti.com SLVSAI0J - OCTOBER 2010 - REVISED MAY 2016 Typical Application (continued) VO = 1.8 V VI = 3.6 V MODE = Low (TPS82671) Figure 23. Load Transient Response in PFM/PWM Operation VO = 1.8 V VI = 2.7 V MODE = Low (TPS82671) Figure 25. Load Transient Response in PFM/PWM Operation VO = 1.8 V VI = 3.6 V MODE = Low (TPS82671) Figure 27. Load Transient Response in PFM/PWM Operation Copyright (c) 2010-2016, Texas Instruments Incorporated VO = 1.8 V VI = 3.6 V MODE = Low (TPS82671) Figure 24. Load Transient Response in PFM/PWM Operation VO = 1.8 V VI = 4.5 V MODE = Low (TPS82671) Figure 26. Load Transient Response in PFM/PWM Operation VO = 1.8 V VI = 2.7 V MODE = Low (TPS82671) Figure 28. Load Transient Response in PFM/PWM Operation Submit Documentation Feedback Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195 17 TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676 TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195 SLVSAI0J - OCTOBER 2010 - REVISED MAY 2016 www.ti.com Typical Application (continued) VO = 1.8 V VI = 4.5 V MODE = Low (TPS82671) Figure 29. Load Transient Response in PFM/PWM Operation VO = 1.8 V VI = 3.6 V VI = 2.7 V MODE = Low Figure 33. Load Transient Response in PFM/PWM Operation 18 Submit Documentation Feedback VI = 3.6 V MODE = Low MODE = Low Figure 31. Load Transient Response in PFM/PWM Operation VO = 1.2 V MODE = Low (TPS82671) Figure 30. AC Load Transient Response VO = 1.2 V VO = 1.2 V VI = 3.6 V Figure 32. Load Transient Response in PFM/PWM Operation VO = 1.2 V VI = 4.5 V MODE = Low Figure 34. Load Transient Response in PFM/PWM Operation Copyright (c) 2010-2016, Texas Instruments Incorporated Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195 TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676 TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195 www.ti.com SLVSAI0J - OCTOBER 2010 - REVISED MAY 2016 Typical Application (continued) VO = 1.2 V VI = 3.6 V MODE = Low Figure 35. Load Transient Response in PFM/PWM Operation VO = 1.2 V VI = 4.5 V MODE = Low (TPS82671) Figure 37. Load Transient Response in PFM/PWM Operation VO = 1.8 V Figure 39. PFM/PWM Boundaries Copyright (c) 2010-2016, Texas Instruments Incorporated (TPS82671) VO = 1.2 V VI = 2.7 V MODE = Low Figure 36. Load Transient Response in PFM/PWM Operation VO = 1.2 V VI = 3.6 V MODE = Low (TPS82671) Figure 38. AC Load Transient Response VO = 1.2 V (TPS82674) Figure 40. PFM/PWM Boundaries Submit Documentation Feedback Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195 19 TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676 TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195 SLVSAI0J - OCTOBER 2010 - REVISED MAY 2016 www.ti.com Typical Application (continued) VO = 1.8 V VI = 3.6 V IO = 0 mA MODE = Low Figure 41. Start-Up VO = 1.8 V RL = 100 VI = 3.6 V (TPS82671) MODE = Low Figure 42. Start-Up 11 Power Supply Recommendations The TPS8267X devices are designed to operate from a 2.3-V to 4.8-V input voltage supply. The input power supply's output current needs to be rated according to the output voltage and the output current of the power rail application. 20 Submit Documentation Feedback Copyright (c) 2010-2016, Texas Instruments Incorporated Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195 TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676 TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195 www.ti.com SLVSAI0J - OCTOBER 2010 - REVISED MAY 2016 12 Layout 12.1 Layout Guidelines In making the pad size for the SiP LGA balls, it is recommended that the layout use non-solder-mask defined (NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the opening size is defined by the copper pad width. Figure 43 shows the appropriate diameters for a MicroSiPTM layout. 12.2 Layout Example Copper Trace Width Solder Pad Width Solder Mask Opening Copper Trace Thickness Solder Mask Thickness M0200-01 Figure 43. Recommended Land Pattern Image And Dimensions SOLDER PAD DEFINITIONS (1) (2) (3) (4) COPPER PAD Non-solder-mask defined (NSMD) 0.30mm (1) (2) (3) (4) (5) (6) SOLDER MASK OPENING 0.360mm (5) COPPER THICKNESS STENCIL (6) OPENING STENCIL THICKNESS 1oz max (0.032mm) 0.34mm diameter 0.1mm thick Circuit traces from non-solder-mask defined PWB lands should be 75 m to 100 m wide in the exposed area inside the solder mask opening. Wider trace widths reduce device stand off and affect reliability. Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the intended application. Recommend solder paste is Type 3 or Type 4. For a PWB using a Ni/Au surface finish, the gold thickness should be less than 0.5 m to avoid a reduction in thermal fatigue performance. Solder mask thickness should be less than 20 m on top of the copper circuit pattern. For best solder stencil performance use laser cut stencils with electro polishing. Chemically etched stencils give inferior solder paste volume control. 12.3 Surface Mount Information The TPS8267x MicroSiPTM DC/DC converter uses an open frame construction that is designed for a fully automated assembly process and that features a large surface area for pick and place operations. See the "Pick Area" in the package drawings. Package height and weight have been kept to a minimum thereby to allow the MicroSiPTM device to be handled similarly to a 0805 component. See JEDEC/IPC standard J-STD-20b for reflow recommendations. Copyright (c) 2010-2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195 21 TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676 TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195 SLVSAI0J - OCTOBER 2010 - REVISED MAY 2016 www.ti.com 13 Device and Documentation Support 13.1 Documentation Support 13.1.1 References "EMI Reduction in Switched Power Converters Using Frequency Modulation Techniques", in IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, VOL. 4, NO. 3, AUGUST 2005, pp 569-576 by Josep Balcells, Alfonso Santolaria, Antonio Orlandi, David Gonzalez, Javier Gago. 13.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 1. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY TPS82670 Click here Click here Click here Click here Click here TPS82671 Click here Click here Click here Click here Click here TPS82672 Click here Click here Click here Click here Click here TPS82673 Click here Click here Click here Click here Click here TPS82674 Click here Click here Click here Click here Click here TPS82675 Click here Click here Click here Click here Click here TPS82676 Click here Click here Click here Click here Click here TPS82677 Click here Click here Click here Click here Click here TPS826711 Click here Click here Click here Click here Click here TPS826716 Click here Click here Click here Click here Click here TPS826721 Click here Click here Click here Click here Click here TPS826745 Click here Click here Click here Click here Click here TPS826765 Click here Click here Click here Click here Click here TPS8267195 Click here Click here Click here Click here Click here 13.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 13.4 Trademarks MicroSiP, E2E are trademarks of Texas Instruments. Bluetooth is a trademark of Bluetooth SIG, Inc. All other trademarks are the property of their respective owners. 13.5 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 22 Submit Documentation Feedback Copyright (c) 2010-2016, Texas Instruments Incorporated Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195 TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676 TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195 www.ti.com SLVSAI0J - OCTOBER 2010 - REVISED MAY 2016 13.6 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. 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Copyright (c) 2010-2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677 TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195 23 PACKAGE OPTION ADDENDUM www.ti.com 3-Sep-2018 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) TPS82670SIPR ACTIVE uSiP SIP 8 3000 RoHS (In Work) & Green (In Work) Call TI Call TI -40 to 85 YK TXI670 TPS82670SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 YK TXI670 TPS826711SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 YW TXI671 TPS826711SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 YW TXI671 TPS826716SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 GS (TXI671, TXI6716) TPS826716SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 GS (TXI671, TXI6716) TPS82671SIPR ACTIVE uSiP SIP 8 3000 Green (RoHS & no Sb/Br) SnAgCu Level-2-260C-1 YEAR -40 to 85 RA TXI671 TPS82671SIPT ACTIVE uSiP SIP 8 250 Green (RoHS & no Sb/Br) SnAgCu Level-2-260C-1 YEAR -40 to 85 RA TXI671 TPS826721SIPR ACTIVE uSiP SIP 8 3000 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 EO TXI672 TPS826721SIPT ACTIVE uSiP SIP 8 250 Green (RoHS & no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 EO TXI672 TPS82672SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 WD TXI672 TPS82672SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 WD TXI672 TPS82673SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 YL TXI673 TPS82673SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 YL TXI673 TPS826745SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 B5 TXI674 TPS826745SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 B5 TXI674 TPS82674SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 SW Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 3-Sep-2018 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) TXI674 TPS82674SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 SW TXI674 TPS82675SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 RB TXI675 TPS82675SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 RB TXI675 TPS826765SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 AN TXI676 TPS826765SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 AN TXI676 TPS82676SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 TU TXI676 TPS82676SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 TU TXI676 TPS82677SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 SK TXI677 TPS82677SIPT ACTIVE uSiP SIP 8 250 TBD Call TI Call TI -40 to 85 SK TXI677 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 3-Sep-2018 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 6-May-2018 TAPE AND REEL INFORMATION *All dimensions are nominal Device TPS826721SIPR Package Package Pins Type Drawing uSiP SIP 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 3000 178.0 9.0 Pack Materials-Page 1 2.45 B0 (mm) K0 (mm) P1 (mm) 3.05 1.1 4.0 W Pin1 (mm) Quadrant 8.0 Q2 PACKAGE MATERIALS INFORMATION www.ti.com 6-May-2018 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS826721SIPR uSiP SIP 8 3000 223.0 194.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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