Datasheet Voltage Detector IC Series Bipolar Voltage Detector ICs BD47xx series General Description The BD47xx Series is a reset IC that was developed to prevent system errors at transient state when the power of CPU or logic circuit switches ON/OFF or momentary shut down. These ICs consist of three terminals (power supply, GND and reset output) to detect power supply voltages and outputs reset signals of various systems. These ICs are ultra-compact and are realized low current consumption, making them ideal for portable products. Key Specifications Detection voltage range: High accuracy detection voltage: Low current consumption: Operating temperature range: Package SSOP5 Features High accuracy detection Low current consumption Very small package Open collector "L" reset output 1.9~4.6V (Typ.) 0.1V steps 1% 1.6A (Typ.) -40C to +75C 2.90mm x 2.80mm x 1.15mm Applications All electronic devices that use micro controllers and logic circuits Typical Application Circuit VDD VDD RL BD47xx series CPU Micro-controller RESET VOUT CL GND Connection Diagram SSOP5 TOP VIEW VDD Pin Descriptions VOUT Lot. No Marking N.C. GND SUB GND PIN No. Symbol Function 1 N.C. Unconnected Terminal 2 SUB Substrate * 3 GND GND 4 VOUT Reset Output 5 VDD Power Supply Voltage *Substrate Pin should be connected with GND Product structureSilicon monolithic integrated circuit This product is not designed protection against radioactive rays. www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211114001 1/10 TSZ02201-0R7R0G300020-1-2 20.DEC.2011 Rev.002 Datasheet BD47xx series z Ordering Information B D 4 7 1 Bipolar Reset 9 G T R Detection Voltage Package Packaging and forming specification Example: 1.9VAE19 GSSOP5 TR: Embossed tape and reel SSOP5 5 4 1 2 3 Tape Embossed carrier tape Quantity 3000pcs Direction of feed 0.2Min. +0.2 1.6 -0.1 2.80.2 <Tape and Reel information> +6 4 -4 2.90.2 TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand 1pin +0.05 0.13 -0.03 1.25Max. ) 0.050.05 1.10.05 S +0.05 0.42 -0.04 0.95 0.1 S Direction of feed Reel (Unit : mm) Order quantity needs to be multiple of the minimum quantity. Lineup Marking B2 B1 BZ BY BX BW BV BU BT BS Detection Voltage 4.6V 4.5V 4.4V 4.3V 4.2V 4.1V 4.0V 3.9V 3.8V 3.7V Part Number Marking BD4746 BD4745 BD4744 BD4743 BD4742 BD4741 BD4740 BD4739 BD4738 BD4737 BR BQ BP B4 BN BM BL BK BJ B3 Detection Voltage 3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2/10 Part Number Marking BD4736 BD4735 BD4734 BD4733 BD4732 BD4731 BD4730 BD4729 BD4728 BD4727 BH BG BF BE BD BC BB BA Detection Voltage 2.6V 2.5V 2.4V 2.3V 2.2V 2.1V 2.0V 1.9V Part Number BD4726 BD4725 BD4724 BD4723 BD4722 BD4721 BD4720 BD4719 TSZ02201-0R7R0G300020-1-2 20.DEC.2011 Rev.002 Datasheet BD47xx series Absolute maximum ratings (Ta=25C) Parameter Symbol Limit Unit Power Supply Voltage VDD -0.3 to +10 V -0.3 to +10 V VOUT Output Voltage *1 *2 Power Dissipation Pd 540 mW Operation Temperature Range Topt -40 to +75 C Ambient Storage Temperature Tstg -55 to +125 C *1 When a ROHM standard circuit board (70mmx70mmx1.6mm glass epoxy board) is mounted. *2 When used at temperatures higher than Ta=25C, the power is reduced by 5.4mW/C Electrical characteristics (Unless Otherwise Specified Ta=25C) Parameter Detection Voltage Symbol VDET Condition VDD=HAEL RL=4.7k Temperature Coefficient VDET/T RL=4.7kTa=-20~+75C Designed Guarantee Of Detection Voltage Detection Hysteresis Voltage VDET RL=4.7k, VDDLAEHAEL Transfer Delay Time "H" tPLH CL=100pFRL=4.7k *1 Transfer Delay Time "L" tPHL CL=100pFRL=4.7k *2 Reset Output Voltage "L" VOL VDD=VDET(min.)-0.05V, RL=4.7k Circuit Current ON Icc1 VDD=VDET(min.)-0.05V, RL= Circuit Current OFF Icc2 VDD=VDET(typ.)/0.85V, RL= Operating Voltage Range VOPL RL=4.7kVOL0.4V Output Leak Current Ileak VDD=VOUT=10V Reset Output Current "L" IOL Vo=0.4V, VDD=VDET(min.)-0.05V VDET(T):Standard Detection Voltage1.9V to 4.6V, 0.1V step R:Pull-up resistor to be connected between VOUT and power supply. CL:Capacitor to be connected between VOUT and GND. *1 tPLH:Vcc=(VDET(typ.)-0.4V)AE(VDET(typ.)+0.4V) *2 tPHL:Vcc=(VDET(typ.)+0.4V)AE(VDET(typ.)-0.4V) Designed Guarantee.(Outgoing inspection is not done on all products.) www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/10 Limit Typ. Min. Max. VDET (T) VDET(T) VDET(T) x0.99 x1.01 Unit V - 0.01 - %/C 30 3.0 50 20 60 0.1 1.5 1.6 0.65 15.0 100 50 120 0.4 3.0 3.2 0.85 0.1 - mV s s V A A V A mA TSZ02201-0R7R0G300020-1-2 20.DEC.2011 Rev.002 Datasheet BD47xx series Block Diagram VDD 5 4 VOUT Vref 3 GND Fig.1 BD47xx series www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/10 TSZ02201-0R7R0G300020-1-2 20.DEC.2011 Rev.002 Datasheet BD47xx series Typical Performance Curves "LOW" OUTPUT CURRENT IOL [mA] CIRCUIT CURRENT ICC [A] 10 BD4729 BD4729G 9 8 7 6 5 4 3 2 Icc1=1.34A Icc2=1.46A 1 0 0 1 2 3 4 5 6 7 8 800 600 500 400 IOL=12.194mA at Vo=400mV 300 200 100 0 9 10 0 VDD SUPPLY VOLTAGE VDD [V] 5 10 15 20 25 30 OUTPUT VOLTAGE VOUT[mV] Fig.2 Circuit Current Fig.3 "Low" Output Current 1000 OUTPUT VOLTAGE VOUT[mV] 6 OUTPUT VOLTAGE VOUT[V] BD4729 BD4729G 700 BD4729 BD4729G 5 4 3 2 VDET=2.90V VDET=2.95V 1 VDET=50mV 0 0 1 2 3 4 5 BD4729G BD4729 900 800 700 600 500 400 VOPL=0.675V 300 200 100 0 6 0 VDD SUPPLY VOLTAGE VDD [V] 0.5 1 1.5 2 2.5 VDD SUPPLY VOLTAGE VDD [V] Fig.4 I/O Characteristics Fig.5 Operating Limit Voltage www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 5/10 TSZ02201-0R7R0G300020-1-2 20.DEC.2011 Rev.002 Datasheet BD47xx series CIRCUIT CURRENT WHEN ON ICC1[mA] DETECTION VOLTAGE VDET[V] 3.5 BD4729G BD4729 3.3 3.1 -0.007%/ 2.9 2.7 2.5 ~ ~ 2.0 1.5 1.0 0.5 0.0 -20 -10 0 10 20 30 40 50 60 70 80 TEMPERATURE Ta[] Fig.6 Detection Voltage Fig.7 Circuit Current when ON 2.5 0.9 BD4729 BD4729G 2.0 1.5 1.0 0.5 0.0 -20 -10 0 10 20 30 40 50 60 70 80 BD4729 BD4729G 0.8 0.7 0.6 0.5 0.4 -20 -10 0 10 20 30 40 50 60 70 80 TEMPERATURE Ta[] TEMPERATURE Ta[] Fig.8 Circuit Current when OFF Fig.9 Operating Limit Voltage www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 BD4729G BD4729 TEMPERATURE Ta[] MINIMUM OPERATION VOLTAGE VOPL[V] CIRCUIT CURRENT WHEN OFF I CC2[mA] 2.3 -20 -10 0 10 20 30 40 50 60 70 80 2.5 6/10 TSZ02201-0R7R0G300020-1-2 20.DEC.2011 Rev.002 Datasheet BD47xx series OUTPUT VOLTAGE VOUT [mV] 500 BD4729 BD4729G 400 300 Ta=-20 200 100 Ta=75 Ta=25 0 0 1 2 3 4 5 "LOW" OUTPUT CURRENT IOL [mA] Fig.10 Output Saturation Voltage www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 7/10 TSZ02201-0R7R0G300020-1-2 20.DEC.2011 Rev.002 Datasheet BD47xx series Application Information Explanation of Operation BD47xx series has the detection voltages and release voltages as threshold voltages and, as the voltages applied to the input reach their respective threshold voltages, the output switches from "High" to "Low" and from "Low" to "High". The release voltage has a hysteresis that is the detection voltage +50mV (Typ.), preventing chattering in the output. When the input is greater than the release voltage, the output is in a "High" state. When the input is lowered from that state, the output switches to "Low" on the detection voltage. When the input is less than the detection voltage, the output is in a "Low" state. When the input is raised from that state, the output switches to "High" with the release voltage. Additionally, at least 0.85V is required for the circuit to operate fully. When the input falls below the operating limit voltage, the output becomes unsettled. VDD VDD VDET+VDET VDET 0V VOPL VOUT VOH tPHL tPLH tPLH tPHL VOL Fig.11 Timing Waveform 1 When the power supply is turned on, the output is unsettled from after over the operating limit voltage (VOPL) until tPHL. Therefore it is possible that the reset signal is not outputted when the rise time of VDD is faster than tPHL. 2 When VDD is greater than VOPL but less than the reset release voltage (VDET+VDET), the output voltages will switch to Low. 3 If VDD exceeds the reset release voltage (VDET+VDET), then VOUT switches from L to H. 4 If VDD drops below the detection voltage (VDET) when the power supply is powered down or when there is a power supply fluctuation, VOUT switches to L (with a delay of tPHL). 5 The potential difference between the detection voltage and the release voltage is known as the hysteresis width (VDET). The system is designed such that the output does not flip-flop with power supply fluctuations within this hysteresis width, preventing malfunctions due to noise. <Precautions> Please be aware that when there is resistance on the power supply line, the detection voltage varies with voltage drops caused by the IC current consumption. Please connect a capacitor between VDD and GND when the power supply line has high impedance. www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 8/10 TSZ02201-0R7R0G300020-1-2 20.DEC.2011 Rev.002 Datasheet BD47xx series Circuit Applications The following is an example of an application circuit using Reset IC for normal power supply detection. BD47xx series requires a pull up resistor on the output terminal. The pull up resister value should be decided. As the application with enough confirmation of power supply level and output current capability. When a capacitor has been inserted into the output terminal to delay the output time or to remove noise, the output will be slower during starting or stopping. Please be careful to select the appropriate pull up resistors, output current and capacitor when inserting a bypass capacitor between input and GND. Please be aware that if an extremely large capacitor is used, the response time will become excessively slow. 5 VDD microcontroller 4 VDD Reset Pin VOUT Vref 3 BD47xx series GND Fig.12 Circuit Applications www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 9/10 TSZ02201-0R7R0G300020-1-2 20.DEC.2011 Rev.002 Datasheet BD47xx series Operational Notes 1. Absolute maximum range Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be defined the failure mode, such as short mode or open mode. Therefore a physical security countermeasure, like fuse, is to be given when a specific mode to be beyond absolute maximum ratings is considered. 2. GND potential GND terminal should be a lowest voltage potential every state. Please make sure all pins, which are over ground even if, include transient feature. 3. Electromagnetic Field Mal-function may happen when the device is used in the strong electromagnetic field. 4. Bypass Capacitor for Noise Rejection Please put into the capacitor between VDD pin and GND, to reject noise. If extremely big capacitor is used, transient response might be late. Please confirm sufficiently for the point. 5. Short Circuit between Terminal and Soldering Don't short-circuit between Output pin and VDD pin, Output pin and GND pin, or VDD pin and GND pin. When soldering the IC on circuit board, please be unusually cautious about the orientation and the position of the IC. When the orientation is mistaken the IC may be destroyed. 6. This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause unexpected operations. Application values in these conditions should be selected carefully. If the leakage is assumed between the VOUT terminal and the GND terminal, the pull-up resistor should be less than 1/10 of the assumed leak resistance. 7. External parameters The recommended parameter range for RL is 2k~1M. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using practical applications. 8. Power on reset operation Please note that the power on reset output varies with the VDD rise up time. Please verify the actual operation. 9. Precautions for board inspection Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be certain to use proper discharge procedure before each process of the test operation. To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handing, transfer and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup. 10. When the power supply, is turned on because of in certain cases, momentary Rash-current flow into the IC at the logic unsettled, the couple capacitance, GND pattern of width and leading line must be considered. Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10/10 TSZ02201-0R7R0G300020-1-2 20.DEC.2011 Rev.002 Datasheet Notice Precaution for circuit design 1) The products are designed and produced for application in ordinary electronic equipment (AV equipment, OA equipment, telecommunication equipment, home appliances, amusement equipment, etc.). If the products are to be used in devices requiring extremely high reliability (medical equipment, transport equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or operational error may endanger human life and sufficient fail-safe measures, please consult with the ROHM sales staff in advance. If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits in the case of single-circuit failure 2) The products are designed for use in a standard environment and not in any special environments. Application of the products in a special environment can deteriorate product performance. Accordingly, verification and confirmation of product performance, prior to use, is recommended if used under the following conditions: [a] Use in various types of liquid, including water, oils, chemicals, and organic solvents [b] Use outdoors where the products are exposed to direct sunlight, or in dusty places [c] Use in places where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use in places where the products are exposed to static electricity or electromagnetic waves [e] Use in proximity to heat-producing components, plastic cords, or other flammable items [f] Use involving sealing or coating the products with resin or other coating materials [g] Use involving unclean solder or use of water or water-soluble cleaning agents for cleaning after soldering [h] Use of the products in places subject to dew condensation 3) The products are not radiation resistant. 4) Verification and confirmation of performance characteristics of products, after on-board mounting, is advised. 5) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 6) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 7) Confirm that operation temperature is within the specified range described in product specification. 8) Failure induced under deviant condition from what defined in the product specification cannot be guaranteed. Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the remainder of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the Company in advance. Regarding Precaution for Mounting / Circuit board design, please specially refer to ROHM Mounting specification Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics of the products and external components, including transient characteristics, as well as static characteristics. 2) The application examples, their constants, and other types of information contained herein are applicable only when the products are used in accordance with standard methods. Therefore, if mass production is intended, sufficient consideration to external conditions must be made. Notice - Rev.001 Datasheet Precaution for Electrostatic This product is Electrostatic sensitive product, which may be damaged due to Electrostatic discharge. Please take proper caution during manufacturing and storing so that voltage exceeding Product maximum rating won't be applied to products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriorate if the products are stored in the following places: [a] Where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] Where the temperature or humidity exceeds those recommended by the Company [c] Storage in direct sunshine or condensation [d] Storage in high Electrostatic 2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using products of which storage time is exceeding recommended storage time period . 3) Store / transport cartons in the correct direction, which is indicated on a carton as a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use products within the specified time after opening a dry bag. Precaution for product label QR code printed on ROHM product label is only for internal use, and please do not use at customer site. It might contain a internal part number that is inconsistent with an product part number. Precaution for disposition When disposing products please dispose them properly with a industry waste company. Precaution for Foreign exchange and Foreign trade act Since concerned goods might be fallen under controlled goods prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Prohibitions Regarding Industrial Property 1) Information and data on products, including application examples, contained in these specifications are simply for reference; the Company does not guarantee any industrial property rights, intellectual property rights, or any other rights of a third party regarding this information or data. Accordingly, the Company does not bear any responsibility for: [a] infringement of the intellectual property rights of a third party [b] any problems incurred by the use of the products listed herein. 2) The Company prohibits the purchaser of its products to exercise or use the intellectual property rights, industrial property rights, or any other rights that either belong to or are controlled by the Company, other than the right to use, sell, or dispose of the products. Notice - Rev.001