BD4719G-TR - Rohm Semiconductor

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Datasheet

Voltage Detector IC Series

Bipolar

Voltage Detector ICs

BD47xx series

●General Description

The BD47xx Series is a reset IC that was developed to

prevent system errors at transient state when the

power of CPU or logic circuit switches ON/OFF or

momentary shut down. These ICs consist of three

terminals (power supply, GND and reset output) to

detect power supply voltages and outputs reset signals

of various systems. These ICs are ultra-compact and

are realized low current consumption, making them

ideal for portable products.

●Features

 High accuracy detection

 Low current consumption

 Very small package

 Open collector “L” reset output

●Key Specifications

 Detection voltage range: 1.9~4.6V (Typ.)

0.1V steps

 High accuracy detection voltage: ±1%

 Low current consumption: 1.6µA (Typ.)

 Operating temperature range: -40°C to +75°C

●Package

SSOP5 2.90mm x 2.80mm x 1.15mm

●Applications

All electronic devices that use micro controllers and

logic circuits

●Typical A pplication Circuit

●Connection Diagram

SSOP5

TOP VIEW

●Pin Descriptions

PIN No. Symbol Function

1 N.C. Unconnected Terminal

2 SUB Substrate *

3 GND GND

4 VOUT Reset Output

5 VDD Power Supply Voltage

*Substrate Pin should be connected with GND

GND

BD47xx series RESET

GND

VOUT

VDDVDD

CPU

Micro-controller

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.

N.C. SUB GND

VOUTVDD

Lot. No

Marking

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BD47xx series Datasheet

z Ordering Information

B D 4 7 1 9 G － T R

Bipolar Reset Detection Voltage Package Packaging and forming specification

Example: 1.9VÆ19 G：SSOP5 TR: Embossed tape and reel

●Lineup

Marking Detection

Voltage Part Number Marking Detection

Voltage Part Number

B2 4.6V BD4746 BR 3.6V BD4736 BH 2.6V BD4726

B1 4.5V BD4745 BQ 3.5V BD4735 BG 2.5V BD4725

BZ 4.4V BD4744 BP 3.4V BD4734 BF 2.4V BD4724

BY 4.3V BD4743 B4 3.3V BD4733 BE 2.3V BD4723

BX 4.2V BD4742 BN 3.2V BD4732 BD 2.2V BD4722

BW 4.1V BD4741 BM 3.1V BD4731 BC 2.1V BD4721

BV 4.0V BD4740 BL 3.0V BD4730 BB 2.0V BD4720

BU 3.9V BD4739 BK 2.9V BD4729 BA 1.9V BD4719

BT 3.8V BD4738 BJ 2.8V BD4728

BS 3.7V BD4737 B3 2.7V BD4727

Direction of feed

Reel

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

3000pcs

()

1pin

(Unit : mm)

SSOP5

2.9±0.2

0.13

4°+6°

−4°

1.6

2.8±0.2

1.1±0.05

0.05±0.05

+0.2

−0.1

+0.05

−0.03

0.42+0.05

−0.04

0.95

123

1.25Max.

0.2Min.

0.1 S

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BD47xx series Datasheet

●Absolute maximum ratings (Ta=25°C)

Parameter Symbol Limit Unit

Power Supply Voltage VDD -0.3 to +10 V

Output Voltage VOUT -0.3 to +10 V

Power Dissipation *1 *2 Pd 540 mW

Operation Temperature Range Topt -40 to +75 °C

Ambient Storage Temperature Tstg -55 to +125 °C

*1 When a ROHM standard circuit board (70mm×70mm×1.6mm glass epoxy board) is mounted.

*2 When used at temperatures higher than Ta=25°C, the power is reduced by 5.4mW/°C

●Electrical characteristics (Un l ess Otherwise Specified Ta=25°C)

Limit

Parameter Symbol Condition Min. Typ. Max.

Unit

Detection Voltage VDET VDD=HÆL RL=4.7k VDET (T)

×0.99 VDET(T) VDET(T)

×1.01 V

Temperature Coefficient

Of Detection Voltage VDET/T RL=4.7kTa=-20~+75°C Designed Guarantee - ±0.01 - %/°C

Detection Hysteresis Voltage VDET RL=4.7k, VDD＝LÆHÆL 30 50 100 mV

Transfer Delay Time ”H” t

PLH C

L=100pF，RL=4.7k *1 - 20 50 µs

Transfer Delay Time ”L” t

PHL C

L=100pF，RL=4.7k *2 - 60 120 µs

Reset Output Voltage ”L” V

OL V

DD=VDET(min.)-0.05V, RL=4.7k - 0.1 0.4 V

Circuit Current ON Icc1 VDD=VDET(min.)-0.05V, RL=∞ - 1.5 3.0 µA

Circuit Current OFF Icc2 VDD=VDET(typ.)/0.85V, RL=∞ - 1.6 3.2 µA

Operating Voltage Range VOPL R

L=4.7k，VOL0.4V - 0.65 0.85 V

Output Leak Current Ileak V

DD=VOUT=10V - - 0.1 µA

Reset Output Current ”L” I

OL Vo=0.4V, VDD=VDET(min.)-0.05V 3.0 15.0 - mA

VDET(T):Standard Detection Voltage（1.9V to 4.6V, 0.1V step）

RＬ:Pull-up resistor to be connected between VOUT and power supply.

CL:Capacitor to be connected between VOUT and GND.

*1 tPLH:Vcc=(VDET(typ.)-0.4V)Æ(VDET(typ.)+0.4V)

*2 tPHL:Vcc=(VDET(typ.)+0.4V)Æ(VDET(typ.)-0.4V)

Designed Guarantee.(Outgoing inspection is not done on all products.)

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BD47xx series Datasheet

●Block Diagram

Fig.1 BD47xx series

Vre

VOUT

VDD

GND

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BD47xx series Datasheet

●Typical Performance Curves

Fig.2 Circuit Current

012345678910

VDD SUPPLY VOLTAGE ：VDD[V]

CIRCUIT CURRENT ： ICC[A]

【BD4729G】

Icc1=1.34A

Icc2=1.46A

100

200

300

400

500

600

700

800

0 5 10 15 20 25 30

OUTPUT VOLTAGE ： VOUT[mV]

"LOW" OUTPUT CURRENT ： IOL[mA]

【BD4729G】

IOL=12.194mA at Vo=400m

Fig.3 “Low” Output Current

Fig.4 I/O Characteristics

0123456

VDD SUPPLY VOLTAGE ：VDD[V]

OUTPUT VOLTAGE ： VOUT[V]

【BD4729G】

VDET=2.95V

⊿VDET=50mV

VDET=2.90

100

200

300

400

500

600

700

800

900

1000

00.511.522.5

VDD SUPPLY VOLTAGE ： VDD[V]

OUTPUT VOLTAGE ： VOUT[mV]

【BD4729G】

VOPL=0.675V

Fig.5 Operating Limit Voltage

【BD4729】【BD4729】

【BD4729】

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BD47xx series Datasheet

Fig.7 Circuit Current when ON

0.0

0.5

1.0

1.5

2.0

2.5

-20-100 1020304050607080

TEMPERATURE ： Ta[℃]

CIRCUIT CURRENT WHEN ON ： ICC1[mA]

【BD4729G】

Fig.8 Circuit Current when OFF

0.0

0.5

1.0

1.5

2.0

2.5

-20-100 1020304050607080

TEMPERATURE ： Ta[℃]

CIRCUIT CURRENT WHEN OFF ： I CC2[mA]

【BD4729G】

Fig.9 Operating Limit Voltage

0.4

0.5

0.6

0.7

0.8

0.9

-20-100 1020304050607080

TEMPERATURE ： Ta[℃]

MINIMUM OPERATION VOLTAGE ： VOPL[V]

【BD4729G】

Fig.6 Detection Voltage

2.3

2.5

2.7

2.9

3.1

3.3

3.5

-20-100 1020304050607080

TEMPERATURE ： Ta[℃]

DETECTION VOLTAGE ： VDET[V]

【BD4729G】

-0.007%/℃

【BD4729】

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BD47xx series Datasheet

100

200

300

400

500

012345

"LOW" OUTPUT CURRENT ： IOL[mA]

OUTPUT VOLTAGE

： VOUT[mV]

【BD4729G】

Ta=25℃Ta=75℃

Ta=-20℃

Fig.10 Output Saturation Voltage

【BD4729】

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BD47xx series Datasheet

●Applic at ion Informa tion

Explanation of Operation

BD47xx series has the detection voltages and release voltages as threshold voltages and, as the voltages applied to the input

reach their respective threshold voltages, the output switches from “High” to “Low” and from “Low” to “High”. The release

voltage has a hysteresis that is the detection voltage +50mV (Typ.), preventing chattering in the output. When the input is

greater than the release voltage, the output is in a “High” state. When the input is lowered from that state, the output switches

to “Low” on the detection voltage. When the input is less than the detection voltage, the output is in a “Low” state. When the

input is raised from that state, the output switches to “High” with the release voltage. Additionally, at least 0.85V is required for

the circuit to operate fully. When the input falls below the operating limit voltage, the output becomes unsettled.

1 When the power supply is turned on, the output is unsettled from after over the operating limit voltage (VOPL) until tPHL.

Therefore it is possible that the reset signal is not outputted when the rise time of VDD is faster than tPHL.

2 When VDD is greater than VOPL but less than the reset release voltage (VDET+VDET), the output voltages will switch to

Low.

3 If VDD exceeds the reset release voltage (VDET+VDET), then VOUT switches from L to H.

4 If VDD drops below the detection voltage (VDET) when the power supply is powered down or when there is a power

supply fluctuation, VOUT switches to L (with a delay of tPHL).

5 The potential difference between the detection voltage and the release voltage is known as the hysteresis width

(VDET). The system is designed such that the output does not flip-flop with power supply fluctuations within this hysteresis

width, preventing malfunctions due to noise.

Please be aware that when there is resistance on the power supply line, the detection voltage varies with voltage drops

caused by the IC current consumption.

Please connect a capacitor between VDD and GND when the power supply line has high impedance.

Fig.11 Timing Waveform

VDD

VDET+ΔVDET

VDET

VOPL

tPHL

① ②

VOUT

tPLH

tPHL

tPLH

③ ④

VOL

VOH

VDD

⑤

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BD47xx series Datasheet

Circuit A pplications

●The following is an example of an application circuit using Reset IC for normal power supply detection. BD47xx series

requires a pull up resistor on the output terminal. The pull up resister value should be decided. As the application with

enough confirmation of power supply level and output current capability. When a capacitor has been inserted into the

output terminal to delay the output time or to remove noise, the output will be slower during starting or stopping. Please

be careful to select the appropriate pull up resistors, output current and capacitor when inserting a bypass capacitor

between input and GND. Please be aware that if an extremely large capacitor is used, the response time will become

excessively slow.

Fig.12 Circuit Applications

Vref

VOUT

VDD

GND

3 BD47xx series

VDD

Reset Pin

microcontroller

●●●●●●●●●●●●

●●●●●●●●●●●

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BD47xx series Datasheet

●Operational Notes

1. Absolute maximum range

Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be defined the

failure mode, such as short mode or open mode. Therefore a physical security countermeasure, like fuse, is to be given

when a specific mode to be beyond absolute maximum ratings is considered.

2. GND potential

GND terminal should be a lowest voltage potential every state. Please make sure all pins, which are over ground even if,

include transient feature.

3. Electromagnetic Field

Mal-function may happen when the device is used in the strong electromagnetic field.

4. Bypass Capacitor for Noise Rejection

Please put into the capacitor between VDD pin and GND, to reject noise. If extremely big capacitor is used, transient

response might be late. Please confirm sufficiently for the point.

5. Short Circuit between Terminal and Soldering

Don’t short-circuit between Output pin and VDD pin, Output pin and GND pin, or VDD pin and GND pin. When soldering the IC

on circuit board, please be unusually cautious about the orientation and the position of the IC. When the orientation is

mistaken the IC may be destroyed.

6. This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause

unexpected operations. Application values in these conditions should be selected carefully. If the leakage is assumed

between the VOUT terminal and the GND terminal, the pull-up resistor should be less than 1/10 of the assumed leak

resistance.

7. External parameters

The recommended parameter range for RL is 2k~1M. There are many factors (board layout, etc) that can affect

characteristics. Please verify and confirm using practical applications.

8. Power on reset operation

Please note that the power on reset output varies with the VDD rise up time. Please verify the actual operation.

9. Precautions for board inspection

Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be

certain to use proper discharge procedure before each process of the test operation.

To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any

equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handing, transfer

and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is

OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup.

10. When the power supply, is turned on because of in certain cases, momentary Rash-current flow into the IC at the logic

unsettled, the couple capacitance, GND pattern of width and leading line must be considered.

Status of this document

The Japanese version of this document is formal specification. A customer may use this translation version only for a reference

to help reading the formal version.

If there are any differences in translation version of this document formal version takes priority.

Datasheet

Notice - Rev.001

Notice

●Precaution for circuit design

1) The products are designed and produced for application in ordinary electronic equipment (AV equipment, OA

equipment, telecommunication equipment, home appliances, amusement equipment, etc.). If the products are to be

used in devices requiring extremely high reliability (medical equipment, transport equipment, aircraft/spacecraft,

nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose

malfunction or operational error may endanger human life and sufficient fail-safe measures, please consult with the

ROHM sales staff in advance. If product malfunctions may result in serious damage, including that to human life,

sufficient fail-safe measures must be taken, including the following:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits in the case of single-circuit failure

2) The products are designed for use in a standard environment and not in any special environments. Application of the

products in a special environment can deteriorate product performance. Accordingly, verification and confirmation of

product performance, prior to use, is recommended if used under the following conditions:

[a] Use in various types of liquid, including water, oils, chemicals, and organic solvents

[b] Use outdoors where the products are exposed to direct sunlight, or in dusty places

[c] Use in places where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2,

and NO2

[d] Use in places where the products are exposed to static electricity or electromagnetic waves

[e] Use in proximity to heat-producing components, plastic cords, or other flammable items

[f] Use involving sealing or coating the products with resin or other coating materials

[g] Use involving unclean solder or use of water or water-soluble cleaning agents for cleaning after soldering

[h] Use of the products in places subject to dew condensation

3) The products are not radiation resistant.

4) Verification and confirmation of performance characteristics of products, after on-board mounting, is advised.

5) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

6) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta).

When used in sealed area, confirm the actual ambient temperature.

7) Confirm that operation temperature is within the specified range described in product specification.

8) Failure induced under deviant condition from what defined in the product specification cannot be guaranteed.

●Precaution for Mounting / Circuit board design

1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the remainder of flux may negatively affect

product performance and reliability.

2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

Company in advance.

Regarding Precaution for Mounting / Circuit board design, please specially refer to ROHM Mounting specification

●Precautions Regarding Application Examples and External Circuits

1) If change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics

of the products and external components, including transient characteristics, as well as static characteristics.

2) The application examples, their constants, and other types of information contained herein are applicable only when

the products are used in accordance with standard methods. Therefore, if mass production is intended, sufficient

consideration to external conditions must be made.

Datasheet

Notice - Rev.001

●Precaution for Electrostatic

This product is Electrostatic sensitive product, which may be damaged due to Electrostatic discharge. Please take proper

caution during manufacturing and storing so that voltage exceeding Product maximum rating won't be applied to products.

Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from

charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

●Precaution for Storage / Transportation

1) Product performance and soldered connections may deteriorate if the products are stored in the following places:

[a] Where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] Where the temperature or humidity exceeds those recommended by the Company

[c] Storage in direct sunshine or condensation

[d] Storage in high Electrostatic

2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using products of which storage time is

exceeding recommended storage time period .

3) Store / transport cartons in the correct direction, which is indicated on a carton as a symbol. Otherwise bent leads may

occur due to excessive stress applied when dropping of a carton.

4) Use products within the specified time after opening a dry bag.

●Precaution for product label

QR code printed on ROHM product label is only for internal use, and please do not use at customer site. It might contain a

internal part number that is inconsistent with an product part number.

●Precaution for disposition

When disposing products please dispose them properly with a industry waste company.

●Precaution for Foreign exchange and Foreign trade act

Since concerned goods might be fallen under controlled goods prescribed by Foreign exchange and Foreign trade act,

please consult with ROHM in case of export.

●Prohibitions Regarding Industrial Property

1) Information and data on products, including application examples, contained in these specifications are simply for

reference; the Company does not guarantee any industrial property rights, intellectual property rights, or any other

rights of a third party regarding this information or data. Accordingly, the Company does not bear any responsibility for:

[a] infringement of the intellectual property rights of a third party

[b] any problems incurred by the use of the products listed herein.

2) The Company prohibits the purchaser of its products to exercise or use the intellectual property rights, industrial

property rights, or any other rights that either belong to or are controlled by the Company, other than the right to use,

sell, or dispose of the products.