MLX90632 FIR sensor Datasheet Features and Benefits Application Examples Small size High precision non-contact temperature measurements Easy to integrate Factory calibrated Body temperature measurement External ambient and object temperature calculation Non-contact thermometer for mobile and IoT application Standard measurement resolution 0.02C Temperature sensing element for residential, commercial and industrial building air conditioning Medical measurement resolution 0.01C Supply voltage of 3.3V, supply current 1mA (sleep current less than 2.5uA) Industrial temperature control of moving parts I2C compatible digital interface Software definable I C address with 1 LSB bit external address pin Home appliances with temperature control Healthcare Field of View of 50 Livestock monitoring Default refresh rate 0.5s, configurable between 16ms and 2s https://github.com/melexis/mlx90632library Integrated post-calibration option 2 Figure 1: Image of MLX90632 MLX90632 FIR sensor Datasheet Description The MLX90632 is a non-contact infrared temperature sensor in a small SMD SFN package. The device is factory calibrated with calibration constants stored in the EEPROM memory. The ambient and object temperature can be calculated externally based on these calibration constants and the measurement data. The MLX90632 is available in two different versions: standard and medical accuracy. Both versions are calibrated in the ambient temperature range from -20 to 85C. The difference between both versions is visible in accuracy and the object temperature range. The medical version is factory calibrated with an accuracy of 0.2C within the narrow object temperature range from 35 to 42C for medical applications. The object temperature range is limited from -20 to 100C. On the other hand, the standard version covers an object temperature range from -20 to 200C but offers an accuracy of 1C. It is very important for the application designer to understand that these accuracies are guaranteed and achievable when the sensor is in thermal equilibrium and under isothermal conditions (no temperature differences across the sensor package). The accuracy of the thermometer can be influenced by temperature differences in the package induced by causes like (among others): Hot electronics behind the sensor, heaters/coolers behind or beside the sensor or by a hot/cold object very close to the sensor that not only heats the sensing element in the thermometer but also the thermometer package. A major strength of the MLX90632 is that these temperature differences around the sensor package will be reduced to the minimum. However, some extreme cases will influence the sensor. In the same way, localized thermal variations -like turbulence in the air- will not generate thermal noise in the output signal of the thermopile. The typical supply voltage of the MLX90632 is 3.3V. For the I2C communication with the master microcontroller, two versions of the sensor are available, working either at 3.3V or 1.8V I2C reference voltage. The communication to the chip is done by I2C in fast mode plus (FM+). Through I2C the external microcontroller has access to the following blocks: RAM memory used for measurement data, in this document mainly referred to as `storage memory' EEPROM used to store the trimming values, calibration constants and device/measurement settings Based on this data, the external microcontroller can calculate the object temperature and if needed the sensor temperature. An optical filter (long-wave pass) that cuts off the visible and near infra-red radiant flux is integrated in the sensor to provide ambient light immunity. The wavelength pass band of this optical filter is from 2 till 14m. MLX90632 FIR sensor Datasheet Contents Features and Benefits................................................................................................................................ 1 Application Examples ................................................................................................................................ 1 Description ................................................................................................................................................ 2 2. Ordering Information ............................................................................................................................ 5 3. Glossary of Terms .................................................................................................................................. 6 4. Absolute Maximum ratings .................................................................................................................... 7 5. Pin definitions and descriptions ............................................................................................................. 8 6. Electrical characteristics ........................................................................................................................ 9 7. Detailed General Description............................................................................................................... 10 7.1. Block diagram.................................................................................................................................... 10 7.2. Description ........................................................................................................................................ 10 8. Memory map ....................................................................................................................................... 11 8.1. Product ID.......................................................................................................................................... 14 8.2. Product Code (0x2409) ..................................................................................................................... 15 9. Control and configuration.................................................................................................................... 16 9.1. Measurement control....................................................................................................................... 16 9.2. Device status ..................................................................................................................................... 18 9.3. Measurement settings...................................................................................................................... 19 9.3.1. Refresh rate................................................................................................................................. 19 10. I2C commands ................................................................................................................................... 20 10.1. I2C address....................................................................................................................................... 21 10.2. Addressed read ............................................................................................................................... 22 10.3. Addressed write .............................................................................................................................. 22 10.4. Global reset ..................................................................................................................................... 23 10.5. Addressed reset .............................................................................................................................. 23 10.6. EEPROM unlock for customer access ............................................................................................ 23 10.7. Direct read ...................................................................................................................................... 24 11. Operating Modes............................................................................................................................... 25 12. Temperature calculation ................................................................................................................... 26 12.1. Medical measurement ................................................................................................................... 26 12.1.1. Pre-calculations ........................................................................................................................ 27 REVISION 9 - MAY, 2020 Page 3 of 53 MLX90632 FIR sensor Datasheet 12.1.2. Ambient temperature .............................................................................................................. 28 12.1.3. Object temperature ................................................................................................................. 28 12.1.4. Example Medical measurement Temperature Calculation .................................................... 29 12.2. Extended range measurement ...................................................................................................... 33 12.2.1. Pre-calculations ........................................................................................................................ 33 12.2.2. Ambient temperature .............................................................................................................. 34 12.2.3. Object temperature ................................................................................................................. 34 12.2.4. Example Extended range measurement Temperature Calculation ....................................... 36 13. Performance characteristics .............................................................................................................. 40 13.1. Accuracy .......................................................................................................................................... 40 13.1.1. Standard .................................................................................................................................... 40 13.1.2. Medical ...................................................................................................................................... 41 13.2. Field of View (FoV) .......................................................................................................................... 42 13.3. Noise ................................................................................................................................................ 43 14. Mechanical Drawing .......................................................................................................................... 44 14.1. Package dimensions ....................................................................................................................... 44 14.2. PCB footprint................................................................................................................................... 45 15. Application schematic........................................................................................................................ 46 15.1. 3V3 I2C mode .................................................................................................................................. 46 15.2. 1V8 I2C mode .................................................................................................................................. 47 16. Software ............................................................................................................................................ 48 17. Standard information regarding manufacturability of Melexis products with different soldering processes............................................................................................................................................ 49 18. ESD Precautions................................................................................................................................. 50 19. Application comments ....................................................................................................................... 50 20. Table of figures .................................................................................................................................. 51 21. Disclaimer .......................................................................................................................................... 52 22. Contact Information .......................................................................................................................... 53 REVISION 9 - MAY, 2020 Page 4 of 53 MLX90632 FIR sensor Datasheet 2. Ordering Information Product Temperature Code Package Option Code Packing Form MLX90632 S LD BCB-000 RE MLX90632 S LD DCB-000 RE MLX90632 S LD DCB-100 RE Table 1 : Ordering codes for MLX90632 Legend: Temperature Code: S: from -20C to 85C sensor temperature Package Code: "LD" for SFN 3x3 package Option Code: XYZ-123 X: Accuracy B: Standard accuracy D: Medical accuracy Y: Pixel type C: High stability version Z: Field Of View B: 50 degrees 2 1: I C level 0: 3V3 1: 1V8 2-3: 00: Standard configuration xx: Reserved Packing Form: "RE" for Reel Ordering Example: "MLX90632SLD-DCB-000-RE" For a FIR Sensor type in SFN 3x3 package with medical accuracy, Field Of View of 50 degrees and 3V3 I2C level, delivered in Reel. Table 2: Coding legend REVISION 9 - MAY, 2020 Page 5 of 53 MLX90632 FIR sensor Datasheet 3. Glossary of Terms POR Power On Reset IR InfraRed 2 IC Inter-Integrated Circuit SDA Serial DAta - I C compatible communication pins SCL Serial CLock - I C compatible communication pins ACK / NACK Acknowledge / Not Acknowledge SOC Start Of Conversion EOC End Of Conversion FOV Field Of View Ta Ambient Temperature measured from the chip - (the package temperature) To Object Temperature, `seen' from IR sensor SFN Single Flat pack No-lead TBD To Be Defined LSB Least Significant Bit MSB Most Significant Bit EMC Electro-Magnetic Compatibility ESD Electro-Static Discharge HBM Human Body Model CDM Charged Device Model 2 2 Table 3: List of abbreviations REVISION 9 - MAY, 2020 Page 6 of 53 MLX90632 FIR sensor Datasheet 4. Absolute Maximum ratings Parameter Symbol Min. Typ. Max. Unit Supply Voltage, (over voltage) VDD 5 V Supply Voltage, (operating) VDD 3.6 V Reverse Voltage VR -1.5 V VADDR VDD + 0.6 V Address-pin Voltage Operating Temperature Range, TA -20 +85 C Storage Temperature Range, TS -40 +105 C ESD Sensitivity - HBM (acc. AEC Q100 002) 2 kV - CDM (acc. AEC Q100 011) 750 V - Air discharge (acc. IEC61000-4-2) +4 kV - Contact discharge (acc. IEC61000-4-2) +2 kV 10 A DC current into SCL DC sink current, SDA pin 20 mA DC clamp current, SDA pin 25 mA DC clamp current, SCL pin 25 mA EEPROM re-writes 10 Table 4: Absolute maximum ratings Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute maximumrated conditions for extended periods may affect device reliability. REVISION 9 - MAY, 2020 Page 7 of 53 MLX90632 FIR sensor Datasheet 5. Pin definitions and descriptions Figure 2: MLX90632 TOP view Pin # Name Direction Description 1 SDA In/Out I C Data line 2 VDD POWER Supply 3 GND GND Ground 4 SCL In I C Clock line 5 ADDR In LSB of I C address 2 2 2 Table 5: Pin definition REVISION 9 - MAY, 2020 Page 8 of 53 MLX90632 FIR sensor Datasheet 6. Electrical characteristics All parameters are valid for TA = 25 C, VDD = 3.3V (unless otherwise specified) Parameter Symbol Test Conditions Min Typ Max Units 3 3.3 3.6 V 0.5 1 1.4 mA 1.5 2.5 uA Supplies External supply VDD Supply current IDD No load Sleep current IDDpr No load, erase/write EEPROM operations Power On Reset POR level VPOR_up Power-up (full temp range) 1.3 2.4 V POR level VPOR_down Power-down (full temp range) 1.1 2.1 V VPOR_hys Full temp range 200 500 mV TPOR Ensure POR signal 20 ms Tvalid After POR POR hysteresis VDD rise time (10% to 90% of specified supply voltage) Output valid (result in RAM) 64 ms 2 I C compatible 2-wire interface 2 I C Voltage VI2C I C version = 1.8V 2 I C version = 3.3V 1.65 3 Input high voltage VIH Over temperature and supply Input low voltage VIL Output low voltage VOL 2 1.95 3.6 V V 0.7*VI2C VI2C+0.5 V Over temperature and supply -0.5 0.3*VI2C V Over temperature and supply 0 0.4 V VDD+0.5 V 0.5 V 1 A Address pin voltage ("1") VADDR,HI 2 Address pin voltage ("0") VADDR,LO 0 ADDR leakage IADDR, leak 1.8 VDD VDD SCL leakage ISCL, leak VSCL=3.6V, Ta=+85C 1 A SDA leakage ISDA, leak VSDA=3.6V, Ta=+85C 1 A SCL capacitance CSCL 10 pF SDA capacitance CSDA 10 pF Slave address SA Factory default, ADDR-pin grounded 3A hex Table 6: Electrical characteristics REVISION 9 - MAY, 2020 Page 9 of 53 MLX90632 FIR sensor Datasheet 7. Detailed General Description 7.1. Block diagram Figure 3: Block diagram 7.2. Description The MLX90632 is a far infrared, non-contact temperature sensor which is factory calibrated to a high accuracy. Internally, electrical and thermal precautions are taken to compensate for thermally harsh external conditions. The thermopile sensing element voltage signal is amplified and digitized. After digital filtering, the raw measurement result is stored in the RAM memory. Furthermore, the MLX90632 contains a sensor element to measure the temperature of the sensor itself. The raw information of this sensor is also stored in RAM after processing. All above functions are controlled by a state machine. The result of each measurement conversion is accessible via I2C. The communication to the chip is done by I2C in fast mode plus (FM+). The requirement of the standard is to run at frequencies up to 1MHz. Through I2C the external unit can have access to the following blocks: Control registers of internal state machines RAM (96cells x 16bit) for pixel and auxiliary measurement data, in this document mainly referred to as `storage memory'. EEPROM (256cells x 16bit) used to store the trimming values, calibration constants and various device/measurement settings. From the measurement data and the calibration data the external unit can calculate both the sensor temperature and the object temperature. The calculation allows the customer to adjust the calibration for his own application in case an optical window or obstructions are present. REVISION 9 - MAY, 2020 Page 10 of 53 MLX90632 FIR sensor Datasheet 8. Memory map Access Address Name Description EEPROM Read-only 0x2405 ID0[15:0] Chip version Read-only 0x2406 ID1[15:0] Chip version Read-only 0x2407 ID2[15:0] Chip version Read-only 0x2408 ID_CRC16 CRC Read-only 0x2409 EE_PRODUCT_CODE Sensor information - - Read-only 0x240B EE_VERSION EEPROM version Read-only 0x240C EE_P_R [15:0] P_R calibration constant (16-bit, Least Significant Word) Read-only 0x240D EE_P_R [31:16] P_R calibration constant (16-bit, Most Significant Word) Read-only 0x240E EE_P_G [15:0] P_G calibration constant (16-bit, Least Significant Word) Read-only 0x240F EE_P_G [31:16] P_G calibration constant (16-bit, Most Significant Word) Read-only 0x2410 EE_P_T [15:0] P_T calibration constant (16-bit, Least Significant Word) Read-only 0x2411 EE_P_T [31:16] P_T calibration constant (16-bit, Most Significant Word) Read-only 0x2412 EE_P_O [15:0] P_O calibration constant (16-bit, Least Significant Word) Read-only 0x2413 EE_P_O [31:16] P_O calibration constant (16-bit, Most Significant Word) Read-only 0x2414 EE_Aa [15:0] Aa calibration constant (16-bit, Least Significant Word) Read-only 0x2415 EE_Aa [31:16] Aa calibration constant (16-bit, Most Significant Word) Read-only 0x2416 EE_Ab [15:0] Ab calibration constant (16-bit, Least Significant Word) Read-only 0x2417 EE_Ab [31:16] Ab calibration constant (16-bit, Most Significant Word) Read-only 0x2418 EE_Ba [15:0] Ba calibration constant (16-bit, Least Significant Word) Read-only 0x2419 EE_Ba [31:16] Ba calibration constant (16-bit, Most Significant Word) Read-only 0x241A EE_Bb [15:0] Bb calibration constant (16-bit, Least Significant Word) Read-only 0x241B EE_Bb [31:16] Bb calibration constant (16-bit, Most Significant Word) Read-only 0x241C EE_Ca [15:0] Ca calibration constant (16-bit, Least Significant Word) Read-only 0x241D EE_Ca [31:16] Ca calibration constant (16-bit, Most Significant Word) Read-only 0x241E EE_Cb [15:0] Cb calibration constant (16-bit, Least Significant Word) Read-only 0x241F EE_Cb [31:16] Cb calibration constant (16-bit, Most Significant Word) Read-only 0x2420 EE_Da [15:0] Da calibration constant (16-bit, Least Significant Word) Read-only 0x2421 EE_Da [31:16] Da calibration constant (16-bit, Most Significant Word) Read-only 0x2422 EE_Db [15:0] Db calibration constant (16-bit, Least Significant Word) Read-only 0x2423 EE_Db [31:16] Db calibration constant (16-bit, Most Significant Word) REVISION 9 - MAY, 2020 Melexis reserved Page 11 of 53 MLX90632 FIR sensor Datasheet Read-only 0x2424 EE_Ea [15:0] Ea calibration constant (16-bit, Least Significant Word) Read-only 0x2425 EE_Ea [31:16] Ea calibration constant (16-bit, Most Significant Word) Read-only 0x2426 EE_Eb [15:0] Eb calibration constant (16-bit, Least Significant Word) Read-only 0x2427 EE_Eb [31:16] Eb calibration constant (16-bit, Most Significant Word) Read-only 0x2428 EE_Fa [15:0] Fa calibration constant (16-bit, Least Significant Word) Read-only 0x2429 EE_Fa [31:16] Fa calibration constant (16-bit, Most Significant Word) Read-only 0x242A EE_Fb [15:0] Fb calibration constant (16-bit, Least Significant Word) Read-only 0x242B EE_Fb [31:16] Fb calibration constant (16-bit, Most Significant Word) Read-only 0x242C EE_Ga [15:0] Ga calibration constant (16-bit, Least Significant Word) Read-only 0x242D EE_Ga [31:16] Ga calibration constant (16-bit, Most Significant Word) Read-only 0x242E EE_Gb [15:0] Gb calibration constant (16-bit) Read-only 0x242F EE_Ka [15:0] Ka calibration constant (16-bit) Read-only 0x2430 EE_Kb [15:0] Kb calibration constant (16-bit) - - R/W 0x2481 EE_Ha [15:0] Ha Customer calibration constant (16 bit) R/W 0x2482 EE_Hb [15:0] Hb Customer calibration constant (16 bit) - - R/W 0x24D4 EE_CONTROL EEPROM Control register, measurement control R/W 0x24D5 EE_I2C_ADDRESS I C slave address >> 1 Example: standard address (= 0x003A) >> 1 = 0x001D - - Melexis reserved R/W 0x24E1 EE_MEAS_1 Measurement settings 1 (see section Measurement settings) R/W 0x24E2 EE_MEAS_2 Measurement settings 2 (see section Measurement settings) - - Melexis reserved Melexis reserved 2 REVISION 9 - MAY, 2020 Melexis reserved Page 12 of 53 MLX90632 FIR sensor Datasheet REGISTER 2 R/W 0x3000 REG_I2C_ADDRESS I C slave address >> 1 R/W 0x3001 REG_CONTROL Control register, measurement mode - - R/W 0x3FFF Melexis reserved REG_STATUS Status register: data available RAM Read-only 0x4000 RAM_1 Raw data 1 Read-only 0x4001 RAM_2 Raw data 2 Read-only 0x4002 RAM_3 Raw data 3 Read-only 0x4003 RAM_4 Raw data 4 Read-only 0x4004 RAM_5 Raw data 5 Read-only 0x4005 RAM_6 Raw data 6 Read-only 0x4006 RAM_7 Raw data 7 Read-only 0x4007 RAM_8 Raw data 8 Read-only 0x4008 RAM_9 Raw data 9 ... ... ... ... Read-only 0x4033 RAM_52 Raw data 52 Read-only 0x4034 RAM_53 Raw data 53 Read-only 0x4035 RAM_54 Raw data 54 Read-only 0x4036 RAM_55 Raw data 55 Read-only 0x4037 RAM_56 Raw data 56 Read-only 0x4038 RAM_57 Raw data 57 Read-only 0x4039 RAM_58 Raw data 58 Read-only 0x403A RAM_59 Raw data 59 Read-only 0x403B RAM_60 Raw data 60 Table 7: Memory table Important! The width of the EEPROM is 16 bit. Some calibration parameters are 32 bit and split up into two 16 bit numbers in EEPROM. The least significant 16 bits of the parameter starts on the address shown in the Memory table. Example: To retrieve value EE_Aa (32bit) = EE_Aa_MS (at 0x2415) << 16 | EE_Aa_LS (at 0x2414) (Section Example Temperature Calculation) Important! The EEPROM needs to be unlocked before each write command. (Section EEPROM unlock for customer access) REVISION 9 - MAY, 2020 Page 13 of 53 MLX90632 FIR sensor Datasheet 8.1. Product ID A unique 48-bit product ID is stored in the EEPROM. Addresses 0x2405 (ID0), 0x2406 (ID1) and 0x2407 (ID2) should be readout to know the ID of the product. ProductID[47:0] = ID2[15:0] << 32 | ID1[15:0] << 16 | ID0[15:0] 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 6 5 4 3 2 1 0 6 5 4 3 2 1 0 ProductID[15:0] 15 Figure 4: ID0 14 13 12 11 10 9 8 7 ProductID[31:16] 15 Figure 5: ID1 14 13 12 11 10 9 8 7 ProductID[47:32] 15 Figure 6: ID2 REVISION 9 - MAY, 2020 Page 14 of 53 MLX90632 FIR sensor Datasheet Melexis reserved Melexis reserved 10 9 8 7 6 5 4 3 2 1 0 Accuracy range Melexis reserved 11 Package 12 FOV 13 Melexis reserved 14 Melexis reserved 15 Melexis reserved 8.2. Product Code (0x2409) Figure 7 EE_PRODUCT_CODE FOV 0: 1: 70 Package 0: 1: SFN 3x3 Accuracy range 0: 1: Medical 2: Standard REVISION 9 - MAY, 2020 Page 15 of 53 MLX90632 FIR sensor Datasheet 9. Control and configuration Several bits in the EEPROM or register are available to control and configure the measurements: Melexis reserved Melexis reserved Melexis reserved 9 8 7 6 5 4 3 2 1 0 Melexis reserved Melexis reserved 10 mode 11 soc 12 meas_select 13 Melexis reserved 14 Melexis reserved 15 Melexis reserved 9.1. Measurement control Figure 8: Register Measurement control settings REG_CONTROL controls the measurement handling and data storage. Changes will take immediate effect. Bits Parameter Description See section 8:4 meas_select select the type of measurement to be performed Operating Modes 3 soc starts a measurement when being in (sleeping) step mode Operating Modes 2:1 mode[1:0] defines the operating mode (step mode or continuous mode) Operating Modes Table 8: Register REG_CONTROL explained Note that this register is initialized during POR by the EEPROM word EE_CONTROL. Several measurement modes exist. These modes are controlled by bits mode[1:0] in register REG_CONTROL. In continuous mode the measurements are constantly running while in step mode the state machine will execute only one measurement which is initiated by soc bit. After finishing the measurement it will go in wait state until the next measurement is initiated by soc. The measurements are following the measurement sequence as defined in the measurement table. The different possible measurement modes are: mode[1:0] = 01: Enables the sleeping step mode. In this mode the device will be in sleep. On request (soc bit), the device will power-on, the state machine will do one measurement, will go into sleep and will wait for next command. mode[1:0] = 10: Enables the step mode. In this mode the state machine will do one measurement upon request (soc bit) and will wait for next command. The device remains powered all time in this mode. mode[1:0] = 11: Device is in continuous mode. Measurements are executed continuously. The device remains powered all time in this mode. By default, the device is in continuous mode. REVISION 9 - MAY, 2020 Page 16 of 53 MLX90632 FIR sensor Datasheet Switching between the step modes and continuous mode has only effect after the current measurement has finished (not waiting till end of measurement table was reached). There are only two possible measurements to select from: meas_select[4:0] = 0x00: Enables the medical measurement. In order to calculate the correct temperatures, the appropriate raw data values and formulas should be used. Refer to the medical measurement temperature calculations meas_select[4:0] = 0x11: Enables the extended range measurement. In order to calculate the correct temperatures, the appropriate raw data values and formulas should be used. Refer to the extended range measurement temperature calculations Note: If other values are being used for meas_select, the resulting calculated temperatures will be invalid. In order to switch to the desired measurement type the following routine should be performed: 1. Send an addressed reset to the MLX90632 device 2. Read the register (REG_CONTROL) value 3. Modify the REG_CONTROL value to: a. mode[1:0] = 00 b. meas_select = 0x00 for medical or 0x11 for extended range 4. Read the register (REG_CONTROL) value 5. Modify the REG_CONTROL value mode[1:0] to the desired mode The next measurement will be of the type that was programmed By default, the medical measurement is enabled REVISION 9 - MAY, 2020 Page 17 of 53 MLX90632 FIR sensor Datasheet 9.2. Device status Figure 9: Register Device status settings REG_STATUS allows checking in which state the device is and indicates when measurements are finished. Changes will take immediate effect. Bits Parameter Description device_busy Read-only Flag indicating that a measurement is being executed (1 = measurement ongoing) In sleep mode, this flag is always low. In continuous mode, this flag is always high. In soc-step mode, this flag is high during one measurement. In sob-step mode, this flag is high till all measurements are finished. 9 eeprom_busy Read-only Flag indicating that the eeprom is busy (0: not busy) Eeprom being busy is defined as follows: - at start-up, the eeprom is busy and remains busy till initialization phase (eeprom copy) has finished - during eeprom write/erase, the eeprom is busy 8 brown_out 10 6:2 cycle_position 0 new_data See section Bit is set to 0 Customer should set bit to 1 When device is reset, the bit is set to 0 and reset can be detected Read-only Indicates from which measurement (in the measurement table) the last written data is coming: - cycle_position[4:0]=x, corresponds to measurement x, x=0->31 Customer should set bit to 0 When a measurement is done, the bit is set to 1 Customer can readout the data and reset the bit to 0 Temperature calculation Operating Modes Table 9: Register REG_STATUS explained REVISION 9 - MAY, 2020 Page 18 of 53 MLX90632 FIR sensor Datasheet 9.3. Measurement settings 6 5 4 3 2 1 0 Melexis reserved Melexis reserved 7 Melexis reserved Melexis reserved 8 Melexis reserved Melexis reserved 9 Melexis reserved Melexis reserved 10 Melexis reserved 11 Melexis reserved 12 Melexis reserved 13 Melexis reserved 14 Refresh rate 15 Melexis reserved 9.3.1. Refresh rate Figure 10: EEPROM Measurement settings The refresh rate is the speed that the RAM will be updated with results and is configurable in "Measurement settings 1" and "Measurement settings 2". The refresh rate can be set with 3 bits and is located in EEPROM addresses 0x24E1 and 0x24E2. Changing the refresh rate will take immediate effect. It is important to know that the refresh rate should be kept the same for both measurements. The table below shows the available refresh rates and the corresponding result to be written in EEPROM addresses EE_MEAS_1 and EE_MEAS_2. EE_MEAS_1[10:8] EE_MEAS_2[10:8] Refresh rate [Hz] Time [ms] EE_MEAS_1 (0x24E1) EE_MEAS_2 (0x24E2) 0 0.5 2000 0x800D 0x801D 1 1 1000 0x810D 0x811D 2 2 500 0x820D 0x821D 3 4 250 0x830D 0x831D 4 8 125 0x840D 0x841D 5 16 62.5 0x850D 0x851D 6 32 31.25 0x860D 0x861D 7 64 15.625 0x870D 0x871D Table 10: EEPROM Refresh rate explained REVISION 9 - MAY, 2020 Page 19 of 53 MLX90632 FIR sensor Datasheet 10. I2C commands This device is based on I2C specification Rev.5 - October 9th 2012. I2C FM+ mode is supported. The sensor uses the following I2C features: Slave mode only 7-bits addressing Modes: Standard-mode, Fast-mode, Fast-mode Plus Incremental addressing - allowing a block of addresses to be accessed inside one I2C sequence The following I2C commands are implemented: Read/write access to internal memories and registers Addressed write Addressed read Global reset Addressed reset EEPROM unlock for CUST access Direct read REVISION 9 - MAY, 2020 Page 20 of 53 MLX90632 FIR sensor Datasheet 10.1. I2C address By default, the device responds to the 7-bit slave address 0x3A. Configuration of the 7-bit slave address is possible at EEPROM address 0x24D5. The least significant bit (bit0) of the address is determined by the status of the ADDR-pin (either connected to ground or supply) and is taken in after power-up or reset command if the change is made in EEPROM. - Bit0 = `0' if ADDR-pin is connected to GND - Bit0 = `1' if ADDR-pin is connected to VDD The remaining 6-bits can be used to configure the I2C address of the device. Figure 11: EEPROM I2C address configuration Important! The device will not respond if the I2C address is changed to 0 (and ADDR pin is low). The only way to get the device to respond is to pull the ADDR pin high. The slave address will be changed to 1 and communication is possible. Important! The device shall not execute measurements when performing EEPROM memory operations (I2C read/write instructions in EEPROM address range)! Hence, the device shall be put in halt mode or in a stepping mode before doing EEPROM read/write operations. REVISION 9 - MAY, 2020 Page 21 of 53 MLX90632 FIR sensor Datasheet 10.2. Addressed read The addressed read command allows doing an incremental read-out, starting from any given address within the memory space. SCL MSByte address SDA _ S 0 1 1 1 0 1 0 W A LSByte address A MSByte data A S 0 1 1 1 0 1 0 R A Slave address LSByte data A N P A K Slave address Figure 12: Addressed read Important! An addressed read is only valid when combining directly an addressed write and a direct read through a repeated START condition. In case the read and write part are separated by a STOP condition, or in case the read is not directly following the write, or in case the slave address is not identical for both, the command will not be seen as an addressed read. As a result, the second read will in practice act as a direct read. As soon as incremental addressing leaves the address space, the slave will respond with all 8'hFF. 10.3. Addressed write The addressed write command allows doing an incremental write, starting from any given address within the memory space. SCL MSByte address SDA _ S 0 1 1 1 0 1 0 W A LSByte address A MSByte data A LSByte data A A P Slave address Figure 13: Addressed write Important! The slave is sending ACK/NACK based on the fact whether it was able to write data (timing, end of register space, access rights). The slave will automatically increment the address of the write byte, independent if it gave an ACK or a NACK to the master. It is up to the master to re-write the byte afterwards. Before writing to EEPROM it is necessary to erase the specific address location in EEPROM. This is done by first writing 0x0000. Then the new data can be written. When the device is busy with the write operation to EEPROM, new write commands will be ignored. A read operation will return invalid data. The fact that the device is busy is indicated via the bit device_busy in REG_STATUS. REVISION 9 - MAY, 2020 Page 22 of 53 MLX90632 FIR sensor Datasheet 10.4. Global reset This command resets all devices on the I2C bus (based on the general call address 0x00). SCL 8'h06 SDA _ S 0 0 0 0 0 0 0 W A A P Address all devices Figure 14: Global reset 10.5. Addressed reset This command resets the addressed device only (based on the I2C address). SCL 8'h30 SDA _ S 0 1 1 1 0 1 0 W A 8'h05 A 8'h00 A 8'h06 A A P Slave address Figure 15: Addressed reset 10.6. EEPROM unlock for customer access This command unlocks the EEPROM allowing only one write operation to an EEPROM word in the customer part of the EEPROM. After the EEPROM write, the EEPROM access goes back to the "NoKey" access mode. SCL 8'h30 SDA _ S 0 1 1 1 0 1 0 W A 8'h05 A 8'h55 A 8'h4C A A P Slave address Figure 16: EEPROM unlock REVISION 9 - MAY, 2020 Page 23 of 53 MLX90632 FIR sensor Datasheet 10.7. Direct read The direct read command allows an incremental read out at a default start address. This default start address is fixed to the register location REG_STATUS (0x3FFF). According to the I2C specification, the master will keep sending an acknowledge (A) until it want to stop. This is indicated by sending a NAK. As a result, the slave will stop driving the SDA-bus as soon as a NAK is received by the master. As soon as the incremental addressing leaves the address space, the slave will respond with all 8'hFF. SCL MSByte of DEF. ADDR SDA S 0 1 1 1 0 1 0 R A LSByte of DEF. ADDR A MSByte of DEF. ADDR + 1 A LSByte of DEF. ADDR + 1 A Slave address ... A MSByte of DEF. ADDR + x A MSByte of DEF. ADDR + x A N P A K Figure 17: Direct read REVISION 9 - MAY, 2020 Page 24 of 53 MLX90632 FIR sensor Datasheet 11. Operating Modes The device has 2 states of operation: sleep state and active state. Sleep state In this state, most of the circuitry is disabled to limit the current consumption to a few uA. Active state In this state, the sensor is active. Several measurement modes exist. These modes are controlled by bits mode[1:0] in register REG_CONTROL[2:1]. In continuous mode the measurements are constantly running while in step mode the state machine will execute only one measurement which is initiated by soc bit. After finishing the measurement it will go in wait state until the next measurement is initiated by soc. The measurements are following the measurement sequence as defined in the measurement table. The different possible measurement modes are: mode[1:0] = 01: Enables the sleeping step mode. The device will be in sleep mode. On request (soc bit), the device will power-on, the state machine will do one measurement, will go into sleep and will wait for next command. mode[1:0] = 10: Enables the step mode. The state machine will do one measurement upon request (soc bit) and will wait for next command. The device remains powered all time in this mode. mode[1:0] = 11: Device is in continuous mode. Measurements are executed continuously. The device remains powered all time in this mode. By default, the device is in continuous mode. Switching between the step modes and continuous mode has only effect after the current measurement has finished (not waiting till end of measurement table was reached). There are two possible measurement types to select from: meas_select[4:0] = 0x00: Enables the medical measurement. In order to calculate the correct temperatures, the appropriate raw data values and formulas should be used. Refer to the medical measurement temperature calculations meas_select[4:0] = 0x11: Enables the extended range measurement. In order to calculate the correct temperatures, the appropriate raw data values and formulas should be used. Refer to the extended range measurement temperature calculations Note: If other values are being used for meas_select, the resulting calculated temperatures will be invalid. REVISION 9 - MAY, 2020 Page 25 of 53 MLX90632 FIR sensor Datasheet 12. Temperature calculation 12.1. Medical measurement To calculate the ambient and object temperature, a set of 2 measurements is required: Measurement 1: RAM_4, RAM_5, RAM_6; Measurement 2: RAM_7, RAM_8, RAM_9; One should notice this requires double the measurement time than specified (= 2 * 500ms). However, this is only valid for the very first calculation. After the first calculation, TA and TO should be calculated with the next measurement. Example: t0: Measurement 1 (cycle_pos = 1) => no calculation of TA or TO possible because not all parameters are known t1: Measurement 2 (cycle_pos = 2) => calculate TA (RAM_6, RAM_9) calculate TO (RAM_7, RAM_8, RAM_6, RAM_9) => 1s. Measurement 3 (= 1) (cycle_pos = 1) => calculate TA (RAM_6, RAM_9) calculate TO (RAM_4, RAM_5, RAM_6, RAM_9) => 0.5s. Measurement 4 (= 2) (cycle_pos = 2) => calculate TA (RAM_6, RAM_9) calculate TO (RAM_7, RAM_8, RAM_6, RAM_9) => 0.5s. t2: t3: t4: ... To calculate the new ambient and object temperature RAM_6 and RAM_9 have to be used. The choice between [RAM_4 and RAM_5] or [RAM_7 and RAM_8] depends on the current measurement. REG_STATUS[6:2] (= "cycle_pos") returns the current position of the measurement defined in the measurement table. Using the current and the data from measurement (x-1), TA and TO can be calculated every 500ms. The complete measurement sequence can be automated by using the new_data bit in combination with cycle_pos bits. The sequence should look like the following: Write new_data = 0 Check when new_data = 1 Read cycle_pos to get measurement pointer If cycle_pos = 1 Calculate TA and TO base on RAM_4, RAM_5, RAM_6, RAM_9 If cycle_pos = 2 Calculate TA and TO base on RAM_7, RAM_8, RAM_6, RAM_9 Return to top REVISION 9 - MAY, 2020 Page 26 of 53 MLX90632 FIR sensor Datasheet 12.1.1. Pre-calculations 12.1.1.1. Ambient VR = RAM_9 + Gb RAM_6 12 Gb = EE_Gb 2 RAM_6 VR 12 AMB = 2 The parameter EE_Gb is a signed 16-bit number. 12.1.1.2. Object S= RAM_4 + RAM_5 2 OR S= VR RAM_7 + RAM_8 2 = RAM_9 + Ka RAM_6 12 Ka = EE_Ka 2 S = S VR 12 2 The parameter EE_Ka is a signed 16-bit number. REVISION 9 - MAY, 2020 Page 27 of 53 MLX90632 FIR sensor Datasheet 12.1.2. Ambient temperature ( ) = P_O + - P_R + P_T ( P_G - P_R) With: Ta in degrees Celsius P_R = EE_P_R * 2-8 P_O = EE_P_O * 2-8 P_G = EE_P_G * 2-20 P_T = EE_P_T * 2-44 The parameters EE_P_R, EE_P_O, EE_P_G and EE_P_T are signed 32-bit numbers. 12.1.3. Object temperature ( ) = - . - + ( - )+ ( - ) + [ ] With: Fa Fb Ga Ha Hb TO0 TA0 = EE_Fa * 2-46 = EE_Fb * 2-36 = EE_Ga * 2-36 = EE_Ha * 2-14 = EE_Hb * 2-10 = 25C = 25C (AMB - Eb) TA = + 25 Ea -16 Ea = EE_Ea * 2 Eb = EE_Eb * 2-8 Ta[K] = TADUT + 273.15 in Kelvin TODUT = Object temperature in 25C = 1 = Object Emissivity parameter (not stored in EEPROM, but part of the `app') The parameters EE_Ea, EE_Eb, EE_Fa, EE_Fb, EE_Ga are signed 32-bit numbers. The parameters EE_Gb, EE_Ka, EE_Ha and EE_Hb are signed 16-bit numbers. Note: One can see that to compute "To (object temperature)", "To" already needs to be known. "To (object temperature)" is computed in an iterative manner. In the first iteration "To" is assumed to be 25C. In the 2nd iteration the result of first iteration is used, and in the 3rd iteration the end result is obtained. (See example on next page). REVISION 9 - MAY, 2020 Page 28 of 53 MLX90632 FIR sensor Datasheet 12.1.4. Example Medical measurement Temperature Calculation Assumed are the following calibration parameters read from EEPROM: ADDR PARAM 0x240C EE_P_R [15:0] DATA (hex) hex to dec Conversion to use in formula 0103 0x240D EE_P_R [31:16] 005D 0x240E EE_P_G [15:0] FAE5 0x240F EE_P_G [31:16] 051C 0x2410 EE_P_T [15:0] 0000 0x2411 EE_P_T [31:16] 0000 0x2412 EE_P_O [15:0] 1900 0x2413 EE_P_O [31:16] 0000 0x2424 EE_Ea [15:0] CFAE 0x2425 EE_Ea [31:16] 0051 0x2426 EE_Eb [15:0] 0103 0x2427 EE_Eb [31:16] 005D 0x2428 EE_Fa [15:0] 6351 0x2429 EE_Fa [31:16] 0350 0x242A EE_Fb [15:0] 71F1 0x242B EE_Fb [31:16] FE25 0x242C EE_Ga [15:0] A7A4 -8 EE_P_R = 005D0103hex = 6095107dec P_R = 6095107 * 2 = 23809.01 EE_P_G = 051CFAE5hex = 85785317dec P_G = 85785317 * 2 EE_P_T = 00000000hex = 0dec P_T = 0 * 2 EE_P_O = 00001900hex = 6400dec P_O = 6400 * 2 = 25 EE_Ea = 0051CFAEhex = 5361582dec Ea = 5361582 * 2 EE_Eb = 005D0103hex = 6095107dec Eb = 6095107 * 2 = 23809.01 EE_Fa = 03506351hex = 5559995dec Fa = 55599953 * 2 EE_Fb = FE2571F1hex = -31100431dec Fb = -31100431 * 2 EE_Ga = FDFFA7A5hex = -33577052dec Ga = -33577052 * 2 -20 -44 =0 -8 EE_Ga [31:16] FDFF 0x242E EE_Gb [15:0] 2600 EE_Gb = 2600hex = 9728dec Gb = 9728 * 2 0x242F EE_Ka [15:0] 2A00 EE_Ka = 2A00hex = 10752dec Ka = 10752 * 2 0x2481 EE_Ha [15:0] 4000 EE_Ha = 4000hex = 16384dec Ha = 16384 * 2 EE_Hb [15:0] 0000 EE_Hb = 0000hex = 0dec -16 = 81.81125 -8 0x242D 0x2482 = 81.81125 -10 -10 Hb = 0 * 2 -46 = 7.9E-07 -36 = -0.00045 -36 = -0.00049 = 9.5 -10 = 10.5 -14 =1 =0 Table 11: Example EEPROM calibration parameters REVISION 9 - MAY, 2020 Page 29 of 53 MLX90632 FIR sensor Datasheet The returned values from the RAM (0x4000 to 0x4008): ADDR PARAM DATA (hex) DATA (dec) 0x4003 RAM_4 FF9B -101 0x4004 RAM_5 FF9D -99 0x4005 RAM_6 57E4 22500 0x4006 RAM_7 FF97 -105 0x4007 RAM_8 FF99 -103 0x4008 RAM_9 59D8 23000 Table 12: Example RAM data 12.1.4.1. Ambient temperature calculation VR = RAM_9 + Gb VR AMB = RAM_6 VR 12 RAM_6 22500 = 23000 + 9.5 12 12 = 40812.5 2 = 22500 40812.5 2 12 AMB = 24086.73813 (sensortemperatureinC) = P_O + = 25 + AMB - P_R + P_T (AMB - P_R) P_G 24086.73813 - 23809.01 + 0 (24086.73813 - 23809.01) 81.81125 Ta = 28.395C = 28.4 REVISION 9 - MAY, 2020 Page 30 of 53 MLX90632 FIR sensor Datasheet 12.1.4.2. Object temperature calculation S= RAM_4 + RAM_5 (-101) + (-99) = 2 2 S = -100 OR S= RAM_7 + RAM_8 (-105) + (-103) = 2 2 S = -104 Assumed is that RAM_4 and RAM_5 are updated lastly by the device (cycle_pos = 1) VR = RAM_9 + Ka RAM_6 22500 = 23000 + 10.5 12 12 VR S = S VR 12 = 42687.5 2 S = -100 42687.5 2 12 = -102.35 TO0 TA0 TA = = 25C = 25C (AMB - Eb) (24086.73813 - 23809.01) + 25 = + 25 = 28.3947 Ea 81.81125 Ta[K] = TADUT + 273.15 = 28.3947 + 273.15 = 301.5447 REVISION 9 - MAY, 2020 Page 31 of 53 MLX90632 FIR sensor Datasheet T (objecttemperatureinC) = S Fa Ha 1 + Ga (TO - TO ) + Fb (TA - TA ) + Ta[ ] - 273.15 - Hb The emissivity parameter () is controlled by the user and is assumed in this example equal to 1. TODUT = 25 for the first calculation = -102.35 + (301.5447) 1 (7.9E - 07) 1 1 + (-0.00049) (25 - 25) + (-0.00045) (28.3947 - 25) - 273.15 - 0 To = 27.2048027C The object temperature needs to be calculated 3 times in order the get the end result. Next object temperature calculation uses previous obtained object temperature. = -102.35 1 (7.9E - 07) 1 1 + (-0.00049) ( . - 25) + (-0.00045) (28.3947 - 25) + (301.5447) - 273.15 - 0 To = 27.2035098C = -102.35 1 (7.9E - 07) 1 1 + (-0.00049) ( . - 25) + (-0.00045) (28.3947 - 25) + (301.5447) - 273.15 - 0 To = 27.20351053C = . C REVISION 9 - MAY, 2020 Page 32 of 53 MLX90632 FIR sensor Datasheet 12.2. Extended range measurement This measurement type option is implemented in order to give additional range to the medical devices. When using the extended range measurement the following should be done: 1. Switch the device to extended range measurement mode 2. Wait for the whole measurement to finish 3. Use the following routine to read the data of interest and calculate the temperatures. All the necessary functions are available at https://github.com/melexis/mlx90632-library To calculate the ambient and object temperature, a set of 3 measurements is required: Measurement 1: RAM_52, RAM_53, RAM_54; Measurement 2: RAM_55, RAM_56, RAM_57; Measurement 3: RAM_58, RAM_59, RAM_60; All three measurements should be available for proper temperature calculation. 12.2.1. Pre-calculations 12.2.1.1. Ambient VR = RAM_57 + Gb RAM_54 12 Gb = EE_Gb 2 AMB = RAM_54 VR 12 2 The parameter EE_Gb is a signed 16-bit number. 12.2.1.2. Object S= RAM_52 - RAM_53 - RAM_55 + RAM_56 + 2 _58 + _59 OR VR REVISION 9 - MAY, 2020 = RAM_57 + Ka RAM_54 12 Page 33 of 53 MLX90632 FIR sensor Datasheet Ka = EE_Ka 2 S = S VR 12 2 The parameter EE_Ka is a signed 16-bit number. 12.2.2. Ambient temperature ( ) = P_O + - P_R + P_T ( P_G - P_R) With: Ta in degrees Celsius P_R = EE_P_R * 2-8 P_O = EE_P_O * 2-8 P_G = EE_P_G * 2-20 P_T = EE_P_T * 2-44 The parameters EE_P_R, EE_P_O, EE_P_G and EE_P_T are signed 32-bit numbers. 12.2.3. Object temperature ( ) = - + . - + ( - )+ ( - ) [ ] With: Fa Fb Ga Ha Hb TO0 TA0 = EE_Fa * 2-46 = EE_Fb * 2-36 = EE_Ga * 2-36 = EE_Ha * 2-14 = EE_Hb * 2-10 = 25C = 25C (AMB - Eb) TA = + 25 Ea -16 Ea = EE_Ea * 2 Eb = EE_Eb * 2-8 Ta[K] = TADUT + 273.15 in Kelvin TODUT = Object temperature in 25C = 1 = Object Emissivity parameter (not stored in EEPROM, but part of the `app') REVISION 9 - MAY, 2020 Page 34 of 53 MLX90632 FIR sensor Datasheet The parameters EE_Ea, EE_Eb, EE_Fa, EE_Fb, EE_Ga are signed 32-bit numbers. The parameters EE_Gb, EE_Ka, EE_Ha and EE_Hb are signed 16-bit numbers. Note: One can see that to compute "To (object temperature)", "To" already needs to be known. "To (object temperature)" is computed in an iterative manner. In the first iteration "To" is assumed to be 25C. In the 2nd iteration the result of first iteration is used, and in the 3rd iteration the end result is obtained. (See example on next page). REVISION 9 - MAY, 2020 Page 35 of 53 MLX90632 FIR sensor Datasheet 12.2.4. Example Extended range measurement Temperature Calculation Assumed are the following calibration parameters read from EEPROM: ADDR PARAM 0x240C EE_P_R [15:0] DATA (hex) hex to dec Conversion to use in formula 0103 0x240D EE_P_R [31:16] 005D 0x240E EE_P_G [15:0] FAE5 0x240F EE_P_G [31:16] 051C 0x2410 EE_P_T [15:0] 0000 0x2411 EE_P_T [31:16] 0000 0x2412 EE_P_O [15:0] 1900 0x2413 EE_P_O [31:16] 0000 0x2424 EE_Ea [15:0] CFAE 0x2425 EE_Ea [31:16] 0051 0x2426 EE_Eb [15:0] 0103 0x2427 EE_Eb [31:16] 005D 0x2428 EE_Fa [15:0] 6351 0x2429 EE_Fa [31:16] 0350 0x242A EE_Fb [15:0] 71F1 0x242B EE_Fb [31:16] FE25 0x242C EE_Ga [15:0] A7A4 -8 EE_P_R = 005D0103hex = 6095107dec P_R = 6095107 * 2 = 23809.01 EE_P_G = 051CFAE5hex = 85785317dec P_G = 85785317 * 2 EE_P_T = 00000000hex = 0dec P_T = 0 * 2 EE_P_O = 00001900hex = 6400dec P_O = 6400 * 2 = 25 EE_Ea = 0051CFAEhex = 5361582dec Ea = 5361582 * 2 EE_Eb = 005D0103hex = 6095107dec Eb = 6095107 * 2 = 23809.01 EE_Fa = 03506351hex = 5559995dec Fa = 55599953 * 2 EE_Fb = FE2571F1hex = -31100431dec Fb = -31100431 * 2 EE_Ga = FDFFA7A5hex = -33577052dec Ga = -33577052 * 2 -20 -44 =0 -8 EE_Ga [31:16] FDFF 0x242E EE_Gb [15:0] 2600 EE_Gb = 2600hex = 9728dec Gb = 9728 * 2 0x242F EE_Ka [15:0] 2A00 EE_Ka = 2A00hex = 10752dec Ka = 10752 * 2 0x2481 EE_Ha [15:0] 4000 EE_Ha = 4000hex = 16384dec Ha = 16384 * 2 EE_Hb [15:0] 0000 EE_Hb = 0000hex = 0dec -16 = 81.81125 -8 0x242D 0x2482 = 81.81125 -10 -10 Hb = 0 * 2 -46 = 7.9E-07 -36 = -0.00045 -36 = -0.00049 = 9.5 -10 = 10.5 -14 =1 =0 Table 13: Example EEPROM calibration parameters REVISION 9 - MAY, 2020 Page 36 of 53 MLX90632 FIR sensor Datasheet The returned values from the RAM (0x4033 to 0x403A): ADDR PARAM DATA (hex) DATA (dec) 0x4033 RAM_52 FE64 -412 0x4034 RAM_53 FEAB -341 0x4035 RAM_54 57E4 22500 0x4036 RAM_55 FEA3 -349 0x4037 RAM_56 FE6A -406 0x4038 RAM_57 59D8 23000 0x4039 RAM_58 000B 11 0x403A RAM_59 0009 9 Table 14: Example RAM data 12.2.4.1. Ambient temperature calculation VR = RAM_57 + Gb VR AMB = RAM_54 VR 12 RAM_54 22500 = 23000 + 9.5 12 12 = 40812.5 2 = 22500 40812.5 2 12 AMB = 24086.73813 (sensortemperatureinC) = P_O + = 25 + AMB - P_R + P_T (AMB - P_R) P_G 24086.73813 - 23809.01 + 0 (24086.73813 - 23809.01) 81.81125 Ta = 28.395C = 28.4 REVISION 9 - MAY, 2020 Page 37 of 53 MLX90632 FIR sensor Datasheet 12.2.4.2. Object temperature calculation S= RAM_52 - RAM_53 - RAM_55 + RAM_56 + 2 S= _58 + _59 (-412) - (-341) - (-349) + (-406) + 11 + 9 2 S = -44 VR = RAM_57 + Ka RAM_54 22500 = 23000 + 10.5 12 12 VR S = S VR 12 = 42687.5 2 S = -44 42687.5 2 12 = -45.034 TO0 TA0 TA = = 25C = 25C (AMB - Eb) (24086.73813 - 23809.01) + 25 = + 25 = 28.3947 Ea 81.81125 Ta[K] = TADUT + 273.15 = 28.3947 + 273.15 = 301.5447 REVISION 9 - MAY, 2020 Page 38 of 53 MLX90632 FIR sensor Datasheet T (objecttemperatureinC) = S Fa 2 Ha 1 + Ga (TO - TO ) + Fb (TA - TA ) + Ta[ ] - 273.15 - Hb The emissivity parameter () is controlled by the user and is assumed in this example equal to 1. TODUT = 25 for the first calculation -45.034 = 1 7.9E - 07 1 1 + (-0.00049) (25 - 25) + (-0.00045) (28.3947 - 25) 2 - 273.15 - 0 To = 27.34837117C + (301.5447) The object temperature needs to be calculated 3 times in order the get the end result. Next object temperature calculation uses previous obtained object temperature. -45.034 = 7.9E - 07 1 1 1 + (-0.00049) ( 2 - 273.15 - 0 + (301.5447) - 25) + (-0.00045) (28.3947 - 25) . To = 27.34715755C -102.35 = 7.9E - 07 1 1 1 + (-0.00049) ( 2 - 273.15 - 0 . + (301.5447) - 25) + (-0.00045) (28.3947 - 25) To = 27.34715818C = . C REVISION 9 - MAY, 2020 Page 39 of 53 MLX90632 FIR sensor Datasheet 13. Performance characteristics 13.1. Accuracy The calculated ambient temperature has an accuracy of 3C between -20C and 85C of ambient temperature. Between 15C and 45C the accuracy is 1C. All accuracy specifications apply under settled isothermal conditions only. 13.1.1. Standard Figure 18: Standard accuracy table REVISION 9 - MAY, 2020 Page 40 of 53 MLX90632 FIR sensor Datasheet 13.1.2. Medical Figure 19: Medical accuracy table REVISION 9 - MAY, 2020 Page 41 of 53 MLX90632 FIR sensor Datasheet 13.2. Field of View (FoV) Point heat source Sensitivity 100% 50% Field Of View Angle of incidence Rotated sensor Figure 20: Field of View measurement principle Parameter 50% of maximum 10% of maximum Unit Field Of View 50 70 (angular degrees) Table 15: Field Of View of the MLX90632 Figure 21: Field of View of MLX90632 (FoV = 50) The 50 is measured at the 50% level of sensitivity. For high accuracy applications, one should take care that the field of view is not obstructed by the enclosure of the application. For this, one has to take care that no obstruction is in a cone of at least 70 wide. REVISION 9 - MAY, 2020 Page 42 of 53 MLX90632 FIR sensor Datasheet 13.3. Noise Measurement conditions for noise performance are To = Ta = 25C. Note: Due to the nature of thermal infrared radiation, it is normal that the noise will decrease for high temperature and increase for lower temperatures. Figure 22: NETD vs. Refresh rate REVISION 9 - MAY, 2020 Page 43 of 53 MLX90632 FIR sensor Datasheet 14. Mechanical Drawing 14.1. Package dimensions Figure 23: Package dimensions for MLX90632 (FoV = 50) Symbol Min Nom Max DD = EE 3.00 BSC AT 0.90 0.95 1.00 Ra 0.05 D2 2.40 2.50 2.60 E2 2.00 2.10 2.20 Lo1 0.15 Max Kk 0.20 0.30 -- NXL 0.35 0.40 0.45 e1 0.50 BSC NminOne_e (5-1)*e1 Ti 0.18 0.25 0.30 Tolerance (A_CC - A_CP) -0.15 0.15 Tolerance (A_CC - A_CD) -0.1 0.1 Table 16: Package dimensions for MLX90632 (FoV = 50) *BSC basic dimension REVISION 9 - MAY, 2020 *A_CC = Center of silicon Cap *A_CD = Center of Die frame *A_CP = Center of Package Page 44 of 53 MLX90632 FIR sensor Datasheet 14.2. PCB footprint Figure 24: PCB footprint for MLX90632 Symbol Distance [mm] a 0.60 b 0.25 c 2.10 d 2.50 e 3.00 f 3.00 g 0.60/0.80/1.00 h 0.20 i 0.50 j 0.30 k 10 (max.) Table 17 : PCB footprint dimensions for MLX90632 REVISION 9 - MAY, 2020 Page 45 of 53 MLX90632 FIR sensor Datasheet 15. Application schematic 15.1. 3V3 I2C mode 2 Figure 25: Typical application schematic for 3V3 I C communication with MLX90632 REVISION 9 - MAY, 2020 Page 46 of 53 MLX90632 FIR sensor Datasheet 15.2. 1V8 I2C mode 2 Figure 26: Typical application schematic for 1V8 I C communication with MLX90632 REVISION 9 - MAY, 2020 Page 47 of 53 MLX90632 FIR sensor Datasheet 16. Software MLX90632 library on Github: https://github.com/melexis/mlx90632-library Example usage of the MLX90632 Library with Keil IDE: https://github.com/melexis/mlx90632-example Evaluation board EVB90632: https://www.melexis.com/en/documents/tools/tools-evb90632-software-exe REVISION 9 - MAY, 2020 Page 48 of 53 MLX90632 FIR sensor Datasheet 17. Standard information regarding manufacturability of Melexis products with different soldering processes The MLX90632 is a MSL-3 device. Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to following test methods: Reflow Soldering SMD's (Surface Mount Devices) IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices (Classification reflow profiles according to table 5-2) EIA/JEDEC JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (Reflow profiles according to table 2) Wave Soldering SMD's (Surface Mount Devices) and THD's (Through Hole Devices) EN60749-20 Resistance of plastic- encapsulated SMD's to combined effect of moisture and soldering heat EIA/JEDEC JESD22-B106 and EN60749-15 Resistance to soldering temperature for through-hole mounted devices Iron Soldering THD's (Through Hole Devices) EN60749-15 Resistance to soldering temperature for through-hole mounted devices Solderability SMD's (Surface Mount Devices) and THD's (Through Hole Devices) EIA/JEDEC JESD22-B102 and EN60749-21 Solderability For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc.) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD's is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. Melexis recommends reviewing on our web site the General Guidelines soldering recommendation (http://www.melexis.com/Quality_soldering.aspx). Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx REVISION 9 - MAY, 2020 Page 49 of 53 MLX90632 FIR sensor Datasheet 18. ESD Precautions Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products. 19. Application comments 1. Significant contamination at the optical input side (sensor filter) might cause unknown additional filtering/distortion of the optical signal and therefore result in unspecified errors. 2. IR sensors are inherently susceptible to errors caused by thermal gradients. There are physical reasons for these phenomena and, in spite of the careful design of the MLX90632, it is recommended not to subject the MLX90632 to heat transfer and especially transient conditions. 3. The MLX90632 is designed and calibrated to operate as a non-contact thermometer in settled conditions. 4. Upon power-up the MLX90632 passes embedded checking and calibration routines. During these routines the output is not defined and it is recommended to wait for the specified POR time before reading the module. Very slow power-up may cause the embedded POR circuitry to trigger on inappropriate levels, resulting in unspecified operation and this is not recommended. 5. Capacitive loading on an I C bus can degrade the communication. Some improvement is possible with use of current sources compared to resistors in pull-up circuitry. Further improvement is possible with specialized commercially available bus accelerators. 6. A sleep mode is available in the MLX90632. This mode is entered and exited via the I C compatible 2-wire communication. 7. A power supply and decoupling capacitor is needed as with most integrated circuits. The MLX90632 is a mixedsignal device with sensors, small signal analog part, digital part and I/O circuitry. In order to keep the noise low, power supply switching noise needs to be decoupled. High noise from external circuitry can also affect noise performance of the device. In many applications a 10nF SMD ceramic capacitor close to the Vdd and Vss pins would be a good choice. It should be noted that not only the trace to the Vdd pin needs to be short, but also the one to the Vss pin. 8. Do not perform measurements in oily or helium environments 2 2 REVISION 9 - MAY, 2020 Page 50 of 53 MLX90632 FIR sensor Datasheet 20. Table of figures Figure 1: Image of MLX90632 .......................................................................................................................................................... 1 Figure 2: MLX90632 TOP view ......................................................................................................................................................... 8 Figure 3: Block diagram .................................................................................................................................................................10 Figure 4: ID0 ..................................................................................................................................................................................14 Figure 5: ID1 ..................................................................................................................................................................................14 Figure 6: ID2 ..................................................................................................................................................................................14 Figure 7 EE_PRODUCT_CODE .........................................................................................................................................................15 Figure 8: Register Measurement control settings ...........................................................................................................................16 Figure 9: Register Device status settings ........................................................................................................................................18 Figure 10: EEPROM Measurement settings .....................................................................................................................................19 Figure 11: EEPROM I2C address configuration ................................................................................................................................21 Figure 12: Addressed read .............................................................................................................................................................22 Figure 13: Addressed write ............................................................................................................................................................22 Figure 14: Global reset...................................................................................................................................................................23 Figure 15: Addressed reset ............................................................................................................................................................23 Figure 16: EEPROM unlock .............................................................................................................................................................23 Figure 17: Direct read ....................................................................................................................................................................24 Figure 18: Standard accuracy table ................................................................................................................................................40 Figure 19: Medical accuracy table ..................................................................................................................................................41 Figure 20: Field of View measurement principle .............................................................................................................................42 Figure 21: Field of View of MLX90632 (FoV = 50) ...........................................................................................................................42 Figure 22: NETD vs. Refresh rate ....................................................................................................................................................43 Figure 23: Package dimensions for MLX90632 (FoV = 50) ..............................................................................................................44 Figure 24: PCB footprint for MLX90632 ..........................................................................................................................................45 2 Figure 25: Typical application schematic for 3V3 I C communication with MLX90632 ......................................................................46 2 Figure 26: Typical application schematic for 1V8 I C communication with MLX90632 ......................................................................47 REVISION 9 - MAY, 2020 Page 51 of 53 MLX90632 FIR sensor Datasheet 21. Disclaimer Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. The information furnished by Melexis is believed to be correct and accurate. However, this User Manual is intended as an aid to enable a user to install engineering parts of the MLX90632 into his own application for evaluation. While Melexis intends for the final production part of the MLX90632 to be comparable to the engineering parts, it is highly probable that changes will still be implemented. Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis' rendering of technical or other services. (c) 2019 Melexis N.V. All rights reserved. REVISION 9 - MAY, 2020 Page 52 of 53 MLX90632 FIR sensor Datasheet 22. Contact Information For the latest version of this document, go to our website at www.melexis.com Or for additional information contact Melexis Direct: Europe, Africa, Asia: America: Phone: +32 1367 0495 Phone: +1 248 306 5400 E-mail: sales_europe@melexis.com E-mail: sales_usa@melexis.com ISO/TS 16949 and ISO14001 Certified REVISION 9 - MAY, 2020 Page 53 of 53