Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com, www.TriQuint.com Page 1 of 4 January 2008
ECG003
InGaP HBT Gain Block
Product Features
• DC – 6 GHz
• +24 dBm P1dB at 1 GHz
• +39 dBm OIP3 at 1 GHz
• 20 dB Gain at 1 GHz
• 3.6 dB Noise Fi gure
• Available in Lead-free / green
SOT-89 Package Style
• Internally matched to 50 Ω
Applications
• Mobile Infrastru cture
• CATV / FTTX
• W-LAN / ISM
• RFID
• WiMAX / WiBro
Product Description
The ECG003 is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 1000 MHz, the ECG003 typically provides 20
dB of gain, +39 dBm Output IP3, and +24 dBm P1dB.
The ECG003 consists of Darlington pair amplifiers using
the high reliability InGaP/GaAs HBT process technology
and only requires DC-blocking capacitors, a bias resistor,
and an inductive RF choke for operation. The device is
ideal for wireless applications and is available in a low-
cost, surface-mount lead-free/green/RoHS-compliant SOT-
89 package. All devices are 100% RF and DC tested.
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the ECG003 will work for other various applications within
the DC to 6 GHz frequency range such as CATV and
mobile wireless.
Functional Diagram
RF IN GND RF OUT
GND
1 23
4
Function Pin No.
Input 1
Output/Bias 3
Ground 2, 4
Specifications (1)
Parameter Units Min Typ Max
Operational Bandwidth MHz DC 6000
Test Frequency MHz 1000
Gain dB 20
Output P1dB dBm +24
Output IP3 (3) dBm +39
Noise Figure dB 3.5
Test Frequency MHz 2000
Gain dB 18 19
Input Return Loss dB 15
Output Return Loss dB 10
Output P1dB dBm +23
Output IP3 (2) dBm +34 +36
Noise Figure dB 3.6
Device Voltage V 6.7 7.2 7.6
Device Current mA 110
Output mismatch w/o spurs VSWR 10:1
1. Test conditions unless otherwise noted: 25º C, Supply Voltage = +9 V, Rbias = 16 Ω, 50 Ω System.
2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Rating
Parameter Rating
Storage Temperature -65 to +150 °C
RF Input Power (continuous) +10 dBm
Device Current 160 mA
Junction Temperature +160 °C
Thermal Resistance 86 °C/W
Operation of this device above any of these parameters may cause permanent damage.
Typical Performance (1)
Parameter Units Typical
Frequency MHz 500 900 1900 2140
S21 dB 21 20 19 18.7
S11 dB -19 -18 -16 -15
S22 dB -14 -13 -10 -10
Output P1dB dBm +24.4 +24 +23 +22.5
Output IP3 dBm +39 +39 +36 +35
Noise Figure dB 3.5 3.5 3.6 3.7
Ordering Information
Part No. Description
ECG003B-G InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 package)
ECG003B-PCB 700 –2400 MHz Fully Assembled Eval. Board
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com, www.TriQuint.com Page 2 of 4 January 2008
ECG003
InGaP HBT Gain Block
Typical Device RF Performance (3)
Supply Bias = +9 V, Rbias = 16 Ω, Icc = 110 mA
Frequency MHz 100 500 900 1900 2140 2400 3500 5800
S21 dB 21 21 20.4 19 18.7 18.2 17.4 14
S11 dB -20 -19 -18 -16 -15 -13 -12 -6
S22 dB -15 -14 -13 -10 -10 -8 -7 -3
Output P1dB dBm +24.4 +24.4 +24 +23 +22.5 +20.5 +18.7 12
Output IP3 dBm +38 +39 +39 +36 +35 +34 +31
Noise Figure dB 3.9 3.6 3.5 3.6 3.7 3.7 4.2
1. Test conditions: T = 25º C, Supply Voltage = +9 V, Device Voltage = 7.2 V, Rbias = 16 Ω, Icc = 110 mA typical, 50 Ω System.
2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. The performance data does not
account for losses attributed to recommended input and output series resistances shown in the application circuit on page 3.
Gain vs. Frequency
14
16
18
20
22
500 1000 1500 2000 2500 3000
Frequency (M Hz)
Gain
(
dB
)
+25C -40C +85C
S11, S22 vs. Frequency
-25
-20
-15
-10
-5
0
0123456
Frequenc y (GH z )
S11 S22
Icc vs. V de
0
20
40
60
80
100
120
140
0.0 2.0 4.0 6.0 8.0 10.0
Vde (V)
Icc
(
mA
)
+25C
O IP3 vs. Frequency
25
30
35
40
45
500 1000 1500 2000 2500 3000
Frequency (M Hz)
OIP3
(
dBm
)
+25C -40C +85C
N oise Figure vs. Frequen cy
1.5
2
2.5
3
3.5
4
500 1000 1500 2000
Frequency (M Hz)
NF
(
dB
)
P1dB vs. Frequency
10
15
20
25
30
500 1000 1500 2000 2500 3000
Frequency (M Hz)
P1dB
(
dBm
)
+25C -40C -85C
S-Parameters (Vdevice = +7.2 V, ICC = 110 mA, T = 25°C, calibrated to device leads)
Freq (MHz) S11 (dB) S11 (ang ) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)
50 -20.36 -0.18 20.46 177.69 -23.19 -0.38 -13.95 -2.86
500 -19.29 -24.13 20.19 157.68 -23.08 -2.33 -13.44 -35.26
1000 -17.78 -51.50 19.84 136.88 -22.93 -4.52 -12.45 -68.47
1500 -16.23 -75.63 19.40 117.06 -22.61 -7.13 -11.26 -97.26
2000 -14.71 -98.28 19.06 97.71 -22.16 -9.76 -9.96 -123.04
2500 -13.16 -118.71 18.65 78.13 -21.61 -13.40 -8.82 -145.90
3000 -12.14 -139.91 18.23 59.26 -20.91 -17.67 -7.63 -167.85
3500 -11.24 -161.53 17.77 40.27 -20.11 -23.92 -6.59 171.00
4000 -10.30 174.59 17.32 20.70 -19.35 -31.44 -5.32 150.44
4500 -9.20 147.71 16.71 0.41 -18.62 -41.28 -4.19 128.81
5000 -7.76 120.30 15.97 -19.87 -18.16 -52.98 -3.10 107.78
5500 -6.63 92.76 14.85 -40.81 -18.05 -66.03 -2.28 87.09
6000 -5.54 70.28 13.49 -59.45 -18.34 -79.15 -1.78 67.70
Device S-parameters are available for download off of the website at: http://www.wj.com
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com, www.TriQuint.com Page 3 of 4 January 2008
ECG003
InGaP HBT Gain Block
Recommended Application Circuit
Recommended Component Values
Reference Frequency (MHz)
Designator 50 500 900 1900 2200 2500 3500
L1 820 nH 220 nH 68 nH 27 nH 22 nH 18 nH 15 nH
C1, C2, C3 .018 µF 1000 pF 100 pF 68 pF 68 pF 56 pF 39 pF
1. The proper values for the c omponents are dependent upon the intended frequency of operati on.
2. The component values in the table below are contained on the evaluation board to achieve optimal broadband
performance.
3. R1 and R2 are shown in the circuit diagram to avoid potential instabilities. The configuration shown above assures
of unconditional stability with the use of the device. It is expected that linearity parameters (OIP3 and P1dB) to
degrade about only 0.5 dB, while overall gain will be about 2 dB less than the performance shown in page 1 and 2 of
this data sheet. Input and output return loss is expected to improve with the use of the I/O series resistances at 2 GHz.
Ref. Desig. Value / Type Size
L1 39 nH wirewound inductor 0603
C1, C2 56 pF chip capacitor 0603
C3 0.018 μF chip capacitor 0603
C4 Do Not Place
R1 18 Ω chip resistor 0603
R2 4.7 Ω chip resistor 0603
R3 16 Ω 1% tolerance 2010
Recommended Bias Resistor Values
Supply
Voltage R3 value Size
9 V 16 ohms 2010
10 V 25 ohms 2512
12 V 44 ohms 2512
The proper value for R3 is dependent upon the supply
voltage and allows for bias stability over temperature.
WJ recommends a minimum supply bias of +9 V. A
1% tolerance resistor is recommended.
ECG003B-PCB Performance Data
(WJ’s evaluation board uses the circuit shown above.)
Gain
10
12
14
16
18
20
01234
Frequency (GHz)
Return Loss
-30
-20
-10
0
01234
Frequency (G Hz)
S11 & S22 (dB)
S11 S22
C1
Blocking
Capacitor
RF OUT
L1
RF Choke
C3
0.018 µF
R3
Bias
Resisto
r
RF IN
C4
Bypass
Capacito
r
C2
Blocking
Ca
p
acito
r
Vcc
Icc = 110 mA
ECG003B
R1
18 Ω R2
4.7 Ω
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com, www.TriQuint.com Page 4 of 4 January 2008
ECG003
InGaP HBT Gain Block
ECG003B-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes.
Outline Drawing
Land Pattern
Product Marking
The component will be marked with an
“E003G” designator with an alphanumeric lot
code on the top surface of the package. The
obsolete tin-lead package is marked with an
“E003” designator followed by an
alphanumeric lot code; it may also have been
marked with an “8” designator followed by a
3-digit numeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1A
Value: Passes between 250 and 500V
Test: Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260 °C convection r eflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vi as are critical for the proper performance o f
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board
to a heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
E003G
XXXX-X
