Microwave Ceramics and Modules Filter
4-Pole Filter XM Radio F4052
Design Goal
ISSUE DATE 20.08.04 ISSUE P1 PUBLISHER SAW MWC PD PAGE 1/4
Features
SMD filter consisting of coupled resonators with stepped impedances
MgTiO3 - CaTiO3 (εr = 21/ TCf =0±10 ppm/K) with a coating of copper (10µm) and tin (>5µm)
Excellent reflow solderability, no migration effect due to copper/tin metallization
ESD insensitivity and ESD protecting due to filter characteristics
Index
Page 2 Component drawing
Recommended footprint
Page 3 Characteristics
Maximum ratings
Typical passband characteristic
Page 4 Processing information
Soldering requirements
Delivery mode
Microwave Ceramics and Modules Filter
4-Pole Filter XM Radio F4052
Design Goal
ISSUE DATE 20.08.04 ISSUE P1 PUBLISHER SAW MWC PD PAGE 2/4
Component drawing
Recommended footprint
View from below onto the solder terminals and view from beside
solder pads
I / O connected to lines with an
impedance of 50 Ohm
Standard
condition
FR4 material
permitivity : 4.4
ground layers below footprint
preferred thickness : 0.3
Vias : Ø0.3 / mm²
For other thickness
correlation might be necessary
Microwave Ceramics and Modules Filter
4-Pole Filter XM Radio F4052
Design Goal
ISSUE DATE 20.08.04 ISSUE P1 PUBLISHER SAW MWC PD PAGE 3/4
Characteristics
min. typ. max.
Center frequency fc- 2338.755 - MHz
Insertion loss αIL 2.2 2.5 dB
Passband B5.5 MHz
Amplitude ripple (peak - peak) ∆α 0.2 0.5 dB
Standing wave ratio SWR 1.4 2.0
Group delay in Passband 15 40
Impedance Z 50 Ω
A
ttenuation α
at 2198.755 (fc –140MHz) 45 49
dB
at 2478.755 (fc +140MHz) 50 54
dB
Maximum ratings
EC climatic category (IEC 68-1) - 40/+ 90/56
Operating temperature Top -20 / +80 °C
Typical passband characteristic
-70
-60
-50
-40
-30
-20
-10
0
2072 2122 2172 2222 2272 2322 2372 2422 2472 2522 2572
frequency [MHz]
attenuation [dB]
S11
S21
Microwave Ceramics and Modules Filter
4-Pole Filter XM Radio F4052
Design Goal
ISSUE DATE 20.08.04 ISSUE P1 PUBLISHER SAW MWC PD PAGE 4/4
Processing information
Wettability acc. to IEC 68-2-58: ≥ 75% (after aging)
Soldering Requirements
Profile for eutectic
SnPb solder paste
Profile for leadfree
solder paste
Soldering type reflow reflow
Maximum solderin
g
tem
p
erature 235
(
max. 2 sec.
)
260
(
max. 2 sec.
)
°C
(measuring point on top surface of the component) 225 (max. 10 sec.) 250 (max. 10 sec.) °C
Recommended soldering conditions (infrared):
20-40 sec.
40-80 sec.
within 10 sec.
Time [sec.]
Temp. [°C]
215°C±10°C
30 sec.
2-3 min.
within 10 sec.
Time [sec.]
Temp. [°C]
245°C±5°C
2.5 °C/s > - 5 °C/s
Delivery mode
Blister tape acc. to IEC 286-3, polyester, grey
Pieces/tape: t.b.d.
Note: This document is PRELIMINARY. All specifications are subject to change and are not guaranteed.
EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics.
Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry
recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed.
