SI7015-A10-FM - SILICON LABS

Si7015-A10

DIGITAL I2C HUMIDITY AND TEMPERATURE SENSOR

Features

Applications

Description

The Si7015 I2C Humidity and Temperature Sensor is a monolithic CMOS

IC integrating humidity and temperature sensor elements, an analog-to-

digital converter, signal processing, calibration data, and an I2C Interface.

The patented use of industry-standard, low-K polymeric dielectrics for

sensing humidity enables the construction of low-power, monolithic

CMOS Sensor ICs with low drift and hysteresis and excellent long term

stability.

Each unit is factory-calibrated, and the calibration data is stored in the on-

chip non-volatile memory. This ensures that the sensors are fully

interchangeable, with no recalibration or software changes required. The

Si7015 can be used as a drop-in upgrade for the Si7005 with only minor

software changes because the register sets are the same, and the

4x4 mm QFN package is footprint-compatible with that of the Si7005.

The device is compatible with standard SMT assembly processes, such

as reflow. The optional factory-installed cover offers a low profile and

convenient means of protecting the sensor during assembly (e.g., reflow

soldering) and throughout the life of the product, excluding liquids

(hydrophobic/oleophobic) and particulates.

The Si7015 offers an accurate, low-power, factory-calibrated digital

solution ideal for measuring humidity, dew-point, and temperature in

applications ranging from HVAC/R and asset tracking to industrial and

consumer platforms.

Precision Relative Humidity Sensor

± 4.5% RH (max), 0–80% RH

High-Accuracy Temperature Sensor

±1 ºC (max), –10 to 85 °C

0 to 100% RH operating range

0 to +70 °C operating range (FM)

–40 to +85 °C operating range (GM)

Low Voltage Operation (1.9 to 3.6 V)

Low Power Consumption

150 µA active current

60 nA standby current

Drop-In Upgrade for Si7005

Factory-calibrated

I2C Interface

Integrated on-chip heater

4x4 mm QFN package

Excellent long term stability

Optional factory-installed

cover

Low-profile

Protection during reflow

Excludes liquids and

particulates

HVAC/R

Thermostats/humidistats

Instrumentation

White goods

Micro-environments/data centers

Industrial controls

Weather stations

Asset tracking and storage

Patent protected; patents pending

Ordering Information

See page 31.

Pin Assignments

GND

DNC

SDA

SCL

DNC

GND

DNC

VDD

GND

DNC

GND

DNC

Si7015-A10

2 Rev. 1.1

Functional Block Diagram

Si7015-A10

Rev. 1.1 3

TABLE OF CONTENTS

Section Page

1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

2. Typical Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

4.1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

4.2. Relative Humidity Sensor Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

4.3. Temperature Compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

4.4. Hysteresis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

4.5. Prolonged Exposure to High Humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

4.6. PCB Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

4.7. Protecting the Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

4.8. Bake/Hydrate Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

4.9. Long Term Drift/Aging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

5. Host Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

5.1. I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

5.2. I2C Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

6. Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

6.1. Register Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

7. Pin Descriptions: Si7015 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30

8. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31

9. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32

9.1. 24-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32

9.2. 24-Pin QFN with Protective Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

10. PCB Land Pattern and Solder Mask Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34

11. Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36

11.1. Si7015 Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36

11.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

12. Additional Reference Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37

Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38

Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

Si7015-A10

4 Rev. 1.1

1. Electrical Specifications

Unless otherwise specified, all min/max specifications apply over the recommended operating conditions.

Table 1. Recommended Operating Conditions

Parameter Symbol Test Condition Min Typ Max Unit

Power Supply VDD 1.9 — 3.6 V

Operating Temperature TAF grade 0 — +70 °C

Operating Temperature TAG grade –40 — +85 °C

Table 2. General Specifications

1.9 < VDD <3.6 V; TA= –40 to 85 °C (G grade) or 0 to 70 °C (F grade); default conversion time unless otherwise noted.

Parameter Symbol Test Condition1Min Typ Max Unit

Input Voltage High VIH AD0, SCL, SDA pins 0.7xVDD ——V

Input Voltage Low VIL AD0, SCL, SDA pins — — 0.3xVDD V

Input Voltage Range VIN SCL, SDA, RSTb pins with respect to

GND

0.0 — VDD V

Input Leakage IIL SCL, SDA pins; VIN =GND — — 1 μA

CS pin (200K nominal pull up);

Vin = GND

5xVDD μA

Output Voltage Low VOL SDA pin; IOL = 2.5 mA; VDD = 3.3 V — — 0.6 V

SDA pin; IOL =1.2mA;

VDD =1.9V

——0.4V

Current

Consumption

IDD RH conversion in progress — 150 180 µA

Temperature conversion in progress — 90 120 µA

CS < VIL; no conversion in progress;

VDD = 3.3 V;

SDA = SCL ≥ VIH; HEAT = 1

—24—

Standby2, –40 to +85°C — 0.06 0.62 µA

Peak IDD during powerup3—3.54.0mA

Peak IDD during I2C operations4—3.54.0mA

Conversion Time tCONV RH Normal (Fast = 0) — 5.8 7.0 ms

RH Fast (Fast = 1) — 2.6 3.1 ms

Temperature Normal (Fast = 0) — 4.0 6.2 ms

Temperature Fast (Fast = 1) — 1.5 2.4 ms

Notes:

1. Initiating a RH measurement will also automatically initiate a temperature measurement. The total conversion time will

be tCONV(RH) + tCONV(T).

2. No conversion or I2C transaction in progress. Typical values measured at 25 °C.

3. Occurs once during powerup. Duration is <5 msec.

4. Occurs during I2C commands for Read Device ID and Read Firmware Version. Duration is < 100 µs when I2C clock

speed is >100 kHz.

Si7015-A10

Rev. 1.1 5

Wake Up Time tCS From CS < VIL to ready for a temp/RH

conversion

——1ms

Power Up Time tPU From VDD ≥ 1.9 V to ready for a temp/

RH conversion, 25°C

—1825ms

From VDD ≥ 1.9 V to ready for a temp/

RH conversion, full temperature range

——80ms

Table 3. I2C Interface Specifications1

1.9 VDD  3.6 V; TA = 0 to 70 °C (F grade) or –40 to +85 °C (G grade) unless otherwise noted.

Parameter Symbol Test Condition Min Typ Max Unit

Hysteresis VHYS High-to-low versus low-to-

high transition

0.05 x VDD ——V

SCLK Frequency fSCL — — 400 kHz

SCL High Time tSKH 0.6 — — µs

SCL Low Time tSKL 1.3 — — µs

Start Hold Time tSTH 0.6 — — µs

Start Setup Time tSTS 0.6 — — µs

Stop Setup Time tSPS 0.6 — — µs

Bus Free Time tBUF Between Stop and Start 1.3 — — µs

SDA Setup Time tDS 100 — — ns

SDA Hold Time tDH 100 — — ns

SDA Valid Time tVD;DAT From SCL low to data valid — — 0.9 µs

SDA Acknowledge Valid Time tVD;ACK From SCL low to data valid — — 0.9 µs

Suppressed Pulse Width2tSP 50 — — ns

Notes:

1. All values are referenced to VIL and/or VIH.

2. Pulses up to and including 50ns will be suppressed.

Table 2. General Specifications (Continued)

1.9 < VDD <3.6 V; TA= –40 to 85 °C (G grade) or 0 to 70 °C (F grade); default conversion time unless otherwise noted.

Parameter Symbol Test Condition1Min Typ Max Unit

Notes:

1. Initiating a RH measurement will also automatically initiate a temperature measurement. The total conversion time will

be tCONV(RH) + tCONV(T).

2. No conversion or I2C transaction in progress. Typical values measured at 25 °C.

3. Occurs once during powerup. Duration is <5 msec.

4. Occurs during I2C commands for Read Device ID and Read Firmware Version. Duration is < 100 µs when I2C clock

speed is >100 kHz.

Si7015-A10

6 Rev. 1.1

Figure 1. I2C Interface Timing Diagram

SCL

1/fSCL tSKH

SDA

tSKL

tSTH

D6 D5 D0 R/W ACK

tDS tDH

Start Bit Stop Bit

tBUF

tSTS tVD : ACK

tSPS

tSP

Si7015-A10

Rev. 1.1 7

Figure 2. RH Accuracy at 30 °C

Table 4. Humidity Sensor

1.9 ≤ VDD ≤ 3.6 V; TA = 30 °C; default conversion time unless otherwise noted.

Parameter Symbol Test Condition Min Typ Max Unit

Operating Range1Non-condensing 0 — 100 %RH

Accuracy2, 3 0 – 80% RH — ±3.0 ±4.5 %RH

80 – 100% RH See Figure 2 %RH

Repeatability/Noise Normal Mode — 0.05 — %RH RMS

Fast Mode — 0.2 — %RH RMS

Response Time4τ63% 1m/s airflow — 18 — S

Drift vs. Temperature — 0.05 — %RH/°C

Hysteresis — ±1 — %RH

Long Term Stability3—<0.25 — %RH/yr

Notes:

1. Recommended humidity operating range is 20% to 80% RH (non-condensing) over –10 °C to 60 °C. Prolonged

operation beyond these ranges may result in a shift of sensor reading with slow recovery time.

2. Excludes hysteresis, long term drift, and certain other factors and is applicable to non-condensing environments only.

See “4.2. Relative Humidity Sensor Accuracy” for more details.

3. Drift due to aging effects at typical room conditions of 30C and 30% to 50%. May be impacted by dust, vaporized

solvents or other contaminants, e.g., out-gassing tapes, adhesives, packaging materials, etc. See “4.9. Long Term

Drift/Aging”.

4. Response time to a step change in RH. Time for the RH output to change by 63% of the total RH change.

0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100

RHMeasurementError(±%)

RelativeHumidity(%)

RHAccuracy

Max.RHError(±%) Typ.RHError(±%)

Si7015-A10

8 Rev. 1.1

Figure 3. Temperature Accuracy*

Note: Figure 3 only applies to G-grade devices beyond 70C.

Table 5. Temperature Sensor

1.9 ≤ VDD ≤3.6 V; TA= –40 to +85 °C (G grade) or 0 to +70 °C (F grade), default conversion time unless otherwise noted.

Parameter Symbol Test Condition Min Typ Max Unit

Operating Range F Grade 0 — +70 °C

G Grade –40 — +85 °C

Accuracy10°C < tA < 70 °C — ±0.5 ±1.0 °C

–40 °C < tA< 85 °C Figure 3 °C

Repeatability/Noise Normal Mode — 0.02 — °C RMS

Fast Mode — 0.08 — °C RMS

Response Time2τ63% Unmounted device — 0.7 — s

Si7015-EB board — 5.1 — s

Long Term Stability — < 0.01 — °C/Yr

Notes:

1. 14b measurement resolution (default).

2. Time to reach 63% of final value in response to a step change in temperature. Actual response time will vary dependent

on system thermal mass and air-flow.

Si7015-A10

Rev. 1.1 9

Table 6. Thermal Characteristics

Parameter Symbol Test Condition QFN-24 Unit

Junction-to-Air Thermal Resistance JA JEDEC 4-layer board 55 °C/W

Junction-to-Air Thermal Resistance JA 2-layer evaluation PCB with

minimal thermal pad

110 °C/W

Table 7. Absolute Maximum Ratings1,2

Parameter Symbol Test

Condition Min Typ Max Unit

Ambient Temperature under Bias –55 — 125 °C

Storage Temperature –65 — 150 °C

Voltage on SDA or SCL pin with respect

to GND

–0.3 — VDD+ 0.3 V

Voltage on CS pin with respect to GND –0.3 — VDD + 0.3 V

Voltage on VDD with respect to GND –0.3 — 4.2 V

ESD Tolerance HBM — — 2 kV

CDM — — 1.25 kV

MM — — 250 V

Notes:

1. Absolute maximum ratings are stress ratings only; operation at or beyond these conditions is not implied and may

shorten the life of the device or alter its performance.

2. Special handling considerations apply; see “AN607: Si70xx Humidity Sensor Designer’s Guide” for details.

Si7015-A10

10 Rev. 1.1

2. Typical Application Circuit

Figure 4. Typical Application Circuit*

*Note: If Si7015 is replacing an Si7005, the capacitor connected to Pin 10 may be left connected or removed.

SDA *

SCL *

VDD

CSb

GND

Si7015

DNC 13

DNC 14

SDA

DNC

SCL

DNC

GND

CS 15

DNC 16

DNC 17

DNC 18

DNC

GND

DNC

GND

VDD

GND 19

DNC 24

DNC 20

DNC 23

DNC 22

DNC 21

DNC

7EPAD 25

10K

0.1uF

10K

Si7015-A10

Rev. 1.1 11

3. Bill of Materials

Table 8. Typical Application Circuit BOM*

Reference Description Mfr Part Number Manufacturer

C1 Capacitor, 0.1 µF, 6.3 V, X7R, 0603 C0603X7R6R3-104M Venkel

R1*Resistor, 10 k, ±5%, 1/16 W, 0603 CR0603-16W-1002J Venkel

R2*Resistor, 10 k, ±5%, 1/16 W, 0603 CR0603-16W-1002J Venkel

U1 IC, digital temperature/humidity sensor Si7015-A10 Silicon Labs

*Note: Typical value shown. Optimal value depends on bus capacitance and speed of bus operation; not needed if present

elsewhere in the system.

Si7015-A10

12 Rev. 1.1

4. Functional Description

Figure 5. Si7015 Functional Block Diagram

4.1. Overview

The Si7015 is a digital relative humidity and temperature sensor. This monolithic CMOS IC integrates temperature

and humidity sensor elements, an analog-to-digital converter, signal processing, calibration data, and an I2C host

interface. Both the temperature and humidity sensors on each unit are factory-calibrated and the calibration data is

stored in the on-chip non-volatile memory. This ensures that the sensors are fully interchangeable, with no

recalibration or software changes required.

While the Si7015 is largely a conventional mixed-signal CMOS integrated circuit, relative humidity sensors in

general and those based on capacitive sensing using polymeric dielectric have unique application and use

requirements that are not common to conventional (non-sensor) ICs. Chief among those are:

The need to protect the sensor during board assembly, i.e., solder reflow, and the need to subsequently

rehydrate the sensor.

The need to apply temperature correction to the humidity readings.

The need to protect the sensor from damage or contamination during the product life-cycle.

The impact of prolonged exposure to extremes of temperature and/or humidity and their potential effect on

sensor accuracy.

The effects of humidity sensor “memory”.

Each of these items is discussed in more detail in the following sections.

Si7015-A10

Rev. 1.1 13

4.2. Relative Humidity Sensor Accuracy

To determine the accuracy of a relative humidity sensor, it is placed in a temperature and humidity controlled

chamber. The temperature is set to a convenient fixed value (typically 30 °C) and the relative humidity is swept

from 20 to 80% and back to 20% in the following steps: 20% – 40% – 60% – 80% – 80% – 60% – 40% – 20%. At

each set-point, the chamber is allowed to settle for a period of 60 minutes before a reading is taken from the

sensor. Prior to the sweep, the device is allowed to stabilize to 50%RH. The solid top and bottom trace in Figure 6,

“Measuring Sensor Accuracy Including Hysteresis,” shows the result of a typical sweep after non-linearity

compensation.

Figure 6. Measuring Sensor Accuracy Including Hysteresis

The RH accuracy is defined as the center (dashed) line shown in Figure 6, which is the average of the two data

points at each relative humidity set-point. In this case, the sensor shows an accuracy of 0.25%RH. The Si7015

accuracy specification (Table 4) includes the following:

Unit-to-unit and lot-to-lot variation in non-linearity compensation

Accuracy of factory calibration

Margin for shifts that can occur during solder reflow.

The accuracy specification does not include the following:

Hysteresis (typically ±1%)

Effects from long term exposure to very humid conditions

Contamination of the sensor by particulates, chemicals, etc.

Other aging related shifts (“Long-term stability”)

Variations due to temperature



Ͳ5

Ͳ4

Ͳ3

Ͳ2

Ͳ1

10 20 30 40 50 60 70 80 90

%RHAccuracy

%RHSetͲpoint

RHAccuracyvs.RHSetͲPoint

Hysteresis

Si7015-A10

14 Rev. 1.1

4.3. Temperature Compensation

The Si7015 relative humidity sensor is calibrated at a temperature of 30 °C; it is at this temperature that the sensor

will give the most accurate relative humidity readings. For relative humidity measurements at other temperatures,

the RH reading from the Si7015 must be compensated for the change in temperature relative to 30 °C.

Temperature-compensated relative humidity readings can be calculated as follows:

Where:

RHTempCompensated is the temperature compensated relative humidity value in %RH.

RHLinear is the linear corrected relative humidity value in %RH.

Temperature is the ambient temperature in °C as measured by the Si7015 on chip temperature sensor.

Q1 and Q0 are unit-less correction coefficients derived through characterization of Si7015s by Silicon

Laboratories.

This temperature compensation is most accurate in the range of 15–50 °C. The values for the correction

coefficients are shown in Table 9.

4.4. Hysteresis

The moisture absorbent film (polymeric dielectric) of the humidity sensor will carry a memory of its exposure

history, particularly its recent or extreme exposure history. A sensor exposed to relatively low humidity will carry a

negative offset relative to the factory calibration, and a sensor exposed to relatively high humidity will carry a

positive offset relative to the factory calibration. This factor causes a hysteresis effect illustrated by the solid top

and bottom traces in Figure 6. The hysteresis value is the difference in %RH between the maximum absolute error

on the decreasing humidity ramp and the maximum absolute error on the increasing humidity ramp at a single

relative humidity Setpoint and is expressed as a bipolar quantity relative to the average, the center dashed trace in

Figure 6. In the case of Figure 6, the measurement uncertainty due to the hysteresis effect is ±1.05%RH.

4.5. Prolonged Exposure to High Humidity

Prolonged exposure to high humidity will result in a gradual upward drift of the RH reading. The shift in sensor

reading resulting from this drift will generally disappear slowly under normal ambient conditions. The amount of

shift is proportional to the magnitude of relative humidity and the length of exposure. In the case of lengthy

exposure to high humidity, some of the resulting shift may persist indefinitely under typical conditions. It is generally

possible to substantially reverse this affect by baking the device (see Section “4.8. Bake/Hydrate Procedure”).

Table 9. Linearization Coefficients

Coefficient Value

Q00.060162

Q10.000508

RHTempCompensated RHLinear Temperature 30–RHLinear Q1Q0

++=

Si7015-A10

Rev. 1.1 15

4.6. PCB Assembly

4.6.1. Soldering

Like most ICs, Si7015 devices are shipped from the factory vacuum-packed with an enclosed desiccant to avoid

any drift during storage and to prevent any moisture-related issues during solder reflow. The following guidelines

should be observed during PCB assembly:

Si7015 devices are compatible with standard board assembly processes. Devices should be soldered

using reflow per the recommended card reflow profile. See Section “10. PCB Land Pattern and Solder

Mask Design” for the recommended card reflow profile.

A “no clean” solder process is recommended to minimize the need for water or solvent rinses after

soldering. Cleaning after soldering is possible, but must be done carefully to avoid impacting the

performance of the sensor. See application note, “AN607: Si70xx Humidity Sensor Designer’s Guide” for

more information on cleaning.

It is essential that the exposed polymer sensing film be kept clean and undamaged. This can be

accomplished by careful handling and a clean, well-controlled assembly process. When in doubt or for

extra protection, a heat-resistant, protective cover such as Kapton® KPPD-1/8 can be installed during PCB

assembly.

Si7015s may be ordered with a factory-fitted, solder-resistant protective cover. This cover provides protection

during PCB assembly or rework but without the time and effort required to install and remove the Kapton® tape. It

can be left in place for the lifetime of the product, preventing liquids, dust, or other contaminants from coming into

contact with the polymer sensor film. See Section “8. Ordering Guide” for a list of ordering part numbers that

include the cover.

4.6.2. Rehydration

The measured humidity value will generally shift slightly after solder reflow. A portion of this shift is permanent and

is accounted for in the accuracy specifications in Table 4. After soldering, an Si7015 should be allowed to

equilibrate under controlled RH conditions (room temperature, 45-55%RH) for at least 48 hours to eliminate the

remainder of the shift and return the device to its specified accuracy performance.

Si7015-A10

16 Rev. 1.1

4.6.3. Rework

To maintain the specified sensor performance, care must be taken during rework to minimize the exposure of the

device to excessive heat and to avoid damage/contamination or a shift in the sensor reading due to liquids, solder

flux, etc. Manual touch-up using a soldering iron is permissible under the following guidelines:

The exposed polymer sensing film must be kept clean and undamaged. A protective cover is

recommended during any rework operation (Kapton® tape or the factory-installed cover).

Flux must not be allowed to contaminate the sensor; liquid flux is not recommended even with a cover in

place. Conventional lead-free solder with rosin core is acceptable for touch-up as long as a cover is in

place during the rework.

If possible, avoid water or solvent rinses after touch-up. Cleaning after soldering is possible, but must be

done carefully to avoid impacting the performance of the sensor. See application note, “AN607: Si70xx

Humidity Sensor Designer’s Guide” for more information on cleaning.

Minimize the heating of the device. Soldering iron temperature should not exceed 350 °C and the contact

time per pin should not exceed 5 seconds.

Hot air rework is not recommended. If a device must be replaced, remove the device by hot air and solder

a new part in its place by reflow following the guidelines above.

*Note: All trademarks are the property of their respective owners.

Figure 7. Si7015 with Factory-Installed Protective Cover

Si7015-A10

Rev. 1.1 17

4.7. Protecting the Sensor

Because the sensor operates on the principal of measuring a change in capacitance, any changes to the dielectric

constant of the polymer film will be detected as a change in relative humidity. Therefore, it is important to minimize

the probability of contaminants coming into contact with the sensor. Dust and other particles as well as liquids can

affect the RH reading. It is recommended that a filter cover is employed in the end system that blocks contaminants

but allows water vapor to pass through. Depending on the needs of the application, this can be as simple as plastic

or metallic gauze for basic protection against particulates or something more sophisticated such as a hydrophobic

membrane providing up to IP67 compliant protection.

Si7015s may be ordered with a factory fitted, solder-resistant cover, which can be left in place for the lifetime of the

product. It is very low-profile, hydrophobic and oleophobic, and excludes particulates down to 0.35 microns in size.

See Section “8. Ordering Guide” for a list of ordering part numbers that include the cover. A dimensioned drawing

of the IC with the cover is included in Section “9. Package Outline”. Other characteristics of the cover are listed in

Table 10. The sensor should be protected from direct sunlight to prevent heating effects as well as possible

material degradation.

4.8. Bake/Hydrate Procedure

After exposure to extremes of temperature and/or humidity for prolonged periods, the polymer sensor film can

become either very dry or very wet; in each case the result is either high or low relative humidity readings. Under

normal operating conditions, the induced error will diminish over time. From a very dry condition, such as after

shipment and soldering, the error will diminish over a few days at typical controlled ambient conditions, e.g., 48

hours of 45 ≤ %RH ≤ 55. However, from a very wet condition, recovery may take significantly longer. To accelerate

recovery from a wet condition, a bake and hydrate cycle can be implemented. This operation consists of the

following steps:

Baking the sensor at 125 °C for ≥12 hours

Hydration at 30 °C in 75 %RH for ≥10 hours

Following this cycle, the sensor will return to normal operation in typical ambient conditions after a few days.

4.9. Long Term Drift/Aging

Over long periods of time, the sensor readings may drift due to aging of the device. Standard accelerated life

testing of the Si7015 has resulted in the specifications for long-term drift shown in Table 4 and Table 5. This

contribution to the overall sensor accuracy accounts only for the long-term aging of the device in an otherwise

benign operating environment and does not include the affects of damage, contamination, or exposure to extreme

environmental conditions.

Table 10. Specifications of Protective Cover

Parameter Value

Material ePTFE

Water Entry Pressure 2.7 bar

Pore Size 0.35µ

Operating Temperature –40 to +125 °C

Maximum Reflow Temperature 260 °C

Oleophobicity (AATCC 118 – 1992) 7

IP Rating (per IEC 529) IP67

Si7015-A10

18 Rev. 1.1

5. Host Interface

5.1. I2C Interface

The Si7015 has an I2C serial interface with a 7-bit address of 0x40. The Si7015 is a slave device supporting data

transfer rates up to 400 kHz. Table 20 shows the register summary of the Si7015.

5.1.1. Perfo rm in g a Re lat iv e Humidit y M ea sur e m ent

The following steps should be performed in sequence to take a relative humidity measurement:

1. Set START (D0) in CONFIG to begin a new conversion.

2. Poll RDY (D0) in STATUS (register 0) until it is low (= 0). (This must be done at least once prior to reading

results even if the host waits longer than tCONV.)

3. Read the upper and lower bytes of the RH value from DATAh and DATAl (registers 0x01 and 0x02),

respectively. Table 11 shows the format of the 12-bit relative humidity result.

4. Convert the RH value to %RH using the following equation:

where RH is the measured value returned in DATAh:DATAI.

5. Apply temperature compensation as discussed elsewhere in this data sheet.

Due to normal variations in RH accuracy of the device as described in Table 4, it is possible for the measured value

of %RH to be slightly less than 0 when the actual RH level is close to or equal to 0. Similarly, the measured value

of %RH may be slightly greater than 100 when the actual RH level is close to or equal to 100. This is expected

behavior, and it is acceptable to limit the range of RH results to 0 to 100%RH in the host software by truncating

values that are slightly outside of this range.

Table 12 shows the 12-bit values that correspond to various measured RH levels.

Table 11. 12-Bit Relative Humidity Result Available in Registers 1 and 2

DATAh DATAI

D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

12-Bit Relative Humidity Code

%RH RH

---------





24–=

Si7015-A10

Rev. 1.1 19

The above sequence assumes normal mode, i.e., tCONV = 5.8 ms (typical). Conversions may be performed in fast

mode. See Section “5.1.4. Fast Conversion Mode”.

Table 12. Typical %RH Measurement Codes for 0 to 100% RH Range

%RH 12 Bit Code

Dec Hex

0 384 180

10 544 220

20 704 2C0

30 864 360

40 1024 400

50 1184 4A0

60 1344 540

70 1504 5E0

80 1664 680

90 1824 720

100 1984 7C0

Si7015-A10

20 Rev. 1.1

5.1.2. Perfo rm i ng a Temperature Me a su r em en t

The following steps should be performed in sequence to take a temperature measurement:

1. Set START (D0) and TEMP (D4) in CONFIG (register 0x03) to begin a new conversion, i.e., write CONFIG

with 0x11

2. Poll RDY (D0) in STATUS (register 0) until it is low (=0). This must be done at least once prior to reading

results even if the host waits longer than tCONV.

3. Read the upper and lower bytes of the temperature value from DATAh and DATAl (registers 0x01 and

0x02), respectively

Table 13 shows the format of the 14-bit temperature result. This value may be converted to °C using the following

equation:

where TEMP is the measured value returned in DATAh:DATAI.

Table 14 shows the 14-bit values that correspond to various measured temperature levels.

The above sequence assumes normal mode, i.e., tCONV = 5.8 ms (typical). Conversions may be performed in fast

mode. See Section “5.1.4. Fast Conversion Mode”.

5.1.3. Entering Low-Power Mode

Either of the following sequences can be used to place the Si7015 into its low-power standby mode following an

RH conversion:

Option A:

Bring CSb high. This puts the Si7015 in low-power mode and disables I2C communication. This is similar to Si7005

except that the response to CSb high takes only a few usec and the VDD current is <1 µA (as opposed to Si7005

which can take >1second and can have VDD current of up to 100 µA).

Option B:

1. Poll /RDY until it returns zero, indicating that the conversion is finished.

2. Read the results of the RH conversion from DATAh:DATAl.

3. Clear the start bit (START) by writing 0x0 to register 3.

4. Clear the start bit (START) a second time by again writing 0x0 to register 3.

The Si7015 does enter its low-power standby mode following a temperature conversion. No action is required in

this case. However, please note that doing a temperature conversion following an RH conversion will not put the

Si7015 in low power state.

Table 13. 14-Bit Temperature Result Available in Registers 1 and 2

DATAh DATAI

D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

14-Bit Temperature Code

Temperature C TEMP

-----------------





50–=

Si7015-A10

Rev. 1.1 21

Table 14. Typical Temperature Measurement Codes for the –40 °C to 100 °C Range

Temp(°C) 14 Bit Code

Dec Hex

–40 320 0140

–30 640 0280

–20 960 03C0

–10 1280 0500

0 1600 0640

10 1920 0780

20 2240 08C0

30 2560 0A00

40 2880 0B40

50 3200 0C80

60 3520 0DC0

70 3840 0F00

80 4160 1040

90 4480 1180

100 4800 12C0

Si7015-A10

22 Rev. 1.1

5.1.4. Fast Convers ion Mode

The time needed to perform a temperature or RH measurement can be reduced from 5.8 ms (typical) to 2.6 ms

(typical) by setting FAST (D5) in CONFIG (register 0x03). Fast mode reduces the total power consumed during a

conversion or the average power consumed by the Si7015 when making periodic conversions. It also reduces the

resolution of the measurements.

5.1.5. Heater

The Si7015 relative humidity sensor contains an integrated, resistive heating element that may be used to raise the

temperature of the humidity sensor. This element can be used to drive off condensation or to implement dew-point

measurement when the Si7015 is used in conjunction with a separate temperature sensor such as another Si7015.

The heater can be activated by setting HEAT (D1) in CONFIG (register 0x03). Turning on the heater will reduce the

tendency of the humidity sensor to accumulate an offset due to “memory” of sustained high humidity conditions.

When the heater is enabled, the reading of the on-chip temperature sensor will be affected (increased).

5.1.6. Device Identification

The Si7015 device and its revision level can be determined by reading ID (register 0x11). Table 15 lists the values

for the various device revisions and may include revisions not yet in existence.

Table 15. Device ID Revision Values

Device ID Value Device

Type Revision

Level

D[7:4] D[3:0]

1111 0000 Si7015 A

Si7015-A10

Rev. 1.1 23

5.2. I2C Operation

The format of the address byte is shown in Table 16.

5.2.1. I2C Write Operation

To write to a register on the Si7015, the master should issue a start command (S) followed by the slave address,

0x40. The slave address is followed by a 0 to indicate that the operation is a write. Upon recognizing its slave

address, the Si7015 issues an acknowledge (A) by pulling the SDA line low for the high duration of the ninth SCL

cycle. The next byte the master places on the bus is the register address pointer, selecting the register on the

Si7015 to which the data should be transferred. After the Si7015 acknowledges this byte, the master places a data

byte on the bus. This byte will be written to the register selected by the address pointer. The Si7015 will

acknowledge the data byte, after which the master issues a Stop command (P). See Table 17.

Table 16. I2C Slave Address Byte

A6 A5 A4 A3 A2 A1 A0 R/W

10000001/0

Master Slave

Table 17. I2C Write Sequence

Sequence to Write to a Register

S Slave Address W A Address Pointer ARegister DataAP

Sequence to Start a Relative Humidity Conversion

S0x40 0

A 0x03 A 0x01 AP

Sequence to Start a Temperature Conversion

S0x40 0

A 0x03 A 0x11 AP

Si7015-A10

24 Rev. 1.1

5.2.2. I2C Read Operation

To read a register on the Si7015, the master must first set the address pointer to indicate the register from which

the data is to be transferred. Therefore, the first communication with the Si7015 is a write operation. The master

should issue a start command (S) followed by the slave address, 0x40. The slave address is followed by a 0 to

indicate that the operation is a write. Upon recognizing its slave address, the Si7015 will issue an acknowledge (A)

by pulling the SDA line low for the high duration of the ninth SCL cycle. The next byte the master places on the bus

is the register address pointer selecting the register on the Si7015 from which the data should be transferred. After

the Si7015 acknowledges this byte, the master issues a repeated start command (Sr) indicating that a new transfer

is to take place. The Si7015 is addressed once again with the R/W bit set to 1, indicating a read operation. The

Si7015 will acknowledge its slave address and output data from the previously-selected register onto the data bus

under the control of the SCL signal, the master should not acknowledge (A) the data byte and issue a stop (P)

command (see Table 22). However, if a RH or Temperature conversion result (two bytes) is to be read, the master

should acknowledge (A) the first data byte and continue to activate the SCL signal. The Si7015 will automatically

output the second data byte. Upon receiving the second byte, the master should issue a not Acknowledge (A)

followed by a stop command. (See Table 23.)

Table 18. I2C Read Sequence for a Single Register

Sequence to Read from a Single Register

S Slave Address W A Address Pointer ASr Slave Address R ARegister Data A P

Sequence to Read Device ID

S0x40 0

A 0x11 ASr 0x40 1 AID A P

Sequence to Read RDY bit

S0x40 0

A0x00 ASr 0x40 1 A — RDY A P

Table 19. I2C Read Sequence for RH or Temperature Conversion Result

Sequence to Read Conversion Result

SSlave

Address

WAAddress

Pointer

ASr Slave

Address

R A Register 1

Data

ARegister 2

Data

A P

S0x40 0

A0x01ASr 0x40 1 AData H A Data L A P

Si7015-A10

Rev. 1.1 25

5.2.3. Firmware Revision

The internal firmware revision can be read with the following I2C transaction:

The values in this field are encoded as follows:

0xFF = Firmware revision 1.0

SSlave

Address

WA0x84A 0xB8 A S Slave

Address

RAFWREV ANA P

Si7015-A10

26 Rev. 1.1

6. Control Registers

Table 20 contains a summary of the Si7015 register set. Each register is described in more detail below.

6.1. Register Detail

Reset Settings = 0000_0001

Table 20. Si7015 Register Summary

I2C Register Summary

0x00 STATUS RSVD RSVD RSVD RSVD RSVD RSVD RSVD /RDY

0x01 DATAh Relative Humidity or Temperature, High Byte

0x02 DATAl Relative Humidity or Temperature, Low Byte

0x03 CONFIG RSVD RSVD FAST TEMP RSVD RSVD HEAT START

0x11 ID ID3 ID2 ID1 ID0 0 0 0 0

0x84 0xB8 FWREV MAJREV MINREV

Notes:

1. Any register address not listed here is reserved and must not be written.

2. Reserved register bits (RSVD) must always be written as zero; the result of a read operation on these bits is undefined.

BitD7D6D5D4D3D2D1D0

Name /RDY

Type R

Bit Name Function

7:1 Reserved Reserved. Reads undefined.

0 /RDY Ready.

0 = conversion complete; results available in DATAh:DATAl.

1 = conversion in progress.

Si7015-A10

Rev. 1.1 27

Reset Settings = 0000_0000

BitD7D6D5D4D3D2D1D0

Name Relative Humidity or Temperature, High Byte

Type R

Bit Name Function

7:0 DATAh Data, High Byte.

Eight most significant bits of a temperature or humidity measurement. See Table 11 or

Table 13 for the measurement format.

BitD7D6D5D4D3D2D1D0

Name Relative Humidity or Temperature, Low Byte

Type Read

Bit Name Function

7:0 DATAl Data, Low Byte.

Eight least significant bits of a temperature or humidity measurement. See Table 11 or

Table 13 for the measurement format.

Si7015-A10

28 Rev. 1.1

Reset Settings = 0000_0000

Reset Settings = 0101_0000

BitD7D6D5D4D3D2D1D0

Name FAST TEMP HEAT START

Type R/W R/W R/W R/W

Bit Name Function

7:6 Reserved Reserved. Reads undefined. Always write as zero.

5 FAST Fast Mode Enable.

0= 5.8 ms (typical)

1=2.6ms (typical)

4TEMPTemperature Enable.

0 = Relative humidity

1 = Temperature

3:2 Reserved Reserved. Reads undefined. Always write as zero.

1HEATHeater Enable.

0 = heater off

1 = heater on

0STARTConversion Start.

0 = do not start a conversion

1 = start a conversion

BitD7D6D5D4D3D2D1D0

Name ID7ID6ID5ID4ID3ID2ID1ID0

Type RRRRRRRR

Bit Name Function

7:0 ID Identification.

See “5.1.6. Device Identification” for reset settings.

Si7015-A10

Rev. 1.1 29

BitD7D6D5D4D3D2D1D0

Name MAJREV MINREV

Type RR

Bit Name Function

7:4 MAJREV Major firmware revision number

3:0 MINREV Minor firmware revision number

Si7015-A10

30 Rev. 1.1

7. Pin Descriptions: Si7015

Table 21. Pin Descriptions

Pin # Pin Name Pin Type* Description

1, 8, 11, 19 GND G Ground.

2, 5–7, 12–14,

16–18, 20–24

DNC Do Not Connect.

Do not connect any of these pins to supply, ground or any other

signal. Internal pull-ups or pull-downs will prevent any of these pins

from floating.

3SCLI

I2C Clock Signal.

This pin is voltage-tolerant. See Table 2.

4SDAI/O

I2C Data Signal.

This pin is voltage-tolerant. See Table 2.

DD SVDD Power Supply (1.9 V < VDD < 3.6 V).

10 DNC I If Si7015 is replacing an Si7005, the capacitor connected to Pin 10

may be left connected or removed.

15 CS IChip Select—Active Low Signal.

Epad TGND GThermal Paddle.

This pad is connected to GND internally. The pad can be con-

nected to GND externally or it can be left open-circuit and used as

a thermal input to the on-chip temperature sensor.

*Note: G = Ground, S = Power Supply, I = Digital Input, O = Digital Output, I/O = Input/Output.

GND

DNC

SDA

SCL

DNC

GND

DNC

VDD

GND

DNC

GND

DNC

Si7015-A10

Rev. 1.1 31

8. Ordering Guide

Table 22. Si7015 Device Ordering Guide

P/N Description

Max Accuracy

Pkg Operating

Range (°C) Protective

Cover Packing

Format

Temp RH

Si7015-A10-FM Digital temperature/

humidity sensor ±1 °C ±4.5% QFN-24 0 to 70 °C N Tube

Si7015-A10-FMR Digital temperature/

humidity sensor ±1 °C ±4.5% QFN-24 0 to 70 °C N Tape-and-reel

Si7015-A10-FM1 Digital temperature/

humidity sensor ±1 °C ±4.5% QFN-24 0 to 70 °C Y Cut tape

Si7015-A10-FM1R Digital temperature/

humidity sensor ±1 °C ±4.5% QFN-24 0 to 70 °C Y Tape-and-reel

Si7015-A10-GM Digital temperature/

humidity sensor ±1 °C ±4.5% QFN-24 –40 to

+85 °C NTube

Si7015-A10-GMR Digital temperature/

humidity sensor ±1 °C ±4.5% QFN-24 –40 to

+85 °C N Tape-and-reel

Si7015-A10-GM1 Digital temperature/

humidity sensor ±1 °C ±4.5% QFN-24 –40 to

+85 °C Y Cut tape

Si7015-A10-GM1R Digital temperature/

humidity sensor ±1 °C ±4.5% QFN-24 –40 to

+85 °C Y Tape-and-reel

Note: The "A" denotes product revision A and "10" denotes firmware version 1.0.

Si7015-A10

32 Rev. 1.1

9. Package Outline

9.1. 24-Pin QFN

Figure 8 illustrates the package details for the Si7015. Tables 23 and 24 list the values for the dimensions shown in

the illustration. There are two package variants with slightly different height dimensions. The two package variants

are otherwise interchangeable.

Figure 8. 2 4-Pin Quad Flat No Lead (QFN)

Note: All Dimensions are in mm unless otherwise noted.

Table 23. 24-Pin Package Diagram Dimensions

Dimension Min Nom Max Dimension Min Nom Max

A1 0.00 0.02 0.05 H1 1.03 1.08 1.13

b 0.18 0.25 0.30 H2 1.68 REF

D 4.00 BSC. L 0.30 0.35 0.40

D2 2.55 2.65 2.75 aaa — — 0.15

e 0.50 BSC. bbb — — 0.15

E 4.00 BSC. ccc — — 0.08

E2 2.55 2.65 2.75 ddd ——

0.10

Notes:

1. Dimensioning and Tolerancing per ANSI Y14.5M-1994.

2. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.

Table 24. Package Variants

Variant A Variant B

Dimension Min Nom Max Min Nom Max

A 0.800.901.000.700.750.80



Si7015-A10

Rev. 1.1 33

9.2. 24-Pin QFN with Protective Cover

Figure 9 illustrates the package details for the Si7015 with the optional protective cover. Tables 25 and 26 list the

values for the dimensions shown in the illustration. There are two package variants with slightly different height

dimensions. The two package variants are otherwise interchangeable.

Figure 9. 24-Pin Quad Flat No Lead (QFN) With Protective Cover

Note: All Dimensions are in mm unless otherwise noted.

Table 25. 24-Pin Package Diagram Dimensions

Dimension Min Nom Max Dimension Min Nom Max

A1 0.00 0.02 0.05 h 0.76 0.83 0.90

b 0.18 025 0.30 L 0.30 0.35 0.40

D 4.00 BSC. R1 0.45 0.50 0.55

D2 2.55 2.65 2.75 aaa — — 0.15

e 0.50 BSC. bbb — — 0.15

E 4.00 BSC. ccc — — 0.08

E2 2.55 2.65 2.75 ddd — — 0.10

F1 3.70 3.80 3.90

F2 3.70 3.80 3.90

Notes:

1. Dimensioning and Tolerancing per ANSI Y14.5M-1994.

2. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.

Table 26. Package Variants

Variant A Variant B

Dimension Min Nom Max Min Nom Max

A — 1.27 1.41 — 1.07 1.21

A2 0.80 0.90 1.00 0.70 0.75 0.80



Si7015-A10

34 Rev. 1.1

10. PCB Land Pattern and Solder Mask Design

Figure 10 illustrates the recommended PCB land pattern for use with the Si7015's 4x4 mm QFN package.

Figure 10. Typical QFN-24 PCB Land Pattern

Si7015-A10

Rev. 1.1 35

Table 27. PCB Land Pattern Dimensions

Symbol mm

C1 4.00

C2 4.00

E0.50

P1 2.75

P2 2.75

X1 0.30

Y1 0.75

Notes:

General

1. All dimensions shown are at Maximum Material Condition (MMC). Least

Material Condition (LMC) is calculated based on a Fabrication Allowance of

0.05 mm.

2. This Land Pattern Design is based on the IPC-7351 guidelines.

Solder Mask De s ign

3. All metal pads are to be non-solder mask defined (NSMD). Clearance

between the solder mask and the metal pad is to be 60 µm minimum, all the

way around the pad.

Stencil Design

4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls

should be used to assure good solder paste release.

5. The stencil thickness should be 0.125 mm (5 mils).

6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter

pins.

7. A 2x2 array of 0.95 mm square openings on 1.35 mm pitch should be used

for the center ground pad.

Card Assembly

8. A No-Clean, Type-3 solder paste is recommended.

9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020

specification for Small Body Components.

Si7015-A10

36 Rev. 1.1

11. Top Marking

11.1. Si7015 Top Marking

11.2. Top Marking Explanation

Mark Method: Laser

Pin 1 Indicator: Circle=0.3 mm Diameter

Upper-Left Corner

Font Size: 0.40 mm

Line 1 Marking: TTTT=Manufacturing Code

Note: The top mark may not be visible if the optional protective cover is installed. If

needed, the device can be identified by reading the identification register as

explained in Section “5.1.6. Device Identification”.

Si7015-A10

Rev. 1.1 37

12. Additional Reference Resources

AN607: Si70xx Humidity Sensor Designer’s Guide

AN764: Upgrading from the Si7005 to the Si7015

Si7015-A10

38 Rev. 1.1

DOCUMENT CHANGE LIST

Revision 0.1 to Revision 0.9

Updated Table 2. General Specifications.

Updated Section 4.6. PCB Assembly.

Updated Table 24. Si7015 Device Ordering Guide.

Updated Section 11. Top Marking.

Updated Functional Block Diagram on pages 2 and

12.

Revision 0.9 to Revision 0.95

Updated the features on page 1.

Updated Table 1.

Updated the block diagram on page 2.

Updated Table 2.

Updated Table 4.

Updated Figure 5.

Updated Section “4.2. Relative Humidity Sensor

Accuracy”.

Updated Section “4.6. PCB Assembly”.

Updated “5.1. I2C Interface”.

Updated Section “5.2. I2C Operation”.

Updated Table 21.

Updated Section “6.1. Register Detail”.

Updated Table 23.

Revision 0.95 to Revision 1.0

Updated Table 2. General Specifications

Updated Table 3. I2C Interface Specifications

Added ESD specifications to Table 7. Absolute

Maximum Ratings

Updated part numbers in Table 8. Typical Application

Circuit BOM

Updated Section 5.2.3. Firmware Revision

Added a footnote to Table 22. Si7015 Device

Ordering Guide

Revision 1.0 to Revision 1.1

Added nominal values to Dimension A in Table 26

Si7015-A10

Rev. 1.1 39

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Please visit the Silicon Labs Technical Support web page:

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