NLX2G17 Dual Schmitt-Trigger Buffer The NLX2G17 MiniGatet is an advanced high-speed CMOS dual non-inverting Schmitt-trigger buffer in ultra-small footprint. The NLX2G17 input and output structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage. The NLX2G17 can be used to enhance noise immunity or to square up slowly changing waveforms. http://onsemi.com MARKING DIAGRAMS Features 6 1 ULLGA6 1.2 x 1.0 CASE 613AE 1 OUT Y2 1 GND 2 5 VCC IN A2 3 4 OUT Y1 M M ULLGA6 1.45 x 1.0 CASE 613AF K 1 IN A1 ULLGA6 1.0 x 1.0 CASE 613AD K High Speed: tPD = 3.1 ns (Typ) @ VCC = 5.0 V Designed for 1.65 V to 5.5 V VCC Operation Low Power Dissipation: ICC = 1 mA (Max) at TA = 25C 24 mA Balanced Output Source and Sink Capability Balanced Propagation Delays Overvoltage Tolerant (OVT) Input and Output Pins Ultra-Small Packages These are Pb-Free Devices K * * * * * * * * UDFN6 1.0 x 1.0 CASE 517BX XM UDFN6 1.2 x 1.0 CASE 517AA XM UDFN6 1.45 x 1.0 CASE 517AQ XM M 1 Figure 1. Pinout (Top View) IN A1 1 IN A2 1 1 OUT Y2 1 OUT Y2 K M Figure 2. Logic Symbol PIN ASSIGNMENT 1 A L H GND 3 IN A2 Y 4 OUT Y2 L H 5 VCC 6 OUT Y1 (c) Semiconductor Components Industries, LLC, 2012 January, 2012 - Rev. 1 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. IN A1 2 FUNCTION TABLE = Device Marking = Date Code 1 Publication Order Number: NLX2G17/D NLX2G17 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage -0.5 to +7.0 V VIN DC Input Voltage -0.5 to +7.0 V DC Output Voltage -0.5 to +7.0 V VIN < GND -50 mA VOUT < GND -50 mA VOUT Parameter IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Source/Sink Current 50 mA ICC DC Supply Current Per Supply Pin 100 mA IGND DC Ground Current per Ground Pin 100 mA TSTG Storage Temperature Range -65 to +150 C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 C TJ Junction Temperature Under Bias 150 C MSL FR ILATCHUP Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V-0 @ 0.125 in Latchup Performance Above VCC and Below GND at 125 C (Note 5) mA 500 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA/JESD22-A114-A. 3. Tested to EIA/UESD22-A115-A. 4. Tested to JESD22-C101-A. 5. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 1.65 5.5 V VCC Positive DC Supply Voltage VIN Digital Input Voltage 0 5.5 V Output Voltage 0 5.5 V -55 +125 C 0 0 0 No Limit No Limit No Limit ns/V VOUT TA Operating Free-Air Temperature Dt/DV Input Transition Rise or Fall Rate VCC = 2.5 V 0.2 V VCC = 3.3 V 0.3 V VCC = 5.0 V 0.5 V http://onsemi.com 2 NLX2G17 DC ELECTRICAL CHARACTERISTICS TA = +855C TA = 25 5C TA = -555C to +1255C VCC (V) Min Typ Max Min Max Min Max Unit Positive Threshold Voltage 1.65 2.3 2.7 3.0 4.5 5.5 0.6 1.0 1.2 1.3 1.9 2.2 1.0 1.5 1.7 1.9 2.7 3.3 1.4 1.8 2.0 2.2 3.1 3.6 0.6 1.0 1.2 1.3 1.9 2.2 1.4 1.8 2.0 2.2 3.1 3.6 0.6 1.0 1.2 1.3 1.9 2.2 1.4 1.8 2.0 2.2 3.1 3.6 V VT- Negative Threshold Voltage 1.65 2.3 2.7 3.0 4.5 5.5 0.2 0.4 0.5 0.6 1.0 1.2 0.5 0.75 0.87 1.0 1.5 1.9 0.8 1.15 1.4 1.5 2.0 2.3 0.2 0.4 0.5 0.6 1.0 1.2 0.8 1.15 1.4 1.5 2.0 2.3 0.2 0.4 0.5 0.6 1.0 1.2 0.8 1.15 1.4 1.5 2.0 2.3 V VH Low-Level Input Voltage 1.65 2.3 2.7 3.0 4.5 5.5 0.1 0.25 0.3 0.4 0.6 0.7 0.48 0.75 0.83 0.93 1.2 1.4 0.9 1.1 1.15 1.2 1.5 1.7 0.1 0.25 0.3 0.4 0.6 0.7 0.9 1.1 1.15 1.2 1.5 1.7 0.1 0.25 0.3 0.4 0.6 0.7 0.9 1.1 1.15 1.2 1.5 1.7 V 1.65 - 5.5 VCC - 0.1 VCC VCC - 0.1 VCC - 0.1 1.65 2.3 2.7 3.0 3.0 4.5 1.29 1.9 2.2 2.4 2.3 3.8 1.52 2.1 2.4 2.7 2.5 4.0 1.29 1.9 2.2 2.4 2.3 3.8 1.29 1.9 2.2 2.4 2.3 3.8 Symbol Parameter VT+ VOH VOL IIN High- Level Output Voltage Low-Level Output Voltage Conditions VIN w VT+MAX IOH = -100 mA VIN w VT+MAX IOH = -4 mA IOH = -8 mA IOH = -12 mA IOH = -16 mA IOH = -24 mA IOH = -32 mA VIN v VT-MIN IOL = 100 mA VIN v VT-MIN IOH = 4 mA IOH = 8 mA IOH = 12 mA IOH = 16 mA IOH = 24 mA IOH = 32 mA Input Leakage Current 0 v VIN v 5.5 V IOFF Power-Off Output Leakage Current VOUT = 5.5 V ICC Quiescent Supply Current 0 v VIN v VCC V V 1.65 - 5.5 0 0.1 0.1 0.1 1.65 2.3 2.7 3.0 3.0 4.5 0.08 0.2 0.22 0.28 0.38 0.42 0.24 0.3 0.4 0.4 0.55 0.55 0.24 0.3 0.4 0.4 0.55 0.55 0.24 0.3 0.4 0.4 0.55 0.55 0 to 5.5 0.1 1.0 1.0 mA 0 1.0 10 10 mA 5.5 1.0 10 10 mA http://onsemi.com 3 NLX2G17 AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 nS) Symbol tPLH, tPHL Parameter Propagation Delay Input A to Output VCC (V) Test Condition 1.65 TA = -555C to +1255C TA = 25 5C Min Typ Max Min Max Unit RL = 1 MW, CL = 15 pF 2.0 9.1 15 2.0 15.6 ns 1.8 RL = 1 MW, CL = 15 pF 2.0 7.6 12.5 2.0 13 2.3-2.7 RL = 1 MW, CL = 15 pF 1.0 5.0 9.0 1.0 9.5 3.0-3.6 RL = 1 MW, CL = 15 pF 1.0 3.7 6.3 1.0 6.5 RL = 500 W, CL = 50 pF 1.5 4.4 7.2 1.5 7.5 RL = 1 MW, CL = 15 pF 0.5 3.1 5.2 0.5 5.5 RL = 500 W, CL = 50 pF 0.8 3.7 5.9 0.8 6.2 4.5-5.5 CIN Input Capacitance 5.5 VIN = 0 V or VCC 7.0 pF CPD Power Dissipation Capacitance (Note 6) 3.3 5.5 10 MHz VIN = 0 V or VCC 9.0 11 pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without load. Average operating current can be obtained by the equation ICC(OPR) = CPD * VCC * fin + ICC. CPD is used to determine the no-load dynamic power consumption: PD = CPD * VCC2 * fin + ICC * VCC. A or B VCC 50% GND tPLH Y tPHL 50% VCC Figure 3. Switching Waveforms VCC PULSE GENERATOR DUT RT CL RT = ZOUT of pulse generator (typically 50 W) Figure 4. Test Circuit http://onsemi.com 4 RL NLX2G17 VT, TYPICAL INPUT THRESHOLD VOLTAGE (V) 4 3 (VT+) 2 VHtyp (VT-) 1 2 2.5 3 3.5 3.6 VCC, POWER SUPPLY VOLTAGE (V) VHtyp = (VT + typ) - (VT - typ) Figure 5. Typical Input Threshold, VT+, VT- versus Power Supply Voltage VH VCC VT+ VT- VIN VCC VH VT+ VT- VIN GND GND VOH VOH VOUT Vout VOL VOL (a) A Schmitt-Trigger Squares Up Inputs With Slow Rise and Fall Times (b) A Schmitt-Trigger Offers Maximum Noise Immunity Figure 6. Typical Schmitt-Trigger Applications ORDERING INFORMATION Package Shipping NLX2G17AMX1TCG ULLGA6, 1.45 x 1.0, 0.5P (Pb-Free) 3000 / Tape & Reel NLX2G17BMX1TCG ULLGA6, 1.2 x 1.0, 0.4P (Pb-Free) 3000 / Tape & Reel NLX2G17CMX1TCG ULLGA6, 1.0 x 1.0, 0.35P (Pb-Free) 3000 / Tape & Reel NLX2G17MUTCG UDFN6, 1.2 x 1.0, 0.4P (Pb-Free) 3000 / Tape & Reel NLX2G17AMUTCG UDFN6, 1.45 x 1.0, 0.5P (Pb-Free) 3000 / Tape & Reel NLX2G17CMUTCG UDFN6, 1.0 x 1.0, 0.35P (Pb-Free) 3000 / Tape & Reel Device For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 NLX2G17 PACKAGE DIMENSIONS UDFN6 1.2x1.0, 0.4P CASE 517AA ISSUE O EDGE OF PACKAGE PIN ONE REFERENCE 2X 0.10 C EE EE EE L1 E DETAIL A Bottom View (Optional) TOP VIEW 2X EXPOSED Cu 0.10 C (A3) 0.10 C A1 A 10X 0.08 C EEE EEE 5X A3 DETAIL B Side View (Optional) MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.30 0.40 0.00 0.15 0.40 0.50 MOUNTING FOOTPRINT* 6X C A1 DIM A A1 A3 b D E e L L1 L2 MOLD CMPD SEATING PLANE SIDE VIEW 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B D 6X 0.42 0.22 L 3 L2 6X b 0.10 C A B 0.05 C 6 0.40 PITCH 4 e NOTE 3 1.07 DIMENSIONS: MILLIMETERS BOTTOM VIEW *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 NLX2G17 PACKAGE DIMENSIONS UDFN6 1.45x1.0, 0.5P CASE 517AQ ISSUE O A B D PIN ONE REFERENCE 0.10 C L1 EEE EEE DETAIL A E OPTIONAL CONSTRUCTIONS DETAIL B A1 SIDE VIEW MOLD CMPD OPTIONAL CONSTRUCTIONS A 0.05 C DIM A A1 A2 b D E e L L1 DETAIL B 0.05 C 6X A2 6X C 6X SEATING PLANE 0.30 PACKAGE OUTLINE L 1.24 3 1 DETAIL A 6X 0.53 4 BOTTOM VIEW MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.07 REF 0.20 0.30 1.45 BSC 1.00 BSC 0.50 BSC 0.30 0.40 --- 0.15 MOUNTING FOOTPRINT e 6 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. EE EE EXPOSED Cu TOP VIEW 0.10 C L L 6X 0.50 PITCH DIMENSIONS: MILLIMETERS b 0.10 C A B 0.05 C 1 NOTE 3 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 NLX2G17 PACKAGE DIMENSIONS UDFN6 1.0x1.0, 0.35P CASE 517BX ISSUE O PIN ONE REFERENCE 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D EEE EEE EEE E 0.10 C 2X 0.10 C DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.12 0.22 1.00 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 0.05 C SIDE VIEW A1 C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 5X e 5X 0.48 L 6X 0.22 3 1 L1 1.18 6 4 BOTTOM VIEW 6X b 0.10 M C A B 0.05 M C 0.53 1 PKG OUTLINE NOTE 3 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 NLX2G17 PACKAGE DIMENSIONS ULLGA6 1.0x1.0, 0.35P CASE 613AD ISSUE A PIN ONE REFERENCE 0.10 C EE EE EE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D E DIM A A1 b D E e L L1 TOP VIEW 0.05 C A 6X 0.05 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* SEATING PLANE SIDE VIEW C A1 e 5X L MILLIMETERS MIN MAX --- 0.40 0.00 0.05 0.12 0.22 1.00 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 5X 0.48 NOTE 4 3 1 1.18 L1 0.53 6 4 6X 1 PKG OUTLINE b 0.05 C 0.35 PITCH DIMENSIONS: MILLIMETERS 0.10 C A B BOTTOM VIEW 6X 0.22 *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 http://onsemi.com 9 NLX2G17 PACKAGE DIMENSIONS ULLGA6 1.2x1.0, 0.4P CASE 613AE ISSUE A PIN ONE REFERENCE 0.10 C EE EE EE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D E DIM A A1 b D E e L L1 TOP VIEW 0.05 C A 6X 0.05 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* SEATING PLANE SIDE VIEW C A1 e 5X L MILLIMETERS MIN MAX --- 0.40 0.00 0.05 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.25 0.35 0.35 0.45 5X 0.49 NOTE 4 3 1 1.24 L1 0.53 6 4 6X b 0.10 C A B BOTTOM VIEW 6X 0.26 0.05 C NOTE 3 1 PKG OUTLINE 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 10 NLX2G17 PACKAGE DIMENSIONS ULLGA6 1.45x1.0, 0.5P CASE 613AF ISSUE A PIN ONE REFERENCE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D EEE EEE EEE E DIM A A1 b D E e L L1 TOP VIEW 0.10 C 0.05 C A 6X 0.05 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* SEATING PLANE SIDE VIEW 5X C A1 e 5X L MILLIMETERS MIN MAX --- 0.40 0.00 0.05 0.15 0.25 1.45 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 0.49 NOTE 4 3 1 1.24 L1 0.53 6 4 BOTTOM VIEW 6X 0.30 6X b 0.10 C A B 0.05 C 1 PKG OUTLINE 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5817-1050 http://onsemi.com 11 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NLX2G17/D