Application Note, V1.2, Aug. 2009 AN2008-02 2ED100E12-F2_EVAL 6ED100E12-F2_EVAL Evaluation Driver Board for EconoDUALTM3 and EconoPACKTM+ modules Industrial Power Edition 2009-11-02 Published by Infineon Technologies AG 59568 Warstein, Germany (c) Infineon Technologies AG 2009. All Rights Reserved. LEGAL DISCLAIMER THE INFORMATION GIVEN IN THIS APPLICATION NOTE IS GIVEN AS A HINT FOR THE IMPLEMENTATION OF THE INFINEON TECHNOLOGIES COMPONENT ONLY AND SHALL NOT BE REGARDED AS ANY DESCRIPTION OR WARRANTY OF A CERTAIN FUNCTIONALITY, CONDITION OR QUALITY OF THE INFINEON TECHNOLOGIES COMPONENT. THE RECIPIENT OF THIS APPLICATION NOTE MUST VERIFY ANY FUNCTION DESCRIBED HEREIN IN THE REAL APPLICATION. INFINEON TECHNOLOGIES HEREBY DISCLAIMS ANY AND ALL WARRANTIES AND LIABILITIES OF ANY KIND (INCLUDING WITHOUT LIMITATION WARRANTIES OF NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS OF ANY THIRD PARTY) WITH RESPECT TO ANY AND ALL INFORMATION GIVEN IN THIS APPLICATION NOTE. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ AN2008-02 Revision History: Previous Version: general general general general Page 7 Page 16 Page 17 Page 40 2009-08 V1.2 V1.1 Improved driver stage for higher gate current to adapt for IGBT4 (2ED100E12-F2) Improved protection against disturbances on DESAT-signal (2ED100E12-F2) Providing data for increased portofolio of modules to be used with 2ED100E12-F2 Update of measurement results (modules using IGBT4) Update with recent data from 1ED020I12-F datasheet More detailed text on baseplate temperature measurement Discussing parameters having impact on switching losses References Authors: Alain Siani IFAG IMM INP TM, Uwe Jansen IFAG IMM INP TM We Listen to Your Comments Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to: IGBT.Application@infineon.com Application Note 3 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Introduction 1 Introduction ...................................................................................................................................5 2 2.1 2.2 2.3 2.4 2.5 Design features .............................................................................................................................6 Main features ..................................................................................................................................6 Key data ..........................................................................................................................................7 Pin assignment................................................................................................................................8 Mechanical dimensions of the EconoDUALTM3 Driver Board.........................................................9 Mechanical dimensions of the EconoPACKTM+ Driver Board ........................................................9 3 3.1 3.2 3.3 3.4 3.5 3.6 3.7 Application Note..........................................................................................................................10 Power Supply ................................................................................................................................10 Input logic - PWM signals.............................................................................................................10 Maximum switching frequency ......................................................................................................11 Booster ..........................................................................................................................................12 Short circuit protection and clamp function ...................................................................................12 Fault output ...................................................................................................................................14 Temperature measurement...........................................................................................................15 4 4.1 4.2 Switching losses .........................................................................................................................17 Turn-on losses ..............................................................................................................................17 Turn-off losses ..............................................................................................................................18 5 Definition of layers for Evaluation Driver Boards....................................................................19 6 6.1 6.2 6.3 6.4 6.5 Schematic, Layout and Bill of Material EconoDUALTM3 board ..............................................20 Schematic......................................................................................................................................20 Assembly drawing .........................................................................................................................23 Layout............................................................................................................................................24 Bill of Material................................................................................................................................25 Gate resistor list ............................................................................................................................26 7 7.1 7.2 7.3 7.4 7.5 Schematic, Layout and Bill of Material EconoPACKTM+ board ..............................................27 Schematic......................................................................................................................................27 Assembly drawing .........................................................................................................................34 Layout............................................................................................................................................35 Bill of material................................................................................................................................37 Gate resistor list ............................................................................................................................39 8 How to order Evaluation Driver Boards....................................................................................39 9 References ...................................................................................................................................40 Part number explanation: 2ED 100 E12 - F2 F - Functional isolation 12 - Suitable up to 1200 V IGBTs Evaluationboard 100 - 10 A output driver 2ED - 2 channel driver Application Note 4 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Introduction 1 Introduction The Evaluation Driver Board 2ED100E12-F2 for EconoDUALTM3 modules as can be seen in Figure 1 and the Evaluation Driver Board 6ED100E12-F2 for EconoPACKTM+ modules, shown in Figure 2, were developed to support customers during their first steps designing applications with these modules. The basic version of each board is available from Infineon in small quantities. The properties of these parts are described in the chapter 2.2 of this document whereas the remaining paragraphs provide information intended to enable the customer to copy, modify and qualify the design for production, according to his specific requirements. The design of the 2ED100E12-F2 and the 6ED100E12-F2 was performed with respect to the environmental conditions described as design target in this document. The requirements for leadfree reflow soldering have been considered when components were selected. The design was tested as described in this documentation but not qualified regarding manufacturing and operation in the whole operating ambient temperature range or lifetime. The boards provided by Infineon are subjected to functional testing only. Due to their purpose Evaluation Boards are not subjected to the same procedures regarding Returned Material Analysis (RMA), Process Change Notification (PCN) and Product Discontinuation (PD) as regular products. See Legal Disclaimer and Warnings for further restrictions on Infineons warranty and liability. SAP number for EconoDUALTM3 Evaluation Driver Board: 31165 Figure 1 The 2ED100E12-F2 Evaluation Driver Board mounted on the top of the EconoDUALTM3 module Application Note 5 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Design features The following picture shows the driver board mounted on an EconoPACKTM+ module. SAP number for EconoPACKTM+ Evaluation Driver Board: 31166 Figure 2 The 6ED100E12-F2 Evaluation Driver Board mounted on the top of the EconoPACKTM+ module 2 Design features The following sections provide an overview of the boards including main features, key data, pin assignments and mechanical dimensions. 2.1 Main features The 2ED100E12-F2 and the 6ED100E12-F2 Evaluation Driver Board offers the following features: * * * * * * * * * * Dual channel IGBT driver in 2ED100E12-F2 version, adapted for use with IGBT4 Six channel IGBT driver in 6ED100E12-F2 version Electrically and mechanically suitable for 600 V and 1200 V EconoDUALTM3 or EconoPACKTM+ IGBT modules Includes DC/DC power supply with short circuit protection Isolated temperature measurement Short circuit protection with toff < 6 s Under Voltage Lockout of IGBT driver IC Positive logic with 5 V CMOS level for PWM and Fault signals One fault output signal for each leg PCB is designed to fulfil the requirements of IEC61800-5-1, pollution degree 2, overvoltage category III Application Note 6 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Design features 2.2 Key data All values given in the table bellow are typical values, measured at TA = 25 C Table 1 Key data and characteristic values (typical values) Parameter VDC - primary DC/DC voltage supply VCC - primary supply voltage for logic devices VLogicIN - PWM signals for Top and Bottom IGBT (active high) VFAULT - /FAULT detection output (active low) IFAULT - max. /FAULT detection output load current VRST - /RST input (active low) IDC - primary DC/DC current drawn (idle mode) per leg ICC - primary current drawn for logic devices per leg Vout - drive voltage level for Top and Bottom channel IG - max. peak output current PDC/DC - max. DC/DC output power (Top channel + Bottom channel) per leg fS - max. PWM signal frequency for Top and Bottom channel1) tPDELAY - propagation delay time ta - Two-level turn-off time tPDISTO - input to output propagation distortion tMININ - min. pulse suppression for turn-on and turn-off2) VDesat - Desaturation reference level dmax - max. duty cycle VCES - max. collector - emitter voltage on IGBT VTEMP - temperature measurement output voltage ITEMP - max. temperature measurement load current Top - operating temperature (design target)3) Tsto - storage temperature (design target) Uis,eff - Isolation voltage4) (Transformer Vacuumschmelze) VIORM - Maximum Repetitive Insulation Voltage5) (1ED020I12-F Driver IC) VIORM - Max. working insulation voltage6) (AD7400 Sigma-Delta Converter) 1) Value +15 (0.5) +5 (0.5) 0 / +5 0 / +5 10 0 / +5 40 25 +16 / -8 10 3 100 200 n.a. 15 n.a. 9 100 600/1200 digital 0/5 5 -40...+85 -40...+85 500 1420 891 Unit V V V V mA V mA mA V A W kHz ns ns ns ns V % V V mA C C VAC Vpeak Vpeak The maximum switching frequency for every EconoDUALTM3 or EconoPACKTM+ module type should be calculated separately. Limitation factors are: max. DC/DC output power of 1.5 W per channel and max. PCB board temperature measured around gate resistors of 105 C for used FR4 material. For detailed information see chapter 2.3 2) Minimum value tMININ given in 1ED020I12-F IGBT driver datasheet 3) Maximum ambient temperature strictly depends on load and cooling conditions. For detailed description see chapter 2.3 4) Values defined in datasheets: T60403-D4615-X054 (date: 21.03.2000), 5) 1ED020I12-F (Datasheet, Version 2.1, October 2008) 6) AD7400 (9/07 - Revision B) Application Note 7 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Design features 2.3 Pin assignment All external signals should be applied to connector X1 to X3, they are shown on Figure 3 and the description is given in Table 2. Table 2 Inputs and outputs of 6ED100E12-F2 for connector X3 Pin Label X3.1 X3.2 X3.3 X3.4 X3.5 X3.6 X3.7 X3.8 X3.9 X3.10 X3.11 X3.12 X3.13 X3.14 X3.15 X3.16 MClock Supply GND Supply TOP INTOP IN+ TOP RDY TOP /FLT TOP/BOT /RST BOT /FLT BOT RDY BOT INBOT IN+ TEMP-Digital +5V Signal GND Figure 3 Function Clock out for temperature measurement +15 V Primary voltage for DC/DC converter Primary ground for DC/DC converter supply voltage +15 V Primary voltage for DC/DC converter PWM signal for Top transistor, negative logic PWM signal for Top transistor, positive logic Ready signal for Top channel Fault detection output Top channel Reset signal for Top and Bottom IGBT-Driver Fault detection output Bottom channel Ready signal for Bottom channel PWM signal for Bottom transistor, negative logic PWM signal for Bottom transistor, positive logic Sigma / Delta signal for temperature measurement +5 V Voltage supply for logic devices Primary ground logic devices The 6ED100E12-F2 Evaluation Driver Board pin assignment for the third leg Connectors X1 and X2 of the EconoPACKTM+ board have the same pinning as connector X3 except temperature measurement. Connector X3 of EconoPACKTM+ driver board has the same pin assignment as connector X1 of the EconoDUALTM3 driver board. Application Note 8 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Design features 2.4 Mechanical dimensions of the EconoDUALTM3 Driver Board SAP number to order Evaluation Driver Board for EconoDUALTM3 modules: 31165 max. 17 mm max. 19 mm 2 1 62 mm 5 6 7 8 9 99 mm Figure 4 Dimensions of the 2ED100E12-F2 Driver Board 2.5 Mechanical dimensions of the EconoPACKTM+ Driver Board SAP number to order Evaluation Driver Board for EconoPACKTM+ modules: 31166 max. 17 mm max. 19 mm 15 20 25 16 17 21 22 26 27 99 mm 18 19 13 14 X 23 24 X 28 29 X 161 mm Figure 5 Dimensions of the 6ED100E12-F2 Driver Board Application Note 9 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Application Note Both Driver Boards should be fastened by self taping screws and soldered to the auxiliary connectors on top of the IGBT module. Clearance and creepage distances for EconoDUALTM3 and EconoPACKTM+ Driver Boards: Primary/Secondary is not less than 8 mm and Secondary/Secondary is not less than 4 mm. 3 Application Note The following chapter describes the boards operation in evaluation setup. Please note that the following paragraphs describe the circuits of the 2ED100E12-F2 which has been modified (compared to the last revision of this AN) to drive IGBT4 modules and to reduce the susceptibility to erroneous triggering of the Vcesat-detection. Same changes may also be applied to the 6ED100E12-12-F2, but layout and part list of this board provided in chapter 7 still represent the initial design. 3.1 Power Supply The 2ED100E12-F2 and the 6ED100E12-F2 have an integrated DC/DC converter for each leg, which generates the required secondary isolated unsymmetrical supply voltage of +16 V / -8 V. Top and Bottom driver voltages are independently generated by using one unipolar input voltage of 15 V. Additionally, the power supply is protected against gate - emitter short circuit of the IGBTs. In case of DC/DC converter overload, the output voltage drops. This Under Voltage Detection function insures gate voltages within specified range. The fault is reported to the driver's primary side. 3.2 Input logic - PWM signals The Evaluation Driver Boards are dedicated for a half-bridge EconoDUALTM3 and sixpack EconoPACKTM+ IGBT configuration, therefore it is necessary to connect two separate PWM signals or 6 separate PWM signals. Individual signals for Top and Bottom IGBT are necessary if there is a half-bridge module or rather 6 dedicated signals if there is a sixpack module. The schematic for a single driver is depicted in Figure 6. The signals need to have the correct dead time. Both Evaluation Driver Boards do not provide automatic dead time generation and recommended minimum dead time tTD is 1 s, provided gate resistors like suggested in tables 5 and 7 are used. If larger gate resistors are used please refer to [1]. Figure 6 Schematic detail of the input circuit for a single driver. The schematic in Figure 6 shows driver circuit with positive logic. IN+ is used as signal input whereas IN- is used as enable signal. Therefore a +5 V signal on the IN+ input pin and a GND signal on the IN- input pin is necessary to switch on the IGBT. To operate the whole circuit with negative logic the capacitors on the input pins have to be exchanged. Otherwise this would cause an additional delay. IN+ will then operate as an enable signal. Application Note 10 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Application Note 3.3 Maximum switching frequency The IGBT switching frequency is limited by the available power and by PCB temperature. According to theory the power losses generated in gate resistors are a function of gate charge, voltage step at the driver output and switching frequency. The energy is dissipated mainly through the PCB and raises the temperature around the gate resistors. When the available power of the DC/DC converter is not exceeded, the limiting factor for the switching frequency is the absolute maximum temperature for the FR4 material. The allowed operation temperature is 105 C. Generally the power losses generated in the gate resistors can be calculated according to formula (1): Pdis = PRgext + PRg int = Vout fs Qge (1) In this formula f s resembles the switching frequency, Vout represents the voltage step at the driver output Pdis is the dissipated power, Qge is the IGBT gate charge value corresponding to -8/+16V operation. This value can be approximately calculated from the datasheet value by multiplying by 0.8. Most of the losses are shared between the internal - PRg int and the external - PRgext gate resistors. Negligible losses are also in the driver IC itself. Due to the PCB temperature criteria the power dissipated in external gate resistors PR gext is to be considerd for the thermal design. Temperatures can be calculated takeing relevant thermal resistances of this part of the board into account. Based on experimentally determined board temperatures the following thermal resistances have been calculated using an equivalent circuit diagram as given in Figure 7: Gate resistors to baseplate: RthB-G = 45 K/W Gate resistors to ambient: RthR-A = 39 K/W TBASE IGBT RthB-G PCB TG PRgext PRgext RthR-A TA Figure 7 RthB-G RthB -G * (TBASE - TA ) RthR - A + RthB -G RthR-A AIR Thermal equivalent circuit Application Note 11 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Application Note Using these values and the equivalent circuit, it is possible to determine the maximum board temperature, if the power losses of the external gate resistors, the maximum ambient temperature and the maximum baseplate temperature are known: TG = TA + RthB - G * (TBASE - TA ) R *R + PRgext * thR - A thB - G RthR - A + RthB - G RthR - A + RthB - G The maximum switching frequency will be determined when either the maximum allowable board temperature has been reached (105C) or when the limit of power transmission of the DC/DC converter (1.5 W per channel) is exceeded. 3.4 Booster Two complementary pairs of transistors are used to amplify the driver ICs signal. This allows driving IGBTs that need more current than the driver IC can deliver. Two NPN transistors are used for switching the IGBT on and two PNP transistors for switching the IGBT off. Resistors in the individual base connections ensure proper parallel operation. The transistors are dimensioned to have enough peak current to drive all 600 V and 1200 V EconoDUALTM3 and EconoPACKTM+ modules. Peak current can be calculated like in formula (2): I peak = Figure 8 RGint Vout + RGext + RDriver (2) Booster Gate resistors are connected in between booster stage and IGBT module gate connection. Suggested values are provided in tables 5 and 7. For some modules the value for these resistors is 0 Ohm. In this case just a jumper is required. If resistors are needed ensure that these resistors have a suitable rating for repetitive pulse power to avoid degradation. 3.5 Short circuit protection and clamp function The short circuit protection of the Evaluation Driver Board basically relies on the detection of a voltage level higher as 9 V on the DESAT pin of the 1ED020I12-F driver IC and the implemented active clamp function. Thanks to this operation mode, the collector-emitter overvoltage, which is a result of the stray inductance and Application Note 12 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Application Note the collector current slope, is limited. Depending on the stray inductance, the current and the DC voltage the overvoltage shoot during turn off changes. Figure 9 shows the parts of the circuit needed for the desaturation function and the active clamping function. Figure 9 Desaturation protection and active clamping diodes In case of a short circuit the saturation voltage U GE will rise and the driver detects that there is a short circuit. The IGBT has to be switched off. There will be an overvoltage shoot due to the stray inductance of the module and the DC-Link. This overvoltage shoot has to be lower than the maximum IGBT blocking voltage. Therefore the evaluation driver board contains an active clamping function whereby the clamping will raise the voltage for the booster and also raise the voltage directly on the gate. The typical turn-off waveform under short circuit condition and room temperature of a FF450R12ME4 module without any additional function is shown in Figure 10a.Typical waveform under short circuit condition with active clamp function is shown in 10b at room temperature. UGE UGE IC UCE UCE b) a) Figure 10 IC a) Short circuit without active clamp b) with active clamp function Application Note 13 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Application Note 3.6 Fault output When a short circuit occurs, the voltage UCE is detected by the desaturation protection of the 1ED020I12-F and the IGBT is switched off. The fault is reported to the primary side of the driver as long as there is no reset signal applied to the driver. The /FAULT signal is active low, the according schematic can be seen in Figure 11. Figure 11 /Fault output for a single driver Short circuit occurs Ready signal Fault signal UGE b) a) Figure 12 /Fault output during: a) normal operation b) operation under short circuit The fault signal will be in low state in case of a short circuit until /RST is pulled down. Application Note 14 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Application Note 3.7 Temperature measurement Based on the NTC built into both module types, the Driver Board offers IGBT base plate temperature measurement in the range of -40 C...150 C. The Evaluation driver boards work with a Sigma/Delta converter. Thus a digital signal is provided. This has the advantage that a normal I/O Pin on the microcontroller can be used and that the subsequent error is low. However an analog signal can be produced with the use of the following schematic. Figure 13 Schematic to convert digital / to analog output Table 3 Bill of Material / to analog converter Type Qty Value / Device Package size imperal Part Name Capacitor Capacitor Capacitor Capacitor 1 1 1 1 100n/50V/X7R 1n/50V/C0G 10n/50V/X7R 100p/50V/C0G C0603 C0603 C0603 C0603 C1 C2 C3 C4 Amplifier Resistor Resistor Resistor Resistor 1 2 2 2 1 AD8542ARZ 39k 100k 22k 10R SOIC08 R0603 R0603 R0603 R0603 IC1 R1, R5 R2, R6 R3, R4 R7 Recommended Manufacturer Assembled Analog Devices The bill of material not only includes a part list, but also assembly notes. All electronic parts used in the design are lead-free with 260 C soldering profile. The tolerances for resistors should be less or equal 1 %, for capacitors of the type C0G less or equal 5 % and for capacitors of the type X7R less or equal 10 % Application Note 15 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Switching losses Using the baseplate temperature and a thermal model the junction temperature can be estimated. The complexity of the thermal model needed for this purpose depends on application and heatsinking conditions as well as on requirements on accuracy and dynamic response. In case of a broken wire the output switches down to 0 V. Output voltage vs. baseplate temperature is shown in Figure 14, assuming that the circuit according to Figure 12 is used to convert the digital signal to an analog signal. Temperature Measurement VTEMP=f(TJ) 6 5 V TEMP [V] 4 3 2 1 0 -50 -30 -10 10 30 50 70 90 110 130 150 TJ [C] Figure 14 Characteristics of the temperature measurement Note: This temperature measurement is not suitable for short circuit detection or short term overload and may be used to protect the module from long term overload conditions or malfunction of the cooling system. Application Note 16 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Switching losses 4 Switching losses The setup used for preparing this application note varies from the setup used to characterize the devices in three aspects: DC-link inductance: The DC-link inductance of the setup used for these test is has a value of approximately 35 nH for all modules investigated here in contrast to varying values between 35 nH to 80 nH used for device characterization (see device datasheets for details). For a detailed discussion on the impact of DC-link inductance on switching losses please refer to [2]. Gate voltage: This Evaluation Board provides a gate voltage of -8 V for turning off and 16 V for turning on wheras charactization is done with a driver providing +/- 15 V of gate voltage. Gate driver output impedance: According to IEC 60747-9 for characterization of an IGBT the driver used should resemble an ideal voltage source as far as possible. For the Evaluation Board a driver output stage has been choosen that considers board space as well as cost constraints. Therefore it can not provide close to zero output impedance. All aspects discussed above have an impact on the switching speed of the module and hence also on the switching losses. Gate resistor values have been choosen so that di/dt at turn-on compareable to characterization has been achieved. Nevertheless small deviations in the turn-on losses persist. For the turnoff losses there is little impact of driving conditions for trench-fieldstop IGBTs like the ME3 and ME4 devices. For NPT IGBTs, like used in the MS4 modules, the considerations made for turn-on losses also apply for turn-off losses. 4.1 Turn-on losses The turn-on losses are expected to be close to the values of the datasheet of the modules. As an example the turn-on losses for an EconoDUALTM3 FF450R12ME3 as well as for a FF450R12ME4 module are shown in the following diagrams. FF450R12ME3 Sw itching losses, Eon= f(Uce,Ic) 160 140 Eon @ Tj = 25C Losses Eon [mJ] 120 400V Eon @ Tj = 125C 500V 600V 100 700V 800V 80 400V 500V 60 600V 700V 40 800V 20 0 0 100 200 300 400 500 600 700 800 900 1000 Current [A] a) Application Note 17 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Switching losses FF450R12ME4 Sw itching losses, Eon= f(Uce,Ic) 160 Eon @ Tj = 25C 400V Eon @ Tj = 125C 500V 600V 140 Eon @ Tj = 150C 700V Losses Eon [mJ] 120 800 400V 100 500V 600V 80 700V 800V 60 400V 500V 40 600V 700V 20 800V 0 0 100 200 300 400 500 600 700 800 900 1000 Current [A] b) Figure 15 Turn-on losses with a) FF450R12ME3 and b) FF450R12ME4 module 4.2 Turn-off losses In general the turn-off losses increase linear with the DC-Link voltage. In the case of the driver board it does not increase linear because the active clamping function increases the turn-off losses due to a decrease of the di/dt. FF450R12ME3 Sw itching losses, Eoff= f(Uce,Ic) 160 140 Eoff @ Tj = 25C Losses Eoff [mJ] 400V Eoff @ Tj = 125C 120 500V 600V 100 700V 800V 80 400V 500V 60 600V 700V 40 800V 20 0 0 100 200 300 400 500 600 700 800 900 1000 Current [A] a) Application Note 18 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Schematic, Layout and Bill of Material EconoDUALTM3 board FF450R12ME4 Sw itching losses, Eoff= f(Uce,Ic) 140 Eoff @ Tj = 25C 400V 500V Eoff @ Tj = 125C 120 600V Eoff @ Tj = 150C 700V 800V Losses Eoff [mJ] 100 400V 500V 80 600V 700V 60 800V 400V 40 500V 600V 20 800V 700V 0 0 100 200 300 400 500 600 700 800 900 1000 Current [A] b) Figure 16 Turn-off losses with a) FF450R12ME3 and b) FF450R12ME4 module All losses are measured according the IEC 60747-9 standard. Eon is the integration of U CE I C from 10% of I C and 2% U CE . For Eoff it is vice versa. Here it is the integration from 10% of U CE to 2% of I C . 5 Definition of layers for Evaluation Driver Boards Both driver boards were made keeping the following rules for the copper thickness and the space between different layers shown in Figure 17. Layers: Copper Isolation 1: 35 m / 1 oz. 1-2: 0.5 mm 2: 35 m / 1 oz. 2-3: 0.5 mm 3: 35 m / 1 oz. 3-4: 0.5 mm 4: 35 m / 1 oz. Figure 17 Copper and isolation for layers Application Note 19 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Schematic, Layout and Bill of Material EconoDUALTM3 board 6 Schematic, Layout and Bill of Material EconoDUALTM3 board To meet the individual customer requirement and make the Evaluation Driver Board for the EconoDUALTM3 module simple for development or modification, all necessary technical data like schematic, layout and components are included in this chapter. 6.1 Schematic Figure 18 IGBT driver - Top transistor Figure 19 IGBT driver - Bottom transistor Application Note 20 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Schematic, Layout and Bill of Material EconoDUALTM3 board Figure 20 IGBT driver - Gate resistors Figure 21 IGBT driver - Temperature measurement Application Note 21 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Schematic, Layout and Bill of Material EconoDUALTM3 board Figure 22 IGBT driver - DC/DC converter Figure 23 IGBT driver - External connection Application Note 22 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Schematic, Layout and Bill of Material EconoDUALTM3 board 6.2 Assembly drawing Figure 24 Assembly drawing of the EconoDUALTM3 driver board For detail information use the zoom function of your PDF viewer to zoom into the drawing. Application Note 23 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Schematic, Layout and Bill of Material EconoDUALTM3 board 6.3 Layout a) Figure 25 b) EconoDUALTM3 IGBT driver - a) Top layer and b) Layer 2 a) Figure 26 b) EconoDUALTM3 IGBT driver - a) Layer 3 and b) Bottom layer Application Note 24 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Schematic, Layout and Bill of Material EconoDUALTM3 board 6.4 Bill of Material The bill of material not only includes a part list, but also assembly notes. All electronic parts used in the design are lead-free with 260 C soldering profile. The external gate resistors are not assembled, a list for the resistor values is presented in chapter 6.5. The tolerances for resistors should be less or equal 1 %, for capacitors of the type C0G less or equal 5 % and for capacitors of the type X7R less or equal 10 %. Table 4 Bill of Material for EconoDUALTM3 Driver Board Type Qty Value / Device Package size imperal Part Name capacitor 4 100p/50V/C0G C0603 C1,C4,C10,C12 capacitor 9 100n/50V/X7R C0603 C1B, C1T, C4B, C4T, C3, C6, C8, C13, C18T capacitor capacitor 2 2 .../50V/C0G 470p/50V/X7R C0603 C0603 C1C,C2C C1R,C2R capacitor 5 10n/50V/X7R C0603 capacitor 19 47/25V/X7R C-EUC1206 capacitor capacitor capacitor capacitor connector diode diode diode Driver IC Half-Bridge Driver IC Shottky Diode Isolated SigmaDelta Modulator 2 2 3 2 1 2 4 2 2 220p/50V/C0G 33p/50V/C0G 1/25V/X7R optional/50V/C0G TYCO16POL STTH112U ES1D ZLLS1000 1ED020I12-F C0603 C0603 C0805 C0603 TYCO16POL SOD6 DO214AC SOT23 P-DSO-16 C2, C5, C15T, C16T, C17T C2B, C2T, C3B, C3T,C5B,C5T, C6B, C6T,C9B, C9T, C10B, C10T, C11B, C11T, C14T, C7, C14, C15, C16 C7B,C7T C8B,C8T C11,C12T,C13T CGE1,CGE2 X1 D5B,D5T D6,D7,D8,D9 D7B,D7T IC1,IC2 1 IR2085SPBF SO08 IC3 2 BAT165 SOD323R DB,DT 1 AD7400YRWZ P-DSO-16 IC5 BB, BT, BB1, BT3 BT2,R1L,R2L,R2L1 R1,R2,R7,R8 R1B,R1T,R1B2,R1T2 R1B1,R1T1 LED 2 resistor resistor resistor resistor resistor 4 4 4 4 2 27R 10R 100R 12R 220R CHIPLED0805 R0603 R0603 R0402 R0805 R0805 resistor 5 0R R0603 R1C,R1C1,R2C,R2C1, R8T resistor resistor resistor resistor resistor resistor 2 2 5 2 4 2 0R 1k 4k7 4R7 10k 39R R0402 R0603 R0402 R0603 R0402 R0805 R_FR1,R_FR2 R2B,R2T R3,R4,R9,R10,R_R R20,R21 R6,R12,R22,R23 R5,R11 resistor 8 variable R2010 R4B, R4T, R5B, R5T, R6B, R6T, R7B, R7T resistor resistor 1 1 1k2 820R R0603 R0603 R9T R10T Application Note Recommended Manufacturer Assembled Description no Murata no TYCO no Infineon International Rectifier Infineon no LED1, LED2 25 no Pulsresistor no no TT electronics Pulsresistor V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Schematic, Layout and Bill of Material EconoPACKTM+ board resistor resistor resistor resistor resistor resistor resistor 3 1 2 2 1 1 1 Schmitt-Trigger 1 2k2 270R 10R 15R 68k 0R15 39k SN74LVC1G17D BVR R0603 R0603 R1206 R0603 R0603 R0805 R0603 R11T,R13T,R17 R12T R13,R19 R15,R16 R14 R18 R25 SOT23-5 IC4 SC70-6L D2B,D2R,D2T,D3, D3B,D3T,D4,D4B, D4T,D5,D10,D11, D12,D13,D1, D1R,D2 IC7 D4615-X054 TR SOT23 SOT89 SOT89 SOT23 T1,T2 T1B, T1B1, T1T, T1T1 T2B, T2B1, T2T, T2T1 T3,T4 Vacuumschmelze Infineon Zetex Zetex philips P6SMB440A SMB D1.1C,D2.1C Vishay 2 P6SMB510A SMB D2.1C,D2.2C Vishay Zener diode 4 MM3Z5V6T1G SOD323-R D1.1B, D1.1T, D1.2B, D1.2T On Semiconductor Zener diode Zener diode 1 2 ZMR500FTA BZX84-C11 SOT23 SOT23 IC6 ZB,ZT Shottky Diode 17 BAT165 Shunt Regulator 1 Transformer 1 Transistor Transistor Transistor TrenchMOS Unipolar TVS Diode Unipolar TVS Diode 2 4 4 2 TLV431BIDCKT T60403-D4615X054 BC856 ZXTN2010Z ZXTP2012Z PMV45EN 2 SOD323R Infineon no 6.5 Gate resistor list Table 5 External gate resistors RGext are listed below, all packages are 2010 Module FF600R06ME3 FF150R12ME3G FF225R12ME3 FF225R12ME4 FF300R12ME3 FF300R12ME4 FF450R12ME3 FF450R12ME4 FF150R12MS4 FF225R12MS4 FF300R12MS4 Application Note RGon [] RGoff [] 2.0 5.6 1.5 0 1.1 0 1 1 5.1 3 1.5 1,25 3,7 0 0 0 0 0,25 0 3,2 1,5 0,5 R4T, R4B, R6T, R6B [] 2,5 7,5 0 0 0 0 0,5 0 6,2 3 1 26 no R5T, R5B, R7T, R7B [] 1,5 3,7 3 0 2,2 0 1,5 2 4 3 2 Assembled no no no no no no no no no no no V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Schematic, Layout and Bill of Material EconoPACKTM+ board 7 Schematic, Layout and Bill of Material EconoPACKTM+ board To meet the individual customer requirement and make the Evaluation Driver Board for the EconoPACKTM+ module a simple for development or modification, all necessary technical data like schematic, layout and components are included in this chapter. The tolerances for resistors should be less or equal 1 %, for capacitors of the type C0G less or equal 5 % and for capacitors of the type X7R less or equal 10 %. 7.1 Schematic Figure 27 IGBT driver - Top transistor of first leg Application Note 27 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Schematic, Layout and Bill of Material EconoPACKTM+ board Figure 28 IGBT driver - Bottom transistor of first leg Figure 29 DC/DC converter of first leg Application Note 28 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Schematic, Layout and Bill of Material EconoPACKTM+ board Figure 30 Gate resistors of first leg Figure 31 IGBT driver - Top transistor of second leg Application Note 29 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Schematic, Layout and Bill of Material EconoPACKTM+ board Figure 32 IGBT driver - Bottom transistor of second leg Figure 33 DC/DC converter of second leg Application Note 30 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Schematic, Layout and Bill of Material EconoPACKTM+ board Figure 34 Gate resistors of second leg Figure 35 IGBT driver - Top transistor of third leg Application Note 31 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Schematic, Layout and Bill of Material EconoPACKTM+ board Figure 36 IGBT driver - Bottom transistor of third leg Figure 37 DC/DC converter of third leg Application Note 32 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Schematic, Layout and Bill of Material EconoPACKTM+ board Figure 38 Gate resistors of third leg Figure 39 Temperatur measurement Figure 40 Connectors Application Note 33 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Schematic, Layout and Bill of Material EconoPACKTM+ board 7.2 Assembly drawing Figure 41 Assembly drawing of the EconoPACKTM+ driver board For detail information use the zoom function of your PDF viewer to zoom into the drawing. Application Note 34 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Schematic, Layout and Bill of Material EconoPACKTM+ board 7.3 Layout Figure 42 EconoPACKTM+ IGBT driver - Top layer Figure 43 EconoPACKTM+ IGBT driver - Layer 2 Application Note 35 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Schematic, Layout and Bill of Material EconoPACKTM+ board Figure 44 EconoPACKTM+ IGBT driver - Layer 3 Figure 45 EconoPACKTM+ IGBT driver - Bottom Layer 4 Application Note 36 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Schematic, Layout and Bill of Material EconoPACKTM+ board 7.4 Bill of material The bill of material not only includes a part list, but also assembly notes. All electronic parts used in the design are lead-free with 260 C soldering profile. The external gate resistors are not assembled, a list for the resistor values is presented in chapter 7.5. Table 6 Bill of Material for EconoPACKTM+ Driver Board Type Qty Value / Device Package size imperal Part Name Capacitor 6 .../50V/C0G C0603 Capacitor 9 10n/50V/X7R C0603 Capacitor 6 33p/50V/C0G C0603 Capacitor 23 100n/50V/X7R C0603 Capacitor 12 100p/50V/C0G C0603 Capacitor 6 220p/50V/C0G C0603 Capacitor 6 470p/50V/X7R C0603 Capacitor 6 optional/50V/C0G C0603 Capacitor 5 1/25V/X7R C0805 Capacitor 55 47/25V/X7R C1206 Transformer 3 T60403- D4615-X054 C1C, C2C, C3C, C4C, C5C, C6C C2, C5, C18, C21, C34, C37, C40T, C41T, C42T C8B, C8T, C20B, C20T, C32B, C32T C1B, C1T, C3, C4B, C4T, C6, C13, C13B, C13T, C16B, C16T, C19, C22, C25B, C25T, C28B, C28T, C29, C35, C38, C43T, C45, C49 C1, C4, C10, C12, C17, C20, C26, C28, C33, C36, C42, C44 C7B, C7T, C19B, C19T, C31B, C31T C1R, C2R, C3R, C4R, C5R, C6R CGE1, CGE2, CGE3, CGE4, CGE5, CGE6 C11, C27, C37T, C38T, C43 C2B, C2T, C3B, C3T, C5B, C5T, C6B, C6T, C7, C9B, C9T, C10B, C10T, C11B, C11T, C14, C14B, C14T, C15, C15B, C15T, C16, C17B, C17T, C18B, C18T, C21B, C21T, C22B, C22T, C23, C23B, C23T, C26B, C26T, C27B, C27T, C29B, C29T, C30, C30B, C30T, C31, C32, C33B, C33T, C34B, C34T, C35B, C35T, C39, C39T, C46, C47, C48 TR1, TR2, TR3 LED 6 LEDCHIP- LED0805 Schottky Diodes 39 BAT64-02W SCD80 Rectifier Diode 6 ES1D DO214AC Application Note LED1, LED2, LED3, LED4, LED5, LED6 D1, D2, D2B, D2T, D3, D3B, D3T, D4, D4B, D4T, D5, D6, D7, D8, D9, D9B, D9T, D10, D10B, D10T, D11, D11B, D11T, D12, D13, D14, D15, D16, D16B, D16T, D17, D17B, D17T, D18, D18B, D18T, D19, D20, D21 D28, D29, D30, D31, D32, D33 37 Recommended Manufacturer Assembled no no no Murata Vacuumschmelze Infineon V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ Schematic, Layout and Bill of Material EconoPACKTM+ board Type Qty Value / Device Diode 6 BAT64-02W Package size imperal SCD80 Unipolar TVS Diode Unipolar TVS Diode 6 P6SMB/440V SMB 6 P6SMB/510V SMB Diode 6 STTA112U SOD6 D5B, D5T, D12B, D12T, D19B, D19T Zener Diode 12 MM3Z5V6T1G SOD323-R On Semiconductor Zener Diode 6 BZX84-C11 SOT23 D1.1B, D1.1T, D1.2B, D1.2T, D8.1B, D8.1T, D8.2B, D8.2T, D15.1B, D15.1T, D15.2B, D15.2T ZB1, ZB2, ZB3, ZT1, ZT2, ZT3 Diode 6 ZLLS1000 SOT23 Zetex Driver IC 6 1ED020I12-F P-DSO-16 Half-Bridge Driver SchmittTrigger 3 IR2085SPBF SO08 D7B, D7T, D14B, D14T, D21B, D21T IC1, IC2, IC5, IC6, IC8, IC9 IC3, IC7, IC10 1 SN74LVC1G17DBVR SOT23-5 IC11 Isolated Sigma-Delta Modulator Voltage regulator 1 AD7400YRWZ P-DSO-16 IC12 1 ZMR500FTA SOT23 IC13 Shunt Regulator 1 TLV431BIDCKT SC70-6L IC14 Resistor 6 0R R0402 Resistor 15 4k7 R0402 Resistor 6 10k R0402 Resistor 12 100R R0402 Resistor 7 0R R0603 Resistor 6 0R R0603 Resistor 6 27R R0603 Resistor 6 1k R0603 Resistor Resistor 1 5 1k2 2k2 R0603 R0603 Resistor 6 4R7 R0603 Resistor 6 10R R0603 Resistor 6 15R R0603 Resistor Resistor Resistor Resistor Resistor 1 3 1 1 3 39k 68k 270R 820R 0R15 R0603 R0603 R0603 R0603 R0805 R_FR1, R_FR2, R_FR3, R_FR4, R_FR5, R_FR6 R_R1, R_R2, R_R3, R3, R4, R9, R10, R22, R23, R28, R29, R41, R42, R47, R48 R6, R12, R25, R31, R44, R50 R1, R2, R7, R8, R20, R21, R26, R27, R39, R40, R45, R46 R1C, R2C, R3C, R4C, R5C, R6C, R25T R1C1, R2C1, R3C1, R4C1, R5C1, R6C1 BB1, BB2, BB3, BT1, BT2, BT3 R2B, R2T, R10B, R10T, R18B, R18T R26T R18, R28T, R30T, R37, R56 R13, R14, R51, R52, R60, R61 R1L, R2L, R3L, R4L, R5L, R6L R16, R17, R35, R36, R54, R55 R64 R15, R34, R53 R29T R27T R19, R38, R57 Application Note Part Name DB1, DB2, DB3, DT1, DT2, DT3 D1.1C, D2.1C, D3.1C, D4.1C, D5.1C, D6.1C, D1.2C, D2.2C, D3.2C, D4.2C, D5.2C, D6.2C 38 Recommended Manufacturer Infineon Assembled no no no International Rectifier Analog Devices no no no V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ How to order Evaluation Driver Boards Type Qty Value / Device Resistor 6 12R Package size imperal R0805 Resistor 6 39R R0805 Resistor 6 220R R0805 Resistor 6 10R R1206 Resistor 24 variable R2010 Transistor TrenchMOS 6 6 BC856 PMV45EN SOT23 SOT23 Transistor 6 ZXTN2010Z SOT89 Transistor 6 ZXTP2012Z SOT89 Connector 3 8-188275-6 16POL Part Name Recommended Manufacturer R1B, R1T, R9B, R9T, R17B, R17T R5, R11, R24, R30, R43, R49 R1B1, R1B2, R1B3, R1T1, R1T2, R1T3 R32, R33, R58, R59, R62, R63 R4B, R4T, R5B, R5T, R6B, R6T, R7B, R7T, R12B, R12T, R13B, R13T, R14B, R14T, R15B, R15T, R20B, R20T, R21B, R21T, R22B, R22T, R23B, R23T T1, T2, T5, T6, T9, T10 T3, T4, T7, T8, T11, T12 T1B, T1T, T3B, T3T, T5B, T5T T2B, T2T, T4B, T4T, T6B, T6T X1, X2, X3 no TT electronics Zetex Zetex Tyco Gate resistor list Table 7 External gate resistors RGext are listed below, all packages are 2010 RGext [] FS150R12KE3G FS225R12KE3 FS300R12KE3 FS450R12KE3 8 8.2 3.3 2.4 1.6 no: See Table 8 Philips 7.5 Module Assembled R4T, R4B, R6T, R6B [] R5T, R5B, R7T, R7B [] R12T, R12B, R14T, R14B [] R13T, R13B, R15T, R15B [] R20T, R20B, R22T, R22B [] 5.6 1.5 1.1 1 R21T, R21B, R23T, R23B [] 5.6 1.5 1.1 1 How to order Evaluation Driver Boards Every Evaluation Driver Board has its own SAP number and can be ordered via your Infineon Sales Partner. Information can also be found at the Infineons Web Page: www.infineon.com CAD-data for the board decribed here are available on request. The use of this data is subjected to the disclaimer given in this AN. Please contact, IGBT.Application@infineon.com. Application Note 39 V1.2, 2009-08 AN2008-02 Driver board for EconoDUALTM3 and EconoPACKTM+ References 9 References [1] Infineon Technologies AG: AN2007-04, How to calculate and to minimize the dead time requirement for IGBTs properly, V1.0, May 2007 [2] Baler, M., Ciliox A., Kanschat P.: On the loss - softness trade-off: Are different chip versions needed for softness improvement? PCIM Europe 2009, Nuremberg, May 2009 Application Note 40 V1.2, 2009-08 http://www.infineon.com Published by Infineon Technologies AG Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Infineon: 2ED100E12-F2_EVAL