EC1500SJETTS-16.000M TR
EC15 00 SJ ET TS -16.000M TR
Series
3.3V Plastic J-Lead SMD CMOS Oscillator
Frequency Tolerance/Stability
±100ppm Maximum
Package
Operating Temperature Range
-40°C to +85°C
Packaging Options
Tape & Reel
Nominal Frequency
16.000MHz
Output Control Function
Tri-State (High Impedance)
Duty Cycle
50 ±10(%)
ELECTRICAL SPECIFICATIONS
Nominal Frequency 16.000MHz
Frequency Tolerance/Stability ±100ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the
Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°C,
Shock, and Vibration)
Aging at 25°C ±5ppm/year Maximum
Operating Temperature Range -40°C to +85°C
Supply Voltage 3.3Vdc ±10%
Input Current 10mA Maximum
Output Voltage Logic High (Voh) Vdd-0.4Vdc Minimum , IOH = -8mA
Output Voltage Logic Low (Vol) 0.4Vdc Maximum, IOL = +8mA
Rise/Fall Time 5nSec Maximum (Measured over 10% to 90% of waveform)
Duty Cycle 50 ±10(%) (Measured at 50% of waveform)
Load Drive Capability 15pF HCMOS Load Maximum
Output Logic Type HCMOS
Output Control Function Tri-State (High Impedance)
Tri-State Input Voltage (Vih and Vil) +2.0Vdc Minimum to enable output, +0.8Vdc Maximum to disable output (High Impedance), No Connect to
enable output.
Absolute Clock Jitter ±100pSec Maximum
One Sigma Clock Period Jitter ±25pSec Maximum
Start Up Time 4mSec Maximum
Storage Temperature Range -55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test MIL-STD-883, Method 1014, Condition A
Gross Leak Test MIL-STD-883, Method 1014, Condition C
Mechanical Shock MIL-STD-202, Method 213, Condition C
Resistance to Soldering Heat MIL-STD-202, Method 210
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003
Temperature Cycling MIL-STD-883, Method 1010
Vibration MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/19/2010 | Page 1 of 4
EC1500SJETTS-16.000M TR
MECHANICAL DIMENSIONS (all dimensions in millimeters)
MARKING
ORIENTATION
9.8
MAX
14.0
MAX
12
3
4
4.7
MAX
0.25 MIN
5.080
±0.203
7.620
±0.203
0.510 ±0.203
PIN CONNECTION
1 Tri-State
2 Ground
3 Output
4 Supply Voltage
LINE MARKING
1ECLIPTEK
216.000M
3XXYZZ
XX=Ecliptek Manufacturing
Code
Y=Last Digit of Year
ZZ=Week of Year
All Tolerances are ±0.1
Suggested Solder Pad Layout
Solder Land
(X4)
All Dimensions in Millimeters
5.8
3.81
1.27 (X4)
3.0 (X4)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/19/2010 | Page 2 of 4
DIA 50 MIN
DIA 20.2 MIN
DIA 13.0 ±0.2
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
DIA 40 MIN
Access Hole at
Slot Location
1.5 MIN
Tape & Reel Dimensions
*Compliant to EIA 481A
EC1500SJETTS-16.000M TR
24.0 ±0.3
11.5 ±0.1
10.75 ±0.10
4.0 ±0.2
2.0 ±0.1
12.0 ±0.1 B0*
1.5 +1.0/-0.0
A0*
0.3 ±0.1
K0*
30.4 MAX
360 MAX
Quantity Per Reel: 1,000 units
24.4 +2.0/-0.0
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/19/2010 | Page 3 of 4
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
EC1500SJETTS-16.000M TR
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate) 5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 60 - 120 Seconds
Ramp-up Rate (TL to TP)5°C/second Maximum
Time Maintained Above:
- Temperature (TL)150°C
- Time (tL)200 Seconds Maximum
Peak Temperature (TP)240°C Maximum
Target Peak Temperature (TP Target) 240°C Maximum 1 Time / 230°C Maximum 2 Times
Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
Ramp-down Rate 5°C/second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/19/2010 | Page 4 of 4
