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P/N:PM0726 REV. 2.1, MAR. 28, 2003
FEATURES
• Bit organization
- 1Mb x 16 (word mode only)
• Fast access time
- Random access:70ns(max.)
• Current
- Operating:15mA
- Standby:15uA(max.)
• Supply voltage
- VCC : 2.7 ~ 3.6V
- VCCQ : 2.7 ~ 3.6V
• Package
- 48 pin TSOP (12mm X 20mm)
- 48 ball mini BGA (8.0mm X 6.0mm, ball pitch
0.75mm)
• Temperature
- -40~85°C
PIN DESCRIPTION
Symbol Pin Function
A0~A19 Address Inputs
D0~D15 Data Outputs
CE# Chip Enable Input
OE# Output Enable Input
VCC P o wer Supply Pin
VCCQ Output VCC Pin
GND Ground Pin
NC No Connection
PIN CONFIGURATION
MX23L1614
16M-BIT MASK ROM
MODE SELECTION
CE# OE# D0~D15 Power
H X High Z Stand-by
L H High Z Activ e
L L D0~D15 Active
48 TSOP (Top View)
A15
A14
A13
A12
A11
A10
A9
A8
NC
NC
NC
NC
NC
NC
A19
A18
A17
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
A16
VCCQ
GND
D15
D7
D14
D6
D13
D5
D12
D4
VCC
D11
D3
D10
D2
D9
D1
D8
D0
OE#
GND
CE#
A0
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
MX23L1614
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P/N:PM0726 REV. 2.1, MAR. 28, 2003
MX23L1614
48 Mini BGA (Top View, Ball Do wn)
ORDER INFORMATION
P art No. Speed P ac ka ge Grade
MX23L1614TI-70 70ns 48 pin TSOP Industri al
MX23L1614TI-90 90ns 48 pin TSOP Industri al
MX23L1614TI-10 100ns 48 pin TSOP Industria l
MX23L1614XI-70 70ns 48 ball mini BGA Industrial
MX23L1614XI-90 90ns 48 ball mini BGA Industrial
MX23L1614XI-10 100ns 48 ball mini BGA Industrial
A1
A13
B1
A14
C1
A15
D1
A16
E1
VCCQ
F1
GND
A2
A11
B2
A10
C2
A12
D2
D14
E2
D15
F2
D7
A3
A8
B3
NC
C3
A9
D3
D5
E3
D6
F3
D13
A4
NC
B4
NC
C4
NC
D4
D11
E4
D12
F4
D4
A5
NC
B5
A18
C5
NC
D5
D2
E5
D3
F5
VCC
A6
A19
B6
A17
C6
A6
D6
D8
E6
D9
F6
D10
A7
A7
B7
A5
C7
A3
D7
CE#
E7
D0
F7
D1
A8
A4
B8
A2
C8
A1
D8
A0
E8
GND
F8
OE#
8.0 mm
6.0 mm
Note:Industrial grade temperature: -40 ~ 85°C
Commercial grade temper ature: 0 ~ 70°C
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P/N:PM0726 REV. 2.1, MAR. 28, 2003
MX23L1614
ABSOLUTE MAXIMUM RATINGS
Item Symbol Ratings
Voltage on any Pin Relative to VSS VIN -0.3V to 3.9V
Ambient Operating Temperature Topr -40°C to 85°C
Sto rage Temperature Tstg -65°C to 125°C
DC CHARACTERISTICS (Ta = -40°C ~ 85°C, VCC = 2.7V~3.6V)
Item Symbol MIN. MAX. Conditions
Output High Vo ltage VOH 2.4V - IOH = -400uA
Output Low Vo ltage V OL - 0.4V IOL = 1.6mA
Input High Vo ltage VIH 2.2V VCCQ+0.3V
Input Low Voltage VIL -0.4V 0.4V
Input Leakage Current ILI - 5 uA 0V, VCC
Output Leakage Current ILO - 5uA 0V, VCC
Operating Current ICC - 15mA f=5MHz, CE#=VIL, OE#=VIH
all output open
Standby Current (CMOS) ISTB - 15uA CE#>VCC-0.2V
Input Capacitance CIN - 10pF Ta = 25°C, f = 1MHZ
Output Capacitance COUT - 10pF Ta = 25°C, f = 1MHZ
AC CHARACTERISTICS (Ta = -40°C ~ 85°C, VCC = 2.7V~3.6V)
Item Symbol MX23L1614-70 MX23L1614-90 MX23L1614-10
MIN. MAX. MIN. MAX. MIN. MAX.
Read Cycle Time tRC 70ns - 90ns - 100ns -
Address Access Time tAA - 70ns - 90ns - 100ns
Chip Enable Access Time tA C E - 70ns - 90ns - 100ns
Output Enable Time tOE - 20ns - 20ns - 30ns
Output Hold After Address tOH 0ns - 0ns - 0ns -
Output High Z Delay tHZ - 20ns - 20ns - 20ns
Note:Output high-impedance delay (tHZ) is measured
from OE# or CE# going high, and this parameter guar-
anteed by design over the full voltage and temperature
operating range - not tested.
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P/N:PM0726 REV. 2.1, MAR. 28, 2003
MX23L1614
AC Test Conditions
Input Pulse Lev els 0.4V~2.4V
Input Rise and F all Times 5ns
Input Timing Level 1.5V
Output Timing Level 1.5V
Output Load See Figure
100pF output load
capacitance
TIMING DIAGRAM
RANDOM READ
tACE
tAA tOH tHZ
ADD ADD ADD
ADD
CE#
OE#
DATA VALID VALID VALID
tRC
tOE
Note:No output loading is present in tester load board.
Active loading is used and under software programming control.
Output loading capacitance includes load board's and all stray capacitance.
DOUT
C<100pF
IOL (load)=1.6mA
IOH (load)=-400uA
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P/N:PM0726 REV. 2.1, MAR. 28, 2003
MX23L1614
PACKAGE INFORMATION
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P/N:PM0726 REV. 2.1, MAR. 28, 2003
MX23L1614
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P/N:PM0726 REV. 2.1, MAR. 28, 2003
MX23L1614
REVISION HISTORY
Revision Description Page Date
1.1 Mo dify Standb y Current 7uA-->15uA P1,2 AUG/08/2000
Mo dify Oper ating Current 18mA-->15mA P1,2
Modify Pin Descr iption/Pin Configuration VSS-->GND P1,2
Modify Random Access:90ns-->110ns P1
1.2 Add Pin Configuration--48 Mini BGA P1 OCT/17/2000
Add AC Characteristics--MX23L1614-80/90/100 P2
1.3 Modify P ac kage-48 ball mini BGA(8mm x 10mm)-->(6.0mm x 8.0mm) P 1 NOV/24/2000
Modify 48-pin PIN Configuration P2
1.4 Modify Mode Selection--> L, H, High Z, Active P1 DEC/19/2000
1.5 Modify Fast Access Time:80ns-->70ns(max.) P1,2 J AN/18/2001
1.6 Modify Pin Configuration--48 mini BGA P1 JUN/29/2001
Add Package Information P5,6
1.7 Added Order Infor mation P2 JUL/10/2001
1.8 1.Mo dify DC Characteristics--V OH:VCCQ-0.1V -->2.4V, IOH=-100uA--> P3 SEP/10/2001
-400uA, VOL:0.1V-->0.4V , IOL:100uA-->1.6mA, VIH:VCCQ-0.4V-->2.2V
2.Modify AC Test Conditions--Input Pulse Le vels:0~VCCQ-->0.4V~2.4V, P4
Input/Output Timing Le vel:VCCQx0.5-->1.5V, Output Lo ad:50pF-->
100pF output load capacitance
1.9 Add CE#=VIL, OE#=VIH in DC Characteristics's ICC P3 SEP/28/2001
2.0 Modify 48-Ball BAG Package Information P6 MAR/12/2002
2.1 1. To mod if y Package Information P5,6 MAR/28/2003
MX23L1614
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