Rail to Rail Output CMOS Operating Amplifier
Copyright ANPEC Electronics Corp.
Rev. A.1 - Oct., 2001
APC308
www.anpec.com.tw1
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Features
Ordering and Marking Information
The APC308 consists of two independent, high gain,
CMOS operating amplifier, combining rail to rail out-
put range with large output current. It provides a low
input bias current 2pA.
The output swing of the amplifier, guaranteed for
loads down to 1kand output current to an 10 load
from a 5V power supply. APC308 designed to oper-
ating at 3V is especially well-suited for low voltage
application.
Applications
Amplifiers
Gereral Description
Operating Voltage
Single Supply 3V to 6V
Low Input current 2pA
Rail to Rail Output Swing
Push-Pull Output Driving
High Output Current Drive 310mA
Bandwidth:7MHz
Wide Temperature Range
Available in 8 pin SOP ,DIP , TSSOP or MSOP
Package
APC308 P ackage C ode
J : P DIP - 8 K : S OP - 8
O : T SS OP - 8 X : M S OP-8
Tem p. R ange
I : - 4 0 to 8 5 C
Handling C ode
TU : Tube TR : Tape & R eel
Lead Free Code
L : Lead Free D evice Blank : O riginal Device
°
Handling C ode
Tem p. R ange
Package Code
APC 308 J : APC308
XXXXX XXXXX - D ate Code
APC 308 K/O : APC308
XXXXX XXXXX - D ate Code
Lead Free Code
Filters
Analog circuit
Copyright ANPEC Electronics Corp.
Rev. A.1 - Oct., 2001
APC308
www.anpec.com.tw2
Symbol Parameter Rating Unit
VDD Sup ply Voltage 7 V
TSC(O) Output Shor t-circuit duration, at T A=25°C, PTOT=1W 20 S
TAOper ating Am bient Temperatur e rang e -40 to 85 °C
TJMaximum Junction Temperature 150 °C
TSTG Stora ge Tem peratur e Ra ng e -65 to +150 °C
TSSoldering Temperature, 10 seconds 260 °C
VESD Electrostatic D isc har ge -3000 to 3000*1 V
Thermal Characteristics
Absolute Maximum Ratings
Electrical Characteristics
VDD=5V , TA=25°C (unless otherwise noted)
Note : *1. Human body model : C=100pF , R=1500, 3 positive pulses plus 3 negative pulses
Symbol Parameter Value Unit
RTHJA Thermal Resistance from Junction to Ambient in Free Air
DIP-8
SO-8
TSSOP
MSOP
109
180
220
220
K/W
K/W
K/W
K/W
APC308
Symbol Parameter Condition Min. Typ. Max. Unit
Ta=25°C410mV
Vos Input Offset Voltage -25°C<Ta<75°C5mV
Ibias Input Bias Current Ta=25°C2pA
Vicm Input Common Mode Voltage
Range Ta=25°C0V
DD-0.8 V
Block Diagram
1
2
3
45
6
7
8
Out 1
Inverting Input 1
Non-inverting Input 1
Non-inverting Input 2
Out 2
Inverting Input 2
--+
+
VEE
VDD
APC308
Copyright ANPEC Electronics Corp.
Rev. A.1 - Oct., 2001
APC308
www.anpec.com.tw3
Electrical Characteristics Cont.
APC308
Symbol Parameter Condition Min. Typ. Max. Unit
RIN Input R esistance 5 M
Vo Output Voltage Swing RL=2k05V
Voh Output Voltage High RL=10k,
-25°C<Ta<75°C5V
Vol Output Voltage Low RL=10k,
-25°C<Ta<75°C0V
Output Current Source Vo=4.5V -310 mA
lout O utput Current Sink Vo=0.5V 370 m A
CMRR Common Mode Rejection Ratio -80 dB
PSR R Supply Vo ltage Rejection Ratio Vrr=100mVpp,
fin=100HZ,RL=2k-50 dB
Av Large Signa l Vo ltage G ain 85 dB
GB W Gain Bandwidth Product 7 MH z
SR Slew Rate 5.6 V/µs
-25°C<Ta<75°C2.04mA
Icc S upply Curre nt 2.4V<Vcc<6 V, Ta =2 5°C2.55mA
VDD=5V , TA=25°C (unless otherwise noted)
Copyright ANPEC Electronics Corp.
Rev. A.1 - Oct., 2001
APC308
www.anpec.com.tw4
Typical Characteristics
0
0.5
1
1.5
2
2.5
3
3.5
4
01234567
Supply Current vs Supply Voltage
Supply voltage(V)
Supply Current (mA)
No Load
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-25 0 25 50 75
Supply Current vs Temperature
VDD=5V
Supply Current (mA)
Temperature(°C)
0
1
2
3
4
5
6
7
-25 0 25 50 75
Input Offset Voltage vs Temperature
VOS (mV)
VDD=5V
Temperature(°C)
0
1
2
3
4
5
6
01234567
Supply Voltage(V)
Input Common Mode Voltage vs Supply
Voltage
VICM (V)
Copyright ANPEC Electronics Corp.
Rev. A.1 - Oct., 2001
APC308
www.anpec.com.tw5
Output Current vs Output Swing Output Swing vs Load Resistance
Output Swing vs Temperature
Typical Characteristics
0
1
2
3
4
5
6
-25 0 25 50 75
VDD=5V, RL=2k
Output Swing (V)
Temperature(°C)
0.1
1
10
100
1000
0123456
VDD=5V
Output Swing (mA)
Output Swing (V)
0
1
2
3
4
5
6
10 100 1k 10k
VDD=5V
Output Swing (V)
Load Resistance ()
0
1
2
3
4
5
6
7
8
01234567
Output Swing vs Supply Voltage
Supply Voltage (V)
RL=2k
Output Swing (V)
Copyright ANPEC Electronics Corp.
Rev. A.1 - Oct., 2001
APC308
www.anpec.com.tw6
Typical Characteristics
0
50
100
150
200
250
300
350
400
450
500
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Sink Current vs Output Voltage
Output Voltage Referred to Ground (V)
Sink Current (mA)
0
50
100
150
200
250
300
350
400
450
500
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Source Current vs Output Voltage
Source Current (mA)
Output Voltage Referred to Vdd(V)
Large Signal Voltage Gain vs Frequency
+0
+100
+10
+20
+30
+40
+50
+60
+70
+80
+90
10 10M
100 1k 10k 100k 1M
Frequency (Hz)
VDD=5V
Av (dB)
0
1
2
3
4
5
6
10 100 1k 10k 100k 1M 10M
Large Signal Frequency Response
VDD=5V, RL=2k
Output Swing (V)
Frequency (Hz)
VDD=5V VDD=5V
Copyright ANPEC Electronics Corp.
Rev. A.1 - Oct., 2001
APC308
www.anpec.com.tw7
Typical Characteristics
50
55
60
65
70
75
80
85
90
95
100
12345
Supply Voltage (V)
Large Signal Voltage Gain vs Supply
Voltage
Av (dB)
CMRR vs Frequency
-100
+0
-90
-80
-70
-60
-50
-40
-30
-20
-10
10 100k100 1k 10k
Frequency (Hz)
VDD=5V,RL=10k
CMRR (dB)
PSRR vs Frequency
-80
+0
-70
-60
-50
-40
-30
-20
-10
10 100k100 1k 10k
Frequency (Hz)
VDD=5V
VRR=100mVpp/100Hz
PSRR (dB)
Voltage Follower Pulse Response
0
1
2
3
4
5
6
7
8
9
-4
-3
-2
-1
0
1
2
3
4
5
0 1 2 3 4 5
Time (µs)
VDD=5V,RL=2k
Output Voltage (V)
Input Voltage (V)
Copyright ANPEC Electronics Corp.
Rev. A.1 - Oct., 2001
APC308
www.anpec.com.tw8
Typical Characteristics
Time (µs)
Voltage Follower Pulse Response
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
-0.4
-0.5
0.2
-0.4
-0.3
-0.2
-0.1
0
0.1
12034
VDD=5V,CL=270pF
Output Voltage (V)
Input Voltage (V)
Copyright ANPEC Electronics Corp.
Rev. A.1 - Oct., 2001
APC308
www.anpec.com.tw9
Packaging Information
1
D
E1
A2
A1
A
L
e2
e 3 e 1
E
E3
1
PDIP-8 pin ( Reference JEDEC Registration MS-001)
Millimeters InchesDim Min. Max. Min. Max.
A5.33 0.210
A1 0.38 0.015
A2 2.92 3.68 0.115 0.145
D9.02 10.16 0.355 0.400
e1 2.54BSC 0.100BSC
e2 0.36 0.56 0.014 0.022
e3 1.14 1.78 0.045 0.070
E7.62 BSC 0.300 BSC
E1 6.10 7.11 0.240 0.280
E3 10.92 0.430
L2.92 3.81 0.115 0.150
φ
115
°15°
Copyright ANPEC Electronics Corp.
Rev. A.1 - Oct., 2001
APC308
www.anpec.com.tw10
Packaging Information
Millimeters Inches
Dim Min. Max. Min. Max.
A 1.35 1.75 0.053 0.069
A1 0.10 0.25 0.004 0.010
D 4.80 5.00 0.189 0.197
E 3.80 4.00 0.150 0.157
H 5.80 6.20 0.228 0.244
L 0.40 1.27 0.016 0.050
e1 0.33 0.51 0.013 0.020
e2 1.27BSC 0.50BSC
φ 18
°8°
HE
e1 e2
0.015X45
D
A
A1
0.004max.
1
L
SOP-8 pin ( Reference JEDEC Registration MS-012)
Copyright ANPEC Electronics Corp.
Rev. A.1 - Oct., 2001
APC308
www.anpec.com.tw11
Packaging Information
Millimeters Inches
Dim Min. Max. Min. Max.
A 1.2 0.047
A1 0.00 0.15 0.000 0.006
A2 0.80 1.05 0.031 0.041
b 0.19 0.30 0.007 0.012
D 2.9 3.1 0.114 0.122
e 0.65 BSC 0.026 BSC
E 6.40 BSC 0.252 BSC
E1 4.30 4.50 0.169 0.177
L 0.45 0.75 0.018 0.030
L1 1.0 REF 0.039REF
R 0.09 0.004
R1 0.09 0.004
S 0.2 0.008
φ
10
°8°0°8°
φ
212
° REF 12° REF
φ
312
° REF 12° REF
L
(L1)
(3)
S
(2)
0.25
GAUGE
PLANE
1
b
D
e
2 x E / 2
8
12 e/2
E1 E
7
A1
A2
A
TSSOP-8
Copyright ANPEC Electronics Corp.
Rev. A.1 - Oct., 2001
APC308
www.anpec.com.tw12
Packaging Information
e1
E1
E
e1
A1 A2 L2
L1
A3
Millimeters Inches
Dim Min. Max. Min. Max.
A1 0.06 0.15 0.002 0.006
A2 0.86 TYP 0.34 TYP
A3 0.25 0.4 0.01 0.0126
e 0.65 TYP 0.0256TYP
e1 2.90 3.1 0.114 0.122
E 4.8 5.0 0.189 0.197
E1 2.90 3.1 0.114 0.122
L1 0.25 REF 0.039REF
L2 0.0375 REF 0.953 REF
MSOP
Copyright ANPEC Electronics Corp.
Rev. A.1 - Oct., 2001
APC308
www.anpec.com.tw13
t 2 5 C to Pe ak
tp
Ramp-up
tL
Ramp-down
ts
Preheat
Tsmax
Tsmin
TL
TP
25
Temperature
Time
Critical Z one
TL to TP
°
Physical Specifications
Terminal Ma terial Solder-Plated C opp er (Solde r Ma terial : 90/10 or 63 /37 S nPb) , 100 %Sn
Lead Solde rability Mee ts EIA S pe c ification RSI86-91, ANSI/J- S T D-00 2 C ategory 3.
Reflow Condition (IR/Convection or VPR Reflow)
Classificatin Reflow Profiles
Sn-Pb Eutectic Assembly Pb-Free Assembly
Profile Feature Large Body Small Body Large Body Small Body
Average ramp-up rate
(TL to TP) 3°C/second max. 3°C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Mix (Tsmax)
- Time (min to max)(ts)
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
Tsmax to TL
- Ramp-up Rate 3°C/second max
Tsmax to TL
- Temperature(TL)
- Time (tL)
183°C
60-150 seconds
217°C
60-150 seconds
Peak Temperature(Tp) 225 +0/-5°C 240 +0/-5°C 245 +0/-5°C 250 +0/-5°C
Time within 5°C of actual Peak
Temperature(tp) 10-30 seconds 10-30 seconds 10-30 seconds 20-40 seconds
Ramp-down Rate 6°C/second max. 6°C/second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max.
Note: All temperatures refer to topside of the package. Measured on the body surface.
Copyright ANPEC Electronics Corp.
Rev. A.1 - Oct., 2001
APC308
www.anpec.com.tw14
Reliability Test Program
Carrier Tape & Reel Dimensions
A
J
B
T2
T1
C
t
Ao
E
W
Po P
Ko
Bo
D1
D
F
P1
Test item M ethod Desc ription
SOLDERABILITY MIL-STD-883D-2003
245°C, 5 SEC
HOLT MIL-STD-883D-1005.7
1000 H rs B ias @ 1 25°C
PCT JESD-22-B,A102
168 H rs, 100%RH, 121°C
TST MIL-STD-883D-1011.9
-65°C~150°C, 200 Cycles
ESD MIL-STD-883D- 301 5.7 VH BM > 2KV, VM M > 200V
Latch-Up JESD 7 8 10m s , 1tr > 100mA
Copyright ANPEC Electronics Corp.
Rev. A.1 - Oct., 2001
APC308
www.anpec.com.tw15
Applicatio n Carrier Width C over Tap e Width Devices Per Reel
SOP- 8 12 9.3 2500
TSSOP- 8 12 9.3 2500
Cover Tape Dimensions
Anpec Electronics Corp.
Head Office :
5F, No. 2 Li-Hsin Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
7F, No. 137, Lane 235, Pac Chiao Rd.,
Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.
Tel : 886-2-89191368
Fax : 886-2-89191369
Customer Service
Application A B C JT1 T2 W P E
330 ± 1 62 +1.5 12.75+
0.15 2 ± 0.5 12.4 ± 0.2 2 ± 0.2 12 ± 0. 3 8± 0.1 1 .75±0.1
F D D1 Po P1 Ao Bo Ko tSOP- 8
5.5± 1 1.55 +0.1 1.55+ 0.25 4.0 ± 0.1 2.0 ± 0 .1 6.4 ± 0.1 5.2 ± 0. 1 2.1 ± 0.1 0 .3±0.013
Application A B C JT1 T2 W P E
330 ± 1 62 +1.5 12.75+
0.15 2 + 0.5 12.4 ± 0.2 2 ± 0.2 12± 0. 3 8± 0.1 1.75 ±0.1
F D D1 Po P1 Ao Bo Ko tTSSOP-8
5.5 ± 0. 1 1.5 + 0.1 1.5 + 0.1 4.0 ± 0.1 2.0 ± 0 .1 7 .0 ± 0.1 3.6 ± 0.3 1.6 ± 0.1 0.3±0.013
(mm)
Carrier Tape & Reel Dimensions