LM48861TM/NOPB - Texas Instruments

LM48861, LM48861TMBD

www.ti.com

SNAS450B –JUNE 2008–REVISED MAY 2013

LM48861 Ground-Referenced, Ultra Low Noise, Stereo

Headphone Amplifier

Check for Samples: LM48861,LM48861TMBD

1FEATURES DESCRIPTION

The LM48861 is a single supply, ground-referenced

23• Ground Referenced Outputs – Eliminates stereo headphone amplifier. Part of TI's PowerWise™

Output Coupling Capacitors product family, the LM48861 consumes only 3mW of

• Common-Mode Sensing power, yet still provides great audio performance. The

• Advanced Click-and-Pop Suppression ground-referenced architecture eliminates the larger

DC blocking capacitors required by traditional

• Low Supply Current headphone amplifier's saving board space and

• Minimum External Components reducing cost.

• Micro-Power Shutdown The LM48861 features common-mode sensing that

• ESD Protection of 8kV HBM Contact corrects for any differences between the amplifier

• Available in Space-Saving 12-Bump DSBGA ground and the potential at the headphone return

terminal, minimizing noise created by any ground

Package mismatches.

APPLICATIONS The LM48861 delivers 22mW/channel into a 32Ω

load with <1% THD+N with a 1.8V supply. Power

• Mobile Phones supply requirements allow operation from 1.2V to

• Portable Electronic Devices 2.8V. High power supply rejection ratio (PSRR), 83dB

• MP3 Players at 217Hz, allows the device to operate in noisy

environments without additional power supply

KEY SPECIFICATIONS conditioning. A low power shutdown mode reduces

supply current consumption to 0.01µA.

• Output Power/Channel at

VDD = 1.5V,THD+N = 1% Superior click and pop suppression eliminates audible

transients on power-up/down and during shutdown.

– RL= 16Ω12mW (typ) The LM48861 is available in an ultra-small 12-bump,

– RL= 32Ω13mW (typ) 0.4mm pitch, DSBGA package (1.215mm x

• Output Power/Channel at 1.615mm).

VDD = 1.8V, THD+N = 1%

– RL= 16Ω24mW (typ)

– RL= 32Ω22mW (typ)

• Quiescent Power Supply Current at 1.5V

2mA (typ)

• PSRR at 217Hz 83dB (typ)

• Shutdown Current 0.01μA (typ)

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2PowerWise is a trademark of Texas Instruments.

3All other trademarks are the property of their respective owners.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

2.2 PF0.1 PF

ceramic

Shutdown

Control Click/Pop

Suppression

Charge

Pump

2.2 PF

COM

PGND

0.39 PF

VIN1

0.39 PF

VIN2

2.2 PF

VDD

Headphone

Jack

CPP

INR

CPVSS

20 k:

INL OUTL

OUTR

20 k:CPN

VSS

20 k:

SHDN

VDD

Shutdown

LM48861, LM48861TMBD

SNAS450B –JUNE 2008–REVISED MAY 2013

www.ti.com

Typical Application

Figure 1. Typical Audio Amplifier Application Circuit

Product Folder Links: LM48861 LM48861TMBD

CPN

CPVSS

INL

INR

SHDN

PGND

VSS

COM

CPP

VDD

OUTL

OUTR

0.4 mm TYP

LM48861, LM48861TMBD

www.ti.com

SNAS450B –JUNE 2008–REVISED MAY 2013

Connection Diagrams

Figure 2. YFQ Package

1.215mm x 1.615mm x 0.6mm

Top View

See Package Number YFQ0012AAA

BUMP DESCRIPTION

Bump Name Description

A1 CPP Charge Pump Flying Capacitor Positive Terminal

A2 PGND Power Ground

A3 CPN Charge Pump Flying Capacitor Negative Terminal

B1 VDD Positive Power Supply

B2 SHDN Active Low Shutdown

B3 CPVSS Charge Pump Output

C1 OUTL Left Channel Output

C2 VSS Negative Power Supply

C3 INL Left Channel Input

D1 OUTR Right Channel Output

D2 COM Ground reference for inputs and HP

D3 INR Right Channel Input

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Product Folder Links: LM48861 LM48861TMBD

LM48861, LM48861TMBD

SNAS450B –JUNE 2008–REVISED MAY 2013

www.ti.com

Absolute Maximum Ratings(1)(2)(3)

Supply Voltage(1) 3V

Storage Temperature −65°C to +150°C

Input Voltage -0.3V to VDD + 0.3V

Power Dissipation(4) Internally Limited

ESD Ratings (HBM)(5) 2000V

ESD Ratings(OUTL, OUTR)(5) 8000V

ESD Susceptibility (Machine Model)(6) 200V

Junction Temperature 150°C

Thermal Resistance θJA (YFQ) 70°C/W (typ)

(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of

device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum

RatingsRatings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The

Recommended Operating Conditions indicate conditions at which the device is functional and the device should not be operated beyond

such conditions. All voltages are measured with respect to the ground pin, unless otherwise specified

(2) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as

otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and

are not ensured.

(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(4) Maximum allowable power dissipation is PDMAX = (TJMAX - TA) / θJA or the number given in Absolute Maximum Ratings, whichever is

lower.

(5) Human body model, applicable std. JESD22-A114C.

(6) Machine model, applicable std. JESD22-A115-A.

Operating Ratings

Temperature Range TMIN ≤TA≤TMAX −40°C ≤TA≤+85°C

Supply Voltage (VDD) 1.2V ≤VDD ≤2.8V

Product Folder Links: LM48861 LM48861TMBD

LM48861, LM48861TMBD

www.ti.com

SNAS450B –JUNE 2008–REVISED MAY 2013

Electrical Characteristics VDD = 1.5V(1)(2)

The following specifications apply for VDD = 1.5V, AV= –1V/V, RL= 32kΩ, f = 1kHz, unless otherwise specified. Limits apply

for TA= 25°C. LM48861 Units

Symbol Parameter Conditions (Limits)

Typical(3) Limit(4)

IDD Quiescent Power Supply Current VIN = 0V, Both channels enabled 2 2.8 mA (max)

Shutdown Enabled

ISD Shutdown Current 0.01 1.5 µA (max)

VSHDN = GND

VIN = 0V, RL= 32Ω

VOS Output Offset Voltage 0.5 1.5 mV (max)

Both channels enabled

VIH Shutdown Input Voltage High 1.4 V(min)

VIL Shutdown Input Voltage Low 0.4 V(max)

TWU Wake Up Time 500 700 μs (max)

THD+N = 1% RL= 32Ω, f = 1kHz,

Both channels in phase and active

VDD = 1.5V 13 12 mW (min)

VDD = 1.8V 22 20 mW (min)

POOutput Power THD+N = 1% RL= 16Ω, f = 1kHz,

Both channels in phase and active

VDD = 1.5V 12 mW

VDD = 1.8V 24 mW

RL= 10kΩ, f = 1kHz

VLINE-OUT Output Voltage to Line Out VDD = 1.5V, THD+N = 1%, RL= 10kΩ1.1 1 VRMS (min)

VDD = 1.8V, THD+N = 1%, RL= 10kΩ1.3 1.2 VRMS (min)

PO= 8mW, f = 1kHz, RL= 32Ω0.04 %

THD+N Total Harmonic Distortion + Noise PO= 8mW, f = 1kHz, RL= 16Ω0.07 %

VOLIF = 900mVRMS, f = 1kHz, RL= 10kΩ0.001 %

VRIPPLE = 200mVP-P Sine, Inputs AC GND, C1 = C2 = 0.39μF

fRIPPLE = 217Hz 83 dB

PSRR Power Supply Rejection Ratio fRIPPLE = 1kHz 77 dB

fRIPPLE = 15kHz 57 dB

RL= 32Ω, POUT = 8mW

SNR Signal-to-Noise Ratio (A-weighted), f = 1kHz 102 dB

BW = 20Hz to 22kHz

XTALK Crosstalk RL= 32Ω, POUT = 5mW, f = 1kHz 93 dB

A-weighted, AV= 5.1dB

NOUT Output Noise 5 μV

R1 = R2 = 10kΩ, R3 = R4 = 18kΩ

Inputs Grounded

C-P Click-Pop 79 dB

BW = <10Hz to >500kHz

(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of

device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum

RatingsRatings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The

Recommended Operating Conditions indicate conditions at which the device is functional and the device should not be operated beyond

such conditions. All voltages are measured with respect to the ground pin, unless otherwise specified

(2) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as

otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and

are not ensured.

(3) Typical values represent most likely parametric norms at TA= +25ºC, and at the Recommended Operation Conditions at the time of

product characterization and are not ensured.

(4) Datasheet min/max specification limits are ensured by test or statistical analysis.

Product Folder Links: LM48861 LM48861TMBD

0.01

100

0.1

THD +N (%)

1m 100m2m 5m 10m 20m 50m

OUTPUT POWER (W)

VDD = 1.5V

VDD = 1.8V

0.01

100

0.1

THD + N (%)

1m 100m2m 5m 10m 20m 50m

OUTPUT POWER (W)

VDD = 1.5V

VDD = 1.8V

LM48861, LM48861TMBD

SNAS450B –JUNE 2008–REVISED MAY 2013

www.ti.com

Typical Performance Characteristics

THD+N vs Frequency THD+N vs Frequency

VDD = 1.5V, RL= 16Ω, PO= 8mW VDD = 1.5V, RL= 32Ω, PO= 8mW

Figure 3. Figure 4.

THD+N vs Frequency THD+N vs Frequency

VDD = 1.8V, RL= 16Ω, PO= 18mW VDD = 1.8V, RL= 32Ω, PO= 20mW

Figure 5. Figure 6.

THD+N vs Output Power THD+N vs Output Power

VDD = 1.5V & 1.8V, RL= 16Ω, f = 1kHz VDD = 1.5V & 1.8V, RL= 32Ω, f = 1kHz

Figure 7. Figure 8.

Product Folder Links: LM48861 LM48861TMBD

SUPPLY VOLTAGE (V)

100

1 1.25 1.5 1.75 2 2.25 2.5 2.75 3

OUTPUT POWER/CHANNEL (mW)

THD+N = 1%

THD+N = 10%

0.5

1.5

2.5

3.5

1 1.5 2 2.5 3

SUPPLY VOLTAGE (V)

SUPPLY CURRENT (mA)

100

120

140

1 1.25 1.5 1.75 2 2.25 2.5 2.75 3

SUPPLY VOLTAGE (V)

OUTPUT POWER/CHANNEL (mW)

THD+N = 1%

THD+N = 10%

-90

-80

-70

-60

-50

-40

-30

-20

-10

10 100 1000 10000 100000

FREQUENCY (Hz)

PSRR (dB)

0 10 20 30 40

OUTPUT POWER/CHANNEL (mW)

VDD = 1.5V

VDD = 1.8V

POWER DISSIPATION (mW)

0 10 20 30 40

OUTPUT POWER/CHANNEL (mW)

POWER DISSIPATION (mW)

VDD = 1.8V

VDD = 1.5V

LM48861, LM48861TMBD

www.ti.com

SNAS450B –JUNE 2008–REVISED MAY 2013

Typical Performance Characteristics (continued)

Power Dissipation vs Output Power Power Dissipation vs Output Power

RL= 16Ω, f = 1kHz RL= 32Ω, f = 1kHz

Figure 9. Figure 10.

PSRR vs Frequency Output Power vs Supply Voltage

VDD = 1.5V, VRIPPLE = 200mVP-P, RL= 32ΩRL= 16Ω, f = 1kHz

Figure 11. Figure 12.

Output Power vs Supply Voltage Supply Current vs Supply Voltage

RL= 32Ω, f = 1kHz No Load

Figure 13. Figure 14.

Product Folder Links: LM48861 LM48861TMBD

0.02

0.04

0.06

0.08

1 1.5 2 2.5 3

SUPPLY VOLTAGE (V)

SUPPLY CURRENT (uA)

-120

-100

-80

-60

-40

-20

10 100 1000 10000 100000

FREQUENCY (Hz)

CROSSTALK (dB)

LM48861, LM48861TMBD

SNAS450B –JUNE 2008–REVISED MAY 2013

www.ti.com

Typical Performance Characteristics (continued)

Shutdown Current vs Supply Voltage Crosstalk vs Frequency

No Load VDD = 1.5V, POUT = 5mW, RL= 32Ω

Figure 15. Figure 16.

Product Folder Links: LM48861 LM48861TMBD

AUDIO

INPUT

COM

COMMON MODE SENSE

EQUIVALENT CIRCUIT

LM48861, LM48861TMBD

www.ti.com

SNAS450B –JUNE 2008–REVISED MAY 2013

APPLICATION INFORMATION

GENERAL AMPLIFIER FUNCTION

The LM48861 headphone amplifier features TI’s ground referenced architecture that eliminates the large DC-

blocking capacitors required at the outputs of traditional headphone amplifiers. A low-noise inverting charge

pump creates a negative supply (CPVSS) from the positive supply voltage (VDD). The headphone amplifiers

operate from these bipolar supplies, with the amplifier outputs biased about GND, instead of a nominal DC

voltage (typically VDD/2), like traditional amplifiers. Because there is no DC component to the headphone output

signals, the large DC-blocking capacitors (typically 220μF) are not necessary, conserving board space and

system cost, while improving frequency response.

COMMON MODE SENSE

The LM48861 features a ground (common mode) sensing feature. In noisy applications, or where the headphone

jack is used as a line out to other devices, noise pick up and ground imbalance can degrade audio quality. The

LM48861 COM input senses and corrects any noise at the headphone return, or any ground imbalance between

the headphone return and device ground, improving audio reproduction. Connect COM directly to the headphone

return terminal of the headphone jack Figure 17. No additional external components are required. Connect COM

to GND if the common-mode sense feature is not in use.

Figure 17.

MICRO POWER SHUTDOWN

The voltage applied to the shutdown (SHDN) pin controls the LM48861’s shutdown function. Activate micro-

power shutdown by applying a logic-low voltage to the SHDN pin. When active, the LM48861’s micro-power

shutdown feature turns off the amplifier’s bias circuitry, reducing the supply current. The trigger point is 0.4V

(max) for a logic-low level, and 1.4V (min) for a logic-high level. The low 0.1μA (typ) shutdown current is

achieved by applying a voltage that is as near as ground as possible to the SHDN pin. A voltage that is higher

than ground may increase the shutdown current.

There are a few ways to control the micro-power shutdown. These include using a single-pole, single-throw

switch, a microprocessor, or a microcontroller. When using a switch, connect an external 100kΩpull-up resistor

between the SHDN pin and GND. Connect the switch between the SHDN pin and VDD. Select normal amplifier

operation by closing the switch. Opening the switch connects the SHDN pin to ground, activating micro-power

shutdown. The switch and resistor ensure that the SHDN pin will not float. This prevents unwanted state

changes. In a system with a microprocessor or microcontroller, use a digital output to apply the control voltage to

the SHDN pin. Driving the SHDN pin with active circuitry eliminates the pull-up resistor.

POWER DISSIPATION

Power dissipation is a major concern when using any power amplifier, especially one in mobile devices. In the

LM48861, the power dissipation comes from the charge pump and two operational amplifiers. Refer to the

Figure 10 Power Dissipation vs Output Power curve in the Typical Performance Characteristics section of the

datasheet to find the power dissipation associated the output power level of the LM48861. The power dissipation

should not exceed the maximum power dissipation point of the DSBGA package given in Equation 1.

PDMAX = (TJMAX - TA) / (θJA) (1)

Product Folder Links: LM48861 LM48861TMBD

LM48861, LM48861TMBD

SNAS450B –JUNE 2008–REVISED MAY 2013

www.ti.com

For the LM48861TM DSBGA package, θJA = 70°C/W. TJMAX = 150°C, and TAis the ambient temperature of the

system surroundings.

PROPER SELECTION OF EXTERNAL COMPONENTS

Power Supply Bypassing/Filtering

Proper power supply bypassing is critical for low noise performance and high PSRR. Place the supply bypass

capacitors as close to the supply pins as possible. Place a 1μF ceramic capacitor from VDD to GND. Additional

bulk capacitance may be added as required.

Charge Pump Capacitor Selection

Use low ESR ceramic capacitors (less than 100mΩ) for optimum performance.

Charge Pump Flying Capacitor (C5)

The flying capacitor (C5) affects the load regulation and output impedance of the charge pump. A C5 value that

is too low results in a loss of current drive, leading to a loss of amplifier headroom. A higher valued C5 improves

load regulation and lowers charge pump output impedance to an extent. Above 2.2μF, the RDS(ON) of the charge

pump switches and the ESR of C5 and C6 dominate the output impedance. A lower value capacitor can be used

in systems with low maximum output power requirements.

Charge Pump Hold Capacitor (C6)

The value and ESR of the hold capacitor (C6) directly affects the ripple on CPVSS. Increasing the value of C6

reduces output ripple. Decreasing the ESR of C6 reduces both output ripple and charge pump output impedance.

A lower value capacitor can be used in systems with low maximum output power requirements.

Power Supply Bypassing /Filtering

Proper power supply bypassing is critical for low noise performance and high PSRR. Place the supply bypass

capacitors as close to the device as possible. Typical applications employ a voltage regulator with 10µF and

0.1µF bypass capacitors that increase supply stability. These capacitors do not eliminate the need for bypassing

of the LM48861 supply pins. A 1µF capacitor is recommended.

Input Capacitor Selection

The LM48861 requires input coupling capacitors. Input capacitors block the DC component of the audio signal,

eliminating any conflict between the DC component of the audio source and the bias voltage of the LM48861.

The input capacitors create a high-pass filter with the input resistors RIN. The -3dB point of the high-pass filter is

found using Equation 2 below.

f = 1 / 2πRINCIN

Where

• the value of RIN is selected based on the gain-setting resistor selection. (2)

In relation to Figure 1, RIN = R1 = R2, CIN = C1 = C2.

The input capacitors can also be used to remove low frequency content from the audio signal. Small speakers

can not reproduce, and may even be damaged by low frequencies. High-pass filtering the audio signal helps

protect the speakers. When the LM48861 is using a single-ended source, power supply noise on the ground is

seen as an input signal. Setting the high-pass filter point above the power supply noise frequencies, 217Hz in a

GSM phone, for example, filters out the noise such that it is not amplified and heard on the output. Capacitors

with a tolerance of 10% or better are recommended for impedance matching and improved CMRR and PSRR.

Product Folder Links: LM48861 LM48861TMBD

LM48861, LM48861TMBD

www.ti.com

SNAS450B –JUNE 2008–REVISED MAY 2013

PCB Layout Guidelines

Minimize trace impedance of the power, ground and all output traces for optimum performance. Voltage loss due

to trace resistance between the LM48861 and the load results in decreased output power and efficiency. Trace

resistance between the power supply and ground has the same effect as a poorly regulated supply, increased

ripple and reduced peak output power. Use wide traces for power supply inputs and amplifier outputs to minimize

losses due to trace resistance, as well as route heat away from the device. Proper grounding improves audio

performance, minimizes crosstalk between channels and prevents switching noise from interfering with the audio

signal. Use of power and ground planes is recommended.

As described in the Common Mode Sense section, the LM48861 features a ground sensing feature. On the PCB

layout, connect the COM pin (pin D2) directly to the headphone jack ground and also to the left and right input

grounds. This will help correct any noise or any ground imbalance between the headphone return, input, and the

device ground, therefore improving audio reproduction.

The charge pump capacitors and traces connecting the capacitor to the device should be kept away from the

input and output traces to avoid any switching noise injected into the input or output.

Demo Board Schematic and Layout

Figure 18. Top Silkscreen Layer Figure 19. Top Solder Mask

Product Folder Links: LM48861 LM48861TMBD

LM48861, LM48861TMBD

SNAS450B –JUNE 2008–REVISED MAY 2013

www.ti.com

Figure 20. Bottom Solder Mask Figure 21. Top Layer

Figure 22. Layer 2 Figure 23. Layer 3

Product Folder Links: LM48861 LM48861TMBD

LM48861, LM48861TMBD

www.ti.com

SNAS450B –JUNE 2008–REVISED MAY 2013

Figure 24. Bottom Layer Figure 25. Bottom Silkscreen

Product Folder Links: LM48861 LM48861TMBD

LM48861, LM48861TMBD

SNAS450B –JUNE 2008–REVISED MAY 2013

www.ti.com

REVISION HISTORY

Rev Date Description

1.0 06/11/08 Initial release.

1.01 02/08/10 Input text edits.

B 05/02/2013 Changed layout of National Data Sheet to TI format.

Product Folder Links: LM48861 LM48861TMBD

PACKAGE OPTION ADDENDUM

www.ti.com 24-Sep-2015

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM48861TM/NOPB ACTIVE DSBGA YFQ 12 250 Green (RoHS

& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 G

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

PACKAGE OPTION ADDENDUM

www.ti.com 24-Sep-2015

Addendum-Page 2

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM48861TM/NOPB DSBGA YFQ 12 250 178.0 8.4 1.35 1.75 0.76 4.0 8.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 2-Sep-2015

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM48861TM/NOPB DSBGA YFQ 12 250 210.0 185.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 2-Sep-2015

Pack Materials-Page 2

MECHANICAL DATA

YFQ0012xxx

www.ti.com

TMD12XXX (Rev B)

0.600

±0.075

. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.

B. This drawing is subject to change without notice.

NOTES:

4215079/A 12/12

D: Max =

E: Max =

1.64 mm, Min =

1.24 mm, Min =

1.58 mm

1.18 mm

IMPORTANT NOTICE

Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its

semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers

should obtain the latest relevant information before placing orders and should verify that such information is current and complete.

TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated

circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and

services.

Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is

accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced

documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements

different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the

associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers

remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have

full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products

used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with

respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous

consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and

take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will

thoroughly test such applications and the functionality of such TI products as used in such applications.

TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,

including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to

assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any

way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource

solely for this purpose and subject to the terms of this Notice.

TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI

products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,

enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically

described in the published documentation for a particular TI Resource.

Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that

include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE

TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY

RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information

regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or

endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR

REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO

ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF

MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL

PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,

INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF

PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,

DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN

CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN

ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949

and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.

Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such

products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards

and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must

ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in

life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.

Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life

support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all

medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.

TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).

Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications

and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory

requirements in connection with such selection.

Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-

compliance with the terms and provisions of this Notice.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

Texas Instruments:

LM48861TM/NOPB LM48861TMX/NOPB