12 V, 2 A Logic Controlled
High-Side Power Switch
Data Sheet
ADP1290
FEATURES
Low RDSON of 40 mΩ
Wide input voltage range: 2.3 V to 13.2 V
2 A continuous operating current, TJ = <85°C
1.2 V logic compatible enable input
Low 15 µA quiescent current, VIN = 3.3 V
Low 19 µA quiescent current, VIN = 6.5 V
Ultralow shutdown current: 2.0 µA at VIN = 6.5 V
Ultrasmall 1.0 mm × 1.5 mm, 6-ball, 0.5 mm pitch WLCSP
APPLICATIONS
Mobile phones
Digital cameras and audio devices
Portable and battery-powered equipment
TYPICAL APPLICATIONS CIRCUIT
GND
EN LOAD
VIN VOUT
ADP1290
CHARGE
PUMP
OFF
ON
12529-001
+
–
Figure 1.
GENERAL DESCRIPTION
The ADP1290 is a high-side load switch designed for operation
between 2.3 V and 13.2 V. This load switch provides power
domain isolation, helping to extend battery operation. The
device contains a low on-resistance, N-channel MOSFET that
supports more than 2 A of continuous current and minimizes
power loss. In addition, RDSON is constant independent of the VIN
voltage. The low 15 µA quiescent current and ultralow shutdown
current of 20 µA make the ADP1290 ideal for battery-operated
portable equipment. The built-in level shifter for enable logic
makes the ADP1290 compatible with many processors and
general-purpose input/output (GPIO) controllers.
In addition to operating performance, the ADP1290 occupies
minimal printed circuit board (PCB) space with an area of less
than 1.5 mm2 and a height of 0.60 mm.
The ADP1290 is available in an ultrasmall, 1 mm × 1.5 mm,
6-ball, 0.5 mm pitch WLCSP.
Rev. 0 Document Feedback
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responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
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Tel: 781.329.4700 ©2014 Analog Devices, Inc. All rights reserved.
Technical Support www.analog.com
ADP1290 Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Typical Applications Circuit ............................................................ 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Timing Diagram ........................................................................... 3
Absolute Maximum Ratings ............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution .................................................................................. 4
Pin Configuration and Function Descriptions ............................. 5
Typical Performance Characteristics ............................................. 6
Theory of Operation .........................................................................9
Applications Information .............................................................. 10
Capacitor Selection .................................................................... 10
Ground Current .......................................................................... 10
Enable Feature ............................................................................ 10
Timing ......................................................................................... 11
Current and Thermal Overload Precautions .......................... 11
Thermal Considerations ............................................................ 11
Outline Dimensions ....................................................................... 12
Ordering Guide .......................................................................... 12
REVISION HISTORY
12/14—Revision 0: Initial Version
Rev. 0 | Page 2 of 12
Data Sheet ADP1290
SPECIFICATIONS
VIN = 6.5 V, enable input voltage (VEN) = VIN, IOUT = 2 A, TA = 25°C, TJ = −40°C to +105°C for minimum/maximum specifications, unless
otherwise noted.
Table 1.
Parameter Symbol Test Conditions/Comments Min Typ Max Unit
INPUT VOLTAGE RANGE
V
IN
2.3
13.2
V
EN INPUT VIN = 2.3 V to 13.2 V
EN Input VIH 1.0 V
VIL 0.4 V
EN Input Pull-Down Current IEN 15 1000 nA
CURRENT
Ground (Quiescent) Current IGND VIN = 2.3 V 10 30 µA
VIN = 3.3 V 15 45 µA
VIN = 6.5 V 19 45 µA
VIN = 13.2 V 20 45 µA
Shutdown Current IOFF VEN = 0 V, VIN = 6.5 V, output = high impedance 2.0 µA
V
EN
= 0 V, output voltage (V
OUT
) = 0 V, V
IN
= 2.3 V to 13.2 V
4.0
µA
Continuous Operating Current IOUT VIN = 2.3 V to 13.2 V, TJ = <85°C 2 A
VIN TO VOUT RESISTANCE RDSON
V
IN
= 2.3 V
40
70
mΩ
VIN = 3.3 V 40 70 mΩ
VIN = 6.5 V 40 70 mΩ
VIN = 13.2 V 40 70 mΩ
VOUT TURN ON See Figure 2
Turn On Delay Time tON _DLY VIN = 5.5 V, CLOAD = 10 µF 250 µs
Turn On Rise Time tON_RISE VIN = 5.5 V, CLOAD = 10 µF 350 µs
Turn On Time tON Turn on delay time + turn on rise time 600 2000 µs
VOUT TURN OFF See Figure 2
Turn Off Delay Time tOFF_DLY VIN = 5.5 V, CLOAD = 10 µF, IOUT = 20 mA 125 µs
Turn Off Fall Time tOFF_FALL VIN = 5.5 V, CLOAD = 10 µF, IOUT = 20 mA 2000 µs
Turn Off Time
t
OFF
Turn off delay time + turn off fall time
2125
µs
SOURCE DRAIN BODY DIODE
Diode Forward Current ID VIN = 0 V, pulse width = 70 µs, duty cycle < 1%, VOUT = 0.9 V 4 6 A
TIMING DIAGRAM
V
EN
V
OUT
TURN O N
RISE
90%
10%
TURN O FF
DELAY
TURN O FF
FALL
TURN O N
DELAY
12529-002
Figure 2. Timing Diagram
Rev. 0 | Page 3 of 12
ADP1290 Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
VIN to GND −0.3 V to +16.5 V
VOUT to GND −0.3 V to VIN
EN to GND −0.3 V to +16.5 V
Continuous Drain Current
TJ = 70°C ±3 A
TJ = 105°C ±1.6 A
Continuous Diode Current −50 mA
Storage Temperature Range
−65°C to +150°C
Operating Junction Temperature Range −40°C to +105°C
Soldering Conditions JEDEC J-STD-020
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θJA is specified for the worst case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3 Thermal Resistance
Package Type θJA ΨJB Unit
6-Ball, 0.5 mm Pitch WLCSP 260 58 °C/W
ESD CAUTION
Rev. 0 | Page 4 of 12
Data Sheet ADP1290
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
VIN VOUT
1 2
VIN
A
BVOUT
ENC GND
TOP VIEW
(No t t o Scal e)
ADP1290
12529-003
Figure 3. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
A1, B1 VIN Input Voltage.
A2, B2 VOUT Output Voltage.
C1
EN
Enable Input. Drive the EN pin high to turn on the switch. Drive the EN pin low to turn off the switch.
C2 GND Ground.
Rev. 0 | Page 5 of 12
ADP1290 Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 6.5 V, VEN = VIN, CIN = COUT = 0 µF, TA = 25°C, unless otherwise noted.
0
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
–50 –30 –10 10 30 50 70 90 110
RDSON (Ω)
TEMPERATURE ( °C)
VIN = 2.3V
VIN = 5.0V
VIN = 6.5V
VIN = 12.0V
12529-004
Figure 4. RDSON vs. Temperature, 50 mA, Different Input Voltages (VIN)
0
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
RDSON (Ω)
12529-005
VIN = 2.3V
VIN = 5.0V
VIN = 6.5V
VIN = 12.0V
–50 –30 –10 10 30 50 70 90 110
TEMPERATURE ( °C)
Figure 5. RDSON vs. Temperature, 2 A, Different Input Voltages (VIN)
0.030
0.035
0.040
0.045
0.050
246810 12 14
RDS
ON
(Ω)
V
IN
(V)
I
LOAD
= 50mA
I
LOAD
= 100m A
I
LOAD
= 200m A
I
LOAD
= 500m A
I
LOAD
= 1000mA
I
LOAD
= 2000mA
12529-006
Figure 6. RDSON vs. Input Voltage (VIN), Different Load Currents (ILOAD)
0
10
20
30
40
50
60
70
80
90
100
246810 12 14
VOLTAGE DROP (mV)
V
IN
(V)
I
LOAD
= 50mA
I
LOAD
= 100m A
I
LOAD
= 200m A
I
LOAD
= 500m A
I
LOAD
= 1000mA
I
LOAD
= 2000mA
12529-007
Figure 7. Voltage Drop vs. Input Voltage (VIN), Different Load Currents (ILOAD)
0
1
2
3
4
5
6
7
8
9
10
–40 –5 25 85 105
GRO UND CURRE NT (µA)
TEMPERATURE ( °C)
12529-008
I
LOAD
= 100m A
I
LOAD
= 200m A
I
LOAD
= 500m A
I
LOAD
= 1000mA
I
LOAD
= 2000mA
Figure 8. Ground Current vs. Temperature, Different Load Currents,
VIN = 2.3 V
–40 –5 25 85 105
TEMPERATURE ( °C)
12529-009
0
5
10
15
20
25
GRO UND CURRE NT (µA)
I
LOAD
= 100m A
I
LOAD
= 200m A
I
LOAD
= 500m A
I
LOAD
= 1000mA
I
LOAD
= 2000mA
Figure 9. Ground Current vs. Temperature, Different Load Currents,
VIN = 6.5 V
Rev. 0 | Page 6 of 12
Data Sheet ADP1290
–40 –5 25 85 105
TEMPERATURE ( °C)
12529-010
0
5
10
15
20
25
GRO UND CURRE NT (µA)
I
LOAD
= 100m A
I
LOAD
= 200m A
I
LOAD
= 500m A
I
LOAD
= 1000mA
I
LOAD
= 2000mA
Figure 10. Ground Current vs. Temperature, Different Load Currents,
VIN = 13.2 V
0
5
10
15
20
25
10 100 1000 10000
I
LOAD
(mA)
GRO UND CURRE NT (µA)
V
IN
= 2.3V
V
IN
= 2.5V
V
IN
= 3.0V
V
IN
= 4.0V
V
IN
= 5.0V
V
IN
= 6.5V
V
IN
= 8.0V
V
IN
= 10.0V
V
IN
= 12.0V
V
IN
= 13.2V
12529-011
Figure 11. Ground Current vs. Load Current (ILOAD), Different Input Voltages (VIN)
–50 –30 –10 10 30 50 70 90 110
TEMPERATURE ( °C)
0.01
0.1
1
10
SHUT DO WN CURRENT (IOFF) (µA)
VIN = 2.3V
VIN = 2.5V
VIN = 3.0V
VIN = 4.0V
VIN = 5.0V
VIN
= 6.5V
V
IN
= 8.0V
V
IN
= 10.0V
V
IN
= 12.0V
V
IN
= 13.2V
12529-012
Figure 12. Ground Shutdown Current vs. Temperature, Output Open,
Different Input Voltages (VIN)
–50 –30 –10 10 30 50 70 90 110
TEMPERATURE ( °C)
0.01
0.10
1.00
SHUT DO WN CURRENT (IOFF) (µA)
VIN = 2.3V
VIN = 2.5V
VIN = 3.0V
VIN = 4.0V
VIN = 5.0V
VIN = 6.5V
VIN = 8.0V
V
IN
= 10.0V
V
IN
= 12.0V
V
IN
= 13.2V
12529-013
Figure 13. Ground Shutdown Current vs. Temperature, VOUT = 0 V,
Different Input Voltages (VIN)
12529-014
CH1 2.00V
BW
CH2 1.00V
BW
M400µs A CH4 1.04V
T 10.40%
2
1
3
EN
INPUT CURRENT
OUTPUT
CH3 200mAΩ
BW
Figure 14. Typical Turn On Time and Inrush Current, VIN = 2.3 V,
COUT = 100 μF, RLOAD = 100 Ω
12529-015
CH1 2.00V
BW
CH3 1.00AΩ
BW
CH2 2.00V
BW
M400µs A CH4 1.04V
T 10.40%
2
1
3
EN
INPUT CURRENT
OUTPUT
Figure 15. Typical Turn On Time and Inrush Current, VIN = 6.5 V,
COUT = 100 μF, RLOAD = 100 Ω
Rev. 0 | Page 7 of 12
ADP1290 Data Sheet
12529-016
CH1 2.00V
BW
CH3 1.00AΩ
BW
CH2 5.00V
BW
M400µs A CH4 1.04V
T 10.40%
2
1
3
EN
INPUT CURRENT
OUTPUT
Figure 16. Typical Turn On Time and Inrush Current, VIN = 13.2 V,
COUT = 100 μF, RLOAD = 100 Ω
12529-017
CH1 2.00V
BW
CH3 50.0mAΩ
BW
CH2 1.00V
BW
M400µs A CH4 1.04V
T 10.40%
2
1
3
Figure 17. Typical Turn On Time and Inrush Current, VIN = 2.3 V,
COUT = 10 μF, RLOAD = 100 Ω
12529-018
CH1 2.00V
BW
CH3 100mAΩ
BW
CH2 2.00V
BW
M400µs A CH4 1.04V
T 10.40%
2
1
3
EN
INPUT CURRENT
OUTPUT
Figure 18. Typical Turn On Time and Inrush Current, VIN = 6.5 V,
COUT = 10 μF, RLOAD = 100 Ω
12529-019
CH1 2.00V
BW
CH3 200mAΩ
BW
CH2 5.00V
BW
M400µs A CH4 1.04V
T 10.40%
2
1
3
EN
INPUT CURRENT
OUTPUT
Figure 19. Typical Turn On Time and Inrush Current, VIN = 13.2 V,
COUT = 10 μF, RLOAD = 100 Ω
Rev. 0 | Page 8 of 12
Data Sheet ADP1290
THEORY OF OPERATION
The ADP1290 is a high-side NMOS load switch, controlled by
an internal charge pump. The ADP1290 is designed to operate
with power supply voltages between 2.3 V and 13.2 V.
An internal charge pump biases the NMOS switch to achieve a
relatively constant, ultralow on resistance of 40 mΩ across the
entire input voltage range. The use of the internal charge pump
also allows controlled turn on times. Turning the NMOS switch on
and off is controlled by the enable input, EN, which is capable of
interfacing directly with 1.2 V logic signals.
GND
EN
VIN VOUT
12529-020
CHARGE P UM P
AND
SL EW RAT E CONT ROL
Figure 20. Functional Block Diagram
The ADP1290 is capable of 2 A of continuous current as long as
TJ is less than 85°C. Between 85°C and 105°C, the rated current
decreases linearly to 1.6 A.
ESD protection structures are shown in the block diagram as
Zener diodes.
The ADP1290 is a low quiescent current device with a weak 15 nA
pull-down current sink on its enable pin (EN).
The ADP1290 is available in a space-saving 1.0 mm × 1.5 mm,
0.5 mm pitch, 6-ball WLCSP.
Rev. 0 | Page 9 of 12
ADP1290 Data Sheet
APPLICATIONS INFORMATION
CAPACITOR SELECTION
Output Capacitor
The ADP1290 is designed for operation with small, space-
saving ceramic capacitors but functions with most commonly
used capacitors when the effective series resistance (ESR) value
is carefully considered. The ESR of the output capacitor affects
the response to load transients. A typical 1 µF capacitor with an
ESR of 0.1 Ω or less is recommended for good transient response.
Using a larger value of output capacitance improves the transient
response to large changes in load current.
Input Bypass Capacitor
Connecting at least 1 µF of capacitance from VIN to GND reduces
the circuit sensitivity to the PCB layout, especially when high
source impedance or long input traces are encountered. When
an output capacitance of greater than 1 µF is required, increase
the input capacitor to match it.
GROUND CURRENT
The major source for ground current in the ADP1290 is the
internal charge pump for the FET drive circuitry. Figure 21
shows the typical ground current when VEN = VIN and varies
from 2.3 V to 13.2 V.
0
5
10
15
20
25
2 4 6 8 10 12 14
INPUT VOLTAGE (V)
GRO UND CURRE NT (µA)
I
LOAD
= 100m A
I
LOAD
= 50mA
I
LOAD
= 200m A
I
LOAD
= 500m A
I
LOAD
= 1000mA
I
LOAD
= 2000mA
12529-021
Figure 21. Ground Current vs. Input Voltage (VIN), Different Load Currents (ILOAD)
ENABLE FEATURE
The ADP1290 uses the EN pin to enable and disable the VOUT
pin under normal operating conditions. As shown in Figure 22,
when a rising voltage (VEN) on the EN pin crosses the active
threshold, the VOUT pin turns on. When a falling voltage (VEN)
on the EN pin crosses the inactive threshold, the VOUT pin
turns off.
0
1
2
3
4
5
6
0.50 0.55 0.60 0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00
V
OUT
(V)
ENABL E V OLTAGE (V)
V
EN
RISING
V
EN
FALLING
12529-022
V
OUT
AT 2.3V
V
OUT
AT5.0V
Figure 22. Typical EN Operation
As shown in Figure 22, the EN pin has hysteresis built into it.
The hysteresis prevents on/off oscillations that can occur due to
noise on the EN pin as it passes through the threshold points.
The EN pin rising and falling thresholds derive from the VIN
voltage; therefore, these thresholds vary with the changing input
voltage. Figure 23 shows the typical EN rising and falling
thresholds when the input voltage varies from 2.3 V to 13.2 V.
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
2 4 6 8 10 12 14
ENABL E THRES HOL D ( V )
V
IN
(V)
EN RISE
EN FALL
12529-023
Figure 23. Typical EN Thresholds (Rising and Falling) vs. Input Voltage (VIN)
Rev. 0 | Page 10 of 12
Data Sheet ADP1290
TIMING
Turn on delay is defined as the interval between the time that
VEN exceeds the rising threshold voltage and when VOUT rises to
~10% of its final value. The ADP1290 includes circuitry that has
a typical 250 μs turn on delay and a controlled rise time to limit
the VIN inrush current. As shown in Figure 24 and Figure 25,
the turn on delay is nearly independent of the input voltage.
12529-024
CH1 2.00V BW
CH3 100mAΩ BW
CH2 2.00V BWM400µs A CH4 1.04V
T 10.40%
2
1
3
EN
INPUT CURRENT
OUTPUT
Figure 24. Typical Turn On Time and Inrush Current, VIN = 2.5 V,
COUT = 10 μF, RLOAD = 100 Ω
12529-025
CH1 2.00V
BW
CH3 200mAΩ
BW
CH2 5.00V
BW
M400µs A CH4 1.04V
T 10.40%
2
1
3
EN
INPUT CURRENT
OUTPUT
Figure 25. Typical Turn On Time and Inrush Current, VIN = 6.5 V,
COUT = 10 μF, RLOAD = 100 Ω
The rise time is defined as the time it takes the output voltage
to rise from 10% to 90% of VOUT reaching its final value. The turn
on delay is dependent on the rise time of the internal charge pump.
For very large values of output capacitance, the RC time constant
(where C is the load capacitance, CLOAD, and R is the RDSON||RLOAD)
can become a factor in the rise time of the output voltage. Because
RDSON is much smaller than RLOAD, an adequate approximation for
RC is RDSON × CLOAD. An input or load capacitor is not required for
the ADP1290; however, capacitors can suppress noise on the board.
The turn off time is defined as the time it takes for the output
voltage to fall from 90% to 10% of VOUT reaching its final value. The
turn off time is also dependent on the RC time constant of the
output capacitance (CLOAD) and load resistance (RLOAD).
Figure 26 and Figure 27 show the typical turn off times with
VIN = 6.5 V, COUT = 10 μF and 100 μF, and RLOAD = 100 Ω.
12529-026
CH1 2.00V
BW
CH2 2.00V
BW
M400µs A CH4 1.04V
T 10.40%
2
1
EN
OUTPUT
Figure 26. Typical Turn Off Time, COUT = 10 μF, RLOAD = 100 Ω
12529-027
CH1 1.00V
BW
CH2 2.00V
BW
M400µs A CH4 1.08V
T 10.40%
2
1
EN
OUTPUT
Figure 27. Typical Turn Off Time, COUT = 100 μF, RLOAD = 100 Ω
CURRENT AND THERMAL OVERLOAD
PRECAUTIONS
The ADP1290 is not protected against damage due to excessive
power dissipation and does not have thermal overload protection
circuits. To prevent permanent damage, never allow current
through the ADP1290 to exceed its rated value for more than a
few milliseconds. Permanent damage can also occur if the
output is shorted to ground
THERMAL CONSIDERATIONS
To guarantee reliable operation, the junction temperature of the
ADP1290 must not exceed 105°C. To ensure that the junction
temperature stays below this maximum value, the user must be
aware of the parameters that contribute to junction temperature
changes. These parameters include ambient temperature, power
dissipation in the power device, and thermal resistances between
the junction and ambient air (θJA). The θJA number is dependent
on the package assembly and the amount of copper used to solder
the package pins to the PCB.
Rev. 0 | Page 11 of 12
ADP1290 Data Sheet
OUTLINE DIMENSIONS
11-08-2012-B
A
B
C
0.675
0.595
0.515
0.380
0.355
0.330
0.270
0.240
0.210
1.000
0.950
0.900
1.500
1.450
1.400
12
BOTTOM VIEW
(BALL SI DE UP)
TOP VIEW
(BALL SI DE DOW N)
SIDE VIEW
0.345
0.295
0.245
1.00
REF
0.50
BSC
BALLA1
IDENTIFIER
SEATING
PLANE
0.50 BSC
COPLANARITY
0.075
Figure 28. 6-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-6-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model1 Temperature Range Package Description Package Option Branding
ADP1290ACBZ-R7 −40°C to +105°C 6-Ball Wafer Level Chip Scale Package [WLCSP] CB-6-2 CL
ADP1290CB-EVALZ Evaluation Board
1 Z = RoHS Compliant Part.
©2014 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D12529-0-12/14(0)
Rev. 0 | Page 12 of 12
