© Semiconductor Components Industries, LLC, 2017
August, 2019 Rev. 2
1Publication Order Number:
FAN53713/D
FAN53713
1.5 A Synchronous Buck
Regulator
Description
The FAN53713 is a Super Low Iq, stepdown switching voltage
regulator, that delivers a fixed output from an input voltage supply of
2.3 V to 5.5 V. Using a proprietary architecture with synchronous
rectification, the FAN53713 is capable of delivering a peak efficiency
of 93%, while maintaining efficiency over 90% at load currents as low
as 1 mA.
The regulator operates with 0402 and 0603 input and output
capacitors, respectively, which reduces the total solution size to
5.5 mm2. At moderate and light load, Pulse Frequency Modulation
(PFM) is used to operate the device with a low quiescent current. Even
with such a low quiescent current, the part exhibits excellent transient
response during load swings. In Shutdown Mode, the supply current
drops to 100 nA, reducing power consumption. The Mode pin allows
the part to be in a Super Low IQ (SLIQ) mode with a typical quiescent
current of 2 mA.
The FAN53713 is available in 6bump, 0.4 mm pitch, WaferLevel
ChipScale Package (WLCSP).
Features
2 mA Typical Quiescent Current
5.5 mm2 Total Solution Size
1.5 A Output Current Capability
0.6 V to 1.8 V Fixed Output Voltage
2.3 V to 5.5 V Input Voltage Range
BestinClass Load Transient Response
BestinClass Efficiency with Sub 1 mA Output Currents
Internal SoftStart Limits Battery Current Below 150 mA to avoid
Brownout Scenarios
Protection Faults (UVLO, OCP and OTP)
Thermal Shutdown and Overload Protection
6Bump WLCSP, 0.4 mm Pitch
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
Applications
Wearables
Smart Watch
Health Monitoring
Sensor Drive
Energy Harvesting
Utility and Safety Modules
RF Modules
www.onsemi.com
See detailed ordering and shipping information on page 2 of
this data sheet.
ORDERING INFORMATION
WLCSP6 1.38 0.94 0.625
CASE 567UH
MARKING DIAGRAM
12KK
XYZ
12 = Alphanumeric Device Marking
KK = Lot Run Code
X = Alphabetical Year Code
Y = 2 Weeks Date Code
Z = Assembly Plant Code
FAN53713
FB
L1
MODE
EN GND
SW
22 mF
COUT
VOUT
1.0 mH
2.2 mF
VIN
CIN
Figure 1. Typical Application
FAN53713
www.onsemi.com
2
Table 1. ORDERING INFORMATION
Part Number
Output Voltage
(Note 1)
Max. Output
Current (Note 1)
Temperature
Range Package
Packing
Method
Device
Marking
FAN53713UC02X 0.7 V 1.5 A 40 to 85°C WLCSP Tape & Reel GJ
FAN53713UC10X
(In Development)
1.1 V 1.5 A 40 to 85°C WLCSP Tape & Reel LE
1. Other voltage and output current options are available. Contact an On Semiconductor representative.
Table 2. RECOMMENDED EXTERNAL COMPONENTS
Component Description Vendor Parameter Typ. Unit
L1.0 mH, 20%, 2.3 A, 107 mW, 1608 DFE160810S1R0M (Murata) L 1.0 mH
CIN 2.2 mF, 20%, 6.3 V, X5R, 0402 C1005X5R0J225M050BC (TDK) C 2.2 mF
COUT (Note 1) 22 mF, 20%, 6.3 V, X5R, 0603 C1608X5R0J226M080AC (TDK) C 22
1. A 10 mF, 0402 capacitor can be used to reduce total solution size at the expense of load transient performance.
Pin Configuration
Figure 2. Top View
C1
B1
A1
C2
B2
A2 EN
MODE
FB
VIN
SW
GND
C1
B1
A1
C2
B2
A2 VIN
SW
GND
EN
MODE
FB
Figure 3. Bottom View
Table 3. PIN DEFINITIONS
Pin # Name Description
A1 EN Enable. The device is in Shutdown Mode when voltage to this pin is <0.4 V and enabled
when >1.2 V. Do not leave this pin floating. Recommended for GPIO 1.8 V to drive this pin
A2 VIN Input Voltage. Connect to input power source across CIN
B1 MODE MODE. Logic “LOW” allows the IC to be in a Super Low IQ (SLIQ) state. A Logic HIGH
allows the part to be in normal Iq state Auto Mode
B2 SW Switching Node. Connect to SW pad of inductor
C1 FB Feedback. Connect to positive side of output capacitor
C2 GND Ground. Power and IC ground. All signals are referenced to this pin
Table 4. ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Min. Max. Unit
VIN Input Voltage 0.3 6.5 V
VSW Voltage on SW Pin 0.3 VIN + 0.3 (Note 1) V
VCTRL EN, FB and Mode Pin Voltage 0.3 VIN + 0.3 (Note 1) V
ESD Human Body Model per JESD22A114 2.0 kV
Charged Device Model per JESD22C101 1.0
TJJunction Temperature 40 +150 °C
TSTG Storage Temperature 40 +150 °C
TLLead Soldering Temperature, 10 Seconds +260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Lesser of 6 V or VIN + 0.3 V.
FAN53713
www.onsemi.com
3
Table 5. RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min. Typ. Max. Unit
VIN Supply Voltage Range 2.3 5.5 V
IOUT Continuous Output Current 0 1.5 A
Pulsed Output Current, 100 ms0 1.6 A
CIN Input Capacitor 2.2 mF
COUT (Note 1) Output Capacitor 3 100 mF
L Inductor 0.47 1.0 1.3 mH
TAOperating Ambient Temperature 40 +85 °C
TJOperating Junction Temperature 40 +125 °C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Effective capacitance after DC bias.
Table 6. THERMAL PROPERTIES
Symbol Parameter Min. Typ. Max. Unit
θJA JunctiontoAmbient Thermal Resistance (Note 1) 125 °C/W
1. Junctiontoambient thermal resistance is a function of application and board layout. This data is simulated with fourlayer 2s2p boards with
vias in accordance to JESD51 JEDEC standard. Special attention must be paid not to exceed the junction temperature.
Table 7. ELECTRICAL CHARACTERISTICS Minimum and Maximum Values are at VIN = VEN = 3.6 V, TA = 40°C to
+85°C, unless otherwise noted. Typical values are at TA = 25°C, VIN = VEN = 3.6 V, VOUT = 1.8 V
Symbol Parameter Condition Min. Typ. Max. Unit
IQ,SLIQ Quiescent Current SLIQ Mode, no load, nonswitching 2mA
IQ,PFM PFM Quiescent Current PFM Mode, no load, nonswitching 5mA
ISD Shutdown Supply Current EN=GND, VIN=3.6 V, no load 100 nA
VUVLO_RISE UnderVoltage Lockout Threshold VIN Rising 2.10 2.15 2.21 V
VUVLO_FALL VIN Falling 2.00 2.05 2.10 V
VIH HIGHLevel Input Voltage 1.2 V
VIL LOWLevel Input Voltage 0.4 V
ILIM Peak Current Limit VIN = 4.35 V 2215 mA
VOACC Output Voltage Accuracy VOUT = 0.6 V to 1.8 V, IOUT(DC) = 0,
PWM Mode
25 +25 mV
VOUT = 0.6 V to 1.8 V, IOUT(DC )= 0,
PFM Mode
40 +40 mV
RDS(on) PMOS On Resistance VIN = VGS = 3.6 V 135 mW
NMOS On Resistance VIN = VGS = 3.6 V 95 mW
TTSD Thermal Shutdown 150 °C
THYS Thermal Shutdown Hysteresis 15 °C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
FAN53713
www.onsemi.com
4
Table 8. SYSTEM CHARACTERISTICS The following system characteristics are guaranteed by design and are not performed in
production testing. Recommended operating conditions, unless otherwise noted, VIN = 2.3 V to 5.5 V, TA = 40°C to +85°C, VOUT = 1.8
V. Typical values are given at TA = 25°C, VIN = 3.6 V. System characteristics are based on circuit per Figure 1.
L = 1.0 mH, 2.3 A, 107 mW DCR, DFE160810S1R0M (Murata), CIN = 1 × 2.2 mF, 6.3 V, 0402 (1005 metric), C1005X5R0J225M050BC
(TDK) and COUT = 1 × 22 mF, 6.3 V, 0603 (1608 metric), C1608X5R0J226M080AC (TDK).
Symbol Parameter Condition Min. Typ. Max. Unit
LOADREG Load Regulation IOUT = 10 mA to 1 mA, SLIQ Mode 9.0 mV/mA
IOUT = 200 mA to 300 mA, PWM 2.0 mV/A
LINEREG Line Regulation 3.0 V VIN 4.35 V,
IOUT = 1 A, PWM
0.5mV/V
VOUT_RIPPLE Ripple Voltage IOUT = 250 mA, SLIQ Mode 40 mV
IOUT = 20 mA, PFM Mode 25
IOUT = 200 mA, PWM Mode 5
Eff Efficiency IOUT = 100 mA, SLIQ Mode 88 %
IOUT = 500 mA, SLIQ Mode 91
IOUT = 1 mA, PFM Mode 90
IOUT = 100 mA, PFM Mode 91
IOUT = 300 mA, PWM Mode 91
Eff Efficiency IOUT = 500 mA, PWM Mode 90%
IOUT = 700 mA, PWM Mode 88
ΔVOUT_LOAD Load Transient IOUT = 10 mA 150 mA,
TR = TF = 1 ms, Auto Mode
±40 mV
IOUT = 100 mA 500 mA,
TR = TF = 1 ms, SLIQ Mode
±15 mV
ΔVOUT_LINE Line Transient VIN = 3.0 V 3.6 V, TR = TF = 10 ms,
IOUT = 300 mA, PWM Mode
±20 mV
FAN53713
www.onsemi.com
5
Typical Characteristics
Unless otherwise specified, VIN = 3.6 V, VOUT = 1.8 V, Auto Mode, TA = 25°C; circuit and components according to Figure 1 and Table 2.
70%
74%
78%
82%
86%
90%
94%
1 10 100
Efficiency
Load Current (mA)
70%
74%
78%
82%
86%
90%
94%
1 10 100 1,000
Efficiency
Load Current (mA)
50%
55%
60%
65%
70%
75%
80%
85%
90%
95%
0.01 0.10 1.00
Efficiency
Load Current (mA)
50%
55%
60%
65%
70%
75%
80%
85%
90%
95%
0.01 0.10 1.00
Efficiency
Load Current (mA)
0
500
1,000
1,500
2,000
2,500
3,000
0 250 500 750 1000 1250 1500
Switching Frequency (KHz)
Load Current (mA)
0
10
20
30
40
50
60
0 250 500 750 1000 1250 1500
Output Ripple (mVpp)
Load Current (mA)
1,000
VIN = 2.5 V
VIN = 3.0 V
VIN = 3.6 V
VIN = 4.2 V
VIN = 5.0 V
VIN = 2.5 V
VIN = 3.0 V
VIN = 3.6 V
VIN = 4.2 V
VIN = 5.0 V
40°C
+25
+85
°C
°C
40°C
+25
+85
°C
°C
VIN = 2.5 V
VIN = 3.0 V
VIN = 3.6 V
VIN = 4.2 V
Figure 4. Efficiency vs. Load Current and Input
Voltage, VOUT = 1.8 V, Auto Mode
Figure 5. Efficiency vs. Load Current and
Temperature, VIN = 3.6 V , VOUT = 1.8 V, Auto Mode
Figure 6. Efficiency vs. Load Current and Input Voltage,
VOUT = 1.8 V, SLIQ Mode
Figure 7. Efficiency vs. Load Current and
Temperature, VIN = 3.6 V , VOUT = 1.8 V, SLIQ Mode
Figure 8. Frequency vs. Load Current and Input Voltage,
Auto Mode, VOUT = 1.8 V, Auto Mode
Figure 9. Output Ripple vs. Load Current and
Input Voltage, VOUT = 1.8 V, Auto Mode
VIN = 2.5 V
VIN = 3.0 V
VIN = 3.6 V
VIN = 4.2 V
FAN53713
www.onsemi.com
6
Typical Characteristics (continued)
Unless otherwise specified, VIN = 3.6 V, VOUT = 1.8 V, Auto Mode, TA = 25°C; circuit and components according to Figure 1 and Table 2.
2
3
4
5
6
7
8
2.3 2.8 3.3 3.8 4.3 4.8 5.3
Input Voltage (V)
Input Current (mA)
Input Current (mA)
Input Current (mA)
1.0
0.5
0.0
0.5
1.0
1.5
2.0
0 250 500 750 1000 1250 1500
Output Regulation (%)
Load Current (mA)
2.0
1.5
1.0
0.5
0.0
0.5
1.0
1.5
2.0
0 250 500 750 1000 1250 1500
Output Regulation (%)
Load Current (mA)
0
1
2
3
4
2.3 2.8 3.3 3.8 4.3 4.8 5.3
Input Voltage (V)
405C
+255C
+855C
0.0
0.1
0.2
0.3
0.4
0.5
2.3 2.8 3.3 3.8 4.3 4.8 5.3
Input Voltage (V)
Figure 10. Output Regulation vs. Load Current and
Input Voltage, VOUT = 1.8 V, Auto Mode
Figure 11. Output Regulation vs. Load Current and
Temperature, VIN = 3.6 V, VOUT = 1.8 V, Auto Mode
Figure 12. Quiescent Current vs. Input Voltage and
Temperature, VOUT = 1.8 V, Auto Mode
Figure 13. Quiescent Current vs. Input Voltage and
Temperature, VOUT = 1.8 V, SLIQ Mode
Figure 14. Shutdown Current vs. Input Voltage
and Temperature
Figure 15. Load Transient, VIN = 3.6 V, VOUT = 1.8 V,
10 mA 150 mA, 1 ms Edge, Auto Mode
40°C
+25°C
+85°C
40°C
+25°C
+85°C
40°C
+25°C
+85°C
40°C
+25°C
+85°C
VIN = 2.5 V
VIN = 3.0 V
VIN = 3.6 V
VIN = 4.2 V
VIN = 5.0 V
FAN53713
www.onsemi.com
7
Typical Characteristics (continued)
Unless otherwise specified, VIN = 3.6 V, VOUT = 1.8 V, Auto Mode, TA = 25°C; circuit and components according to Figure 1 and Table 2.
Figure 16. Load Transient, VIN = 3.6 V, VOUT = 1.8 V,
5 mA 300 mA, 1 ms Edge, Auto Mode
Figure 17. Load Transient, VIN = 3.6 V, VOUT = 1.8 V,
100 mA 300 mA, 1 ms Edge, Auto Mode
Figure 18. Load Transient, VIN = 3.6 V, VOUT = 1.8 V,
10 mA 1500 mA, 1 ms Edge, Auto Mode
Figure 19. Line Transient, VIN = 3.0 V 3.6 V,
VOUT = 1.8 V, 10 ms Edge, 300 mA Load, Auto Mode
Figure 20. Startup, VIN= 3.6 V, VOUT= 1.8 V,
50 mA Resistive Load, Auto Mode
Figure 21. Startup, VIN= 3.6 V, VOUT= 1.8 V,
300 mA Resistive Load, Auto Mode
FAN53713
www.onsemi.com
8
Operation Description
The FAN53713 is a Super Low Iq (SLIQ), stepdown
switching voltage regulator, typically operating at 2.5 MHz
in Continuous Conduction Mode(CCM). Using a
proprietary architecture with synchronous rectification, the
FAN53713 is capable of delivering a peak efficiency of
93%, while maintaining efficiency over 90% at load currents
sub 1mA.
In SLIQ mode the device is very efficient with load
currents in the uA range. In SLIQ mode the device draws less
than 2 mA typical from the battery with no load. The load
transients in SLIQ mode are best in class.
The FAN53713 provides a fixed output voltage of 0.6 V
to 1.8 V and load capability of 1.5 A, which can support
wearable or mobile phone applications which use LiIon
batteries. Specialized softstart limits the battery current to
150 mA to limit any brown out occurrences.
Control Scheme
Enable and Disable
When EN pin is Low, all circuits are off and the IC draws
100 nA current. When EN is High and VIN is above its
UVLO threshold, the regulator begins a softstart cycle. The
FAN53713 has internal softstart which limits the battery
current draw to 150 mA. Once the part reaches 95% of VOUT
target, the part will transition to the correct mode of
operation depending on load current. The part starts up
within 400 ms typical with the recommended external
components listed in Table 2.
MODE Pin
Setting Mode Pin Low sets the device in SLIQ mode;
setting Mode Pin High sets the device in normal Iq Auto
Mode.
Protection Features
VOUT Fault
If the VOUT fails to reach 95% of VOUT target within 1.8
ms during startup, a VOUT fault is declared. During the fault
condition the part restarts every 20 ms to achieve the 95%
target voltage. Once the output voltage reaches the 95%
VOUT target voltage within 1.8 ms during startup, the VOUT
fault clears.
OverCurrent Protection (OCP)
A heavy load or short circuit on the output causes the
current in the inductor to increase until a maximum current
threshold is reached in the highside switch. Upon reaching
this point, the highside switch turns off, preventing high
currents from causing damage. The regulator continues to
limit the current cyclebycycle. After 500 ms of current
limit, the regulator triggers an overcurrent fault, causing
the regulator to shut down for about 20 ms before attempting
a restart.
UnderVoltage Lockout (UVLO)
When EN is HIGH, the undervoltage lockout keeps the
part from operating until the input supply voltage rises high
enough to properly operate. This ensures no misbehavior of
the regulator during startup or shutdown.
OverTemperature Protection (OTP)
When the die temperature increases, due to a high load
condition and/or a high ambient temperature, the output
switching is disabled until the die temperature falls
sufficiently. The junction temperature at which the thermal
shutdown activates is nominally 150°C with a 15°C
hysteresis. Once the junction temperature falls below the
hysteresis threshold, the regulator performs a softstart.
Modes of Operations
SLIQ (Super Low IQ)
In SLIQ Mode the device acts in a modified PFM mode
with a super low Iq state. The part draws 2 mA with no load.
The part enters SLIQ Mode when the Mode pin is set to
logic “LOW”. Before pulling the Mode Pin Low, the load
current should drop below 1 mA to maintain output voltage
regulation in SLIQ mode. The maximum load current in
SLIQ Mode that the device can support is 1 mA. If load
current exceeds 1 mA, it is recommended to place part in
Auto Mode by pulling Mode pin High so that the device can
support more current.
The part can support more than 1 mA in SLIQ Mode if the
output capacitor is increased.
PFM
At light load operation in Auto Mode, the device enters
PFM mode when load current is below 100 mA typically.
PFM mode reduces switching frequency as well as battery
current draw, which yields high efficiency.
When Mode pin goes High, the part will transition from
SLIQ Mode into normal PFM mode within 10 ms, typically.
PWM
When load is high, the part transitions smoothly from
PFM mode to PWM mode. The part enters PWM mode
when load current exceeds 132 mA, typically.
FAN53713
www.onsemi.com
9
Applications Information
Selecting the Inductor
The output inductor must meet both the required
inductance and the energy-handling capability of the
application. The inductor value affects average current limit,
output voltage ripple, and efficiency.
The ripple current (ΔI) of the regulator is:
DIVOUT
VIN ǒVIN *VOUT
L fSW Ǔ(eq. 1)
The maximum average load current, IMAX(LOAD), is
related to the peak current limit, ILIM(PK), by the ripple
current, given by:
IMAX(LOAD) +ILIM(PK) *DI
2(eq. 2)
The transition between PFM and PWM operation is
determined by the point at which the inductor valley current
crosses zero. The regulator DC current when the inductor
current crosses zero, IDCM, is:
IDCM +DI
2(eq. 3)
The FAN53713 is optimized for operation with L =
1.0 mH, but is stable with inductances up to 1.3 H (nominal).
The inductor should be rated to maintain at least 80% of its
value at ILIM(PK).
Efficiency is affected by the inductor DCR and inductance
value. Decreasing the inductor value for a given physical
size typically decreases the DCR; but because DI increases,
the RMS current increases, as do the core and skin effect
losses.
IRMS +IOUT(DC)
2
Ǹ)DI2
12 (eq. 4)
The increased RMS current produces higher losses
through the RDS(ON) of the IC MOSFETs, as well as the
inductor DCR.
Increasing the inductor value produces lower RMS
currents, but degrades transient response. For a given
physical inductor size, increased inductance usually results
in an inductor with lower saturation current and higher DCR.
Table 3 shows the effects of inductance higher or lower
than the recommended 1.0 mH on regulator performance.
Output Capacitor
Increasing COUT has no effect on loop stability and can
therefore be increased to reduce output voltage ripple or to
improve transient response. Vice versa, lower COUT can be
used but with a compromise of load transient response.
Output voltage ripple, ΔVOUT, is:
DVOUT +DILƪfSW COUT ESR2
2 D (1 *D) )1
8 FSW COUTƫ(eq. 5)
Input Capacitor
The 2.2 mF ceramic input capacitor should be placed as
close as possible between the VIN pin and GND to minimize
the parasitic inductance. If a long wire is used to bring power
to the IC, additional “bulk” capacitance (electrolytic or
tantalum) should be placed between CIN and the power
source lead to reduce the ringing that can occur between the
inductance of the power source leads and CIN.
The effective capacitance value decreases as VIN
increases due to DC bias effects.
PCB Layout Guidelines
1. The input capacitor (CIN) should be connected as
close as possible to the VIN and GND pins
Connect to VIN and GND using only top metal.
Do not route through vias (see Figure 22)
2. Place the inductor (L) as close as possible to the
IC. Use short wide traces for the main current
paths
3. An output capacitor (COUT) should be placed as
close as possible to the IC. Connection to GND
should only be on top metal. Feedback signal
connection to VOUT should be routed away from
noisy components and traces (e.g. SW line)
Table 9. EFFECTS OF CHANGES in Inductor Value (from 1.0 mH Recommended Value) on Regulator Performance
Inductor Value IMAX(LOAD) DVOUT Transient Response
Increase Increase Decrease Degraded
Decrease Decrease Increase Improved
FAN53713
www.onsemi.com
10
Figure 22. Top Layer
Connect VIN pin and CIN using only top metal.
Connect COUT and GND pin only on top layer
Put as many as possible vias connected to
ground plane (Layer 2), to help dissipate heat.
Connect GND vias to system ground
The ground area should be made as large as
possible to help dissipate heat
VOUT trace should be as wide and as short
as possible, for low impedance, also should
be routed away from noisy components and
traces (e.g. SW line)
Figure 23. Layer 1
Layer 2 should be a solid ground layer, to
shield VOUT from capacitive coupling of the
fast edges of SW node.
Logic signals can be routed on this layer.
Figure 24. Layer 3
SW trace should be as wide and as short as
possible, and be isolated with GND area from
any other sensitive traces.
WLCSP6 1.38x0.94x0.625
CASE 567UH
ISSUE O
DATE 31 APR 2017
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98AON13465G
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
WLCSP6 1.38x0.94x0.625
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
www.onsemi.com
1
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
TECHNICAL SUPPORT
North American Technical Support:
Voice Mail: 1 8002829855 Toll Free USA/Canada
Phone: 011 421 33 790 2910
LITERATURE FULFILLMENT:
Email Requests to: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Europe, Middle East and Africa Technical Support:
Phone: 00421 33 790 2910
For additional information, please contact your local Sales Representative