Recommended Land Pattern 0.039 0.006 1 0.15 Solder-resister 0.020 0.006 0.50 0.15 0.020 0.006 0.50 0.15 0.022 0.55 Chip Bead 0.020 0.50 Part Name Material 1 Base Material Ferrite 2 InternalConductor Ag 3 Pull out Electrode Ag 4 Terminal Electrode Ag (Innerlayer) Ni-Sn (Outerlayer) 0.022 0.55 Land Pattern structure of Electro-plating 0.010 0.004 TYP. 0.25 0.10 Materials sn Ferrite Ni Side View Ag UNLESS OTHERWISE SPECIFIED: DIMENSIONS ARE IN INCH(MM) SURFACE FINISH: TOLERANCES: LINEAR: ANGULAR: Top View NAME DRAWN SAAZVAT CHK'D XXXXXX DEBUR AND BREAK SHARP EDGES FINISH: SIGNATURE DO NOT SCALE DRAWING 2 3 4 Q.A - 30332 Esperanza, Rancho Santa margarita, California 92688 TITLE: MFG TOP PACKAGE MARKING IS FOR ILLUSTRATION PURPOSES ONLY REVISION DATE APPV'D 1 0.020 0.50 MATERIAL: WEIGHT: DWG NO. SCALE:85:1 Bead ACML-0402H SHEET 1 OF 1 A3