0.020
0.50
0.020
0.50
0.022
0.55
0.022
0.55
0.020 ±0.006
0.50 ±0.15
0.039 ±0.006
1 ±0.15
0.020 ±0.006
0.50 ±0.15
0.010 ±0.004
0.25 ±0.10
TYP.
Chip Bead
Land Pattern
Solder-resister
Recommended Land Pattern
Materials
Top View
Side View
1234
structure of
Electro-plating
sn
Ni
Ag
Ferrite
Part Name
Material
1
Base Material
Ferrite
2
InternalConductor
Ag
3
Pull out Electrode
Ag
4
Terminal Electrode
Ag (Innerlayer)
Ni-Sn (Outerlayer)
-
ACML-0402H
XXXXXX
SAAZVAT
WEIGHT:
A3
SHEET 1 OF 1
SCALE:85:1
DWG NO.
TITLE:
REVISION
DO NOT SCALE DRAWING
MATERIAL:
DATE
SIGNATURE
NAME
DEBUR AND
BREAK SHARP
EDGES
FINISH:
UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE IN INCH(MM)
SURFACE FINISH:
TOLERANCES:
LINEAR:
ANGULAR:
Q.A
MFG
APPV'D
CHK'D
DRAWN
30332 Esperanza, Rancho Santa margarita, California 92688
Bead
TOP PACKAGE MARKING IS
FOR ILLUSTRATION PURPOSES ONLY