CRCW0100330RJREL - VISHAY - Datasheet.Live

CRCW01005 e3

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Revision: 06-Nov-13 1Document Number: 20056

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Standard Thick Film Chip Resistors

FEATURES

• Very small standard size (0.4 mm x 0.2 mm)

•Low tolerance (1 %)

• Material categorization:

For definitions of compliance please see

www.vishay.com/doc?99912

Notes

• These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over

operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.

• Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.

Note

(1) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the

printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 125 °C is not exceeded.

STANDARD ELECTRICAL SPECIFICATIONS

TYPE

CASE

SIZE

IMPERIAL

CASE

SIZE

METRIC

POWER RATING

P70

LIMITING

ELEMENT

VOLTAGE

Umax.

ACRMS/DC

TEMPERATURE

COEFFICIENT

ppm/K

TOLERANCE

RESISTANCE

RANGE



SERIES

CRCW01005 01005 RR0402M

0.031 15

± 250

± 1

10.0 to 1M

E24; E96

± 2, ± 5 E24

-200/+600

± 1 1.0 to 9.76 E24; E96

± 2, ± 5 1.0 to 9.1 E24

Zero-Ohm-Resistor: Rmax. = 50 m, Imax. = 0.5 A

TECHNICAL SPECIFICATIONS

PARAMETER UNIT CRCW01005

Rated Dissipation P70 (1) W 0.031

Operating Voltage Umax. ACRMS/DC V 15

Insulation Voltage Uins (1 min) V 30

Insulation Resistance > 109

Operating Temperature Range °C -55 to +125

Mass mg 0.07

CRCW01005 e3

www.vishay.com Vishay

Revision: 06-Nov-13 2Document Number: 20056

For technical questions, contact: thickfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

DIMENSIONS in millimeters

Note

• No marking for 01005 size.

DERATING

PART NUMBER AND PRODUCT DESCRIPTION

PART NUMBER: CRCW01001K00FREL

TYPE VALUE TOLERANCE TCR PACKAGING

CRCW0100 R = Decimal

K = Thousand

M = Million

0000 = Jumper

F = ± 1.0 %

G = ± 2.0 %

J = ± 5.0 %

Z = Jumper

R = ± 250 ppm/K

Y = -200 ppm/K/+600 ppm/K

0 = Jumper

PRODUCT DESCRIPTION: CRCW01005 250 1K0 1 % ET3 e3

CRCW01005 250 1K0 1 % ET3 e3

TYPE TCR RESISTANCE

VALUE

TOLERANCE

VALUE PACKAGING LEAD (Pb)-FREE

CRCW01005 ± 250 ppm/K

-200/+600 ppm/K

1R0 = 1 

10R = 10 

1K0 = 1 k

10K = 10 k

1M0 = 1 M

0R0 = Jumper

± 1 %

± 2 %

± 5 %

ET3 e3 = Pure tin

termination finish

PACKAGING

TYPE CODE QUANTITY CARRIER TAPE WIDTH PITCH REEL DIAMETER

CRCW01005 EL = ET3 20 000 Paper tape acc. to IEC 60286-3, Type 1a 8 mm 2 mm 180 mm/7"

SIZE DIMENSIONS RECOMMENDED SOLDER PAD

DIMENSIONS

IMPERIAL METRIC L W H T1 T2 a b l

01005 RR0402M 0.4 ± 0.02 0.2 ± 0.02 0.13 ± 0.02 0.10 ± 0.03 0.10 ± 0.03 0.15 0.2 0.2

- 50 0 50 100 150

70 125

Ambient Temperature amb in °C

Fraction of Rated Dissipation P70 in %

100

C R C W 0 1 0 0 1 K 0 0 F R E L

CRCW01005 e3

www.vishay.com Vishay

Revision: 06-Nov-13 3Document Number: 20056

For technical questions, contact: thickfilmchip@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

All tests are carried out in accordance with the following specifications:

• EN 60115-1, generic specification

• EN 140400, sectional specification

• EN 140401-802, detail specification

• IEC 60068-2-x, environmental test procedures

Packaging of components is done in paper tapes according to IEC 60286-3.

TEST PROCEDURES AND REQUIREMENTS

EN 60115-1

CLAUSE

IEC

60068-2

TEST

METHOD

TEST

PROCEDURE

REQUIREMENTS

PERMISSIBLE CHANGE (R)

STABILITY CLASS 1 OR BETTER

Stability for product types:

1  to 1 M

CRCW01005 e3

4.5 - Resistance - ± 1 %; ± 2 %; ± 5 %

4.13 - Short time overload U = 2.5 x  2 x Umax.;

duration according to style ± (2 % R + 0.1 )

4.17.2 58 (Td) Solderability

Solder bath method;

Sn60Pb40

non activated flux;

(235 ± 5) °C

(2 ± 0.2) s

Good tinning ( 95 % covered)

no visible damage

Solder bath method;

Sn96.5Ag3Cu0.5

non-activated flux;

(235 ± 3) °C

(2 ± 0.5) s

Good tinning ( 95 % covered)

no visible damage

4.8.4.2 - Temperature coefficient (20/-55/20) °C and

(20/125/20) °C

- 200 ppm/K/+600 ppm/K,

± 250 ppm/K

4.33 21 (Uu1) Substrate bending Depth 3 mm; 1 time

No visible damage,

no open circuit in bent position

± (1 % R + 0.05 )

4.19 14 (Na) Rapid change

of temperature

15 min. at -55 °C;

15 min. at 125 °C;

300 cycles

± (2 % R + 0.1 )

4.25.1 - Endurance at 70 °C

U =  Umax.;

1.5 h on; 0.5 h off;

70 °C; 1000 h

± (5 % R + 0.1 )

4.18.2 58 (Td) Resistance to

soldering heat

Solder bath method

(260 ± 5) °C; (10 ± 1) s ± (2 % R + 0.1 )

4.24 78 (Cab) Damp heat, steady state (40 ± 2) °C; (90 to 95) % RH;

1000 h ± (5 % R + 0.1 )

4.25.3 - Endurance at upper

category temperature 125 °C, 1000 h ± (2 % R + 0.1 )

4.29 45 (XA) Component

solvent resistance

Isopropyl alcohol;

(20 to 25) °C; (5 ± 0.5) min No visible damage

P70 x R

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