8600801EA - ANALOG DEVICES

REVISIONS

LTR DESCRIPTION DATE (YR-MO-DA) APPROVED

A

Change to military drawing format. Page 2, add device type 02. Page 6, table

I, add device type 02 characteristic. Page 8, 6.4 add vendor. Editorial

changes throughout.

87-05-11 M. A.FRYE

B

Add device types 03 and 04. Add case outline 2. Add vendors CAGE 34031

and 64155. For 1.3 change footnotes 1/ and 2/ and delete footnotes 3/ and 4/.

Change vendor similar part number for CAGE 07263 and change vendor

CAGE 07263 to 27014. Add footnotes 7/, 8/, and 9/ to table I and change

footnote 1/. Delete latch setup test and subgroup 12. Change drawing CAGE

to 67268. Editorial changes throughout. Add latch enable voltage to the

recommended operating conditions. Add latch enable propagation delay to

table I to be tested. Delete vendor CAGE 27014.

89-05-09

M. A. FRYE

C

Changes in accordance with NOR 5962-R054-93.

93-04-07

M. A. FRYE

D

Drawing updated to reflect current requirements. -rrp

07-12-03

R. HEBER

THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.

CURRENT CAGE CODE 67268

REV

SHEET

REV

SHEET

REV STATUS REV D D D D D D D D D

OF SHEETS SHEET 1 2 3 4 5 6 7 8 9

PMIC N/A PREPARED BY

JOSEPH A. KERBY

DEFENSE SUPPLY CENTER COLUMBUS

STANDARD

MICROCIRCUIT

DRAWING

CHECKED BY

RAY MONNIN

COLUMBUS, OHIO 43218-3990

http://www.dscc.dla.mil

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

APPROVED BY

MICHAEL A. FRYE

MICROCIRCUIT, LINEAR, HIGH-SPEED VOLTAGE

COMPARATOR, MONOLITHIC SILICON

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

DRAWING APPROVAL DATE

85-11-14

AMSC N/A

REVISION LEVEL

D SIZE

A CAGE CODE

14933

86008

SHEET

1 OF

9

DSCC FORM 2233

APR 97 5962-E560-06

STANDARD

MICROCIRCUIT DRAWING

SIZE

A

86008

DEFENSE SUPPLY CENTER COLUMBUS

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APR 97

1. SCOPE

1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in

accordance with MIL-PRF-38535, appendix A.

1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:

86008 01 E X

Drawing number Device type

(see 1.2.1) Case outline

(see 1.2.2) Lead finish

(see 1.2.3)

1.2.1 Device type(s). The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function tPD±(at TA = +25°C)

Min Max

01 685 Open-emitter output 4.5 6.5 ns

02 685 Open-emitter output 0.5 6.5 ns

03 6685 Open-emitter output 2.0 4.0 ns

04 96685 Open-emitter output 1.5 3.5 ns

1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style

E GDIP1-T16 or CDIP2-T16 16 Dual-in-line

I MACY1-X10 10 Can

2 CQCC1-N20 20 Square leadless chip carrier

1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.

1.3 Absolute maximum ratings.

Positive supply voltage (V+):

Device types 01, 02, 03 ............................................................. +7 V dc

Device type 04 ........................................................................... +6.5 V dc

Negative supply voltage (V-):

Device types 01, 02, 03 ............................................................. -7 V dc

Device type 04 ........................................................................... -6.5 V dc

Input voltage range (VI):

Device types 01, 02, 03 ............................................................. ±4 V dc

Device type 04 ........................................................................... ±5 V dc

Differential input voltage (VID):

Device types 01, 02, 03 ............................................................. ±6 V dc

Device type 04 ........................................................................... ±5.5 V dc

Storage temperature range .......................................................... -65°C to +150°C

Maximum power dissipation (PD):

Device types 01, 02 ................................................................... 500 mW

Device types 03, 04 ................................................................... 300 mW

Lead temperature (soldering, 10 seconds) .................................... +300°C

Thermal resistance, junction-to-case (θJC) .................................... See MIL-STD-1835

Thermal resistance, junction-to-ambient (θJA):

Case E ....................................................................................... 120°C/W

Case I ........................................................................................ 140°C/W

Case 2 ....................................................................................... 92.3°C/W

Output current ............................................................................... 30 mA

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1.4 Recommended operating conditions.

Positive supply voltage (V+):

Device types 01, 02, 03 ............................................................. +6.0 V dc

Device type 04 ........................................................................... +5.0 V dc 1/

Negative supply voltage (V-):

Device types 01, 02, 03 ............................................................. -5.2 V dc

Device type 04 ........................................................................... -5.2 V dc 1/

Minimum operating voltage (V+ to V-) ........................................... 9.7 V dc

Latch enable voltage:

V

IH .............................................................................................. -0.85 V

V

IL .............................................................................................. -1.65 V

Ambient operating temperature range (TA) .................................... -55°C to +125°C 2/

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 - Test Method Standard Microcircuits.

MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 - List of Standard Microcircuit Drawings.

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or

from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-

JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer

Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-

PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying

activity approval in accordance with MIL-PRF -38535. This QML flow as documented in the Quality Management (QM) plan

may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.

These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-

PRF-38535 is required to identify when the QML flow option is used.

1/ VIN ≤ positive supply and negative supply voltage.

2/ Devices require a thermal equilibrium to be established with a transverse airflow of ≥500 LFPM.

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3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535, appendix A and herein.

3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are

as specified in table I and shall apply over the full ambient operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are described in table I.

3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed

in 1.2 herein. In addition, the manufacturer's PIN may also be marked.

3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance

to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in

accordance with MIL-PRF-38535 to identify when the QML flow option is used.

3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an

approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to

listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,

appendix A and the requirements herein.

3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided

with each lot of microcircuits delivered to this drawing.

3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.

3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's

facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the

reviewer.

4. VERIFICATION

4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,

appendix A.

4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices

prior to quality conformance inspection. The following additional criteria shall apply:

a. Burn-in test, method 1015 of MIL-STD-883.

(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level

control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify

the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method

1015 of MIL-STD-883.

(2) TA = +125°C, minimum.

b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter

tests prior to burn-in are optional at the discretion of the manufacturer.

4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-

883 including groups A, B, C, and D inspections. The following additional criteria shall apply.

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TABLE I. Electrical performance characteristics.

Test

Symbol

Conditions 1/ 2/ 3/ 4/

-55°C ≤ TA ≤ +125°C

unless otherwise specified

Group A

subgroups

Device

type

Limits Unit

Min Max

Input offset voltage VIO RS = 100 Ω, VCM = 0 V dc 1 All ±2.0 mV

2, 3

±3.0

Input offset voltage

temperature coefficient

5/

ΔVIO/ΔT RS = 100 Ω, VCM = 0 V 1, 2, 3 01,02 ±10 μV/°C

03

±15.0

04

±20

Input offset current IIO VCM = 3.3 V, TA = +25°C 1 01,02 ±1.0 μA

03

±1.5

VCM = +0.5 V, TA = +25°C 04

±1.0

-VCM = -3.3 V,

TA = +125°C, -55°C 2, 3 01,02 ±1.6

03

±3.0

-VCM = -0.5 V,

TA = +125°C, -55°C 04

±1.6

Input bias current IIB VCM = 3.3 V, TA = +25°C 1 01,02 10 μA

03 15

VCM = +0.5 V, TA = +25°C 04 10

-VCM = -3.3 V,

TA = +125°C, -55°C 2, 3 01,02 16

03 30

-VCM = -0.5 V,

TA = +125°C, -55°C 04 16

Input voltage range VCM 1, 2, 3 01,02,

03 -3.3 3.3 V

04 -2.5 +5.0

Input voltage common

mode rejection ratio CMRR RS = 100 Ω,

-3.3 V ≤ VCM ≤ +3.3 V 4, 5, 6 01,02,

03 80 dB

-2.5 V ≤ VCM ≤ +5.0 V 04 80

Power supply rejection

ratio PSRR RS = 100 Ω, ΔVS = ±5% 4, 5, 6 All 60 dB

High level output voltage V OH TA = +25°C 1 01,02,

03 -0.960 -0.810 V

TA = +125°C 2 -0.850 -0.620

TA = -55°C 3 -1.10 -0.920

1, 2, 3 04 -1.10

See footnotes at end of table.

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TABLE I. Electrical performance characteristics – Continued.

Test

Symbol

Conditions 1/ 2/ 3/ 4/

-55°C ≤ TA ≤ +125°C

unless otherwise specified

Group A

subgroups

Device

type

Limits Unit

Min Max

Low level output voltage VOL TA = +25°C 1 01,02,

03 -1.85 -1.65 V

TA = +125°C 2 -1.81 -1.57

TA = -55°C 3 -1.91 -1.69

1, 2, 3 04 -1.50

Positive supply current I+ 1, 2, 3 01, 02,

03 22 mA

04 9

Negative supply current I- 1, 2, 3 01, 02, -26 mA

03,04 -18

Propagation delay time tPD± TA = -55°C, +25°C 6/ 7/ 9, 11 01 3.5 6.5 ns

TA = +125°C 6/ 7/ 10 5.5 12

TA = +25°C, -55°C 6/ 7/ 9, 11 02 0.5 6.5

TA = +125°C 6/ 7/ 10 0.5 12

TA = +25°C, -55°C 7/ 8/ 9, 11 03 2.0 4.0

TA = +125°C 7/ 8/ 10 1.5 6.0

TA = +25°C, -55°C 9/ 9, 11 04 1.5 3.5

TA = +125°C 9/ 10 1.5 6.0

TA = +25°C, -55°C 9, 11 01,03 8 ns

Propagation delay time

latch enable to output 5/ tPD±

(E) TA = +125°C 10 12.5

TA = +25°C, -55°C 9, 11 02 8

TA = +125°C 10 12.5

TA = +25°C 9 04 3.5

TA = +125°C, -55°C 10, 11 7

1/ For device types 01, 02, and 03 unless otherwise specified: V+ = +6.0 V dc, V- = -5.2 V dc, VT = -2.0 V dc, and RL = 50 Ω.

2/ Devices require a thermal equilibrium to be established with a transverse airflow of >500 LFPM.

3/ Production pulse test devices at correlated temperatures of -35°C and +145°C to compensate for high power steady-state

operation.

4/ For device type 04 unless otherwise specified: V+ = +5.0 V dc, V- = -5.2 V dc, VT = -2.0 V dc, and RL = 50 Ω.

5/ Guaranteed if not tested to the limits specified.

6/ 100 mV step input with 5 mV overdrive.

7/ a. This parameter tested with VCM = 0 V and supplies V+ = 6.0 V, V- = -5.2 V.

b.

tPD+ on either output Q or Q is performed.

c. tPD- on either output Q or Q is performed.

8/ 100 mV step input with 10 mV overdrive V+ = +5.0 V, V- = -5.2 V for 03.

9/ This parameter measured with 100 mV pulse (10 mV overdrive), to 50 percent of the transition output point.

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Device types 01, 02, 03, and 04 04

Case outlines I E 2

Terminal number Terminal symbol

1 V+ GROUND 1 NC

2 NONINVERTING INPUT V+ GROUND 1

3 INVERTING INPUT NONINVERTING INPUT V+

4 LATCH ENABLE INVERTING INPUT NONINVERTING INPUT

5 V- NC INVERTING INPUT

6 NC/HYSTERESIS LATCH ENABLE NC

7 Q OUTPUT NC NC

8 QOUTPUT V- LATCH ENABLE

9 GROUND 2 NC/HYSTERESIS NC

10 GROUND 1 NC V-

11 ---- Q OUTPUT NC

12 ---- QOUTPUT NC

13 ---- NC NC

14 ---- NC Q OUTPUT

15 ---- NC QOUTPUT

16 ---- GROUND 2 NC

17 ---- ---- NC

18 ---- ---- NC

19 ---- ---- NC

20 ---- ---- GROUND 2

NC = No connection

FIGURE 1. Terminal connections.

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TABLE II. Electrical test requirements.

MIL-STD-883 test requirements Subgroups

(in accordance with

MIL-STD-883, method 5005,

table I)

Interim electrical parameters

(method 5004)

----

Final electrical test parameters

(method 5004)

1*, 2, 3, 4

Group A test requirements

(method 5005)

1, 2, 3, 4, 5, 6, 9**, 10**, 11**

Groups C and D end-point

electrical parameters

(method 5005)

1

* PDA applies to subgroup 1.

** Subgroups 9, 10 and 11, if not tested, shall be guaranteed to the limits in table I herein.

4.3.1 Group A inspection.

a. Tests shall be as specified in table II herein.

b. Subgroups 7 and 8 in table I, method 5005 of MIL-STD-883 shall be omitted.

4.3.2 Groups C and D inspections.

a. End-point electrical parameters shall be as specified in table II herein.

b. Steady-state life test conditions, method 1005 of MIL-STD-883.

(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision

level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall

specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in

method 1005 of MIL-STD-883.

(2) TA = +125°C, minimum.

(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.

5. PACKAGING

5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.

6. NOTES

6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications

(original equipment), design applications, and logistics purposes.

6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-

prepared specification or drawing.

6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for

the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.

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6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system

application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be

used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC

5962) should contact DSCC-VA, telephone (614) 692-0544.

6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone

(614) 692-0547

6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-

HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by

DSCC-VA.

STANDARD MICROCIRCUIT DRAWING BULLETIN

DATE: 07-12-03

Approved sources of supply for SMD 86008 are listed below for immediate acquisition information only and shall be

added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to

include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of

compliance has been submitted to and accepted by DSCC-VA. This information information bulletin is superseded by

the next dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current

sources of supply at http://www.dscc.dla.mil/Programs/Smcr/ .

Standard

microcircuit drawing

PIN 1/

Vendor

CAGE

number

Vendor

similar

PIN 2/

8600801EA 3/

3/

AM685/BEA

LT685J/883

8600801IA 3/

3/

AM685/BIC

LT685H/883

8600802EA 3/ LT685J/883

8600802IA 3/ LT685H/883

8600803EA 3/ AM6685/BEA

8600803IA 3/ AM6685/BIC

8600804EA 3/ AD96685TQ/883B

8600804IA 3/ AD96685TH/883B

86008042A 3/ AD96685TE/883B

1/ The lead finish shown for each PIN representing

a hermetic package is the most readily available

from the manufacturer listed for that part. If the

desired lead finish is not listed contact the vendor

to determine its availability.

2/ Caution. Do not use this number for item

acquisition. Items acquired to this number may not

satisfy the performance requirements of this drawing.

3/ Not available from an approved source of supply.

The last known available sources of supply are listed below.

1 of 2

STANDARD MICROCIRCUIT DRAWING BULLETIN - Continued

Vendor CAGE Vendor name

number and address

24355 Analog Devices

Route 1 Industrial Park

P.O. Box 9106

Norwood, MA 02062

Point of contact: 7910 Triad Center Drive

Greensboro, NC 27409-9605

34335 Advance Micro Devices, Incorporated

901 Thompson Place

P.O. Box 3453

Sunnyvale, CA 94086

64155 Linear Technology Corp.

1630 McCarthy Blvd.

Milpitas, CA 95035-7417

The information contained herein is disseminated for convenience only and the

Government assumes no liability whatsoever for any inaccuracies in the

information bulletin.

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