SDFS063A - D2932, MARCH 1987 - REVISED OCTOBER 1993 * SN54F244 . . . J PACKAGE SN74F244 . . . DB, DW, OR N PACKAGE (TOP VIEW) 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs 1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND description These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Taken together with the F240 and F241, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical OE (active-low output-enable) inputs, and complementary OE and OE inputs. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 2OE 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1 2Y4 1A1 1OE VCC SN54F244 . . . FK PACKAGE (TOP VIEW) The F244 is organized as two 4-bit buffers/line drivers with separate output enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state. 1A2 2Y3 1A3 2Y2 1A4 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 1Y1 2A4 1Y2 2A3 1Y3 2Y1 GND 2A1 1Y4 2A2 The SN74F244 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area. 2OE * The SN54F244 is characterized for operation over the full military temperature range of - 55C to 125C. The SN74F244 is characterized for operation from 0C to 70C. FUNCTION TABLE (each buffer) INPUTS OE A OUTPUT Y L H H L L L H X Z Copyright 1993, Texas Instruments Incorporated !"#$ % &'!!($ #% )'*+&#$ ,#$(!,'&$% &!" $ %)(&&#$% )(! $.( $(!"% (/#% %$!'"($% %$#,#!, 0#!!#$1- !,'&$ )!&(%%2 ,(% $ (&(%%#!+1 &+',( $(%$2 #++ )#!#"($(!%- * DALLAS, TEXAS 75265 * HOUSTON, TEXAS 77251-1443 POST OFFICE BOX 655303 POST OFFICE BOX 1443 2-1 SDFS063A - D2932, MARCH 1987 - REVISED OCTOBER 1993 logic symbol 1OE 1A1 1A2 1A3 1A4 1 logic diagram (positive logic) 1OE 1 EN 2 18 4 16 6 14 8 12 1A1 1Y1 2 18 4 16 1Y2 1Y3 1A2 6 2OE EN 14 1Y3 8 12 1A4 2A1 2A2 2A3 2A4 11 9 13 7 15 5 17 3 1Y2 1Y4 1A3 19 1Y1 1Y4 2Y1 2Y2 19 2OE 2Y3 2Y4 11 9 13 7 15 5 17 3 2Y1 2A1 This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. 2Y2 2A2 2Y3 2A3 2A4 2Y4 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.2 V to 7 V Input current range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -30 mA to 5 mA Voltage range applied to any output in the disabled or power-off state . . . . . . . . . . . . . . . . . . . -0.5 V to 5.5 V Voltage range applied to any output in the high state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to VCC Current into any output in the low state: SN54F244 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA SN74F244 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Operating free-air temperature range: SN54F244 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55C to 125C SN74F244 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0C to 70C Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The input voltage ratings may be exceeded provided the input current ratings are observed. 2-2 * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * SDFS063A - D2932, MARCH 1987 - REVISED OCTOBER 1993 recommended operating conditions SN54F244 SN74F244 MIN NOM MAX MIN NOM MAX 4.5 5 5.5 4.5 5 5.5 UNIT VCC VIH Supply voltage VIL IIK Low-level input voltage 0.8 0.8 V Input clamp current -18 -18 mA IOH IOL High-level output current - 12 - 15 mA 64 mA TA Operating free-air temperature 70 C High-level input voltage 2 2 Low-level output current V 48 -55 125 V 0 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VCC = 4.5 V, VCC = 4.5 V VOH SN54F244 TYP MAX TEST CONDITIONS VCC = 4.75 V, VOL VCC = 4.5 V IOZH IOZL VCC = 5.5 V, VCC = 5.5 V, II IIH VCC = 5.5 V, VCC = 5.5 V, MIN II = - 18 mA IOH = - 3 mA -1.2 IOH = - 12 mA IOH = - 15 mA 2.4 3.3 2 3.2 IOH = - 3 mA IOL = 48 mA IOS Any A 0.38 IOL = 64 mA VO = 2.7 V VI = 2.7 V VI = 0.5 V VCC = 5.5 V, VO = 0 Outputs high 3.3 2 3.1 V -100 0.55 -50 -50 A 0.1 0.1 mA A 20 20 -1 -1 - 1.6 - 1.6 -225 -100 -225 40 60 60 90 60 90 Outputs disabled 60 90 60 All typical values are at VCC = 5 V, TA = 25C. Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second. 90 Outputs low * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * A 50 60 VCC = 5.5 V, Outputs open V 50 40 ICC V 0.55 0.42 VO = 0.5 V VI = 7 V VCC = 5.5 V, -1.2 2.4 UNIT 2.7 OE IIL SN74F244 TYP MAX MIN mA mA mA 2-3 SDFS063A - D2932, MARCH 1987 - REVISED OCTOBER 1993 switching characteristics (see Note 2) PARAMETER FROM (INPUT) VCC = 5 V, CL = 50 pF, RL = 500 , TA = 25C TO (OUTPUT) VCC = 4.5 V to 5.5 V, CL = 50 pF, RL = 500 , TA = MIN to MAX F244 tPLH tPHL A Y tPZH tPZL OE Y tPHZ tPLZ OE Y SN74F244 MIN TYP MAX MIN MAX MIN MAX 1.7 3.6 5.2 2 6.5 1.7 6.2 1.7 3.6 5.2 2 7 1.7 6.5 1.2 3.9 5.7 2 7 1.2 6.7 1.2 5 7 2 8.5 1.2 8 1.2 4.1 6 2 7 1.2 7 1.2 4.1 6 2 7.5 1.2 7 For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. NOTE 2: Load circuits and waveforms are shown in Section 1. 2-4 * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * UNIT SN54F244 ns ns ns PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-9758601Q2A ACTIVE LCCC FK 20 1 TBD 5962-9758601QRA ACTIVE CDIP J 20 1 TBD 5962-9758601QRA ACTIVE CDIP J 20 1 5962-9758601QSA ACTIVE CFP W 20 1 5962-9758601QSA ACTIVE CFP W 20 JM38510/33203B2A ACTIVE LCCC FK JM38510/33203B2A ACTIVE LCCC FK JM38510/33203BRA ACTIVE CDIP JM38510/33203BRA ACTIVE JM38510/33203BSA ACTIVE JM38510/33203BSA Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type TBD A42 N / A for Pkg Type TBD Call TI N / A for Pkg Type 1 TBD Call TI N / A for Pkg Type 20 1 TBD POST-PLATE N / A for Pkg Type 20 1 TBD POST-PLATE N / A for Pkg Type J 20 1 TBD CDIP J 20 1 CFP W 20 1 ACTIVE CFP W 20 SN54F244J ACTIVE CDIP J SN54F244J ACTIVE CDIP J SN74F244DBLE OBSOLETE SSOP DB 20 SN74F244DBLE OBSOLETE SSOP DB 20 SN74F244DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74F244N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type A42 N / A for Pkg Type TBD A42 N / A for Pkg Type TBD Call TI N / A for Pkg Type 1 TBD Call TI N / A for Pkg Type 20 1 TBD A42 N / A for Pkg Type 20 1 TBD A42 N / A for Pkg Type TBD Call TI Call TI Call TI Call TI TBD Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74F244N3 OBSOLETE PDIP N 20 TBD Call TI Call TI SN74F244N3 OBSOLETE PDIP N 20 TBD Call TI Call TI SN74F244NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74F244NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74F244NSLE OBSOLETE SO NS 20 TBD Call TI Call TI SN74F244NSLE OBSOLETE SO NS 20 TBD Call TI Call TI SN74F244NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54F244FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54F244FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54F244J ACTIVE CDIP J 20 1 TBD Lead/Ball Finish MSL Peak Temp (3) A42 N / A for Pkg Type SNJ54F244J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type SNJ54F244W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type SNJ54F244W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 10-Nov-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2.5 12.0 16.0 Q1 SN74F244DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 SN74F244DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74F244DWR SOIC DW 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 Q1 SN74F244NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 10-Nov-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74F244DBR SSOP DB 20 2000 346.0 346.0 33.0 SN74F244DWR SOIC DW 20 2000 346.0 346.0 41.0 SN74F244DWR SOIC DW 20 2000 346.0 346.0 41.0 SN74F244NSR SO NS 20 2000 346.0 346.0 41.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-9758601Q2A ACTIVE LCCC FK 20 1 TBD 5962-9758601QRA ACTIVE CDIP J 20 1 TBD 5962-9758601QRA ACTIVE CDIP J 20 1 5962-9758601QSA ACTIVE CFP W 20 1 5962-9758601QSA ACTIVE CFP W 20 JM38510/33203B2A ACTIVE LCCC FK JM38510/33203B2A ACTIVE LCCC FK JM38510/33203BRA ACTIVE CDIP JM38510/33203BRA ACTIVE JM38510/33203BSA ACTIVE JM38510/33203BSA Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type TBD A42 N / A for Pkg Type TBD Call TI N / A for Pkg Type 1 TBD Call TI N / A for Pkg Type 20 1 TBD POST-PLATE N / A for Pkg Type 20 1 TBD POST-PLATE N / A for Pkg Type J 20 1 TBD CDIP J 20 1 CFP W 20 1 ACTIVE CFP W 20 SN54F244J ACTIVE CDIP J SN54F244J ACTIVE CDIP J SN74F244DBLE OBSOLETE SSOP DB 20 SN74F244DBLE OBSOLETE SSOP DB 20 SN74F244DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74F244N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type A42 N / A for Pkg Type TBD A42 N / A for Pkg Type TBD Call TI N / A for Pkg Type 1 TBD Call TI N / A for Pkg Type 20 1 TBD A42 N / A for Pkg Type 20 1 TBD A42 N / A for Pkg Type TBD Call TI Call TI Call TI Call TI TBD Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74F244N3 OBSOLETE PDIP N 20 TBD Call TI Call TI SN74F244N3 OBSOLETE PDIP N 20 TBD Call TI Call TI SN74F244NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74F244NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74F244NSLE OBSOLETE SO NS 20 TBD Call TI Call TI SN74F244NSLE OBSOLETE SO NS 20 TBD Call TI Call TI SN74F244NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74F244NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54F244FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54F244FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54F244J ACTIVE CDIP J 20 1 TBD Lead/Ball Finish MSL Peak Temp (3) A42 N / A for Pkg Type SNJ54F244J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type SNJ54F244W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type SNJ54F244W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 10-Nov-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2.5 12.0 16.0 Q1 SN74F244DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 SN74F244DWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74F244DWR SOIC DW 20 2000 330.0 24.4 10.8 13.1 2.65 12.0 24.0 Q1 SN74F244NSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 10-Nov-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74F244DBR SSOP DB 20 2000 346.0 346.0 33.0 SN74F244DWR SOIC DW 20 2000 346.0 346.0 41.0 SN74F244DWR SOIC DW 20 2000 346.0 346.0 41.0 SN74F244NSR SO NS 20 2000 346.0 346.0 41.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 MECHANICAL DATA MLCC006B - OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DLP(R) Products www.dlp.com Communications and Telecom www.ti.com/communications DSP dsp.ti.com Computers and Peripherals www.ti.com/computers Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps Interface interface.ti.com Energy www.ti.com/energy Logic logic.ti.com Industrial www.ti.com/industrial Power Mgmt power.ti.com Medical www.ti.com/medical Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Space, Avionics & Defense www.ti.com/space-avionics-defense RF/IF and ZigBee(R) Solutions www.ti.com/lprf Video and Imaging www.ti.com/video Wireless www.ti.com/wireless-apps Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2010, Texas Instruments Incorporated