SN74AUP1G00 www.ti.com SCES604H - SEPTEMBER 2004 - REVISED APRIL 2012 LOW-POWER SINGLE 2-INPUT POSITIVE-NAND GATE Check for Samples: SN74AUP1G00 FEATURES 1 * 2 * * * * * * * * * Available in the Texas Instruments NanoStarTM Package Low Static-Power Consumption (ICC = 0.9 A Max) Low Dynamic-Power Consumption (Cpd = 4 pF Typ at 3.3 V) Low Input Capacitance (Ci = 1.5 pF Typ) Low Noise Overshoot and Undershoot <10% of VCC Ioff Supports Partial-Power-Down Mode Operation Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at Input (Vhys = 250 mV Typ at 3.3 V) DBV PACKAGE (TOP VIEW) 1 A B 2 GND 3 5 4 1 6 2 5 N.C. GND 3 4 Y A 1 B 2 GND 3 VCC DRL PACKAGE (TOP VIEW) A 1 B 2 GND 3 VCC 5 4 5 VCC 4 Y Y Y DSF PACKAGE (TOP VIEW) VCC B * DCK PACKAGE (TOP VIEW) DRY PACKAGE (TOP VIEW) A * * * Wide Operating VCC Range of 0.8 V to 3.6 V Optimized for 3.3-V Operation 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation tpd = 4.8 ns Max at 3.3 V Suitable for Point-to-Point Applications Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Performance Tested Per JESD 22 - 2000-V Human-Body Model (A114-B, Class II) - 1000-V Charged-Device Model (C101) A 1 6 VCC B 2 5 N.C. GND 3 4 Y YZP PACKAGE (TOP VIEW) A B GND A1 1 B1 2 C1 3 5 A2 4 C2 VCC Y YFP PACKAGE (TOP VIEW) A B GND A1 1 6 A2 B1 2 5 B2 C1 3 4 C2 VCC DNU Y DNU - Do not use N.C. - No internal connection See mechanical drawings for dimensions. DESCRIPTION/ORDERING INFORMATION The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see Figure 1 and Figure 2). 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2004-2012, Texas Instruments Incorporated SN74AUP1G00 SCES604H - SEPTEMBER 2004 - REVISED APRIL 2012 www.ti.com Switching Characteristics at 25 MHz 3.5 Voltage - V 3 2.5 Input 2 1.5 1 Output 0.5 0 -0.5 0 5 10 15 20 25 30 Time - ns 35 40 45 AUP1G08 data at C = 15 pF L Figure 1. AUP - The Lowest-Power Family Figure 2. Excellent Signal Integrity This single 2-input positive-NAND gate performs the Boolean function Y = A * B or Y = A + B in positive logic. NanoStarTM package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION (1) -40C to 85C (1) (2) (3) ORDERABLE PART NUMBER PACKAGE (2) TA TOP-SIDE MARKING (3) NanoStarTM - WCSP (DSBGA) 0.23-mm Large Bump - YFP (Pb-free) Reel of 3000 SN74AUP1G00YFPR ___HA_ NanoStarTM - WCSP (DSBGA) 0.23-mm Large Bump - YZP (Pb-free) Reel of 3000 SN74AUP1G00YZPR ___HA_ QFN - DRY Reel of 5000 SN74AUP1G00DRYR HA uQFN - DSF Reel of 5000 SN74AUP1G00DSFR HA SOT (SOT-23) - DBV Reel of 3000 SN74AUP1G00DBVR H00_ SOT (SC-70) - DCK Reel of 3000 SN74AUP1G00DCKR HA_ SOT (SOT-553) - DRL Reel of 4000 SN74AUP1G00DRLR HA_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK/DRL: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YFP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). FUNCTION TABLE INPUTS A B OUTPUT Y L L H L H H H L H H H L LOGIC DIAGRAM (POSITIVE LOGIC) A B 2 1 4 2 Submit Documentation Feedback Y Copyright (c) 2004-2012, Texas Instruments Incorporated Product Folder Link(s): SN74AUP1G00 SN74AUP1G00 www.ti.com SCES604H - SEPTEMBER 2004 - REVISED APRIL 2012 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage range -0.5 4.6 V VI Input voltage range (2) -0.5 4.6 V VO Voltage range applied to any output in the high-impedance or power-off state (2) -0.5 4.6 V VO Output voltage range in the high or low state (2) -0.5 VCC + 0.5 V IIK Input clamp current VI < 0 50 mA IOK Output clamp current VO < 0 50 mA IO Continuous output current 20 mA 50 mA Continuous current through VCC or GND JA Tstg (1) (2) (3) Package thermal impedance (3) DBV package 206 DCK package 252 DRL package 142 DSF package 300 DRY package 234 YFP/YZP package 132 Storage temperature range -65 150 C/W C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback Copyright (c) 2004-2012, Texas Instruments Incorporated Product Folder Link(s): SN74AUP1G00 3 SN74AUP1G00 SCES604H - SEPTEMBER 2004 - REVISED APRIL 2012 www.ti.com RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage VCC = 0.8 V VIH High-level input voltage MIN MAX 0.8 3.6 VCC = 1.1 V to 1.95 V VCC = 2.3 V to 2.7 V 0.65 x VCC V 1.6 2 VCC = 0.8 V Low-level input voltage V VCC VCC = 3 V to 3.6 V VIL UNIT 0 VCC = 1.1 V to 1.95 V 0.35 x VCC VCC = 2.3 V to 2.7 V 0.7 VCC = 3 V to 3.6 V 0.9 V VI Input voltage 0 3.6 VO Output voltage 0 VCC V VCC = 0.8 V -20 A VCC = 1.1 V -1.1 VCC = 1.4 V -1.7 VCC = 1.65 -1.9 VCC = 2.3 V -3.1 IOH High-level output current VCC = 3 V IOL Low-level output current Input transition rise or fall rate TA Operating free-air temperature (1) 4 mA -4 VCC = 0.8 V 20 VCC = 1.1 V 1.1 VCC = 1.4 V 1.7 VCC = 1.65 V 1.9 VCC = 2.3 V 3.1 VCC = 3 V t/v V A mA 4 VCC = 0.8 V to 3.6 V -40 200 ns/V 85 C All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback Copyright (c) 2004-2012, Texas Instruments Incorporated Product Folder Link(s): SN74AUP1G00 SN74AUP1G00 www.ti.com SCES604H - SEPTEMBER 2004 - REVISED APRIL 2012 ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VOH TEST CONDITIONS VCC MAX MIN 0.8 V to 3.6 V VCC - 0.1 VCC - 0.1 1.1 V 0.75 x VCC 0.7 x VCC IOH = -1.7 mA 1.4 V 1.11 1.03 IOH = -1.9 mA 1.65 V 1.32 1.3 2.05 1.97 1.9 1.85 2.72 2.67 2.3 V IOH = -2.7 mA 3V IOH = -4 mA IOL = 20 A 0.8 V to 3.6 V IOL = 1.1 mA IOL = 1.7 mA IOL = 1.9 mA IOL = 2.3 mA IOL = 3.1 mA V 2.55 0.1 1.1 V 0.3 x VCC 0.3 x VCC 1.4 V 0.31 0.37 1.65 V 0.31 0.35 0.31 0.33 0.44 0.45 0.31 0.33 0.44 0.45 0 V to 3.6 V 0.1 0.5 A 2.3 V 3V IOL = 4 mA VI = GND to 3.6 V 2.6 UNIT MAX 0.1 IOL = 2.7 mA A or B input TYP IOH = -1.1 mA IOH = -3.1 mA II MIN TA = -40C to 85C IOH = -20 A IOH = -2.3 mA VOL TA = 25C V Ioff VI or VO = 0 V to 3.6 V 0V 0.2 0.6 A Ioff VI or VO = 0 V to 3.6 V 0 V to 0.2 V 0.2 0.6 A ICC VI = GND or (VCC to 3.6 V), IO = 0 0.8 V to 3.6 V 0.5 0.9 A ICC VI = VCC - 0.6 V (1), IO = 0 3.3 V 40 50 A Ci VI = VCC or GND Co VO = GND (1) 0V 1.5 3.6 V 1.5 0V pF 3 pF One input at VCC - 0.6 V, other input at VCC or GND SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, CL = 5 pF (unless otherwise noted) (see Figure 3 and Figure 4) PARAMETER FROM (INPUT) TO (OUTPUT) MIN 0.8 V tpd A or B Y TA = -40C to 85C TA = 25C VCC TYP UNIT MAX MIN MAX 16.6 1.2 V 0.1 V 2.6 7 13.8 2.1 17.1 1.5 V 0.1 V 2.9 5 9.2 2.9 11.1 1.8 V 0.15 V 2 4 7.1 2 9 2.5 V 0.2 V 1.3 2.9 4.9 1.3 6.2 3.3 V 0.3 V 1 2.4 3.8 1 4.8 Submit Documentation Feedback Copyright (c) 2004-2012, Texas Instruments Incorporated Product Folder Link(s): SN74AUP1G00 ns 5 SN74AUP1G00 SCES604H - SEPTEMBER 2004 - REVISED APRIL 2012 www.ti.com SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, CL = 10 pF (unless otherwise noted) (see Figure 3 and Figure 4) PARAMETER FROM (INPUT) TO (OUTPUT) MIN TYP 0.8 V tpd A or B Y TA = -40C to 85C TA = 25C VCC UNIT MAX MIN MAX 18.9 1.2 V 0.1 V 3.2 8 15.7 3.1 18.8 1.5 V 0.1 V 2.9 5.8 10.5 2.9 12.1 1.8 V 0.15 V 2 4.7 8.2 2 9.8 2.5 V 0.2 V 1.3 3.4 5.7 1.3 6.8 3.3 V 0.3 V 1 2.9 4.5 1 5.2 ns SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 3 and Figure 4) PARAMETER FROM (INPUT) TO (OUTPUT) MIN TYP 0.8 V tpd A or B Y TA = -40C to 85C TA = 25C VCC UNIT MAX MIN MAX 21.3 1.2 V 0.1 V 3.6 9 17.3 3.1 21.5 1.5 V 0.1 V 2.9 6.5 11.6 2.9 14 1.8 V 0.15 V 2 5.3 9.2 2 11.4 2.5 V 0.2 V 1.3 3.9 6.4 1.3 8 3.3 V 0.3 V 1 3.3 5.1 1 6.4 ns SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 3 and Figure 4) PARAMETER FROM (INPUT) TO (OUTPUT) MIN 0.8 V tpd A or B Y TA = -40C to 85C TA = 25C VCC TYP UNIT MAX MIN MAX 28.4 1.2 V 0.1 V 4.9 11.9 21.9 4.4 27.1 1.5 V 0.1 V 2.9 8.6 14.7 2.9 17.7 1.8 V 0.15 V 2 7.1 11.5 2 14.2 2.5 V 0.2 V 1.3 5.3 8.1 1.3 10 3.3 V 0.3 V 1 4.5 6.5 1 8 ns OPERATING CHARACTERISTICS TA = 25C PARAMETER Cpd 6 Power dissipation capacitance TEST CONDITIONS f = 10 MHz Submit Documentation Feedback VCC TYP 0.8 V 4 1.2 V 0.1 V 4 1.5 V 0.1 V 4 1.8 V 0.15 V 4 2.5 V 0.2 V 4 3.3 V 0.3 V 4 UNIT pF Copyright (c) 2004-2012, Texas Instruments Incorporated Product Folder Link(s): SN74AUP1G00 SN74AUP1G00 www.ti.com SCES604H - SEPTEMBER 2004 - REVISED APRIL 2012 PARAMETER MEASUREMENT INFORMATION (Propagation Delays, Setup and Hold Times, and Pulse Width) From Output Under Test CL (see Note A) 1 M LOAD CIRCUIT CL VM VI VCC = 0.8 V VCC = 1.2 V 0.1 V VCC = 1.5 V 0.1 V VCC = 1.8 V 0.15 V VCC = 2.5 V 0.2 V VCC = 3.3 V 0.3 V 5, 10, 15, 30 pF VCC/2 VCC 5, 10, 15, 30 pF VCC/2 VCC 5, 10, 15, 30 pF VCC/2 VCC 5, 10, 15, 30 pF VCC/2 VCC 5, 10, 15, 30 pF VCC/2 VCC 5, 10, 15, 30 pF VCC/2 VCC tw VCC Input VCC/2 VCC/2 VI VM Input 0V VM VOLTAGE WAVEFORMS PULSE DURATION 0V tPHL tPLH VOH VM Output VM VOL tPHL VCC Timing Input 0V tPLH tsu VOH VM Output th VCC VM VOL Data Input VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS NOTES: A. B. C. D. E. VCC/2 VCC/2 VCC/2 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES CL includes probe and jig capacitance. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , slew rate 1 V/ns. The outputs are measured one at a time, with one transition per measurement. tPLH and tPHL are the same as tpd. All parameters and waveforms are not applicable to all devices. Figure 3. Load Circuit and Voltage Waveforms Submit Documentation Feedback Copyright (c) 2004-2012, Texas Instruments Incorporated Product Folder Link(s): SN74AUP1G00 7 SN74AUP1G00 SCES604H - SEPTEMBER 2004 - REVISED APRIL 2012 www.ti.com PARAMETER MEASUREMENT INFORMATION (Enable and Disable Times) 2 x VCC S1 5 k From Output Under Test GND CL (see Note A) 5 k TEST S1 tPLZ/tPZL tPHZ/tPZH 2 x VCC GND LOAD CIRCUIT CL VM VI V VCC = 0.8 V VCC = 1.2 V 0.1 V VCC = 1.5 V 0.1 V VCC = 1.8 V 0.15 V VCC = 2.5 V 0.2 V VCC = 3.3 V 0.3 V 5, 10, 15, 30 pF VCC/2 VCC 0.1 V 5, 10, 15, 30 pF VCC/2 VCC 0.1 V 5, 10, 15, 30 pF VCC/2 VCC 0.1 V 5, 10, 15, 30 pF VCC/2 VCC 0.15 V 5, 10, 15, 30 pF VCC/2 VCC 0.15 V 5, 10, 15, 30 pF VCC/2 VCC 0.3 V VCC Output Control Output Waveform 1 S1 at 2 x VCC (see Note B) VCC/2 0V tPLZ tPZL VCC VCC/2 VOL + V VOL tPHZ tPZH Output Waveform 2 S1 at GND (see Note B) VCC/2 VCC/2 VOH VOH - V 0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , slew rate 1 V/ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. All parameters and waveforms are not applicable to all devices. Figure 4. Load Circuit and Voltage Waveforms 8 Submit Documentation Feedback Copyright (c) 2004-2012, Texas Instruments Incorporated Product Folder Link(s): SN74AUP1G00 SN74AUP1G00 www.ti.com SCES604H - SEPTEMBER 2004 - REVISED APRIL 2012 REVISION HISTORY Changes from Revision G (March 2010) to Revision H * Page Corrected the MIN Value for 1.2V as per available characterization data. .......................................................................... 6 Submit Documentation Feedback Copyright (c) 2004-2012, Texas Instruments Incorporated Product Folder Link(s): SN74AUP1G00 9 PACKAGE OPTION ADDENDUM www.ti.com 24-Apr-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G00DBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G00DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G00DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G00DBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G00DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G00DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G00DCKRE4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G00DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G00DCKT ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G00DCKTE4 ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G00DCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G00DRLR ACTIVE SOT DRL 5 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G00DRLRG4 ACTIVE SOT DRL 5 4000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G00DRYR ACTIVE SON DRY 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G00DSFR ACTIVE SON DSF 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AUP1G00YFPR ACTIVE DSBGA YFP 6 3000 Green (RoHS & no Sb/Br) Addendum-Page 1 Samples (Requires Login) SN74AUP1G00DBVR SNAGCU (3) Level-1-260C-UNLIM PACKAGE OPTION ADDENDUM www.ti.com Orderable Device SN74AUP1G00YZPR 24-Apr-2012 Status (1) ACTIVE Package Type Package Drawing DSBGA YZP Pins 5 Package Qty 3000 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish SNAGCU MSL Peak Temp (3) Samples (Requires Login) Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ SN74AUP1G00DBVR SOT-23 3000 180.0 8.4 DBV 5 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.23 3.17 1.37 4.0 8.0 Q3 SN74AUP1G00DBVT SOT-23 DBV 5 250 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3 SN74AUP1G00DCKR SC70 DCK 5 3000 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3 SN74AUP1G00DCKT SC70 DCK 5 250 180.0 8.4 2.25 2.4 1.22 4.0 8.0 Q3 SN74AUP1G00DRLR SOT DRL 5 4000 180.0 8.4 1.98 1.78 0.69 4.0 8.0 Q3 SN74AUP1G00DRLR SOT DRL 5 4000 180.0 9.5 1.78 1.78 0.69 4.0 8.0 Q3 SN74AUP1G00DRYR SON DRY 6 5000 180.0 9.5 1.15 1.6 0.75 4.0 8.0 Q1 SN74AUP1G00DSFR SON DSF 6 5000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2 SN74AUP1G00YFPR DSBGA YFP 6 3000 178.0 9.2 0.89 1.29 0.62 4.0 8.0 Q1 SN74AUP1G00YZPR DSBGA YZP 5 3000 180.0 8.4 1.02 1.52 0.63 4.0 8.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74AUP1G00DBVR SOT-23 DBV 5 3000 202.0 201.0 28.0 SN74AUP1G00DBVT SOT-23 DBV 5 250 202.0 201.0 28.0 SN74AUP1G00DCKR SC70 DCK 5 3000 205.0 200.0 33.0 SN74AUP1G00DCKT SC70 DCK 5 250 202.0 201.0 28.0 SN74AUP1G00DRLR SOT DRL 5 4000 202.0 201.0 28.0 SN74AUP1G00DRLR SOT DRL 5 4000 180.0 180.0 30.0 SN74AUP1G00DRYR SON DRY 6 5000 180.0 180.0 30.0 SN74AUP1G00DSFR SON DSF 6 5000 180.0 180.0 30.0 SN74AUP1G00YFPR DSBGA YFP 6 3000 220.0 220.0 35.0 SN74AUP1G00YZPR DSBGA YZP 5 3000 220.0 220.0 34.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. 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