664, 667, 668
664, 667, 668664, 667, 668
664, 667, 668
BI Technologies Corporation
4200 Bonita Place
Fullerton, CA 92835 USA
Website: www.bitechnologies.com
May 29, 2008 page 2 of 3 BI technologies
PACKAGE POWER AND DE
PACKAGE POWER AND DEPACKAGE POWER AND DE
PACKAGE POWER AND DERATING CURVE
RATING CURVERATING CURVE
RATING CURVE
Model Package Power @ 70°
°°
°C(watts) 3
664 0.4
667 0.5
668 0.5
ENVIRONMENTAL (MIL
ENVIRONMENTAL (MILENVIRONMENTAL (MIL
ENVIRONMENTAL (MIL-
--
-R
RR
R-
--
-83401)
83401)83401)
83401)
Thermal Shock plus Power Conditioning ∆R 0.25%
Short Time Overload ∆R 0.1%
Terminal Strength ∆R 0.1%
Moisture Resistance ∆R 0.2%
Mechanical Shock ∆R 0.25%
Vibration ∆R 0.25%
Low Temperature Operation ∆R 0.1%
High Temperature Exposure ∆R 0.1%
Load Life, 1,000 Hours ∆R 0.1%
Resistance to Solder Heat ∆R 0.1%
Dielectric Withstanding Voltage 100V for 1 minute
Temperature Exposure, Maximum 215°C for 3 minutes
Marking Permanency MIL-STD-202, Method 215
Lead Solderability MIL-STD-202, Method 208
Flammability UL-94V-0 Rated
Storage Temperature Range -65°C to +125°C
MECHANICAL
MECHANICALMECHANICAL
MECHANICAL
Lead Plating 80/20 Tin Lead (Standard)
100 matte Tin (RoHS)
Lead Material Copper Alloy
Lead Configuration Gull Wing
Lead Coplanarity 0.004” (0.102 mm)
Substrate Material Alumina
Resistor Material Passivated Nichrome
Body Material Molded Epoxy
3 Maximum power per resistor @ 70°C is 100 mW, not to exceed package power